JP6499941B2 - Resin molding method and resin molding apparatus - Google Patents

Description

  The present invention relates to a technique effective when applied to a resin transport method, a resin molding method, and a resin molding apparatus.

  In Japanese Patent Laid-Open No. 2003-249605 (hereinafter referred to as “Patent Document 1”), a first resin is molded on a lead frame with a first mold and molded with a second mold. A technique for molding a resin and a second resin covering a part of the lead frame is described (in particular, refer to claim 2 and paragraphs [0034] and [0037] of the specification).

JP 2003-249605 A

  In order to efficiently supply the substrate and the resin to the mold, it is conceivable that the substrate is transported to the mold while the resin is mounted on the substrate. However, it is necessary to devise so as not to drop the resin from the substrate. In particular, when the resin is a granular resin, the granular resin mounted on the substrate rolls during transportation and falls, which is a problem.

  If the first resin is transfer molded on the lead frame as in the technique described in Patent Document 1, the lead frame and the second mold are transferred to the second mold without considering the dropping of the first resin. 1 resin can be conveyed. However, when the first resin is molded on the lead frame, a first mold for that purpose is required, and the efficiency of transporting (supplying) the resin is deteriorated.

  The objective of this invention is providing the technique which can convey resin efficiently. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows. A resin transport method according to one solution of the present invention includes: (a) supplying a resin onto the one surface of a plate-like workpiece having one and the other surface; and (b) a surface portion of the resin. A step of applying heat to the resin so as to be melted; and (c) a step of conveying the workpiece together with the resin whose surface portion is melted. According to this, since the resin whose surface portion is melted adheres to the workpiece, it is possible to prevent the resin from dropping during conveyance, and the resin can also be conveyed during workpiece conveyance. Therefore, the resin can be efficiently conveyed.

  In the resin transport method according to the one solving means, in the step (a), it is more preferable to use a substrate having a hole as the work. Thus, even if a substrate with holes is used, the surface portion is melted in the holes, so that the resin (granule or powder) can be prevented from falling.

  In the resin transport method according to the one solving means, in the step (a), it is more preferable that the granular resin as the resin is raised and supplied onto the one surface. According to this, since the surface part as the whole granulated resin melt | dissolves and adhere | attaches, even when it is a case where granular resin is conveyed with a workpiece | work, rolling of granular resin can be prevented.

  The resin molding method according to one solution of the present invention includes: (a) supplying a compression molding resin onto the one surface of a plate-like workpiece having one and other surfaces; and (b) the compression molding. A step of applying heat to the compression molding resin so as to melt the surface portion of the resin for molding, and (c) supplying the workpiece together with the compression molding resin having the melted surface portion into a mold that is opened. And (d) filling the compression molding resin melted entirely by compression molding in one cavity of the mold and molding on the one surface of the workpiece in the mold closed. It is characterized by including these. According to this, the resin surface can be melted and adhered to the workpiece, so that the resin can be prevented from dropping during conveyance, and the resin can also be conveyed during workpiece conveyance. Therefore, the resin can be efficiently conveyed and the productivity of resin molding can be improved.

  In the resin molding method according to the one solving means, (e) a step of supplying a transfer molding resin into a pot of the mold opened before the step (d), and (f) the mold closed. The mold further includes a step of pumping the transfer molding resin melted in the pot by transfer molding, filling the other cavity of the mold and molding the other surface of the workpiece. More preferred. According to this, it is possible to efficiently mold resins having different properties on both surfaces of a workpiece with one mold without preparing another mold.

  A resin molding apparatus according to one solution of the present invention is provided with a mold for performing resin molding on a plate-shaped workpiece having one and other surfaces, and provided outside the mold, the workpiece being the other surface. A stage set on the side, a resin supply part that is provided outside the mold and supplies compression molding resin onto the one surface of the workpiece set on the stage, and is provided outside the mold A heating unit for applying heat from a position away from the compression molding resin on the one surface so as to melt the surface portion of the compression molding resin supplied to the workpiece; and the mold opened from the stage A loader that transports and supplies the workpiece together with the compression molding resin whose surface portion is melted into the mold, and compresses the mold in which the workpiece and the compression molding resin are supplied and closed For molding Whole, characterized in that the compression molding resin melted is molded on the one surface of the workpiece is filled with one of the cavities of the mold I. According to this, resin fall at the time of conveyance can be prevented, and resin can also be conveyed at the time of work conveyance. Therefore, the resin can be efficiently conveyed and the productivity of resin molding can be improved.

  In the resin molding apparatus according to the one solution, in the mold in which the molding resin is supplied by the loader and closed in the pot of the mold that is opened, the mold melted in the pot by transfer molding. More preferably, the transfer molding resin is pumped, filled in the other cavity of the mold, and molded on the other surface of the workpiece. According to this, it is possible to efficiently mold resins having different properties on both surfaces of a workpiece with one mold without preparing another mold.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows. According to the resin transport method according to one solution of the present invention, the resin can be transported efficiently.

It is a schematic block diagram of the resin molding apparatus which concerns on one Embodiment of this invention. It is typical sectional drawing of the operation | movement process of the principal part of the resin molding apparatus shown in FIG. It is typical sectional drawing of the operation | movement process of the principal part of the resin molding apparatus following FIG. It is typical sectional drawing of the operation | movement process of the principal part of the resin molding apparatus following FIG. It is typical sectional drawing of the operation | movement process of the principal part of the resin molding apparatus following FIG. It is typical sectional drawing of the operation | movement process of the principal part of the resin molding apparatus following FIG. It is typical sectional drawing of the operation | movement process of the principal part of the resin molding apparatus which concerns on other embodiment of this invention. FIG. 8 is a schematic cross-sectional view of the operation process of the main part of the resin molding apparatus following FIG. 7. It is typical sectional drawing of the operation | movement process of the principal part of the resin molding apparatus following FIG. FIG. 10 is a schematic cross-sectional view of the operation process of the main part of the resin molding apparatus following FIG. 9. It is typical sectional drawing of the operation | movement process of the principal part of the resin molding apparatus following FIG. It is typical sectional drawing of the molded article which concerns on other embodiment of this invention.

  In the following embodiments of the present invention, the description will be divided into a plurality of sections when necessary. However, in principle, they are not irrelevant to each other, and one of them is related to some or all of the other modifications, details, etc. It is in. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted. In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .

(Embodiment 1)
A resin molding apparatus 10 according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a schematic configuration diagram of the resin molding apparatus 10 and shows an arrangement of each mechanism portion in a top view. 2-6 is typical sectional drawing of the operation | movement process of the principal part of the resin molding apparatus 10. FIG. In FIGS. 5 and 6, the press unit 16 has a bilaterally symmetric configuration around the one-dot chain line, but the left side in the drawing is omitted.

  As shown in FIG. 1, the resin molding apparatus 10 includes a member storage unit 12, a resin mounting unit 14, a press unit 16, and a molded product storage unit 18 disposed on the front side of the apparatus, and a transport disposed on the back side of the apparatus. Part 20. As will be described later, the resin molding apparatus 10 has a hybrid structure capable of performing transfer molding and compression molding. In the member storage unit 12, a workpiece W1 and a transfer molding resin Ra (for example, a tablet resin) are stored. Moreover, in the resin mounting part 14, resin Rb for compression molding (for example, granule resin) is mounted on the plate-like workpiece W1. In this embodiment, the resin mounting part 14 is provided outside the press part 16, and resin Rb and the workpiece | work W1 are simultaneously conveyed in the press part 16 from this, and are supplied. In this embodiment, the case where these resin Ra and Rb are thermosetting is mainly demonstrated.

  Moreover, in the press part 16 (refer FIG. 5) provided with the metal mold | die 40, it resin-molds with respect to the workpiece | work W1 clamped with the metal mold | die 40 using resin Ra and resin Rb. The molded product storage unit 18 stores a workpiece W2 as a molded product. And in the conveyance part 20 provided with the loader 22 and the unloader 24, the workpiece | work W1 etc. are conveyed by the loader 22 and the unloader 24 which move on a common rail (not shown). In addition, in the resin molding apparatus 10 shown in FIG. 1, although the press part 16 is provided with two or more (two), you may provide only one.

  An operation method (including a resin conveyance method and a resin molding method) of the resin molding apparatus 10 according to the present embodiment will be described. As shown in FIG. 1, the workpiece W <b> 1 before molding stored in the member storage unit 12 is conveyed to the resin mounting unit 14 by the loader 22. The workpiece W1 (see FIG. 2) is a substrate 80 (for example, a lead frame) having one surface 80a and the other surface 80b on the opposite side. For example, an electronic component 82 (for example, a semiconductor chip) is mounted on each of the surfaces 80a and 80b of the workpiece W1 by wire bonding. The electronic component 82 may be an element such as a chip capacitor or an inductor, or a conductive member such as a bump or a pillar.

  The resin mounting portion 14 includes a stage 30 as shown in FIG. The setting surface of the stage 30 is provided with a recess 30a. The concave portion 30a serves as a relief portion that accommodates the electronic component 82 on the surface 80b side when the workpiece W1 is set. In the resin mounting unit 14, the workpiece W1 conveyed by the loader 22 is set (supplied) on the stage 30 on the surface 80b side. Moreover, the resin mounting part 14 is provided with the resin supply part 32 (for example, trough). In the resin mounting portion 14, the resin Rb is supplied onto the surface 80a of the workpiece W1 set on the stage 30 by the resin supply portion 32 (see FIG. 3).

  As shown in FIG. 3, the resin mounting unit 14 includes a heating unit 34 (for example, a cartridge heater). In the resin mounting part 14, the heating part 34 applies heat to the resin Rb so as to melt the surface part Rbs (see FIG. 4) of the resin Rb. For example, the heating unit 34 heats the surface portion Rbs of the resin Rb supplied to the workpiece W1 by radiant heat in a non-contact manner from a position away from the resin Rb on the surface 80a. Here, the selected heating conditions (temperature, time, etc.) are used. As shown in FIG. 4, the surface portion Rbs of the resin Rb can be melted by radiant heat. Thereby, it is possible to prevent the powder from being wound up and diffused from the surface portion Rbs in the resin Rb. Further, the resin Rb can be preheated by heating in advance, and the molding time in the press portion 16 can be shortened. Note that heat can also be applied to the workpiece W1 by a stage 30 (for example, a hot plate) including a built-in heating unit. According to this, the workpiece W1 (particularly, a metal plate such as a lead frame) and the resin Rb can be uniformly heated by heating from the stage 30 side.

  By the way, in this embodiment, the board | substrate 80 (for example, lead frame) with the hole 80c vacant can be used as the workpiece | work W1. Even if the substrate 80 having the holes 80c is used, the surface portion Rbs is melted in the holes 80c, so that the granules and powder do not fall. Specifically, the resin from the hole 80c is obtained by melting the granule or powder resin Rb so that the viscosity does not decrease too much to become a highly viscous liquid, or the resin Rb granule or powder is bonded to each other. This is because Rb can be prevented from falling. If a resin Rb larger than the hole 80c (for example, a granular resin having a large diameter) is supplied, the resin Rb from the hole 80c can be prevented from dropping when the resin is supplied to the workpiece W1.

  In particular, when a granular resin is used as the resin Rb, the granular resin is raised and supplied at the center of the surface 80a so that the granular resin does not spill from the outer peripheral edge of the surface 80a of the workpiece W1. Even if the inside of the whole granule resin remains in the granular state, if the surface portion Rbs is melted, the granule resin can be prevented from rolling (falling) when the granule resin is transported together with the workpiece W1. Even when the sheet resin is used as the resin Rb in addition to the granular resin, the surface portion (in other words, the exposed portion) of the entire sheet resin is melted even when the sheet is stacked on the surface 80a of the workpiece W1. Therefore, the exposed portion is in close contact with the other sheet resin, so that the sheet resin can be prevented from shifting and falling can be prevented. In addition, by preheating the sheet resin, the sheet resin can be deformed on the workpiece W1 so as to follow the shape of the electronic component 82 on the workpiece W1, thereby preventing the sheet resin from falling.

  Subsequently, as shown in FIG. 1, the work W <b> 1 is conveyed (supplied) from the resin mounting portion 14 to the press portion 16 by the loader 22 together with the resin Rb (the surface portion Rbs is melted). In the present embodiment, since the surface portion Rbs melts and the resin Rb adheres to the workpiece W1, it is possible to prevent the resin from dropping during conveyance, and the resin Rb can also be conveyed during workpiece conveyance. Therefore, the resin Rb can be efficiently conveyed together with the workpiece W1. Further, the resin Ra is conveyed (supplied) from the member storage unit 12 to the press unit 16 by the loader 22.

  As shown in FIG. 5, the press unit 16 includes a mold 40. The mold 40 that can be opened and closed includes one upper mold 42 and the other lower mold 44 that form a pair, and the upper mold 42 and the lower mold 44 are brought into contact with and separated from each other. In this embodiment, the mold 40 can perform resin molding by combining a transfer molding method using the resin Ra with a known plunger mechanism and a compression molding method using the resin Rb with a known press mechanism (mold opening / closing mechanism). Structure. In this regard, in this embodiment, the transfer molding resin Ra and the compression molding resin Rb are handled separately.

  One upper mold 42 of the mold 40 is assembled with each block of a base 46, a clamper 48, and an insert 50, and a cavity C1 (concave portion) is provided on a clamping surface (parting surface). A clamper 48 and an insert 50 are assembled to the base 46. The clamper 48 is provided with a cull 48a that is recessed on the clamp surface at the center and a through hole 48b that penetrates in the mold opening / closing direction.

  The clamper 48 is assembled to the base 46 via the elastic member 52 (supported by being suspended), while the insert 50 is inserted into the through hole 48b and assembled to the base 46 integrally. Therefore, in the upper mold 42, the elastic member 52 expands and contracts by the action of the mold opening / closing operation, so that the clamper 48 and the insert 50 move relatively (see FIGS. 5 and 6). Further, in the upper mold 42, the volume of the cavity C1 provided by being surrounded by the inner wall surface of the through hole 48b whose diameter is enlarged on the clamp surface side and the lower end surface of the insert 50 is also increased or decreased by the action of the mold opening / closing operation. It becomes. That is, the mold 40 is a structure that is compression-molded in the cavity C1. In addition, in order to improve the releasability of the workpiece W2 after molding and prevent the resin from entering between the clamper 48 and the insert 50, the film F is sucked to the clamp surface of the upper mold 42 by a suction mechanism (not shown). Has been pasted.

  The other lower mold 44 of the mold 40 is assembled with the base 54 and each block of the pot 56, a cavity C <b> 2 (recessed part) is provided on the clamping surface (parting surface), and a plunger 58 is provided in the pot 56. Has been inserted. A pot 56 is assembled to the base 54 so as to communicate with the cull 48a of the upper mold 42 when the mold is closed. The base 54 is provided with a runner gate 54a that communicates with the cull 48a of the upper mold 42 and the cavity C2 when the mold is closed. In other words, the mold 40 is structured to be transfer molded in the cavity C2.

  In the press part 16 provided with such a metal mold | die 40, resin Rb and workpiece | work W1 which were conveyed are set (supplied) in the metal mold | die 40 which carried out mold opening (refer FIG. 5). Specifically, the workpiece W1 is set in the set portion of the lower mold 44 together with the resin Rb in which the surface portion Rbs is melted. When the workpiece W1 is set, the electronic component 82 on the surface 80b side is accommodated in the cavity C2. Further, the transported resin Ra is set (supplied) in the pot 56 of the mold 40 opened (see FIG. 5).

  Here, unlike the temperature at which the resin Rb is melted by the mold 40 and the temperature at which the resin mounting portion 14 is melted by the heating unit 34 (for example, 70 to 100 ° C.), the temperature of the mold 40 (for example, 150 ° C.). )Is high. For this reason, the resin mounting part 14 (refer FIG. 2, FIG. 3) provided with the stage 30, the resin supply part 32, and the heating part 34 is outside the metal mold | die 40 of the press part 16 so that it may not receive the thermal influence from the metal mold | die 40. And are insulated from each other.

  Next, the mold 40 is closed, and the workpiece W1 is clamped by the upper mold 42 and the lower mold 44 as shown in FIG. When the workpiece W1 is clamped, the electronic component 82 on the surface 80a side is accommodated in the cavity C1. In order to prevent the generation of voids after molding, the cavities C1 and C2 in the mold 40 are decompressed by a decompression mechanism (not shown). Further, the resins Ra and Rb set in the mold 40 are melted because the mold 40 is heated to a predetermined temperature (for example, a molding temperature).

  Next, the mold 40 is further closed from the mold 40 in the mold-closed state, and as shown in FIG. 6, the resin Rb, which is entirely melted by compression molding, is filled in the cavity C1 of the upper mold 42. Molding is performed on the surface 80a of the workpiece W1. Further, in the closed mold 40, the resin Ra melted in the pot 56 by transfer molding is pumped and filled into the cavity C2 of the lower mold 44 and molded on the surface 80b of the workpiece W1. When a thermosetting resin is used for the resins Ra and Rb, the resins Ra and Rb are thermoset by the molding temperature of the mold 40 to be molded into the cavities C1 and C2. Further, even if the substrate 80 having the hole 80c is used as the work W1, the surface portion Rbs of the resin Rb is melted and blocks the hole 80c by the resin mounting portion 14, and therefore the resin Rb is caused to flow into the resin Ra. The resin Rb does not fall from the hole 80c and mix into the region filled with the resin Ra, and it is possible to prevent them from being mixed excessively. Then, the molded workpiece W2 that is opened from the mold 40 and released from the mold 40 is conveyed and stored in the molded product storage section 18 by the unloader 24 as shown in FIG.

  In the present embodiment, a molded product (work W2) in which the electronic component 82 on the surface 80a side is sealed with the resin Rb and the electronic component 82 on the surface 80b side is sealed with the resin Ra is manufactured. As described above, the resin can be prevented from dropping during conveyance, and the resin Rb can also be conveyed during workpiece conveyance. Therefore, the resin Rb can be efficiently conveyed, and the productivity of resin molding can be improved. In addition, the resins Ra and Rb having different properties can be efficiently molded on both surfaces of the workpiece W2 with one mold 40 without preparing another mold. For example, in contrast to the resin Ra for transfer molding, the resin Rb for compression molding may have high heat dissipation, high strength, and high heat resistance.

(Embodiment 2)
In the first embodiment, a molded product (double-sided package) in which resin molding is performed on both surfaces (surface 80a and surface 80b) of the substrate 80 has been described. In the embodiment of the present invention, a molded product (single-sided package) in which resin molding is performed only on one side (surface 80a) of the substrate 80 will be described with reference to FIGS. 7-11 is typical sectional drawing of the operation | movement process of the principal part (press part 16) of the resin molding apparatus 10. FIG. FIG. 12 is a schematic cross-sectional view of a workpiece W2 that is a molded product. In addition, FIG. 1 can be referred to as a schematic configuration diagram of the resin molding apparatus 10.

  An operation method (including a resin conveyance method and a resin molding method) of the resin molding apparatus 10 according to the present embodiment will be described. The workpiece W1 before molding stored in the member storage unit 12 is conveyed to the resin mounting unit 14 by the loader 22. The workpiece W1 (see FIG. 7) is a substrate 80 having one surface 80a and the other surface 80b on the opposite side. An electronic component 82 is mounted on the surface 80a of the workpiece W1 by wire bonding.

  The resin mounting portion 14 includes a stage 30 as shown in FIG. In the resin mounting unit 14, the workpiece W1 conveyed by the loader 22 is set (supplied) on the stage 30 on the surface 80b side. In addition, the resin mounting unit 14 includes a resin supply unit 32. In the resin mounting part 14, the resin Rb is supplied onto the surface 80a of the workpiece W1 set on the stage 30 by the resin supply part 32 (see FIG. 8).

  As shown in FIG. 8, the resin mounting unit 14 includes a heating unit 34. In the resin mounting part 14, heat is applied to the resin Rb by the heating part 34 so as to melt the surface portion Rbs (see FIG. 9) of the resin Rb. For example, the heating unit 34 heats the surface portion Rbs of the resin Rb supplied to the workpiece W1 by radiant heat in a non-contact manner from a position away from the resin Rb on the surface 80a. Here, the selected heating conditions (temperature, time, etc.) are used. As shown in FIG. 9, the surface portion Rbs of the resin Rb can be melted by radiant heat. Thereby, it is possible to prevent the powder from being wound up and diffused from the surface portion Rbs in the resin Rb. Further, the resin Rb can be preheated by heating in advance, and the molding time in the press portion 16 can be shortened.

  Subsequently, the workpiece W1 is transported (supplied) from the resin mounting unit 14 to the press unit 16 by the loader 22 together with the resin Rb (the melted surface portion Rbs). In the present embodiment, since the surface portion Rbs melts and the resin Rb adheres to the workpiece W1, it is possible to prevent the resin from dropping during conveyance, and the resin Rb can also be conveyed during workpiece conveyance. Therefore, the resin Rb can be efficiently conveyed together with the workpiece W1.

  As shown in FIG. 10, the press unit 16 includes a mold 40. The mold 40 that can be opened and closed includes one upper mold 42 and the other lower mold 44 that form a pair, and the upper mold 42 and the lower mold 44 are brought into contact with and separated from each other. In the present embodiment, the mold 40 has a structure capable of performing resin molding of a compression molding method using the resin Rb by a known press mechanism (die opening / closing mechanism). In the press unit 16, the conveyed resin Rb and the workpiece W1 are set (supplied) in the mold 40 opened (see FIG. 10). Specifically, the workpiece W1 is set in the set portion of the lower mold 44 together with the resin Rb in which the surface portion Rbs is melted.

  Next, the mold 40 is closed, and the workpiece W1 is clamped by the upper mold 42 and the lower mold 44 as shown in FIG. When the workpiece W1 is clamped, the electronic component 82 on the surface 80a side is accommodated in the cavity C1. In order to prevent the generation of voids after molding, the cavities C1 and C2 in the mold 40 are decompressed by a decompression mechanism (not shown). Further, the resin Rb set in the mold 40 is melted because the mold 40 is heated to a predetermined temperature (for example, a molding temperature).

  Next, the mold 40 is further closed from the mold 40 in the mold-closed state, and as shown in FIG. 11, the resin Rb, which is entirely melted by compression molding, is filled in the cavity C1 of the upper mold 42. Molding is performed on the surface 80a of the workpiece W1. When a thermosetting resin is used for the resin Rb, the resin Rb is thermoset according to the molding temperature of the mold 40 and molded into the shape of the cavity C1. Then, the molded workpiece W2 that is opened from the mold 40 and released from the mold 40 is conveyed and stored in the molded product storage section 18 by the unloader 24 as shown in FIG.

  In the present embodiment, as shown in FIG. 12, a molded product (work W2) in which the electronic component 82 on the surface 80a side is sealed with the resin Rb is manufactured. As described above, by melting the surface portion Rbs of the resin Rb on the workpiece W1 and bonding it to the workpiece W1, it is possible to prevent the resin from dropping during conveyance, and the resin Rb can also be conveyed during workpiece conveyance. it can. Therefore, the resin Rb can be efficiently conveyed, and the productivity of resin molding can be improved.

  The present invention has been specifically described above based on the embodiments. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist thereof as follows. Nor.

  For example, in the first and second embodiments, the case where the workpiece is applied to a substrate having a hole is described. However, the present invention can also be applied to a substrate having no hole.

  For example, in the first embodiment, the case where the tablet resin is applied as the transfer molding resin supplied into the pot has been described. However, a granule resin, a liquid resin, a sheet resin, and a powder resin can also be applied.

  Further, as the resin Rb for compression molding, a thermoplastic resin that is cured by being set to a predetermined temperature or lower may be used. In this case, by providing a cooling unit in the mold 40, the molded workpiece W2 can be taken out from the mold 40 after the temperature of the resin Rb is lowered and cured. As the resin Rb, for example, engineering plastic (super engineering plastic) such as polyphenylene sulfide (PPS), unsaturated polyester, or liquid crystal polymer can be used.

Rb Resin Rbs Surface part W1 Workpiece

Claims (2)

(A) supplying a resin for compression molding onto the one surface of the plate-like workpiece having one and other surfaces;
(B) applying heat to the compression molding resin so as to melt the surface portion of the compression molding resin;
(C) a step of transporting and supplying the workpiece into a mold opened with the compression molding resin having a melted surface portion;
(D) in the mold closed, filling the compression molding resin melted entirely by compression molding in one cavity of the mold and molding on the one surface of the workpiece;
(E) supplying a transfer molding resin into the mold pot opened before the step (d);
(F) In the mold closed, the transfer molding resin melted in the pot by transfer molding is pumped to fill the other cavity of the mold and molded on the other surface of the workpiece. Process,
A resin molding method comprising: A mold for performing resin molding on a plate-like workpiece having one and other surfaces;
A stage provided outside the mold, and the workpiece is set on the other surface side;
A resin supply unit that is provided outside the mold and supplies compression molding resin onto the one surface of the workpiece set on the stage;
A heating unit that is provided outside the mold and applies heat from a position away from the compression molding resin on the one surface so as to melt the surface portion of the compression molding resin supplied to the workpiece;
A loader that transports and supplies the workpiece together with the compression molding resin whose surface portion is melted into the mold opened from the stage;
With
In the mold closed by supplying the workpiece and the compression molding resin, the compression molding resin melted entirely by compression molding is filled in one cavity of the mold, and the one surface of the workpiece Is formed into a structure,
In the mold, the mold is opened and the mold is closed by the transfer molding resin being supplied by the loader, the transfer molding resin melted in the pot by the transfer molding is pumped and the mold is closed. The other cavity is filled and formed on the other surface of the workpiece.
A resin molding device.

Images