TWI688056B - Resin molding device and method for manufacturing resin molded product - Google Patents

Abstract

Provided is a resin molding apparatus 1000 capable of changing the depth of a mold cavity of a molding die, including: a molding die; a mold wedge mechanism 1310; and a mold cavity block driving mechanism 1301. The forming mold includes a mold 1100 and a mold 1200. The mold 1100 includes a mold cavity block 1101 and a mold cavity frame member 1102. A slide hole 1105 is formed in the mold cavity frame member 1102. The mold cavity block 1101 can move in the sliding hole 1105 in the mold opening and closing direction of the forming mold. The mold cavity 1106 may be formed on the surface of the mold cavity block 1101 opposite to the mold 1200 and the inner side surface of the mold cavity frame member 1102. The mold cavity block driving mechanism 1301 can be used to move the mold cavity block 1101 in the mold opening and closing direction. The depth of the mold cavity 1106 can be changed by using the mold wedge mechanism 1310 to fix the position of the mold cavity block 1101 in the mold opening and closing direction.

Description

Resin molding device and method for manufacturing resin molded product

The invention relates to a resin molding device and a method of manufacturing a resin molded product.

In the method of manufacturing a resin molded product, for example, a resin molding device equipped with a molding die is used.

For example, Patent Literature 1 describes that in a resin molding device (resin mold device), a molded object (mold cavity) is used to mold a molded object, and a resin molded product (package) is manufactured.

[Prior Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. 06-177190.

However, when the height of the resin molded product (package) is changed, it is necessary to exchange molding dies having different cavity depths, or to exchange members of the molding dies, etc., which takes cost and effort.

Therefore, an object of the present invention is to provide a resin molding device capable of changing the depth of a mold cavity of a molding die and the manufacture of a resin molded product method.

In order to achieve the above object, the resin molding apparatus of the present invention is characterized in that it includes: a molding die; and a mold wedge mechanism; and a mold cavity block driving mechanism, the molding die includes one mold and another mold, the One mold includes one model cavity block and one model cavity frame member, a sliding hole is formed on the one model cavity frame member, and the one model cavity block can be in the sliding hole along the mold opening and closing direction of the molding die It is possible to form a model cavity with the surface of the one model cavity block opposite to the other mold and the inner side surface of the one model cavity frame member. Using the one model cavity block drive mechanism enables the one The model cavity block moves in the mold opening and closing direction. Further, by using the one mold wedge mechanism to fix the position of the one model cavity block in the mold opening and closing direction, the depth of the one model cavity can be changed.

The method for manufacturing a resin molded product of the present invention is characterized by using a resin molding apparatus including a molding die including one mold and another mold, the one mold including a mold cavity block and a mold cavity frame Construct A sliding hole is formed in the one model cavity frame member, the one model cavity block can move in the sliding hole along the mold opening and closing direction of the forming mold, and the one model cavity block can The opposite surface of the other mold and the inner side surface of the one mold cavity frame member form a mold cavity, and the manufacturing method includes: a step of supplying a molded object, supplying the molded object to the mold; and a mold cavity In the depth changing step, the depth of the one model cavity is changed by changing the position of the one model cavity block in the mold opening and closing direction of the molding die, and the resin molding step places the object to be molded in the model cavity Resin molding inside.

According to the present invention, it is possible to provide a resin molding apparatus capable of changing the depth of a mold cavity of a molding die and a method of manufacturing a resin molded article.

1: chip

2: lead

10: substrate (object to be molded)

20: Cured resin (encapsulating resin)

20a: Board (resin material)

20b: molten resin (fluid resin)

20d: remaining resin (useless resin part)

40: Release film

41: Release film

100: resin molding device

1100, 1100a: upper mold (one mold)

1101, 1101a: Upper model cavity block (one model cavity block)

1102, 1102a: Upper mold cavity frame member (a mold cavity frame member)

1103, 1103a: Upper mold cavity frame member (a mold cavity frame member)

1104, 1104a: vent slot

1105, 1105a: sliding hole

1106, 1106a: Upper model cavity (one model cavity)

1200, 1200a: lower mold (another mold)

1201, 1201a: Lower model cavity block (another model cavity block)

1202, 1202a: Lower mold side block (another mold side block)

1203, 1203a: slot block

1204, 1204a: Lower model cavity block column (another model cavity block column)

1205, 1205a: lower mold elastic member (another mold elastic member)

1211: slot

1212: Plunger

1300: Upper model cavity block position changing mechanism setting part (one model cavity block position changing mechanism setting part)

1301: Upper model cavity block drive mechanism (one model cavity block drive mechanism)

1302: Upper model cavity block holding member (one model cavity block holding member)

1303: Force sensor (pressing force measuring mechanism)

1304: Upper model cavity block column (a model cavity block column)

1310: Upper mold wedge mechanism (a mold wedge mechanism)

1311a: Upper die first wedge member (one die first wedge member)

1311b: Upper mold second wedge member (one mold second wedge member)

1312: Upper die wedge member power transmission member (one die wedge member power transmission member)

1313: Upper mold wedge member drive mechanism (one mold wedge member drive mechanism)

1321: Upper mold second wedge member holding member (one mold second wedge member holding member

1322: Elastic member of the second wedge member holding member of the upper mold (elastic member of the second wedge member holding member of one mold)

1330: vent opening and closing mechanism

1331: vent pin power mechanism

1332: vent pin

1340: Pressure plate (upper model cavity block position changing mechanism setting part base member or a model cavity block position changing mechanism setting part base member)

1341: Upper frame cavity block position changing mechanism setting part frame member (one frame cavity block position changing mechanism setting part frame member)

1342, 1343: bottom surface member of the upper model cavity block position changing mechanism setting part (one model cavity block position changing mechanism bottom part member)

1351: Release film adsorption mechanism

1352: Release film adsorption piping

1353: Adsorption hole of release film

1400: Lower model cavity block position changing mechanism setting section (another model cavity block position changing mechanism setting section)

1410: Lower die wedge mechanism (another die wedge mechanism)

1411a: Lower mold first wedge member (another mold first wedge member)

1411b: Lower mold second wedge member (another mold second wedge member)

1412: Lower die wedge member power transmission member (another die wedge member power transmission member)

1413: Lower die wedge member drive mechanism (another die wedge member drive machine Structure)

1421: Lower mold mounting member (another mold mounting member)

1422: Pressure plate (lower mold second wedge member holding member or another mold second wedge member holding member)

X1~X4: Arrows indicating the upward direction or force application direction of the lower mold (another mold) 1200

Y1~Y2: Arrows indicating the downward direction of lower mold (another mold) 1200

a1~a2: Arrows indicating the direction of advancement of the first wedge member of the lower mold (the first wedge member of the other mold) 1411a

c1~c2, c101: Arrows indicating the downward direction of the upper model cavity block (a model cavity block) 1101

d1: an arrow indicating the upward direction of the upper model cavity block (a model cavity block) 1101

e1~e2, e101: Arrows indicating the direction of advancement of the first wedge-shaped member of the upper mold (first wedge-shaped member of one mold) 1311a

g1~g2: Arrows indicating the pushing direction of the plunger 1212

h1: Arrow indicating the downward direction of vent pin 1332

D0, D1, D3: Depth of upper model cavity 1106

FIG. 1 is a cross-sectional view schematically showing an example of the resin molding apparatus of the present invention.

2 is a cross-sectional view schematically showing one step of an example of a method of manufacturing a resin molded product using the resin molding device of FIG. 1.

FIG. 3 is a schematic view showing the manufacturing method of the same resin molded product as FIG. 2 Cross-sectional view of another step of the method.

4 is a cross-sectional view schematically showing still another step of the method of manufacturing the same resin molded product as FIG. 2.

FIG. 5 is a cross-sectional view schematically showing still another step of the method of manufacturing the same resin molded product as FIG. 2.

6 is a cross-sectional view schematically showing still another step of the method of manufacturing the same resin molded product as FIG. 2.

7 is a cross-sectional view schematically showing still another step of the method of manufacturing the same resin molded product as FIG. 2.

FIG. 8 is a cross-sectional view schematically showing still another step of the method of manufacturing the same resin molded product as FIG. 2.

9 is a cross-sectional view schematically showing still another step of the method of manufacturing the same resin molded product as FIG. 2.

10 is a cross-sectional view schematically showing still another step of the method of manufacturing the same resin molded product as FIG. 2.

FIG. 11 is a cross-sectional view schematically showing still another step of the method of manufacturing the same resin molded product as FIG. 2.

FIG. 12 is a cross-sectional view schematically showing still another step of the method of manufacturing the same resin molded product as FIG. 2.

FIG. 13 is a cross-sectional view schematically showing still another step of the method of manufacturing the same resin molded product as FIG. 2.

14 is a cross-sectional view schematically showing still another step of the method of manufacturing the same resin molded product as FIG. 2.

15 is a schematic view showing the manufacture of the same resin molded product as FIG. 2 Cross-sectional view of another step of the method.

FIG. 16 is a cross-sectional view schematically showing still another step of the method of manufacturing the same resin molded product as FIG. 2.

17 is a cross-sectional view schematically showing one step of another example of a method of manufacturing a resin molded product using the resin molding device of FIG. 1.

FIG. 18 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 17.

FIG. 19 is a cross-sectional view schematically showing still another step of the method of manufacturing the same resin molded product as FIG. 17.

FIG. 20 is a cross-sectional view schematically showing the same resin molding apparatus as FIG. 1.

21 is a cross-sectional view schematically showing a state where the upper mold and the lower mold are removed from the resin molding apparatus of FIG. 20.

22 is a cross-sectional view schematically showing a state in which an upper mold and a lower mold different from FIG. 20 are attached to the resin molding apparatus of FIG. 20.

FIG. 23 is a cross-sectional view schematically showing an example of a structure in which the upper mold adsorbs the release film in the resin molding apparatus of FIG. 1.

Hereinafter, the present invention will be described in further detail by examples. However, the present invention is not limited to the following description.

The resin molding apparatus of the present invention may further include, for example, a pressing force measuring mechanism capable of measuring the pressing force of pressing the one model cavity block using the one model cavity block driving mechanism.

The resin molding apparatus of the present invention may be, for example, The one die wedge mechanism includes one die wedge member in a pair, one die wedge member in the pair includes one die first wedge member and one die second wedge member, and one die first wedge member and The second wedge-shaped member of each one of the molds respectively has an inclined surface and is arranged so that the inclined surfaces face each other. By moving at least one of the first wedge-shaped member of the one mold and the second wedge-shaped member of the one mold, it is possible to When the first wedge member of one mold and the second wedge member of one mold are in contact, the length of one wedge member of the pair in the mold opening and closing direction is changed. In addition, the direction in which the at least one wedge member is moved may be, for example, the front end direction or the rear end direction of the wedge shape of the moved wedge member.

The resin molding apparatus of the present invention may be, for example, the resin molding apparatus further includes another mold wedge mechanism, the other mold includes another mold cavity block, and the other mold wedge mechanism can fix the other The position of a mold cavity block in the mold opening and closing direction.

The resin molding apparatus of the present invention may be, for example, the other mold wedge mechanism includes another mold wedge member in a pair, and the other mold wedge member in the pair includes another mold first wedge member and another One mold second wedge member, the other mold first wedge member and the other mold second wedge member each have slopes, and are arranged so that the slopes of each other face each other By moving at least one of the first wedge member of the other mold and the second wedge member of the other mold, the first wedge member of the other mold and the second wedge member of the other mold can be moved When in contact, the length of the other mold wedge member in the pair in the mold opening and closing direction is changed. In addition, the direction in which the at least one wedge member is moved may be, for example, the front end direction or the rear end direction of the wedge shape of the moved wedge member.

The resin molding apparatus of the present invention may be, for example, in the one mold wedge mechanism, by contacting the one mold first wedge member and the one mold second wedge member in the pair The length of the mold wedge-shaped member in the mold opening and closing direction becomes shorter, and the depth of the one mold cavity can be deepened.

The resin molding apparatus of the present invention may be, for example, in the one mold wedge mechanism, by contacting the one mold first wedge member and the one mold second wedge member in the pair The length of the mold wedge member in the mold opening and closing direction becomes longer, and the depth of the one mold cavity can be made shallower.

The resin molding apparatus of the present invention may be, for example, the one mold is an upper mold, and the other mold is a lower mold. In addition, for example, in contrast to this, the resin molding apparatus of the present invention may be such that the one mold is a lower mold and the other mold is an upper mold.

The resin molding device of the present invention may be, for example, a device for transfer molding. In addition, the resin molding apparatus of the present invention is not limited to this, and may be an apparatus for compression molding, for example.

As described above, although the method of manufacturing the resin molded article of the present invention is performed using a resin molding apparatus including a molding die, for example, the resin molding apparatus may be the resin molding apparatus of the present invention.

The method for manufacturing a resin molded product of the present invention may be, for example, further including another mold cavity block position changing step to change the position of the other mold cavity block in the mold opening and closing direction.

The method for manufacturing the resin molded product of the present invention may be, for example, the resin molding device is the resin molding device of the present invention, and the resin molding device of the present invention further includes the other mold wedge mechanism.

The method for manufacturing a resin molded article of the present invention may be, for example, before the step of supplying the object to be molded, the step of changing the depth of one mold cavity.

The method for manufacturing a resin molded product of the present invention may be, for example, further including a mold surface covering step to cover the mold surface of the one mold with a release film. Also, in this case, the one mold cavity depth changing step may be performed before the one mold surface covering step. In doing so, unlike the case where the one mold cavity depth changing step is performed after performing the one mold surface covering step, the mold release film will not expand or contract with the one model cavity depth changing step. Since the expansion and contraction of the release film can be suppressed or prevented in this way, the leakage of the resin due to the damage of the release film, the phenomenon that the wrinkle or slack of the release film is transferred to the resin molded product can be suppressed or prevented Wait, so it's better.

The method for manufacturing the resin molded product of the present invention may be, for example For example, in the resin molding step, the object to be molded is resin-molded by transfer molding. In addition, the method of manufacturing the resin molded article of the present invention is not limited to this, and for example, the object to be molded may be molded by compression molding or the like in the resin molding step.

The method of manufacturing a resin molded article of the present invention may be, for example, the object to be molded may include a plurality of substrates, and the resin to be molded may be resin-molded by performing resin encapsulation between the substrates.

In addition, in the present invention, although the "forming mold" is, for example, a metal mold, it is not limited thereto, and for example, it may be a ceramic mold.

In the present invention, the resin molded product is not particularly limited. For example, it may be a resin molded product that molds only resin, or may be a resin molded product that performs resin encapsulation on accessories such as wafers. In the present invention, the resin molded product may be, for example, an electronic accessory.

In the present invention, "resin molding" or "resin encapsulation" refers to, for example, a state where the resin has been hardened (cured).

In the present invention, the resin material before molding and the resin after molding are not particularly limited, and may be, for example, thermosetting resins such as epoxy resins and silicone resins, or thermoplastic resins. Also, it may be a composite material partially containing a thermosetting resin or a thermoplastic resin. In the present invention, as the form of the resin material before molding, for example, granular resin, fluid resin, sheet resin, plate resin, powder resin and the like can be exemplified. In the present invention, the fluid resin is not particularly limited if it is a fluid resin, and examples thereof include liquid resins and molten resins. In the present invention, the liquid resin means, for example, a liquid that is liquid at room temperature or has fluidity Resin. In the present invention, the molten resin refers to, for example, a resin that becomes liquid or has a fluid state by melting. As far as the form of the resin is concerned, as long as it can be supplied to the cavity, groove, etc. of the molding die, other forms are also possible.

In addition, although the term “electronic accessory” generally refers to the case of a wafer before resin encapsulation and the state where the wafer has been resin encapsulated, in the present invention, only the case of “electronic accessory” is mentioned unless otherwise Indicate, refer to the electronic parts (the finished electronic parts) in which the wafer is resin-encapsulated. In the present invention, the "wafer" refers to a wafer before resin encapsulation, and specifically, for example, an integrated circuit (IC), a semiconductor wafer, a semiconductor element for power control, and the like. In the present invention, the wafer before resin encapsulation is called a "wafer" for convenience in order to distinguish it from the electronic accessories after resin encapsulation. However, the “wafer” of the present invention is not particularly limited as long as it is a wafer before resin encapsulation, and may not be in a wafer shape.

In the present invention, "flip-chip" refers to an integrated circuit (IC) wafer or an integrated circuit (IC) wafer having bump-shaped bump electrodes called bumps on electrodes (pads) on the surface of an integrated circuit (IC) wafer Kinds of wafer morphology. The wafer is mounted downward (face down) on a wiring portion such as a printed circuit board. The flip chip can be used, for example, as a wafer for wireless bonding or as one of mounting methods.

In the present invention, for example, a resin molded product can be manufactured by performing resin encapsulation (resin molding) on a component (for example, wafer, flip chip, etc.) mounted on a substrate. In the present invention, although the substrate (also referred to as an intermediate layer) is not particularly limited, it may be, for example, a lead frame, a wiring substrate, a wafer, a ceramic substrate, or the like. The substrate may be, for example, one of the A mounting substrate on which wafers are mounted on the surface or both surfaces. Although the method of mounting the wafer is not particularly limited, for example, wire bonding, flip chip bonding, etc. may be mentioned. In the present invention, for example, the electronic component in which the wafer is resin-encapsulated can be manufactured by resin-encapsulating the mounting substrate. In addition, the use of the resin-encapsulated substrate by the resin encapsulation device of the present invention is not particularly limited, and examples include high-frequency module substrates for mobile communication terminals, module substrates for power control, and substrates for machine control.

In addition, in the present invention, "installation" includes "placement" or "fixation". Further, in the present invention, "positioning" includes "fixing".

Hereinafter, specific embodiments of the present invention will be described based on the drawings. For convenience of description, each drawing is schematically described by appropriately omitting, exaggerating, etc.

[Example 1]

In this embodiment, an example of a resin molding apparatus of the present invention and an example of a method of manufacturing a resin molded product using the same will be described.

In the cross-sectional view of FIG. 1, the structure of the resin molding apparatus of this embodiment is schematically shown. As shown in the figure, the resin molding apparatus 1000 includes, as main components, a molding die including an upper mold (one mold) 1100 and a lower mold (another mold) 1200; an upper mold cavity block position changing mechanism setting section (one model Cavity block position changing mechanism setting section) 1300; lower model cavity block position changing mechanism setting section (another model cavity block position changing mechanism setting section) 1400. Also, the resin molding apparatus 1000 further includes as a main The release film adsorption mechanism (not shown in FIG. 1) and the vent opening and closing mechanism 1330 of the constituent elements. In this embodiment, as will be described later, the vent opening and closing mechanism 1330 is one of the constituent elements of the upper mold cavity block position changing mechanism setting portion 1300, but the present invention is not limited to this. For example, the vent opening and closing mechanism 1330 may be one of the constituent elements of the resin molding apparatus 1000 that is different from the upper mold cavity block position changing mechanism installation portion 1300.

The upper mold (one mold) 1100 includes an upper mold cavity block (one mold cavity block) 1101 and upper mold cavity frame members (one mold cavity frame member) 1102 and 1103. As shown in the figure, the upper model cavity block 1101 is arranged in parallel. Among the members constituting the upper mold cavity frame member, the upper mold cavity frame member 1103 is arranged so as to be sandwiched by the two upper mold cavity blocks 1101. As shown in the figure, the upper mold cavity frame member 1102 is arranged outside the upper mold cavity block 1101. In the upper mold cavity frame member, a slide hole 1105 is formed so as to be surrounded by the upper mold cavity frame members 1102 and 1103. The upper mold cavity block 1101 can move in the slide hole 1105 in the mold opening and closing direction of the forming mold. In addition, the "mold opening and closing direction" in FIG. 1 is the opening and closing direction of the upper mold 1100 and the lower mold 1200, that is, the vertical direction in the figure. Further, as shown in the figure, the upper model cavity (one model) can be formed by the surface of the above model cavity block 1101 facing the lower mold (another mold) 1200 and the space surrounded by the inner sides of the upper model cavity frame members 1102 and 1103 Cavity) 1106. Then, as will be described later, the object to be resin-formed can be pressed by the upper mold cavity block 1101 through the release film. In addition, a vent hole 1104 is formed at the lower end of the upper mold cavity frame member 1102.

In addition, although not shown in FIG. 1, the upper mold cavity frame member 1103 can be further formed with a remaining resin molded portion. The remaining resin part (also called a waste resin part or a scrap part) of the space of the remaining resin (useless resin).

The lower mold (another mold) 1200 uses the lower mold cavity block (another mold cavity block) 1201, the lower mold side block (another mold side block) 1202, and the groove block 1203 as main components, and further includes a lower mold cavity block A column (another model cavity block column) 1204, a lower mold elastic member (another mold elastic member) 1205, and a plunger 1212. In addition, although the plunger 1212 may be one of the constituent elements of the lower mold 1200 as described above, it may also be one of the constituent elements of the resin molding apparatus 1000 different from the lower mold 1200. There are two lower mold cavity blocks 1201, which are respectively arranged so that the upper surface faces the upper mold cavity block 1101. The groove block 1203 is arranged so as to be sandwiched between the two lower mold cavity blocks 1201. The lower mold side block 1202 is arranged outside the lower mold cavity block 1201 as shown in the figure. Then, the two lower mold cavity blocks 1201 are arranged so as to be sandwiched by the lower mold side block 1202 and the groove block 1203, respectively. In the groove block 1203, a groove 1211 is formed as a hole penetrating vertically. The plunger 1212 can move up and down in the groove 1211. As described later, by raising the plunger 1212, the fluid resin in the groove 1211 can be pushed into the upper mold cavity 1106.

The lower mold cavity block column 1204 is installed on the lower surface of the lower mold cavity block 1201. The lower mold elastic member 1205 is arranged so as to surround the lower mold cavity block column 1204, and can expand and contract in the mold opening and closing direction (the vertical direction in the figure).

The upper model cavity block position changing mechanism setting section (one model cavity block position changing mechanism setting section) 1300 includes an upper model cavity block driving mechanism (one model cavity block driving mechanism) 1301, an upper model cavity block holding member (one model cavity block holding mechanism) Component) 1302, force sensor (pressing force measuring machine) Structure) 1303, upper mold cavity block column (a model cavity block column) 1304, upper mold wedge mechanism (also called a mold wedge mechanism or upper mold wedge mechanism) 1310, upper mold second wedge member holding member (also called a mold 2nd wedge member holding member or upper mold 2nd wedge holding member or one mold second wedge holding member) 1321, upper mold second wedge member holding member elastic member (one mold second wedge member holding member elastic member) 1322 , Vent opening and closing mechanism 1330, pressure plate (upper model cavity block position changing mechanism setting part base member or a model cavity block position changing mechanism setting part base member) 1340, upper model cavity block position changing mechanism setting part frame member (a model cavity Block position changing mechanism setting part frame member) 1341, upper model cavity block position changing mechanism setting part bottom surface member (one model cavity block position changing mechanism setting part bottom surface member) 1342 and 1343. The pressure plate 1340 is a plate-shaped member, and is arranged above the upper mold 1100 so as to cover the entire upper mold 1100. In addition, as will be described later, other members of the upper mold cavity block position changing mechanism setting portion 1300 are directly or indirectly mounted on the pressure plate 1340.

As shown in the figure, the upper mold cavity block holding member 1302 penetrates the pressure plate 1340 in the up and down direction and can move up and down. At the lower end of one mold cavity block holding member 1302, an upper mold cavity block column 1304 is installed. An upper mold cavity block 1101 is installed at the lower end of the upper mold cavity block column 1304. In addition, as will be described later, the upper mold cavity block 1101 can be attached to and detached from the upper mold cavity block column 1304. The upper mold cavity block driving mechanism 1301 is connected to the upper end of the upper mold cavity block holding member 1302. By moving the upper mold cavity block holding member 1302 up and down by the upper mold cavity block drive mechanism 1301, the upper mold cavity block 1101 can be moved up and down (that is, in the mold opening and closing direction).

As shown in the figure, the upper die wedge mechanism 1310 includes an upper die first wedge member (also called a die first wedge member or an upper die first wedge or a die first wedge) 1311a, and an upper die second wedge member (also called One die second wedge member, upper die second wedge, or one die second wedge 1311b, upper die wedge member power transmission member (also called a die wedge member power transmission member, upper die wedge power transmission member, or one die wedge power) Conveying member) 1312, upper die wedge member driving mechanism (also called a die wedge member driving mechanism, upper die wedge driving mechanism or a die wedge driving mechanism) 1313. As shown in FIG. 1, in the upper die first wedge member 1311a and the upper die second wedge member 1311b, one surface in the thickness direction (vertical direction in the figure) is an inclined surface. More specifically, as shown in the drawing, the lower surface of the first wedge member 1311a of the upper mold and the upper surface of the second wedge member 1311b of the upper mold are inclined surfaces, respectively. The first wedge member 1311a of the upper mold and the second wedge member 1311b of the upper mold are arranged so that their inclined surfaces face each other.

The first wedge member 1311a of the upper mold is connected to the upper wedge member drive mechanism 1313 via the upper mold wedge member power transmission member 1312. Then, the upper die wedge member (one of the pair of die wedge members in the pair) formed by the upper die first wedge member 1311a and the upper die second wedge member 1311b is driven by the upper die wedge member driving mechanism 1313. Sometimes just called "upper wedge member in a pair", "upper wedge member" or "upper wedge member"), the slope direction (left and right direction in the figure) of the inclined surface can be slid to change the The length of the upper die wedge member in the thickness direction. For example, if the upper wedge member 1311a of the upper die is slid in the direction of its front end, the second wedge member 1311b of the upper die will be opposite to the first wedge member 1311a of the upper die Swipe. In doing so, the length of the upper die wedge member in the pair in the thickness direction (up and down direction in the figure) increases. Further, for example, by conversely, by sliding the upper die first wedge member 1311a in the direction of the rear end thereof, the length of the upper die wedge member in the pair in the thickness direction (vertical direction in the figure) can be reduced. Thus, as will be described later, the position of the upper mold cavity block 1101 in the vertical direction (mold opening and closing direction) can be changed. That is, by this, the depth of the upper mold cavity 1106 can be adjusted to an appropriate depth.

In addition, in the example of FIG. 1, the upper die first wedge member 1311a on the upper side of the upper die wedge member of the pair can be slid horizontally (left and right in the figure) by the upper die wedge member driving mechanism 1313 (slide shift). However, it is not limited to this. For example, the upper die wedge member 1311b can be slid by the upper die wedge member drive mechanism 1313, and the upper die first wedge member 1311a and the upper die second wedge member 1311b can also be made Both slide. In addition, the upper die wedge member driving mechanism 1313 is not particularly limited, and for example, a servo motor, an air cylinder, or the like can be used.

In addition, in FIG. 1, the entire surface of each of the first wedge member 1311 a of the upper mold and the second wedge member 1311 b of the upper mold is an inclined surface. However, the present invention is not limited to this, and at least one wedge-shaped member can be slid along the inclined surface. For example, with regard to one or both of the first wedge member 1311a of the upper mold and the second wedge member 1311b of the upper mold, only a part of one surface thereof may be a slope. More specifically, for example, with respect to at least one of the upper wedge member 1311a and the upper wedge member 1311b shown in the figure, only the front end side (thin side) of one surface is a slope, and the root side (thick side) ) May be horizontal.

The upper surface of the upper wedge member holding member 1321 is in contact with the lower surface of the upper wedge member 1311b. On the other hand, the lower surface of the pressure plate 1340 is in contact with the upper surface of the first wedge member 1311a of the upper mold. That is, the upper mold wedge member of the pair is arranged so as to be sandwiched between the upper surface of the upper mold second wedge member holding member 1321 and the lower surface of the upper mold cavity block position changing mechanism base part 1340. Then, the elastic member 1322 of the upper mold second wedge member holding member and the upper mold second wedge member holding member 1321 are used to maintain the state where the upper mold first wedge member 1311a and the upper mold second wedge member 1311b are in contact.

The bottom surface member of the upper mold cavity block position changing mechanism installation portion is formed of an upper member 1342 and a lower member 1343. As shown in the figure, the bottom surface member 1343 of the upper mold cavity block position changing mechanism installation part can mount the upper mold cavity frame members 1102 and 1103 on the lower surface thereof. As will be described later, the upper mold cavity frame members 1102 and 1103 can be attached to and detached from the bottom surface member 1343 of the upper mold cavity block position changing mechanism setting portion. In addition, the upper mold cavity block column 1304 penetrates the upper mold cavity block position changing mechanism installation portion bottom surface members 1342 and 1343 in the up-down direction and can move up and down. The elastic member 1322 of the upper mold second wedge member holding member is arranged so as to be sandwiched by the lower surface of the upper mold second wedge member holding member 1321 and the upper surface of the upper mold cavity block position changing mechanism setting portion bottom surface member 1342, and can Stretch up and down. As for the upper mold cavity block position changing mechanism setting portion frame member 1341, its upper end is connected to the lower surface of the pressure plate 1340, and its lower end is connected to the upper surface of the upper mold cavity block position changing mechanism setting portion bottom surface member 1342. In addition, the upper mold cavity block position changing mechanism is provided with a frame member 1341 to surround the upper mold second wedge member holding member 1321. The upper mold cavity block holding member 1302 and the upper mold wedge member of the pair are arranged in a manner.

The vent opening and closing mechanism 1330 includes a vent pin power mechanism 1331 and a vent pin 1332. As shown in the figure, the vent pin 1332 penetrates the upper part of the upper mold cavity frame member 1102, the upper mold cavity block position changing mechanism bottom part 1342 and 1343, the upper mold cavity block position changing mechanism frame part 1341 and Press plate 1340, and can move up and down. The vent pin power 1331 moves the vent pin 1332 up and down, and as described later, the vent hole 1104 can be opened and closed. In addition, the vent pin power mechanism 1331 is not particularly limited, and for example, a servo motor, a cylinder, or the like can be used.

In addition, the "upper model cavity block position changing mechanism (one model cavity block position changing mechanism)" provided in the upper model cavity block position changing mechanism setting section (one model cavity block position changing mechanism setting section) 1300 includes in this embodiment An upper mold cavity block drive mechanism (a mold cavity block drive mechanism) 1301 and an upper mold wedge mechanism (a mold wedge mechanism) 1310. However, the present invention is not limited to this. For example, the upper mold cavity block position changing mechanism (one mold cavity block position changing mechanism) may further include other components.

As shown in the figure, the lower mold cavity block position changing mechanism setting part 1400 includes a lower mold wedge mechanism (another mold wedge mechanism) 1410, a lower mold mounting member (another mold mounting member) 1421, a pressure plate (also called a lower mold second) Wedge member holding member or another mold second wedge member holding member, lower mold second wedge holding member or another mold second wedge holding member) 1422.

As shown in the figure, the lower die wedge mechanism 1410 includes a lower first wedge member (also called another first die wedge member, a lower first die wedge, or another Die first wedge) 1411a, lower die second wedge member (also called another die second wedge member, lower die second wedge or another die second wedge) 1411b, lower die wedge member power transmission member (also called another One mold wedge member power transmission member, lower mold wedge power transmission member or another mold wedge power transmission member) 1412, lower mold wedge member drive mechanism (also called another mold wedge member drive mechanism, lower mold wedge drive mechanism or another Die wedge drive mechanism) 1413. As shown in FIG. 1, the other surfaces of the first lower wedge-shaped member 1411 a and the lower second wedge-shaped member 1411 b in the thickness direction (vertical direction in the figure) are inclined surfaces. More specifically, as shown in the figure, the upper surface of the first wedge member 1411a of the lower mold and the lower surface of the second wedge member 1411b of the lower mold are inclined surfaces, respectively. The first lower wedge member 1411a of the lower die and the second wedge member 1411b of the lower die are arranged so that their inclined surfaces face each other.

In addition, the first wedge member 1411a of the lower mold is connected to the wedge member driving mechanism 1413 of the lower mold wedge member via a lower wedge member power transmission member 1412. Then, the lower die wedge member (the other die wedge member of the pair) formed by the lower die first wedge member 1411a and the lower die second wedge member 1411b is directed by the lower die wedge member driving mechanism 1413. The following may only be referred to as "a pair of lower die wedge members", "lower die wedge members" or "lower die wedges"). The length of the lower die wedge member in the thickness direction. For example, if the lower first wedge member 1411a is slid in the direction of its front end, the lower second wedge member 1411b will slide in the opposite direction relative to the lower first wedge member 1411a. In so doing, the length in the thickness direction (up and down direction in the figure) of the lower die wedge member in the pair increases. And, for example, instead, by making The first wedge member 1411a of the lower die slides in the direction of its rear end, and the length of the thickness direction of the lower die wedge member (up and down direction in the figure) of the pair is reduced. Thus, as described later, the position of the lower mold cavity block 1201 in the up-down direction (mold opening and closing direction) can be changed. Thus, for example, even if the thickness of the substrate (molded product) 10 described later varies (for example, even if the thicknesses of the substrates 10 on the left and right of FIG. 6 described later are different), each lower mold cavity block 1201 can be appropriately changed (adjusted) (For example, the left and right lower mold cavity blocks 1201 in FIG. 6 ), the left and right substrates 10 are fixed with an appropriate pressing force.

In addition, in the example of FIG. 1, by the lower die wedge member drive mechanism 1413, the lower first die wedge member 1411a of the lower die wedge member of the pair can be slid horizontally (left and right in the figure) (Slip). However, it is not limited to this. For example, the lower die second wedge member 1411b can be slid by the lower die wedge member driving mechanism 1413, and the lower die first wedge member 1411a and the lower die second wedge member 1411b can also be made Both slide. In addition, the lower die wedge member drive mechanism 1413 is not particularly limited, and for example, a servo motor, an air cylinder, or the like can be used.

In addition, in FIG. 1, the entire surface of each of the lower first wedge-shaped member 1411 a and the lower second wedge-shaped member 1411 b is an inclined surface. However, the present invention is not limited to this, and at least one wedge-shaped member can be slid along the inclined surface. For example, for one or both of the first wedge member 1411a of the lower mold and the second wedge member 1411b of the lower mold, only a part of one surface thereof may be a slope. More specifically, for example, for at least one of the lower first wedge member 1411a and the lower second wedge member 1411b shown in the figure, only the front end side (thin side) of one surface is a slope, and the root side (thick side) It can also be horizontal. and Moreover, although the lower first wedge member 1411a and the lower second wedge member 1411b are not in contact in FIG. 1, the lower first wedge member 1411a and the second lower die may be held in the same manner as the upper die wedge mechanism 1310. The state where the wedge member 1411b is in contact.

The upper surface of the lower mold second wedge member holding member 1422 is in contact with the lower surface of the lower mold first wedge member 1411a. On the other hand, the lower end of the lower mold cavity block column 1204 is connected to the upper surface of the second wedge member 1411b of the lower mold. That is, the lower die wedge members of the pair are arranged so as to be sandwiched between the upper surface of the lower die second wedge member holding member 1422 and the lower end of the lower mold cavity block column 1204. Then, by changing the length in the thickness direction of the lower die wedge member of the pair, the lower die cavity block 1201 can be moved up and down.

The lower die attaching member 1421 is arranged above the lower die second wedge member holding member 1422, and is fixed so as not to move up and down relative to the lower die second wedge member holding member 1422. It is possible to change the length in the thickness direction of the pair of lower mold wedge members by driving the lower mold wedge members in the space between the lower mold mounting member 1421 and the lower mold second wedge member holding member 1422 as described above. A lower mold side block 1202 and a groove block 1203 are provided on the upper surface of the lower mold mounting member 1421. In addition, the lower mold cavity block column 1204 penetrates the inside of the lower mold mounting member 1421 in the up-down direction and can move up and down. The lower mold elastic member 1205 is sandwiched between the lower surface of the lower mold cavity block 1201 and the upper surface of the lower mold mounting member 1421, and as described above, can expand and contract in the mold opening and closing direction (vertical direction in the figure).

In addition, the "lower model" provided in the lower model cavity block position changing mechanism setting section (another model cavity block position changing mechanism setting section) 1400 The cavity block position changing mechanism (another model cavity block position changing mechanism)" includes a lower mold wedge mechanism (another mold wedge mechanism) 1410 in this embodiment. However, the present invention is not limited to this, for example, the lower mold cavity block position is changed The mechanism (another model cavity block position changing mechanism) may further contain other constituent elements.

The manufacturing method of the resin molded product using the resin molding apparatus of FIG. 1 can be performed as shown in FIGS. 2-16, for example.

First, proceed as shown in FIGS. 2 to 4 to change the depth of the upper model cavity 1106 (a model cavity depth changing step). Specifically, it is as follows.

First, as shown in FIG. 2, the upper mold cavity block driving mechanism 1301 is used to lower the upper mold cavity block 1101 in the direction of arrow c1. At this time, the upper mold cavity block 1101 is lowered until the upper mold cavity 1106 is smaller than a predetermined (target) depth. As will be described later, by raising the upper mold cavity block 1101 again, the upper mold cavity 1106 is brought to a predetermined (target) depth.

Next, as shown in FIG. 3, the left and right upper mold first wedge members 1311a are respectively moved in the direction of the front end (direction of arrow e1). As a result, the length of the upper die wedge member in the pair of the upper die first wedge member 1311a and the upper die second wedge member 1311b in the thickness direction (mold opening and closing direction, vertical direction in the figure) increases. Then, as shown in the figure, the upper mold second wedge member holding member 1321 is pushed down by the upper mold second wedge member 1311b to descend. At this time, the second wedge member holding member 1321 of the upper mold is lowered to a position corresponding to a predetermined (target) depth of the upper mold cavity 1106.

Next, as shown in FIG. 4, the upper mold cavity block driving mechanism 1301 is used to raise the upper mold cavity block 1101 in the direction of arrow d1. At this time, as shown As shown, it rises until the upper mold cavity block holding member 1302 contacts the upper mold second wedge member holding member 1321. As a result, the upper and lower mold cavities 1106 on the left and right are the target depth (D1 on the right side of the figure and D2 on the left side of the figure).

In addition, in the present embodiment, for convenience of illustration and explanation, an example in which the depth of the upper mold cavity 1106 is different is shown on the left and right of the figure. However, in the present invention, the example of changing the depth of the mold cavity of the molding die is not limited to this. Specifically, for example, in the method of manufacturing a primary resin molded product, the depths of the mold cavities of all the molds of one resin molding device are made uniform. When the method of manufacturing a resin molded product is performed again, the upper To deal with the depth of the model cavity.

As described above, after changing the depth of the upper mold cavity 1106, resin molding can be performed as shown in FIGS. 5 to 16, for example. Specifically, it is as follows.

First, as shown in FIG. 5, the mold release film 40 is supplied to the mold surface (upper mold surface) of the upper mold 1100. Then, the upper mold surface is covered with the release film 40 by suction or the like (one mold surface covering step). As described later, a release film adsorption mechanism (not shown in FIG. 5) can be used. The “mold surface of the upper mold 1100 (upper mold surface)” that adsorbs the release film 40 includes the mold surface of the upper mold cavity 1106 and the lower surface of the upper mold cavity frame member 1102 as shown in the figure. Furthermore, at this time, as shown in the figure, the release film 41 is also supplied into the vent hole groove 1104. In the state of FIG. 5, since the vent hole 1104 is not blocked, the release film 40 can be adsorbed by the vent hole 1104.

In addition, the adsorption of the release film 40 can be performed as shown in FIG. 23, for example. In FIG. 23, the resin molding apparatus 1000 is equipped with a release film adsorption machine 建1351. The release film adsorption mechanism 1351 is not particularly limited. For example, a suction pump or the like can be used. Mold release film adsorption piping 1352 is provided on the pressing plate 1340, the upper mold cavity block position changing mechanism setting part frame member 1341, the upper mold cavity block position changing mechanism setting part bottom surface members 1342 and 1343, and the upper mold cavity frame member 1102 and 1103. The release film adsorption piping 1352 is divided into branch lines, and each end of the branch is opened as a release film adsorption hole 1353 at the lower ends of the upper mold cavity frame members 1102 and 1103. Then, by sucking from the other end of the mold release film suction pipe 1352 with the mold release film suction mechanism 1351, the mold release film suction holes 1353 can adsorb the mold release films 40 and 41 to the upper mold surface and the vent holes槽1104.

In addition, the release films 40 and 41 can be transported to the position of the forming mold by a release film transport mechanism (not shown) or the like, and then supplied to the mold surface (upper mold surface) of the upper mold 1100 as described above.

Furthermore, in this embodiment, an example in which the release films 40 and 41 are used is shown. However, the present invention is not limited to this, and for example, a release film may not be used.

Next, as shown in FIG. 6, the plate (resin material) 20 a is supplied into the groove 1211. At the same time, as shown in the figure, the article to be molded (object to be molded) 10 is supplied to the upper surface of the lower mold cavity block 1201 (object to be molded to supply step). The resin material 20a may be, for example, a thermosetting resin, but it is not limited thereto, and may be a thermoplastic resin, for example. At this time, the upper mold 1100 and the lower mold 1200 or only the lower mold 1200 may be heated and raised in advance by a heater (not shown). In addition, for example, the resin material 20a and the article to be molded 10 can be conveyed to the position of the mold by a conveying mechanism (not shown) and supplied to the mold.

Furthermore, in this embodiment, the article to be molded (object to be molded) 10 It is a substrate, hereinafter, sometimes simply referred to as "substrate 10". As shown in the figure, the substrate 10 has a wafer 1 and leads 2 placed (fixed) on one side. In the method of manufacturing a resin molded article of this embodiment, as shown in the figure, the fixed surface of the wafer 1 and the lead 2 of the substrate 10 is upward (upper mold cavity 1106 side), and the surface is resin-encapsulated as follows Manufacture of resin molded products (electronic accessories). However, in the present invention, the article to be molded (object to be molded) is not limited to this. The object to be molded (object to be molded) may be, for example, the above-mentioned lead frame, wiring board, wafer, ceramic substrate, or the like, or any other object to be molded (object to be molded).

Next, as shown in FIG. 7, the lower mold 1200 is raised in the direction of arrow X1 by a driving source (not shown), and the substrate 10 is sandwiched between the lower mold cavity block 1201 and the upper mold cavity frame member 1202. At this time, as shown in the figure, the resin material 20a is melted into molten resin (fluid resin) 20b by the heat of the lower mold 1200 which has been heated in advance.

Next, as shown in FIG. 8, the lower mold 1200 is further raised in the direction of arrow X2. Thus, the lower mold cavity block 1201 applies upward pressure to the substrate 10 sandwiched between the lower mold cavity block 1201 and the upper mold cavity frame member 1102. In so doing, the following mold cavity block 1201 and upper mold cavity frame member 1102 sandwich and fix the substrate 10 (the molded object fixing step).

Next, as shown in FIG. 9, the first wedge member 1411a of the lower mold is moved in the direction of the front end thereof (in the direction of arrow a1), and contacts the second wedge member 1411b of the lower mold. By fixing the lower first wedge member 1411a and the lower second wedge member 1411b at this position, the position of the lower mold cavity block 1201 in the vertical direction is fixed at this position.

Next, as shown in FIG. 10, the lower mold 1200 is lowered in the direction of arrow Y1, and the mold is temporarily opened. Thus, the first wedge member 1411a of the lower mold is temporarily separated from the second wedge member 1411b of the lower mold. This is done to facilitate the movement of the first wedge member 1411a of the lower die in FIG. 11 later.

Next, as shown in FIG. 11, the first wedge member 1411a of the lower mold is slightly moved in the front end direction (direction of arrow a2). Thus, the length of the lower die wedge in the pair of the first die wedge member 1411 a and the lower die wedge member 1411 b in the thickness direction is increased in consideration of the interference amount of the substrate 10.

Next, as shown in FIG. 12, the lower mold 1200 is raised in the direction of arrow X3, and the molding mold is closed again. Furthermore, the inside of the molding die (inside of the upper mold cavity 1106, etc.) is decompressed using a decompression mechanism (not shown). At this time, as shown in FIG. 13, the upward force is continuously applied to the lower mold 1200 in the direction of the arrow X4.

Next, as shown in FIG. 14, the plunger 1212 is moved upward (in the direction of arrow g1 ), and the fluid resin 20b in the groove 1211 is pushed into the upper mold cavity 1106.

Further, as shown in FIG. 15, the vent pin power mechanism 1331 pushes down the vent pin 1332 (in the direction of arrow h1) and blocks the vent slot 1104. Thereafter, as shown in the figure, the plunger 1212 is further raised in the direction of arrow g2, and the final filling of the fluid resin 20b in the upward mold cavity 1106 is performed. At this time, the upper mold cavity block 1101 is fixed using the upper mold wedge mechanism 1310 (the second mold cavity block fixing step). Further, the lower mold cavity block 1201 is fixed using the lower mold wedge mechanism 1410. So, because the upper model cavity block Since 1101 and the lower mold cavity block 1201 are fixed, even if resin pressure is applied to the upper mold cavity 1106, the movement of the upper mold cavity block 1101 and the lower mold cavity block 1201 in the mold opening and closing direction can be suppressed or prevented.

Further, as shown in FIG. 16, after the fluid resin 20 b is cured into a cured resin (encapsulating resin) 20 and an excess resin (useless resin) 20 d, the lower mold 1200 is lowered in the direction of arrow Y2 and the mold is opened. In addition, the method of curing the fluid resin 20b into the cured resin (encapsulating resin) 20 is not particularly limited. For example, when the fluid resin 20b is a thermosetting resin, it can be cured by further continuous heating. In addition, for example, when the fluid resin 20b is a thermoplastic resin, it can be solidified by stopping the heating of the mold and leaving it as it is. In this way, it is possible to manufacture a resin molded product (electronic accessory) in which one surface of the substrate 10 (the fixing surface of the wafer 1 and the lead 2) is encapsulated by the cured resin (encapsulation resin) 20. After that, the resin molded product is carried out and recovered by an unloader (not shown) or the like to the outside of the resin molding device 1000.

In addition, in the method of manufacturing a resin molded article of the present invention, the "resin molding step" is not limited to the method described in FIGS. 2 to 16. For example, although examples of transfer molding are shown in FIGS. 2 to 16, in the present invention, any other resin molding method such as compression molding can be used. In addition, the method of transfer molding is not limited to the method of FIGS. 2 to 16 and is arbitrary.

In the present invention, for example, as described in this embodiment, the depth of one mold cavity can be changed according to the thickness of the article to be molded. Furthermore, according to the resin molding apparatus of the present invention, it is possible to reduce the parts of the molding die The number can also reduce the cost of the molding die.

In addition, in changing the position of the one model cavity block, for example, the one mold wedge mechanism can be used. In addition, in the change of the position, the one model cavity block driving mechanism, the other mold wedge mechanism, etc. may be used as necessary, for example, as explained in this embodiment.

Moreover, the present invention is not limited to this embodiment, and can be arbitrarily changed. For example, in this embodiment, the "one mold" is an upper mold, and the "another mold" is a lower mold. However, the present invention is not limited to this. For example, on the contrary, the "one mold" may be a lower mold, and the "other mold" may also be an upper mold.

[Example 2]

Next, different embodiments of the present invention will be described.

In this embodiment, another example of a method of manufacturing a resin molded product using the resin molding device (FIG. 1) of Embodiment 1 will be described. More specifically, an example in which the "one model cavity depth changing step" of changing the depth of the upper model cavity 1106 is implemented in a method different from the method of Embodiment 1 (FIGS. 2 to 4).

The "one model cavity depth changing step" can be performed as shown in FIGS. 17 to 19, for example. Specifically, first, as shown in FIG. 17, the same resin molding apparatus 1000 as FIG. 1 is prepared. In FIG. 17, the depth of the initial upper model cavity 1106 is about the same, both of which are D0.

First, as shown in FIG. 18, the upper mold cavity block driving mechanism 1301 is used to lower the upper mold cavity block 1101 in the direction of arrow c101. thus, The depths of the upper and lower mold cavities 1106 on the left and right sides are respectively predetermined (target) depths.

Next, as shown in FIG. 19, the left and right upper die first wedge members 1311a are respectively moved in the direction of the front end (direction of arrow e101). As a result, the length of the upper mold wedge member in the pair of the upper mold first wedge member 1311a and the upper mold second wedge member 1311b in the thickness direction (mold opening and closing direction, vertical direction in the figure) is increased. Then, as shown in the figure, the upper mold second wedge member holding member 1321 is pushed down by the upper mold second wedge member 1311b and lowered. At this time, as shown in the figure, the upper mold second wedge member holding member 1321 is lowered until it contacts the upper mold cavity block holding member 1302. As described above, "one model cavity depth changing step" that changes the depth of the upper model cavity 1106 can be implemented. The subsequent resin molding can be performed in the same manner as in FIGS. 5 to 16 of Example 1, for example.

In addition, in FIGS. 17 to 19, for convenience of illustration and explanation, an example in which the depth of the upper mold cavity 1106 is changed to a different depth is shown on the left and right of the figure. However, as described in Embodiment 1, in the present invention, the example of changing the depth of the mold cavity of the molding die is not limited to this. Specifically, for example, as described in Example 1, in the method of manufacturing a primary resin molded product, the depths of the mold cavities of all the molds of one resin molding device are made uniform, and the resin molded product is manufactured again In the case of the method, it is possible to respond by changing the depth of the model cavity last time as needed.

[Example 3]

Next, another embodiment of the present invention will be described.

The resin molding apparatus of the present invention can, for example, only mold the mold Replace with other forming dies. Thereby, it is possible to easily cope with resin molding by molding dies of different specifications.

FIG. 20 is a cross-sectional view showing the structure of the same resin molding apparatus 1000 as FIG. 1 (Example 1). The structure of this resin molding apparatus is as illustrated in FIG. 1.

FIG. 21 schematically shows that the upper mold 1100 and the lower mold 1200 are removed from the resin molding apparatus 1000 of FIG. 20 (FIG. 1), and the upper mold cavity block position changing mechanism setting section (one mold cavity block position changing mechanism setting is retained) Section) 1300 and the lower model cavity block position changing mechanism setting section (another model cavity block position changing mechanism setting section) 1400. The structures of the upper mold cavity block position changing mechanism setting part 1300 and the lower mold cavity block position changing mechanism setting part 1400 are as illustrated in FIG. 1.

22 is a cross-sectional view schematically showing the structure of a resin molding apparatus in a state where an upper mold 1100a and a lower mold 1200a different from the apparatus of FIG. 20 (FIG. 1) are mounted on FIG. For the upper mold (one mold) 1100a, the upper mold cavity block (one mold cavity block) 1101 is replaced with the upper mold cavity block (one mold cavity block) 1101a, and the upper mold cavity frame member (one mold cavity frame member) is replaced. 1102 is provided with an upper model cavity frame member (one model cavity frame member) 1102a, instead of an upper model cavity frame member (one model cavity frame member) 1103, and an upper model cavity frame member (one model cavity frame member) 1103a, an alternative vent The groove 1104 includes a vent hole groove 1104a, a sliding hole 1105a instead of the sliding hole 1105, and an upper model cavity (one model cavity) 1106a instead of the upper model cavity (one model cavity) 1106. As far as the upper mold 1100a is concerned, except for the shape and size of each part (such as the upper mold cavity block and the upper mold cavity frame member), there are slight differences Otherwise, it is the same as the upper mold 1100 of FIG. 20 (FIG. 1). In addition, as for the lower mold (another mold) 1200a, a lower mold cavity block (another mold cavity block) 1201 is provided instead of the lower mold cavity block (another mold cavity block) 1201, and a lower mold side block (another Mold side block) 1202 is provided with a lower mold side block (another mold side block) 1202a, a groove block 1203a is provided instead of the groove block 1203, and a lower mold cavity is provided instead of the lower mold cavity block column (another mold cavity block column) 1204 The block column (another mold cavity block column) 1204a is provided with a lower mold elastic member (another mold elastic member) 1205a instead of the lower mold elastic member (another mold elastic member) 1205. The lower mold 1200a is the same as the lower mold 1200 of FIG. 20 (FIG. 1) except that the shapes and sizes of the parts (for example, the lower mold cavity block and the groove block) are slightly different.

For example, as shown in FIGS. 20 to 22, by replacing the molding die with a molding die of different specifications, it is also possible to cope with resin molding of different specifications. Specifically, for example, as shown in FIGS. 20 to 22, the shape of the upper mold cavity block can be changed in accordance with the necessary cavity shape. Moreover, for example, as shown in FIGS. 20-22, the shape of the lower mold cavity block can be changed according to the shape of the substrate used. Furthermore, as shown in FIGS. 20 to 22, for example, the shape of the groove block can be changed in accordance with the number and shape of the resin plates (resin materials) used. Furthermore, for example, the vent opening and closing mechanism can be moved in accordance with the shape of the molding die.

In the resin molding apparatus of the present invention, for example, as shown in FIGS. 1 to 22, the wedge mechanism (wedge mechanism) is not assembled as a part of the molding die, but the molding die and the wedge mechanism (wedge mechanism) are configured separately. Thus, for example, as shown in FIGS. 20 to 22, even if the wedge-shaped mechanism (wedge mechanism) is not exchanged or another wedge-shaped member (wedge) is not prepared, the molding die can be easily exchanged. Therefore, according to the present For the resin molding device of the present invention, for example, it is easy to exchange molding dies used for exchanging types of resin molded products.

Further, the present invention is not limited to the above-mentioned embodiments, and can be arbitrarily and appropriately combined, changed, or selected for use as needed without departing from the gist of the present invention.

The present invention claims priority based on Japanese application Japanese Patent Application No. 2017-209714 filed on October 30, 2017, and the entire contents of its disclosure are incorporated herein.

1000‧‧‧Resin molding device

1100‧‧‧ Upper mold (one mold)

1101‧‧‧Upper model cavity block (one model cavity block)

1102‧‧‧Up model cavity frame member (a model cavity frame member)

1103‧‧‧Up model cavity frame member (a model cavity frame member)

1104‧‧‧Ventilation slot

1105‧‧‧sliding hole

1106‧‧‧Up model cavity (one model cavity)

1200‧‧‧Lower mold (another mold)

1201‧‧‧Lower model cavity block (another model cavity block)

1202‧‧‧Lower mold side block (another mold side block)

1203‧‧‧Slot block

1204‧‧‧Lower model cavity block column (another model cavity block column)

1205‧‧‧Lower mold elastic member (another mold elastic member)

1211‧‧‧slot

1212‧‧‧ Plunger

1300‧‧‧Upper model cavity block position changing mechanism setting part (one model cavity block position changing mechanism setting part)

1301‧‧‧Up model cavity block drive mechanism (a model cavity block drive mechanism)

1302‧‧‧Up model cavity block holding member (one model cavity block holding member)

1303‧‧‧force measuring sensor (pressing force measuring mechanism)

1304‧‧‧Up model cavity block column (one model cavity block column)

1310‧‧‧ Upper die wedge mechanism (one die wedge mechanism)

1311a‧‧‧The first wedge member of the upper mold (the first wedge member of one mold)

1311b‧‧‧ Upper wedge member (the second wedge member of one mold)

1312‧‧‧ Upper die wedge member power transmission member (one mold wedge member power transmission member)

1313‧‧‧ Upper die wedge member drive mechanism (a mold wedge member drive mechanism)

1321‧‧‧ Upper mold second wedge member holding member (one mold second wedge member holding member)

1322‧‧‧Elastic member of the second wedge member holding member of the upper mold (elastic member of the second wedge member holding member of one mold)

1330‧‧‧ vent opening and closing mechanism

1331‧‧‧Ventilation pin power mechanism

1332‧‧‧ vent pin

1340‧‧‧Pressing plate (upper model cavity block position changing mechanism setting part base member or a model cavity block position changing mechanism setting part base member)

1341‧‧‧Upper model cavity block position changing mechanism setting part frame member (one model cavity block position changing mechanism setting part frame member)

1342, 1343 ‧‧‧ Upper model cavity block position changing mechanism setting part bottom surface member (one model cavity block position changing mechanism setting part bottom surface member)

1400‧‧‧ Lower model cavity block position changing mechanism setting part (another model cavity block position changing mechanism setting part)

1410‧‧‧Lower die wedge mechanism (another die wedge mechanism)

1411a‧‧‧The first wedge member of the lower mold (the first wedge member of the other mold)

1411b‧‧‧The second wedge member of the lower die (the second wedge member of the other die)

1412‧‧‧Lower die wedge member power transmission member (another die wedge member power transmission member)

1413‧‧‧Lower die wedge member drive mechanism (another die wedge member drive mechanism)

1421‧‧‧Lower mold mounting member (another mold mounting member)

1422‧‧‧Pressing plate (lower mold second wedge member holding member or another mold second wedge member holding member)

Claims (16)

A resin molding device includes: a molding die; a mold wedge mechanism; and a model cavity block driving mechanism; the foregoing molding die includes a mold and another mold; the foregoing one mold includes a model cavity block and a model cavity frame member; The aforementioned one model cavity frame member is formed with a sliding hole; the aforementioned one model cavity block can move in the sliding hole along the opening and closing direction of the mold of the forming mold; the face of the aforementioned one model cavity block opposite to the other mold and The inner surface of the aforementioned one model cavity frame member forms a model cavity; using the aforementioned one model cavity block driving mechanism can move the aforementioned one model cavity block in the mold opening and closing direction; further, using the aforementioned one model cavity block driving mechanism, the aforementioned one The model cavity block moves to the target height position, and is fixed using the aforementioned one mold wedge mechanism to restrict the position of the aforementioned one model cavity block moved to the aforementioned height position in the direction away from the aforementioned another mold, so that the aforementioned one model cavity can be changed depth. The resin molding apparatus according to claim 1, further comprising a pressing force measuring mechanism; the pressing force measuring mechanism can measure and use the aforementioned one model The cavity block driving mechanism presses the pressing force of the aforementioned one model cavity block. The resin molding apparatus according to claim 1 or 2, wherein the one mold wedge mechanism includes one mold wedge member of the pair; one mold wedge member of the pair includes one mold first wedge member and one mold first 2 wedge members; the first wedge member of the first mold and the second wedge member of the first mold respectively have slopes and are arranged so that the slopes of the two are opposed to each other; by moving the first wedge member of the first mold and the second die of the first one At least one of the wedge members can change the length of one wedge member of the pair in the mold opening/closing direction when the first wedge member of the one mold contacts the second wedge member of the one mold. The resin molding apparatus according to claim 1 or 2, wherein the resin molding apparatus further includes another mold wedge mechanism; the other mold includes another mold cavity block; and the other mold wedge mechanism can fix the other The position of the mold cavity block in the aforementioned mold opening and closing direction. The resin molding apparatus according to claim 4, wherein, in a state where the other mold is raised toward the one mold, and the one mold cavity frame member and the other mold cavity block press a part of the object to be molded, the The other mold cavity block is arranged closer to the position of the aforementioned one mold than the position where the aforementioned another mold wedge mechanism is used to fix the aforementioned another mold cavity block, so that the aforementioned another mold cavity block can be fixed The location of each model cavity block. The resin molding apparatus according to claim 4, wherein the other mold wedge mechanism includes the other mold wedge member in the pair; the other mold wedge member in the pair includes the other mold first wedge member and another A second wedge member of one mold; the first wedge member of the other mold and the second wedge member of the other mold respectively have slopes and are arranged so that the slopes of each other face each other; by moving the first wedge member of the other mold And at least one of the second wedge members of the other mold, when the first wedge member of the other mold comes into contact with the second wedge member of the other mold, the other wedge member of the pair can be changed in the mold Length in the opening and closing direction. The resin molding apparatus according to claim 3, wherein in the one mold wedge mechanism, when one mold of the pair is brought into contact with the first wedge member of the one mold and the second wedge member of the one mold The length of the wedge-shaped member in the mold opening and closing direction is shortened, and the depth of the aforementioned one model cavity can be deepened. The resin molding apparatus according to claim 3, wherein in the one mold wedge mechanism, when one mold of the pair is brought into contact with the first wedge member of the one mold and the second wedge member of the one mold The length of the wedge-shaped member in the mold opening and closing direction becomes longer, and the depth of the one model cavity can be made shallower. A method for manufacturing a resin molded product using a mold cavity Block drive mechanism and a mold wedge mechanism resin molding device; the aforementioned mold includes one mold and another mold; the aforementioned one mold includes a mold cavity block and a mold cavity frame member; and the aforementioned mold cavity frame member is formed with Sliding hole; the aforementioned one model cavity block can be moved in the sliding hole along the mold opening and closing direction of the aforementioned forming mold through the aforementioned one model cavity block driving mechanism; by using the aforementioned one mold wedge mechanism to fix the position of the aforementioned one model cavity block, Forming a model cavity with the surface of the one model cavity block opposite to the other mold and the inner side surface of the one model cavity frame member; the aforementioned manufacturing method includes the following steps: a step of supplying an object to be molded, and supplying the object to the molding die to be formed A mold cavity depth changing step, by changing the position of the mold cavity block of the mold opening and closing direction of the mold, to change the depth of the mold cavity; and a resin molding step, placing the molded object in the mold Resin molding is performed in the cavity; in the previous step of changing the depth of the model cavity, the model cavity block driving mechanism is used to move the model cavity block to the target height position, and the mold wedging mechanism is used to fix it to limit the movement to The aforementioned one model cavity block at the aforementioned height position is at Away from the aforementioned position in the other mold direction. The method for manufacturing a resin molded product according to claim 9, wherein the resin molding device is the resin molding device according to any one of claims 1 to 8. The method for manufacturing a resin molded product according to claim 9 or 10, wherein the another mold includes another mold cavity block, and the manufacturing method further includes another mold cavity block position changing step to change the other mold cavity block Position in the aforementioned mold opening and closing direction. The method for manufacturing a resin molded product according to claim 11, wherein the resin molding apparatus further includes another mold wedge mechanism, and in the step of changing the position of the other mold cavity block, the other mold rises toward the one mold , And in a state where the one model cavity frame member and the other model cavity block press a part of the object to be molded, by setting the other model cavity block to be fixed to the other model cavity block by using the other mold wedge mechanism The position is closer to the position of the aforementioned one mold. The method for manufacturing a resin molded product according to claim 11, wherein the resin molding device is the resin molding device according to claim 4 or 6. The method for manufacturing a resin molded product as described in claim 9 or 10, wherein the mold cavity depth changing step is performed before the molded object supply step. The method for manufacturing a resin molded product as described in claim 9 or 10, which further includes a mold surface covering step before being covered with a release film Describe the mold surface of one mold; before performing the aforementioned one mold surface covering step, perform the aforementioned one model cavity depth changing step. The method for manufacturing a resin molded product according to claim 9 or 10, wherein the object to be molded includes a plurality of substrates; and the resin to be molded is resin-molded by encapsulating the resin between the substrates.

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