JP6721412B2 - Resin setting method and resin molding method - Google Patents

Description

The present invention relates to a resin setting technique and a resin molding technique.

Japanese Unexamined Patent Application Publication No. 2007-307843 (hereinafter referred to as "Patent Document 1") describes a method of resin-molding a work (molded article) using a sheet resin. Here, after opening the molding die and setting the work, the sheet resin is supplied onto the work so as to cover the resin mold region of the work.

JP, 2007-307843, A

As described in Patent Document 1, when the sheet resin is supplied onto the work set in the molding die in the mold opened state, the sheet resin is softened by the radiant heat of the molding die set to the molding temperature by the heater in advance. Will end up. Therefore, for example, when using a substrate on which a plurality of chip components are mounted as a work having a concavo-convex portion, there is a risk that the sheet resin will be softened while air is entrapped between the sheet resin covering the chip components and the substrate. is there. In this case, voids may occur in the resin-molded portion of the molded product due to air inclusion.

An object of the present invention is to provide a technique capable of suppressing air from entering the resin set. One and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

The following is a brief description of the outline of the typical invention disclosed in the present application.

A resin molding method according to one solution of the present invention is a resin setting method in which a resin that is heated and pressed in a cavity of a molding die to be thermoset in a shape of the cavity is set on a workpiece as a supply target , ) wherein the step of supplying a sheet resin used as the resin onto a feed, (b) after step (a), a step of setting said target feed to the chamber opened, (c) After the step (b), the chamber is closed, and the inside of the chamber is depressurized while heating the resin, and (d) after the step (c), the pressure inside the chamber is adjusted. The supply target supplied with the resin by a resin setting method including a step of raising the temperature, and (e) after the step (d), the chamber is opened and the supply target is taken out. The method includes a step of bringing the resin into the molding die and heating and pressing the resin in the cavity of the molding die to thermally cure the resin. The work is composed of a substrate on which chip components are mounted, and in the step (a), The sheet resin is supplied so that the outer end of the sheet resin is outside the mounting position of the chip component, and in the step (c), the outer end of the heated sheet resin is the outer end of the chip component. Contacting the substrate of the work on the outside, and in the step (d), by applying pressure to the sheet resin in a state where the outer end of the sheet resin is in contact with the substrate, the sheet resin is transferred to the substrate. It is characterized in that it is in a state of conforming to the concavo-convex portion formed by the chip component . According to which this can reduce the gap between the release film or the workpiece and the resin which is to be feed, it can be molded which prevents problems such as unfilled.

Here, in the step (a), a resin is supplied onto the supply target having an uneven portion so as to cover the uneven portion, and in the step (d), the resin is applied to the uneven portion of the supply target. Is more preferable. According to this, it is possible to prevent the formation of a gap between the uneven portion and the resin.

Further, in the step (c), it is more preferable to depressurize the inside of the chamber while heating the resin. According to this, the supply target can be covered with the softened resin.

Further, it is more preferable to cool the resin after the step (c). According to this, the reaction of the resin can be suppressed.

Further, in the step (a), it is more preferable that a sheet resin is used as the resin. According to this, the resin can be uniformly supplied.

It is more preferable that the supply target to which the resin has been supplied by the resin setting method is carried into a molding die, and the resin is heated and pressed in the cavity of the molding die to be thermoset. According to this, it is possible to suppress the occurrence of voids due to air mixing in the resin molded portion of the molded product.

The effect obtained by the representative one of the inventions disclosed in the present application will be briefly described as follows. According to the solving means of the present invention, it is possible to prevent air from entering the resin set.

It is a figure for explaining the resin setting device concerning one embodiment of the present invention. It is a figure for demonstrating the resin setting apparatus in operation following FIG. It is a figure for demonstrating the resin setting apparatus in operation following FIG. It is a figure for demonstrating the resin setting apparatus in operation following FIG. It is a figure for demonstrating the resin setting apparatus in operation following FIG. It is a figure for demonstrating the principal part of the resin molding apparatus which concerns on one Embodiment of this invention. It is a figure for demonstrating the principal part of the resin molding apparatus in operation following FIG. It is a figure for demonstrating the principal part of the resin molding apparatus in operation following FIG. It is a figure for demonstrating the principal part of the resin molding apparatus in operation following FIG.

In the following embodiments of the present invention, description will be made by dividing into a plurality of sections and the like when necessary, but in principle, they are not independent of each other, and one is a relation of some or all of modifications and details of the other. It is in. Therefore, members having the same function are denoted by the same reference symbols throughout the drawings, and the repeated description thereof will be omitted. In addition, the number of constituent elements (including the number, numerical value, amount, range, etc.) is not limited to the specific number unless otherwise specified or in principle limited to the specific number. The number is not limited to a specific number and may be a specific number or more or less. Further, when referring to the shape of a component or the like, it is meant to include those that are substantially similar to or similar to the shape, etc., unless otherwise specified, or where it is considered that the principle is not clear otherwise. ..

A resin setting device 10 and a resin molding device 50 including the same according to an embodiment of the present invention will be described with reference to FIGS. 1 to 9. 1 to 5 are views for explaining the resin setting device 10 in operation. 6 to 9 are views for explaining a main part of the resin molding device 50 in operation. In the present embodiment, the work W is used as the supply target to which the resin R is supplied.

First, the configuration of the resin setting device 10 will be described. As shown in FIG. 1 and the like, the resin setting device 10 includes a chamber 11 in which a resin R and a work W (supply target) are placed. The chamber 11 includes a pair of chamber portions (one is an upper chamber portion 12 and the other is a lower chamber portion 13) and is configured to be openable and closable. The work W is set on the surface 13a (setting surface) of the lower chamber portion 13.

The elevating part of the resin setting device 10 is controlled by a control part (not shown). The control unit is a computer including a CPU (central processing unit) and a storage unit such as a ROM and a RAM, and the CPU reads and executes various control programs recorded in the storage unit. , And controls the operation of the constituent elements of the respective parts constituting the resin setting device 10. In the present embodiment, the resin molding device 50 including the resin setting device 10 is described as including the control unit, but the resin setting device 10 may include the control unit by itself.

The upper chamber section 12 and the lower chamber section 13 are made of a material, such as metal, which can withstand an arbitrary pressure state in the chamber 11. When the chamber 11 is in the closed state, the upper chamber portion 12 having the concave portion and the lower chamber portion 13 are in contact with each other, so that the inside 11a (in the closed state) of the chamber 11 is formed (see FIG. 2). Although not shown in the figure, an appropriate sealing mechanism can be provided between the upper chamber portion 12 and the lower chamber portion 13.

Further, the resin setting device 10 includes a decompression unit 14 (for example, a vacuum pump) that sucks air inside the chamber 11 to form a decompressed state. The decompression unit 14 forms a decompressed state by air-suctioning the inside 11a of the chamber 11 through the air passage 15 provided in the upper chamber 12 when the inside 11a of the chamber 11 is formed. The decompression unit 14 is controlled by the control unit.

Further, the resin setting device 10 includes a heating unit 16 that heats the chamber 11. A plurality of heating units 16 (for example, cartridge heaters) are provided so as to extend in parallel with the surface 13a of the lower chamber unit 13. Further, the resin setting device 10 includes a cooling unit 17 that cools the chamber 11. A plurality of cooling units 17 (for example, cooling pipes in which a refrigerant circulates) are provided so as to extend parallel to the surface 13 a of the lower chamber unit 13. Thereby, the resin R of the work W set on the surface 13a can be heated or cooled. The heating unit 16 and the cooling unit 17 are controlled by the control unit. The heating unit 16 and the cooling unit 17 may be provided in the upper chamber unit 12 or both the upper chamber unit 12 and the lower chamber unit 13.

Here, as shown in FIG. 2, a cooling unit 17 can be provided on the surface 13a side of the heating unit 16. Thereby, the cooling unit 17 can be operated so as to block the heat from the heating unit 16 with respect to the surface 13 a of the lower chamber unit 13. For example, the resin R of the work W set on the surface 13a can be quickly changed from a heated state to a cooled state.

Next, the configuration of the resin molding device 50 shown in FIG. 6 and subsequent figures will be described. The resin molding device 50 includes a press unit including a molding die 60 that can be opened and closed by a known die opening/closing mechanism. The molding die 60 includes a pair of dies (one is an upper die 61 and the other is a lower die 62) opened and closed by a press section.

Further, in the resin molding device 50 as an automatic machine, the press section is provided together with the supply section and the storage section (not shown). In the supply unit, preparation and processing for supplying the work W (here, the product to be molded) and the resin R to the press unit are performed. The resin setting device 10 is provided in this supply unit. In the storage section, preparation and processing for storing the resin-molded work W (here, a molded product) are performed. Further, for transporting the work W and the resin R between the supply unit, the press unit, and the storage unit, a loader (not shown) that carries in the press unit and an unloader (not shown) that carries out the work unit from the press unit. Are used, and these are configured by a known mechanism. The mold opening/closing mechanism, the loader and the unloader are controlled by the control unit. As described above, it is preferable to integrally provide the resin setting device 10 and the resin molding device 50 for the reason of transportation as described later, but they may be provided separately.

The upper die 61 includes an upper clamper 63, a cavity piece 64, and an upper base 65, and these die blocks (for example, made of alloy tool steel) are assembled and configured. A through hole 63a is formed in the upper clamper 63 in the thickness direction, and a cavity piece 64 is provided in the through hole 63a. The cavity piece 64 is fixedly supported by the upper base 65. In the present embodiment, the upper die 61 includes the cavity recess 67, but the side of the cavity recess 67 is configured by the upper clamper 63, and the back of the cavity recess 67 is configured by the cavity piece 64. Further, the upper die 61 includes an elastic member 66 (for example, a spring) provided between the upper clamper 63 and the upper base 65. The upper clamper 63 is assembled to the upper base 65 via the elastic member 66, and is configured to be reciprocally movable in the mold opening/closing direction. When the molding die 60 is closed, the cavity recess 67 is closed to form the cavity C (see FIG. 7). In such a molding die 60, by covering the die surface of the cavity recess 67, the contact between the resin R and the die surface is prevented, the mold release is promoted, and the resin leakage from the sliding portion is prevented. Preventing release film can be used.

The upper die 61 also includes a seal member 70 (for example, an O-ring) provided between the inner peripheral surface of the through hole 63 a of the upper clamper 63 and the outer peripheral surface of the cavity piece 64. The resin molding device 50 also includes a vacuum unit 71 (for example, a vacuum pump) that sucks air into the cavity C to form a vacuum state. The vacuum unit 71 forms a vacuum state by sucking air in the cavity C through an air passage 72 provided in the upper clamper 63 of the upper die 61 in a state where the cavity C is formed by closing the die. Further, the resin molding device 50 includes a heating unit 68 that heats the upper mold 61. A plurality of heating units 68 (for example, cartridge heaters) are provided so as to extend parallel to the lower surface of the cavity piece 64 (the inner surface of the cavity recess 67). The vacuum unit 71 and the heating unit 68 are controlled by the control unit.

The lower die 62 includes a lower clamper 73, an insert 74, and a lower base 75, and is configured by assembling these die blocks. Through holes 73a are formed in the lower clamper 73 in the thickness direction, and inserts 74 are provided in the through holes 73a. The insert 74 is fixedly supported by the lower base 75. In the lower mold 62, the work W is set on the upper surface of the insert 74. Further, the lower die 62 includes an elastic member 76 (for example, a spring) provided between the lower clamper 73 and the lower base 75. The lower clamper 73 is assembled to the lower base 75 via the elastic member 76, and is configured to be reciprocally movable in the mold opening/closing direction.

The lower mold 62 also includes a seal member 79 (for example, an O-ring) provided between the inner peripheral surface of the through hole 73 a of the lower clamper 73 and the outer peripheral surface of the insert 74. Further, the lower mold 62 is provided on the upper surface of the lower clamper 73, and includes a seal member 80 (for example, an O-ring) that contacts the lower surface of the upper clamper 63 of the upper mold 61 when the mold is closed. Further, the resin molding device 50 includes a vacuum unit 81 (for example, a vacuum pump) that sucks the cavity C by air to bring it into a vacuum state. The vacuum section 81 forms a vacuum state by sucking air in the cavity C through an air passage 82 provided in the lower clamper 73 of the lower die 62 in a state where the cavity C is formed by closing the die. Further, the resin molding device 50 includes a heating unit 78 that heats the lower mold 62. A plurality of heating units 78 (for example, cartridge heaters) are provided so as to extend parallel to the upper surface of the insert 74. The vacuum section 81 and the heating section 78 are controlled by the control section.

Next, a resin setting method (a method of operating the resin setting device 10) will be described. First, after supplying (mounting) the resin R onto the work W, as shown in FIG. 1, the work W supplied with the resin R is set in the open chamber 11. The work W is set in the chamber 11 by a loader.

As the work W on which the resin R is set, for example, a substrate 101 on which a plurality of chip components 100 (semiconductor chips or the like) are flip-chip mounted by fine bumps (for example, a temporary carrier having a wiring structure, a wiring substrate, a wafer) is mounted. Etc.) is used. In such a work W, a narrow portion (a bump height or a gap between bumps having a narrow pitch) is formed between the chip component 100 and the substrate 101. In this case, the work W has the uneven portion 102 by mounting the plurality of chip components 100 on the substrate 101. In the present embodiment, the resin R is supplied onto the work W having the uneven portion 102 so as to cover the uneven portion 102. A sheet resin (a thermosetting resin such as a sheet-shaped epoxy resin) is used as the resin R. According to the sheet resin, even if the size of the work W is large (for example, a wafer level of 12 inches or a large panel-like shape whose one side length exceeds 300 mm), the work W is covered. It is possible to obtain a state in which they are uniformly supplied.

Here, as the resin R which is a sheet resin, for example, one protected by a protective sheet can be used. In this case, when using a sheet whose one surface is protected by a protective sheet, the protective sheet can be placed on the opposite side of the workpiece W and set on the workpiece W together with the protective sheet. In this case, the protective sheet can prevent the resin R from being deteriorated or stained. In this case, the protective sheet may be peeled off after setting the resin R on the work W. Also, a plurality of sheets of resin R, which is a sheet resin, may be used in a stacked manner. Further, as the resin R, a plurality of sheet resins (resin R) having an arbitrary area may be lined up and used on the work W.

Subsequently, as shown in FIG. 2, the chamber 11 is closed and the inside 11a of the chamber 11 is depressurized. At this time, the inside 11a of the chamber 11 is depressurized while heating the resin R. Specifically, the elevating part brings the upper chamber part 12 closer to the lower chamber part 13. At this time, by starting the air suction by the decompression unit 14, the inside 11a is formed and the pressure can be immediately reduced. Further, by heating the inside 11a of the chamber 11 by the heating unit 16, the work W and the resin R can be heated and the resin R can be softened. Here, by providing the heating unit 16 in the lower chamber portion 13 on which the work W is placed, the work W can be directly heated by heat conduction and can be quickly heated. As described above, since the resin R on the work W is heated by the heating unit 16, the heating time in the resin molding device 50 can be shortened and the molding time can be shortened. Note that by heating the lower chamber portion 13 in advance, it is possible to heat the entire chamber 11 including the upper chamber portion 12 by the radiant heat and heat the resin R even from the upper surface to facilitate softening.

As a result, the work W can be covered with the resin R in a softened state (soft state) in the depressurized chamber 11. In this case, as shown in FIG. 2, the resin R may be in close contact with the substrate 101, for example, on the outer periphery of the work W, and the space sandwiched between the resin R and the substrate 101 is depressurized. .. At this time, after appropriately reducing the pressure and heating, the heating unit 16 may be stopped at a predetermined timing so that the crosslinking reaction of the resin R does not proceed too much in the reduced pressure state of the inside 11a. It should be noted that if the sheet resin used as the resin R is in a soft state in the atmosphere, the heating unit 16 does not have to heat it.

Subsequently, as shown in FIG. 3, the pressure of the inside 11a of the chamber 11 is increased in the state where the chamber 11 is closed. Specifically, the inside 11a of the chamber 11 may be opened to the atmosphere by stopping the decompression unit 14 and opening the chamber 11. Here, when the pressure in the inside 11a of the chamber 11 is raised, not only the method of opening to the atmosphere but also releasing the depressurized state in order to make it higher than the pressure in the inside 11a in the depressurized state described with reference to FIG. And actively pressurizing are included. In this way, the pressure of the inside 11a of the chamber 11 becomes relatively high, so that the resin R is pressed against the work W side. Further, at this time, the gap between the work W and the resin R can be reduced. In the present embodiment, the resin R can be adhered to the work W so as to be along the uneven portion 102. According to this, it is possible to prevent the formation of the gap between the uneven portion 102 and the resin R.

It is also possible to connect a pressurizing unit (for example, a compressor) to the air passage 15 separately from the depressurizing unit 14, stop the depressurizing unit 14, and then increase the pressure in the inside 11a of the chamber 11 by the pressurizing unit. .. It is also possible to connect a flow meter to the air passage 15 and adjust the pressure of the inside 11a of the chamber 11 while measuring with the flow meter.

Subsequently, as shown in FIG. 4, it is possible to cool the work W and the resin R with the chamber 11 closed. Specifically, by cooling the lower chamber section 13 by the cooling section 17, the resin R of the work W on the surface 13a is cooled, and the crosslinking reaction proceeds even if the resin R has heat. Can be suppressed, and a grace period for transporting the work W and the resin R to the molding die 60 can be secured. Note that the resin R may be cooled by the cooling unit 17 after the resin R is heated and softened to cover the work W.

Then, as shown in FIG. 5, the chamber 11 is opened. After that, the work W is taken out from the chamber 11 by the loader. According to such a resin setting method, the resin R can be set on the work W in a state where air is removed from between the work W and the resin R. That is, it is possible to prevent air from entering the resin set. In other words, the resin set can be in a state where air is not contained between the work W and the resin R. As shown in the figure, it is conceivable that a space not filled with the resin R exists between the chip component 100 and the substrate 101. However, since this region is decompressed and then covered with the molten resin R, it is possible to maintain the state in which the components (air and water vapor) contained in the atmosphere are removed from the space under the chip component 100.

Next, a resin molding method (a method of operating the resin molding device 50) will be described. First, the work W to which the resin R has been supplied by the resin setting method described above is carried into the molding die 60 as shown in FIG. Specifically, the work W is conveyed from the resin setting device 10 to the molding die 60 opened by the loader and set on the upper surface of the lower clamper 73. In this case, as described above, as long as the resin R is cooled by the cooling unit 17, even if a thermosetting resin that cures at a predetermined temperature is used, the cure proceeds during transportation. Thus, it is possible to prevent a situation in which it becomes difficult for the molding die 60 to flow when heated and pressed.

Subsequently, as shown in FIG. 7, the molding die 60 is closed, and the cavity C of the molding die 60 is depressurized (vacuum). Specifically, the upper mold 61 is moved closer to the lower mold 62 by the mold opening/closing mechanism. As a result, the resin R is housed in the cavity C. At this time, by starting air suction by the vacuum unit 71, the cavity C is formed and the pressure can be immediately reduced to a vacuum state.

Subsequently, as shown in FIG. 8, the molding die 60 is further closed and compression molding is performed until a predetermined molding pressure is reached. At this time, since the molding die 60 is heated to the molding temperature by the heating unit 78, the resin R is heated and pressed by the molding die 60. In this case, in the work W, a narrow portion (a bump height or a gap between bumps having a narrow pitch) is formed between the chip component 100 and the substrate 101. Even if there is such a narrow portion, since the components (air and water vapor) contained in the atmosphere are removed from the space under the chip component 100 as described above, it is possible to fill without filling the void, Can be suppressed and underfilling can be performed. Thereafter, necessary and sufficient heating and pressurization is performed, and the resin R is thermoset into the shape of the cavity C of the molding die 60 to complete the process.

Subsequently, as shown in FIG. 9, the molding die 60 is opened and the work W (molded product) is unloaded from the molding die 60. Specifically, the upper mold 61 is moved away from the lower mold 62 by the mold opening/closing mechanism. The work W is taken out from the molding die 60 whose mold has been opened by the unloader and is carried out to the storage section.

In this embodiment, air is prevented from entering between the work W and the resin R by the above-described resin setting method before resin molding. Therefore, it is possible to suppress the generation of voids due to air mixing in the resin molding portion of the work W (molded product). Further, in the work W, even if there is a narrow portion between the chip component 100 and the substrate 101, the mixture of air is suppressed (air and water vapor contained in the atmosphere are removed), so that the generation of voids is suppressed. The underfill can be reliably performed.

Although the present invention has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention.

In the above embodiment, the case where the sheet resin is used as the resin that covers the work has been described. However, the present invention is not limited to this, and it is also possible to use a granular resin as the resin and cover the work in a state in which it is heated and melted to be integrated by the surface tension (leveled state). According to this, the air can be removed from between the granular resins and the work can be covered with the resin. Alternatively, the granular resin may be pressed in advance to be formed into a sheet shape and used as a sheet resin.

Moreover, in the said embodiment, the case where the board|substrate by which the some chip component was flip-chip mounted was used as a workpiece|work as an example of a to-be-supplied material was demonstrated. The present invention is not limited to this, and a flat heat dissipation plate, a shield plate, or the like may be used as the work, and these may have an uneven portion for heat conduction or electric conduction. Further, the work may be a wafer in which chips are not provided and only bumps are mounted, or an adhesive film may be attached to one surface of a ring member and a chip member or the like may be attached to the adhesive film. .. Even in these cases, it is possible to prevent the generation of a gap between the work and the sheet resin, and even if there is a gap, it is possible to remove air, water vapor, and the like contained in the atmosphere to prevent unfilling.

Further, the supply target may be a release film. In this case, for example, a configuration in which the resin molding device 50 shown in FIG. 6 is turned upside down and a release film is supplied to the lower mold is conceivable. In this case, it is conceivable that the resin R, which is a sheet resin, is set on the release film, and then the work W to be carried into the resin molding device 50 and separately carried is resin-molded. In this case also, since air can be removed even if air is trapped in the gap between the release film and the resin R, the residual air expands, causing a defect in molding such that a mark remains on the molded product. Can be prevented.

11 chamber 11a internal R resin W work

Claims (4)

Heated and pressed in a mold cavity a resin is thermally cured in the shape of the cavity as the resin sets a method for setting the workpiece which is an object to be feed,
(A) a step wherein the supplying sheet resin used as the resin onto a feed,
(B) a step of setting the supply target in the open chamber after the step (a),
(C) after the step (b), the chamber is closed, and the inside of the chamber is depressurized while heating the resin ;
(D) a step of increasing the pressure inside the chamber after the step (c),
(E) After the step (d), the chamber is opened, and the supply target is taken out. The supply target supplied with the resin is transferred to the molding die by a resin setting method. A step of carrying in and heating and pressurizing the resin in the cavity of the molding die to thermally cure the resin;
The work is composed of a board on which chip components are mounted,
In the step (a), the sheet resin is supplied so that the outer end of the sheet resin is outside the position where the chip component is mounted,
In the step (c), the outer end of the heated sheet resin contacts the substrate of the work outside the chip component,
In the step (d), pressure is applied to the sheet resin in a state where the outer end of the sheet resin is in contact with the substrate, so that the sheet resin is formed into an uneven portion composed of the substrate and the chip component. A resin molding method, characterized in that the resin molding method is in conformity . The resin molding method according to claim 1 ,
A resin molding method comprising cooling the resin after the step (c). In the resin setting method of setting the resin to be heat-pressurized in the cavity of the molding die and thermosetting to the shape of the cavity to the release film which is the supply target ,
(A) supplying a sheet resin used as the resin onto the supply target;
(B) a step of setting the supply target in the open chamber after the step (a),
(C) after the step (b), the chamber is closed, and the pressure inside the chamber is reduced.
(D) a step of increasing the pressure inside the chamber after the step (c),
(E) After the step (d), the chamber is opened and the supply target is taken out.
A method of setting a resin , comprising : The object to be supplied, to which the resin has been supplied by the resin setting method according to claim 3, is carried into the molding die, and the resin is heated and pressed in the cavity of the molding die to be thermoset. Resin molding method.

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