JP2017209905A - Rein set method and resin molding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique capable of suppressing contamination of air in a resin set.SOLUTION: In a resin set method for setting a resin (R) which is thermally cured to a shape of a cavity by heating and compression in the cavity of a molding mold to a work (W) as an article to be supplied, the resin (R) is supplied onto the work (W) first. Then a chamber (11) with an opening state is set to the work (W). Then the chamber (11) is set at a closed state and pressure is reduced inside (11a) of the chamber (11). Then pressure inside (11a) of the chamber (11) is increased. Then the chamber (11) is set at an open state and the work (W) is taken out.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a resin setting technique and a resin molding technique.

  Japanese Patent Application Laid-Open No. 2007-307843 (hereinafter referred to as “Patent Document 1”) describes a method of resin molding a work (molded product) using a sheet resin. Here, after opening the molding die and setting the work, the sheet resin is supplied onto the work so as to cover the resin mold region of the work.

JP 2007-307843 A

  As described in Patent Document 1, when sheet resin is supplied onto a work set in a mold that has been opened, the sheet resin is softened by the radiant heat of the mold that has been set to a molding temperature in advance by a heater. End up. For this reason, for example, when using a substrate on which a plurality of chip components are mounted as a workpiece having an uneven portion, the sheet resin may be softened while air is entrained between the sheet resin covering the chip components and the substrate. is there. In this case, there is a possibility that a void due to air mixing may occur in the resin molded portion of the molded product.

  An object of the present invention is to provide a technique capable of suppressing air from being mixed in a resin set. One and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  A resin setting method according to one solving means of the present invention is a resin setting method in which a resin to be heated and pressed in a cavity of a molding die and thermally cured to the shape of the cavity is set in a supply object. A step of supplying resin onto an object, (b) a step of setting the workpiece in an open chamber after the step (a), and (c) closing the chamber after the step (b). A step of reducing the pressure inside the chamber, (d) a step of increasing the pressure inside the chamber after the step (c), and (e) after the step (d), the chamber And a step of taking out the material to be supplied. More preferably, the material to be supplied is a workpiece. More preferably, the material to be supplied is a release film. According to this, the clearance gap between the release film or workpiece | work which is a to-be-supplied material, and resin can be reduced, and shaping | molding which prevented malfunctions, such as unfilling, can be performed.

  Here, in the step (a), a resin is supplied on the supply object having an uneven portion so as to cover the uneven portion, and in the step (d), the resin is supplied to the uneven portion of the supply object. It is more preferable to keep it along. According to this, generation | occurrence | production of the clearance gap between an uneven | corrugated | grooved part and resin can be prevented.

  In the step (c), it is more preferable to decompress the interior of the chamber while heating the resin. According to this, the supply object can be covered with the softened resin.

  Moreover, it is more preferable to cool the resin after the step (c). According to this, it can suppress that resin reacts.

  In the step (a), a sheet resin is more preferably used as the resin. According to this, it can be set as the state which supplied resin uniformly.

  More preferably, the material to which the resin is supplied by the resin setting method is carried into a molding die, and the resin is heated and pressurized in a cavity of the molding die to be thermally cured. According to this, generation | occurrence | production of the void by air mixing can be suppressed in the resin molding part of a molded product.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows. According to the solution means of the present invention, air can be prevented from being mixed in the resin set.

It is a figure for demonstrating the resin setting apparatus which concerns on one Embodiment of this invention. It is a figure for demonstrating the resin setting apparatus in operation | movement following FIG. It is a figure for demonstrating the resin setting apparatus in operation | movement following FIG. It is a figure for demonstrating the resin setting apparatus in operation | movement following FIG. It is a figure for demonstrating the resin setting apparatus in operation | movement following FIG. It is a figure for demonstrating the principal part of the resin molding apparatus which concerns on one Embodiment of this invention. It is a figure for demonstrating the principal part of the resin molding apparatus in operation | movement following FIG. It is a figure for demonstrating the principal part of the resin molding apparatus in operation | movement following FIG. It is a figure for demonstrating the principal part of the resin molding apparatus in operation | movement following FIG.

  In the following embodiments of the present invention, the description will be divided into a plurality of sections when necessary. However, in principle, they are not irrelevant to each other, and one of them is related to some or all of the other modifications, details, etc. It is in. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted. In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .

  A resin setting apparatus 10 according to an embodiment of the present invention and a resin molding apparatus 50 including the same will be described with reference to FIGS. 1-5 is a figure for demonstrating the resin setting apparatus 10 in operation | movement. 6-9 is a figure for demonstrating the principal part of the resin molding apparatus 50 in operation | movement. In the present embodiment, the workpiece W is used as the supply object to which the resin R is supplied.

  First, the configuration of the resin setting device 10 will be described. As shown in FIG. 1 and the like, the resin setting device 10 includes a chamber 11 on which a resin R and a workpiece W (supplied material) are placed. The chamber 11 includes a pair of chamber portions (one is an upper chamber portion 12 and the other is a lower chamber portion 13) and is configured to be openable and closable. The workpiece W is set on the surface 13a (set surface) of the lower chamber portion 13.

  As for this resin setting apparatus 10, the raising / lowering part is controlled by the control part which is not shown in figure. The control unit is a computer that includes a CPU (Central Processing Unit) and a storage unit such as a ROM and a RAM, and the CPU reads and executes various control programs recorded in the storage unit. The operation of the constituent elements of each part constituting the resin setting device 10 is controlled. In addition, although this embodiment demonstrates as what the resin molding apparatus 50 provided with the resin setting apparatus 10 is provided with the control part, the resin setting apparatus 10 may be provided with the control part independently.

  The upper chamber portion 12 and the lower chamber portion 13 are made of a material such as metal that can withstand an arbitrary pressure state in the chamber 11. When the chamber 11 is in a closed state, the upper chamber portion 12 having a recess and the lower chamber portion 13 come into contact with each other, thereby forming the interior 11a (becomes closed) of the chamber 11 (see FIG. 2). Although not shown in the drawing, an appropriate sealing mechanism can be provided between the upper chamber portion 12 and the lower chamber portion 13.

  Further, the resin setting device 10 includes a decompression unit 14 (for example, a vacuum pump) that sucks air inside the chamber 11 to form a decompressed state. In the state where the interior 11 a of the chamber 11 is formed, the decompression unit 14 sucks the interior 11 a through the air path 15 provided in the upper chamber unit 12 to form a decompressed state. The decompression unit 14 is controlled by the control unit.

  The resin setting device 10 includes a heating unit 16 that heats the chamber 11. A plurality of heating units 16 (for example, cartridge heaters) are provided so as to extend in parallel with the surface 13 a of the lower chamber unit 13. In addition, the resin setting device 10 includes a cooling unit 17 that cools the chamber 11. A plurality of cooling parts 17 (for example, cooling pipes through which the refrigerant circulates) are provided so as to extend in parallel with the surface 13 a of the lower chamber part 13. Thereby, the resin R of the workpiece W set on the surface 13a can be heated or cooled. The heating unit 16 and the cooling unit 17 are controlled by the control unit. The heating unit 16 and the cooling unit 17 may be provided in the upper chamber unit 12 or in both the upper chamber unit 12 and the lower chamber unit 13.

  Here, as shown in FIG. 2, the cooling unit 17 can be provided on the surface 13 a side from the heating unit 16. Thereby, the cooling unit 17 can be operated so as to block the heat from the heating unit 16 with respect to the surface 13 a of the lower chamber unit 13. For example, the resin R of the workpiece W set on the surface 13a can be quickly shifted from a heated state to a cooled state.

  Next, the structure of the resin molding apparatus 50 shown in FIG. 6 and after will be described. The resin molding apparatus 50 includes a press unit including a molding die 60 that can be opened and closed by a known mold opening / closing mechanism. The molding die 60 includes a pair of dies (one is an upper die 61 and the other is a lower die 62) that is opened and closed by a press portion.

  Moreover, in the resin molding apparatus 50 as an automatic machine, a press part is provided with the supply part and storage part which are not shown in figure. In the supply unit, preparation and processing for supplying the workpiece W (here, a molded product) and the resin R to the press unit are performed. The supply unit is provided with a resin setting device 10. In the storage section, preparation and processing for storing a resin-molded workpiece W (here, a molded product) are performed. In addition, a loader (not shown) for carrying in the press part and an unloader (not shown) for carrying out from the press part are used for transporting the work W and the resin R between the supply part, the press part, and the storage part. Are used, and these are constituted by a known mechanism. The mold opening / closing mechanism, the loader, and the unloader are controlled by the control unit. Thus, although it is preferable to set it as the structure which provided the resin setting apparatus 10 and the resin molding apparatus 50 integrally for the reason at the time of conveyance which is mentioned later, these may be provided separately.

  The upper die 61 includes an upper clamper 63, a cavity piece 64, and an upper base 65, and these die blocks (for example, made of alloy tool steel) are assembled. A through hole 63a is formed in the upper clamper 63 in the thickness direction, and a cavity piece 64 is provided in the through hole 63a. The cavity piece 64 is fixed and supported on the upper base 65. In the present embodiment, the upper mold 61 includes the cavity recess 67, but the side portion of the cavity recess 67 is configured by the upper clamper 63, and the inner portion of the cavity recess 67 is configured by the cavity piece 64. The upper mold 61 includes an elastic member 66 (for example, a spring) provided between the upper clamper 63 and the upper base 65. The upper clamper 63 is assembled to the upper base 65 through the elastic member 66, and is configured to reciprocate in the mold opening / closing direction. When the molding die 60 is closed, the cavity recess 67 is closed to form the cavity C (see FIG. 7). In such a molding die 60, by covering the die surface of the cavity recess 67, the resin R and the die surface are prevented from coming into contact with each other to promote mold release, and resin leakage from the sliding portion is prevented. Release film to prevent can be used.

  The upper die 61 includes a seal member 70 (for example, an O-ring) provided between the inner peripheral surface of the through hole 63 a of the upper clamper 63 and the outer peripheral surface of the cavity piece 64. Further, the resin molding apparatus 50 includes a vacuum unit 71 (for example, a vacuum pump) that sucks air into the cavity C to form a vacuum state. In a state where the cavity C is formed by closing the mold, the vacuum unit 71 forms a vacuum state by sucking the cavity C through the air path 72 provided in the upper clamper 63 of the upper mold 61. Further, the resin molding apparatus 50 includes a heating unit 68 that heats the upper mold 61. A plurality of heating units 68 (for example, cartridge heaters) are provided so as to extend in parallel with the lower surface of the cavity piece 64 (the inner surface of the cavity recess 67). The vacuum unit 71 and the heating unit 68 are controlled by the control unit.

  The lower mold 62 includes a lower clamper 73, an insert 74, and a lower base 75, and these mold blocks are assembled. A through hole 73a is formed in the lower clamper 73 in the thickness direction, and an insert 74 is provided in the through hole 73a. The insert 74 is supported by being fixed to the lower base 75. In the lower mold 62, the workpiece W is set on the upper surface of the insert 74. The lower mold 62 includes an elastic member 76 (for example, a spring) provided between the lower clamper 73 and the lower base 75. The lower clamper 73 is assembled to the lower base 75 via the elastic member 76, and is configured to reciprocate in the mold opening / closing direction.

  The lower mold 62 includes a seal member 79 (for example, an O-ring) provided between the inner peripheral surface of the through hole 73 a of the lower clamper 73 and the outer peripheral surface of the insert 74. The lower mold 62 includes a seal member 80 (for example, an O-ring) that is provided on the upper surface of the lower clamper 73 and contacts the lower surface of the upper clamper 63 of the upper mold 61 when the mold is closed. Further, the resin molding apparatus 50 includes a vacuum unit 81 (for example, a vacuum pump) that draws the cavity C into the vacuum state by air suction. In a state where the cavity C is formed by closing the mold, the vacuum unit 81 forms a vacuum state by sucking the cavity C through the air path 82 provided in the lower clamper 73 of the lower mold 62. In addition, the resin molding apparatus 50 includes a heating unit 78 that heats the lower mold 62. A plurality of heating units 78 (for example, cartridge heaters) are provided so as to extend in parallel with the upper surface of the insert 74. The vacuum unit 81 and the heating unit 78 are controlled by the control unit.

  Next, a resin setting method (an operation method of the resin setting device 10) will be described. First, after the resin R is supplied (mounted) on the work W, the work W supplied with the resin R is set in the open chamber 11 as shown in FIG. The work W is set in the chamber 11 by a loader.

  As the workpiece W on which the resin R is set, for example, a substrate 101 on which a plurality of chip components 100 (semiconductor chips or the like) are flip-chip mounted with fine bumps (for example, a temporary carrier on which a wiring structure is formed, a wiring substrate, a wafer) Etc.). In such a workpiece W, a narrow portion (a gap between bump heights or narrow pitch bumps) is formed between the chip component 100 and the substrate 101. In this case, the workpiece W has the concavo-convex portion 102 by mounting the plurality of chip components 100 on the substrate 101. In the present embodiment, the resin R is supplied on the workpiece W having the uneven portion 102 so as to cover the uneven portion 102. Further, as the resin R, a sheet resin (a thermosetting resin such as a sheet-like epoxy resin) is used. According to the sheet resin, the workpiece W is covered even when the size of the workpiece W is large (for example, a wafer level of 12 inches or a large panel having a side length exceeding 300 mm, for example). It can be in the state supplied uniformly.

  Here, as the resin R which is a sheet resin, for example, a resin protected by a protective sheet can be used. In this case, when a sheet whose one surface is protected by a protective sheet is used, the protective sheet can be disposed on the opposite side of the work W and set on the work W together with the protective sheet. In this case, the protective sheet can prevent the resin R from being deteriorated or soiled. In this case, the protective sheet may be peeled after the resin R is set on the workpiece W. Moreover, a plurality of sheets of resin R, which is a sheet resin, may be used. The resin R may be used by arranging a plurality of sheet resins (resin R) having an arbitrary area on the workpiece W.

  Subsequently, as shown in FIG. 2, the chamber 11 is closed, and the interior 11 a of the chamber 11 is in a reduced pressure state. At this time, the pressure inside the chamber 11a is reduced while the resin R is heated. Specifically, the upper chamber part 12 is brought closer to the lower chamber part 13 by the elevating part. At this time, by starting the air suction by the decompression unit 14, the pressure can be reduced immediately after the inside 11a is formed. Further, by heating the inside 11a of the chamber 11 by the heating unit 16, the workpiece W and the resin R can be heated and the resin R can be softened. Here, by providing the heating unit 16 in the lower chamber unit 13 on which the workpiece W is placed, the workpiece W can be directly heated by heat conduction and quickly heated. Thus, since the resin R on the workpiece W is heated by the heating unit 16, the heating time in the resin molding apparatus 50 can be shortened and the molding time can be shortened. By heating the lower chamber portion 13, the entire chamber 11 including the upper chamber portion 12 can be heated by the radiant heat, and the resin R can be easily heated and softened from the upper surface.

  As a result, the workpiece W can be covered with the resin R in a softened state (soft state) in the decompressed chamber 11. In this case, as shown in FIG. 2, for example, the resin R can be in close contact with the substrate 101 on the outer periphery of the workpiece W, and the space between the resin R and the substrate 101 is decompressed. . At this time, after appropriately performing pressure reduction and heating, the heating unit 16 may be stopped at a predetermined timing so that the crosslinking reaction of the resin R does not proceed excessively in the pressure reduction state of the inside 11a. In addition, if the sheet resin used as the resin R is in a soft state in the air atmosphere, the heating unit 16 may not be heated.

  Subsequently, as shown in FIG. 3, the pressure in the interior 11 a of the chamber 11 is increased with the chamber 11 closed. Specifically, the interior 11a of the chamber 11 may be opened to the atmosphere by stopping the decompression unit 14 and opening the chamber 11. Here, when the pressure in the interior 11a of the chamber 11 is increased, not only the method of releasing to the atmosphere but also the release of the decompressed state is performed in order to make it higher than the pressure in the decompressed state 11a described with reference to FIG. Or positive pressurization is included. Thus, the resin R is pressed against the workpiece W side because the pressure inside the chamber 11a becomes relatively high. At this time, the gap between the workpiece W and the resin R can be reduced. In the present embodiment, the resin R can be brought into close contact with the workpiece W so as to follow the uneven portion 102. According to this, generation | occurrence | production of the clearance gap between the uneven | corrugated | grooved part 102 and resin R can be prevented.

  In addition, a pressure unit (for example, a compressor) is connected to the air passage 15 separately from the decompression unit 14, and after the decompression unit 14 is stopped, the pressure inside the chamber 11a can be increased by the pressurization unit. . In addition, a flow meter can be connected to the air passage 15, and the pressure in the interior 11a of the chamber 11 can be adjusted while measuring with the flow meter.

  Subsequently, as shown in FIG. 4, the workpiece W and the resin R can be cooled in a state where the chamber 11 is closed. Specifically, by cooling the lower chamber portion 13 by the cooling portion 17, the resin R of the workpiece W on the surface 13a is cooled, and the crosslinking reaction proceeds even if the resin R has heat. Can be suppressed, and a grace period for conveying the workpiece W and the resin R to the molding die 60 can be secured. Note that the resin R may be cooled by the cooling unit 17 after the resin R is heated and softened to cover the workpiece W.

  Subsequently, as shown in FIG. 5, the chamber 11 is opened. Thereafter, the work W is taken out from the chamber 11 by the loader. According to such a resin setting method, the resin R can be set on the workpiece W in a state where air is removed from between the workpiece W and the resin R. That is, it can suppress that air mixes in a resin set. In other words, it can be in a state in which no air is contained between the workpiece W and the resin R in the resin set. As shown in the figure, a space not filled with the resin R may be present between the chip component 100 and the substrate 101. However, since this region is decompressed and covered with the molten resin R, it is possible to maintain a state in which components (air and water vapor) contained in the atmosphere are removed from the space under the chip component 100.

  Next, a resin molding method (an operation method of the resin molding apparatus 50) will be described. First, the workpiece W supplied with the resin R by the resin setting method described above is carried into a molding die 60 as shown in FIG. Specifically, the work W is conveyed from the resin setting device 10 to the molding die 60 opened by the loader and set on the upper surface of the lower clamper 73. In this case, as described above, if the resin R is cooled by the cooling unit 17, even if a thermosetting resin that cures at a predetermined temperature is used, curing proceeds during transportation. Thus, it can be prevented that the molding die 60 becomes difficult to flow when heated and pressurized.

  Subsequently, as shown in FIG. 7, the molding die 60 is closed, and the cavity C of the molding die 60 is brought into a reduced pressure (vacuum) state. Specifically, the upper mold 61 is moved closer to the lower mold 62 by a mold opening / closing mechanism. Thereby, the resin R is accommodated in the cavity C. At this time, by starting the air suction by the vacuum unit 71, the pressure can be reduced to a vacuum state immediately after the cavity C is formed.

  Subsequently, as shown in FIG. 8, the molding die 60 is further closed and compression molding is performed until a predetermined molding pressure is reached. At this time, since the molding die 60 is heated to the molding temperature by the heating unit 78, the resin R is heated and pressurized by the molding die 60. In this case, in the work W, a narrow portion (a gap between the bump height or a narrow pitch bump) is formed between the chip component 100 and the substrate 101. Even if there is such a narrow part, since the components (air and water vapor) contained in the atmosphere are removed from the space under the chip component 100 as described above, it can be filled without being filled, and voids The underfill can be performed while suppressing the occurrence of. Thereafter, necessary and sufficient heating and pressurization is performed, and the resin R is thermoset into the shape of the cavity C of the molding die 60 to complete.

  Subsequently, as shown in FIG. 9, the molding die 60 is opened, and the workpiece W (molded product) is unloaded from the molding die 60. Specifically, the upper mold 61 is moved away from the lower mold 62 by a mold opening / closing mechanism. The workpiece W is taken out from the molding die 60 opened by the unloader and carried out to the storage unit.

  In the present embodiment, air is prevented from being mixed between the workpiece W and the resin R by the above-described resin setting method before resin molding. For this reason, generation | occurrence | production of the void by air mixing can be suppressed in the resin molding part of the workpiece | work W (molded article). In addition, in the workpiece W, even if there is a narrow portion between the chip component 100 and the substrate 101, the entry of air is suppressed (air, water vapor, etc. contained in the atmosphere are removed), so that generation of voids is suppressed. Thus, underfill can be reliably performed.

  Although the present invention has been specifically described above based on the embodiments, it is needless to say that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

  In the embodiment, the case where the sheet resin is used as the resin covering the workpiece has been described. However, the present invention is not limited to this, and a granular resin may be used as the resin, and the workpiece may be covered in an integrated state (equalized state) by heating and melting and surface tension. According to this, air can be removed from between the granule resins and the workpiece can be covered with the resin. Alternatively, the granular resin can be pre-pressurized to form a sheet and used as a sheet resin.

  In the above-described embodiment, the case where a substrate on which a plurality of chip components are flip-chip mounted is used as a work as an example of a supply object. Not only this but a flat heat sink, a shield board, etc. may be used as a work, and these may have an uneven part for heat conduction or conduction. Furthermore, the workpiece may be a wafer on which only a bump is mounted without providing a chip, or a structure in which an adhesive film is attached to one side of a ring member and a chip member or the like is attached to the adhesive film may be employed. . Even in these cases, it is possible to prevent the gap between the workpiece and the sheet resin from being generated, and even if there is a gap, the air, water vapor, etc. contained in the atmosphere can be removed to prevent unfilling.

  Further, the material to be supplied may be a release film. In this case, for example, a configuration in which the release film is supplied to the lower mold as a configuration in which the resin molding apparatus 50 shown in FIG. In this case, it is conceivable to set the resin R, which is a sheet resin, on the release film, and then to mold the workpiece W that is loaded into the resin molding apparatus 50 and separately loaded. Even in this case, since the air can be removed even if the air is sandwiched between the release film and the resin R, there is a problem in molding that the remaining air expands and leaves a mark on the molded product. Can be prevented.

11 Chamber 11a Inside R Resin W Workpiece

Claims (8)

In a resin setting method for setting a resin to be thermally cured in the shape of the cavity by heating and pressurizing in a cavity of a molding die,
(A) supplying a resin onto the material to be supplied;
(B) after the step (a), setting the material to be supplied in an open chamber;
(C) After the step (b), the step of closing the chamber and reducing the pressure inside the chamber;
(D) after the step (c), increasing the pressure inside the chamber;
(E) after the step (d), the chamber is opened, and the supply object is taken out;
A resin setting method comprising: In the resin setting method of Claim 1,
The resin set method, wherein the material to be supplied is a workpiece. In the resin setting method of Claim 1,
The resin supply method, wherein the material to be supplied is a release film. In the resin setting method as described in any one of Claims 1-3,
In the step (a), a resin is supplied so as to cover the uneven portion on the supply object having the uneven portion,
In the step (d), the resin is set along the uneven portion of the material to be supplied. In the resin setting method as described in any one of Claims 1-4,
In the step (c), the inside of the chamber is decompressed while heating the resin. In the resin setting method as described in any one of Claims 1-5,
The resin setting method, wherein the resin is cooled after the step (c). In the resin setting method as described in any one of Claims 1-6,
In the step (a), a sheet resin is used as the resin.   The material to which the resin is supplied by the resin setting method according to claim 1 is carried into the molding die, and the resin is heated and pressurized in a cavity of the molding die. A resin molding method characterized by heat curing.

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