JP2011037032A - Device and method for sealing resin - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve the speed-up of resin sealing work in a resin sealing device while maintaining resin sealing quality. <P>SOLUTION: A resin sealing device 100 executes resin sealing of an article to be molded by a die 160 while using a powder resin 102. The device includes: a release film 116 loaded with the powder resin 102; a suction mechanism 132 for holding the release film 116; a transfer hand 130 that transfers the suction mechanism 132 together with the release film to arrange the release film 116 in the die 160; and an infrared heater 134 that is provided in the transfer hand 130 to apply heat to the powder resin 102 (the preliminarily-fused resin 106) loaded on the release film 116, being transferred, on a transfer path of the transfer hand 130. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a technical field of a resin sealing device and a resin sealing method for sealing a product to be molded with resin.

  In a resin sealing device for placing a substrate on which a semiconductor chip or the like, which is a molded product, is placed in a mold and sealing with resin, as a resin sealing material, for example, in Patent Document 1, a granular resin (granular resin) Is used.

JP 2006-120880 A

  However, the granular resin used in Patent Document 1 is a particle-shaped resin placed at room temperature. Therefore, immediately after being put into the mold cavity, the granular resin, that is, the resin maintains the shape of the particles, and an air layer (hereinafter, the air layer has a hole shape) between the resin particles. Otherwise, there are many voids), so that the temperature cannot be increased quickly, and the time required for the resin sealing operation cannot be sufficiently shortened. On the other hand, it is conceivable to increase the temperature of the cavity itself. However, in this case, since the temperature management of the entire resin sealing operation is affected, the temperature management becomes complicated, and there is a possibility that the temperature of only the melted part of the granular resin is too high. For this reason, the quality of resin sealing may be lowered as a result, resulting in a decrease in yield.

  The present invention has been made to solve the above-described problems, and provides a resin sealing device and a resin sealing method capable of speeding up a resin sealing operation in the resin sealing device while maintaining the resin sealing quality. Its purpose is to do.

  The present invention is a resin sealing device for resin-molding a molded product with a mold using a granular resin, a release film on which the granular resin is mounted, and the mold release A holding means for holding the film; a conveying means for conveying the holding means together with the release film to dispose the release film on the mold; and a conveying means provided on the conveying means and conveyed by the conveying means The above-mentioned problem is solved by providing a first heating means capable of imparting heat to the granular resin mounted on the release film being conveyed in the path.

  In the present invention, for the purpose of speeding up the resin sealing operation, the time from when the granular resin is mounted on the release film until the release film is placed in the mold is effectively utilized. Then, the granular resin is heated in advance. That is, according to the present invention, the release means for holding the release film and the first heating means are provided in the conveying means for the granular resin, and the granular resin is heated during conveyance in the conveying path by the conveying means. . For this reason, at the time of disposing the release film on the mold, the temperature of the granular resin is increased by the amount of heat applied. Alternatively, as will be described later, if heat is applied before the conveyance, the state can be maintained (so that the temperature does not decrease). In any case, the time for heating the granular resin to the molding temperature for resin sealing can be shortened as compared with the case where the granular resin is charged at room temperature.

  Further, the heating by the first heating means can also soften at least a part of the resin particles constituting the granular resin, as long as the granular resin is in the state of resin particles. For this reason, for example, the softened resin particles become a fused resin (preliminary fused resin), and the thermal conductivity is improved by reducing the number of pores and the size of the pores between the resin particles serving as the heat insulating layer. It is also possible to make it. In addition, because of the improvement in thermal conductivity, the temperature rise time until the molding temperature is reached in the resin sealing process is shortened. Therefore, compared with the case where the granular resin is charged into the mold at room temperature, the resin sealing is performed. The time required for the stopping process can be further shortened, and the productivity of the molded product can be improved. That is, since the first heating means can be heated while moving, the throughput can be improved.

  Further, since the release film is used from the loading of the granular resin to the sealing of the resin, there is no peeling step in the middle, and an expensive release film can be used efficiently. For this reason, it is possible to promote the speeding up of the resin sealing operation and the reduction of the running cost.

  Further, in the case where it is provided with a second heating unit that is the granular resin mounted on the release film and can apply heat to the granular resin before being conveyed by the conveying unit. The granular resin can be temporarily formed into a preliminary fusion resin before being conveyed by the conveying means. For this reason, when the preliminary fusion resin is already in the softened state by the second heating means, it is possible to perform heating by the first heating means for the purpose of keeping the temperature. In this case, the power consumed by the first heating means can be reduced. Alternatively, by heating the first heating means, the softened state of the preliminary fusion resin can be promoted to further fuse the resin particles, and in that case, the number of pores between the resin particles to be the heat insulating layer and It is possible to further reduce the pore size from the original preliminary fusing resin to improve the thermal conductivity. In any case, since the thermal conductivity of the preliminary fusion resin is higher than that of the granular resin made of resin particles, the time required for the resin sealing process can be further shortened, and the production of the molded product can be shortened. The sex can be further improved. In addition, as a heating aid of the second heating means, the granular resin before conveyance can be heated by the first heating means together with the second heating means, in which case the heating time by the first heating means is shortened. Can do.

  Furthermore, when heating from the lower surface of the release film only by the second heating means, a large temperature difference occurs between the upper surface and the lower surface of the loaded granular resin, but by cooperation with the first heating means The temperature difference can be reduced. It is difficult to achieve a completely uniform height when mounting the granular resin on the release film, but by using the first heating means, it is separated from the lower surface of the mounted granular resin. The resin particles of the granular resin can be effectively heated. That is, in cooperation with the first heating means, the resin particle temperature on the upper surface away from the lower surface of the loaded granular resin, which can be generated by heating only the second heating means, remains low and the cycle time is reduced. It is possible to avoid a situation where the time cannot be shortened sufficiently.

  Further, the powdery resin mounted on the release film is softened by applying heat to the powdery resin before being transported by the transport means, and into a predetermined shape. In the case of comprising a third heating means for molding and a cooling means for cooling the granular resin molded by the third heating means, the granular resin is transferred before being conveyed by the conveying means. Then, a resin (referred to as a pre-molded resin) molded into a predetermined shape through a heat molding step and a cooling step can be used. Therefore, the number of holes and the hole size can be further reduced as compared with the preliminary fusion resin, and the thermal conductivity can be increased. And since it heats so that it may be in a softened state with a 1st heating means, when the release film is arrange | positioned to a metal mold | die, the temperature of the preforming resin has already risen by the part which heated. For this reason, the time required for the resin sealing step can be further shortened, and the productivity of the molded product can be improved.

  Furthermore, when the conveying means has a structure capable of sealing the granular resin on the release film when the release film is held by the holding means, The heating means can be indirectly heated via air, and the temperature can be uniformly and efficiently performed. By making it sealed, the air heated during transportation does not escape (cold air does not enter), so the heat retention effect is high. Furthermore, if the sealed container itself is at a high temperature, the internal air can be prevented from cooling. In addition, since it is in a sealed state, it is possible to prevent impurities from adhering and mixing during the conveyance.

  Furthermore, when the said conveyance means is equipped with the temperature sensor which measures the temperature of the said granular resin during conveyance, it can monitor the temperature of the granular resin during conveyance. That is, it is possible to control the heating state by the first heating means and to maintain the quality of the granular resin.

  The present invention is a resin sealing method for resin-sealing a molded product with a mold using a granular resin, and the mounting step of mounting the granular resin on a release film A holding step for holding the release film, a transfer step for transferring the release film and placing the release film on the mold, and the granules mounted on the release film during the transfer step And a step of applying heat to the resin-like resin.

  By applying the present invention, at least a part of the granular resin mounted on the release film is fused, and the resin temperature is raised before being put into the mold. It is possible to speed up the resin sealing operation in the resin sealing device while maintaining the above.

The schematic diagram which shows an example of the resin sealing apparatus concerning 1st Embodiment of this invention. The perspective view which shows a conveyance hand similarly Similarly, a schematic diagram showing a partial cross-section of the transport hand Similarly, a graph showing the relationship between the degree of cure of resin used for resin sealing and time Similarly, a schematic diagram showing a preliminary molding process and a holding process of a preliminary fusion resin A graph showing the effect of time reduction The perspective view which shows the conveyance hand concerning 2nd Embodiment of this invention. The schematic diagram which shows an example of the resin sealing apparatus concerning 3rd Embodiment of this invention.

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the following description, even if the powdery resin is in a state where the form is changed by heating and does not remain in the form of the powdery particle, it is also referred to as a powdery resin.

  Initially, the structure of the resin sealing apparatus concerning 1st Embodiment of this invention is demonstrated below using FIG.

  The resin sealing device 100 includes a preliminary fusion part 112 for temporarily forming the granular resin 102 as a raw material into a flat preliminary fusion resin 106 and a mold 160 using the preliminary fusion resin 106. And a compression molding portion 114 for sealing the molded product with resin. The preliminary fused part 112 and the compression molding part 114 also serve as the release film 116. The release film 116 is used in a state of being a piece (strip shape), and is transported from the preliminary fusion unit 112 to the compression molding unit 114 by a transport hand 130 serving as transport means. This will be described in detail below.

  In the preliminary fusion part 112, a raw material supplier 126 and a hot plate 128 as a second heating means are arranged. The second heating means is not limited to a hot plate, and an infrared heater, microwave, hot air, or the like may be used.

  The raw material feeder 126 drops (loads) the granular resin 102 onto a predetermined area on the release film 116 at a predetermined position of the preliminary fusion part 112 through which the release film 116 passes. As shown in FIG. 5A, the raw material supplier 126 includes a cylindrical frame 126B for limiting the granular resin 102 dropped from the supply port 126A of the raw material supplier 126 to a predetermined area. Yes. A frame-shaped structure (not shown) is arranged in the frame 126B, and the dropped granular resin 102 is uniformly dispersed within the predetermined area. A recess 126BB having a width and a height that does not fuse with the frame 126B when the granular resin 102 is heated is provided at the lowermost end of the frame 126B.

  The hot plate 128 is a granular resin 102 mounted on the release film 116 and is used as a spare for applying heat (heating) to the granular resin 102 before being conveyed by the conveying hand 130. In the automatic fusion part 112, the material is disposed below the release film 116 so as to face the raw material supplier 126. That is, the hot plate 128 is provided separately from the transport hand 130 (outside the transport hand 130), and is fixedly disposed without being transported to the transport hand 130. The hot plate 128 is controlled by a control unit (not shown) and heated from below the release film 116 (about 100 degrees) so that the resin particles of the granular resin 102 on the release film 116 are softened. I do. For this reason, the powdery resin 102 is formed of a resin (preliminary fusion resin 106) in a form formed into a flat plate shape by fusing at least some of the resin particles softened by heating to each other. Become. The surface of the preliminary fusion resin 106 on the side of the release film is formed as a flat surface without large irregularities following the surface of the release film 116. At the same time, since many of the resin particles of the granular resin 102 are fused to each other, the number of holes and the hole size existing between the resin particles are reduced. On the other hand, the surface of the preliminary release resin 106 on the side of the reverse release film has less heat transferred than the release film side and is not pressed by a tangible object, so that it follows the shape of the resin particles of the granular resin 102 Unevenness remains. At the same time, the number of holes and the size of the holes on the surface of the preliminary fusion resin 106 on the side of the release film are larger and larger than those on the surface of the release film.

  It should be noted that a non-contacting and non-contacting pressurization and contraction is applied to the soft granular material resin by blowing compressed air from the surface of the releasable film side of the preliminary fusion resin 106 against the hot plate 128. Contact shrinkage means may be provided in the preliminary fused portion 112. In that case, since the softened resin particles can be reliably fused, a preliminary fusion resin having a stable and high thermal conductivity can be temporarily formed.

  As shown in FIG. 2, the conveyance hand 130 is provided with an adsorption mechanism 132 that is a holding unit, an infrared heater 134 that is a first heating unit, a support plate 138, a temperature sensor 140, and a triaxial moving mechanism 142.

  The suction mechanism 132 is connected to a vacuum mechanism (not shown), and a plurality of suction ports (not shown) are provided on the end surface 132A. By operating the vacuum mechanism, the release film 116 can be sucked and held on the end face 132A. In FIG. 2, the suction mechanism 132 is in a mode of sucking and holding only two opposite sides of the release film 116, but the suction mechanism is configured to suck and hold all four sides of the release film 116. May be. In this embodiment, the suction mechanism 132 is used as the holding unit. However, a holding mechanism that holds two or more sides of the release film from the vertical direction may be used as the holding unit.

  The suction mechanism 132 is supported by the support plate 138. The infrared heater 134 is supported by the support plate 138 through the heat insulating member 136 as shown in FIG. The infrared heater 134 is disposed to face the release film 116. Since the infrared heater 134 utilizes heat radiation, the preliminary fusion resin 106 can be efficiently heated (applied with heat) directly through the air gap. For this reason, since it is not necessary to seal the infrared heater 134 and the preliminary fusion resin 106 to be heated, the configuration of the transport hand 130 can be simplified. Since the infrared heater 134 is disposed in the recess 136A of the heat insulating member 136, heating other than the preliminary fusion resin 106 can be prevented. When an infrared reflector is used as the heat insulating member 136, the preliminary fusion resin 106 can be efficiently heated to maintain the softened state. In the present embodiment, an infrared heater is used as the first heating means. However, a heating mechanism using microwaves or hot air may be used, and in this case, the preliminary fusion resin 106 can be directly heated. Does not require sealing.

  The support plate 138 also supports the temperature sensor 140. The temperature sensor 140 is a non-contact thermometer and can accurately measure the temperature of the preliminary fusion resin 106 in a non-contact manner. The arrangement for measurement requires a state in which there is no shielding object between the measurement window of the temperature sensor 140 and the preliminary fusion resin 106. Specifically, a support plate 138 is provided with a through-opening so as not to block the wavelength used by the temperature sensor 140, and is arranged so that the measurement window of the temperature sensor 140 comes there, or a transparent plate or a translucent plate Is arranged so that the measurement window of the temperature sensor 140 comes there. For this reason, the infrared heater 134 automatically controls the energization state of the infrared heater 134 by a control signal from a control unit (not shown) based on the value measured by the temperature sensor 140. The energization control to the infrared heater 134 may be simple on / off, or may be continuously changed in an analog manner.

  The support plate 138 is fixed to the triaxial moving mechanism 142. Therefore, the temperature sensor 140 as well as the suction mechanism 132 and the infrared heater 134 are also transported together with the release film 116 by the triaxial moving mechanism 142. That is, heating can be continued even while the preliminary fusion resin 106 on the release film 116 is being transported, and the temperature can be controlled by measuring the temperature.

Although it is desirable for the speed of the resin sealing operation to make the temperature of the preliminary fusion resin 106 as close as possible to the molding temperature in the resin sealing by heating the infrared heater 134, the resin temperature during the transport by the transport hand 130 is as follows. It is determined by the transport time and the allowable reaction curing rate (simply referred to as the curing rate or degree of curing). That is, the curing rate is determined by the thermal history of the preliminary fusion resin 106. Here, when α is the degree of cure, dα / dt is the reaction rate, A ₁ and A ₂ are constants, E ₁ and E ₂ are activation energies, R is a gas constant, and T is temperature, an epoxy resin (thermosetting The reaction curing degree of the resin can be calculated by the Kamal model formula shown below.

dα / dt = (k ₁ + k ₂ α ^m ) (1−α) ⁿ (1)
k ₁ = A ₁ exp (−E ₁ / R * T) (2)
_{k 2 = A 2 exp (-E} 2 / R * T) (3)

  FIG. 4 shows the relationship between the resin curing characteristics based on the formula (1) and the resin temperature. In FIG. 4, for example, if the curing rate at the time of fusion of the preliminary fusion resin 106 is 2.5% and the allowable curing rate is 5%, it is possible to keep the temperature for 60 seconds at a resin temperature of 100 ° C. In other words, if the conveyance time takes 60 seconds, it means that the resin temperature must be 100 ° C. or less. The resin temperature can be determined depending on the length of the conveyance time, such as a resin temperature of 110 ° C. when the conveyance time is 30 seconds and a resin temperature of 120 ° C. when the conveyance time is 15 seconds (this curing rate varies depending on the resin used). In the present embodiment, heating is performed by the infrared heater 134 so that the preliminarily fused resin 106 is maintained in a softened state (warming) while being transported by the transport hand 130. In addition, in order to maintain the resin sealing quality, this thermal history is recorded and the curing rate is integrated, so that the resin is discarded if it falls outside the standard compared to the degree of curing within the standard. It is also possible (for example, when the resin sealing operation is stopped for a short time for some reason, or when the resin temperature rises abnormally).

  The compression molding unit 114 has a compression molding machine 150 as shown in FIG. The number of compression molding machines 150 is one in FIG. 1, but a plurality of compression molding machines 150 may be provided. The compression molding machine 150 includes a main body 152 and a fixed platen 156 supported by tie bars 154 that are a plurality of support columns erected on the main body 152. An upper mold 162 is attached to the lower surface of the fixed platen 156. The main body 152 includes a movable platen 158 that can move toward and away from the fixed platen 156. A lower mold 164 is attached to the upper surface of the movable platen 158. The lower mold 164 is provided with a suction mechanism (not shown) so that the release film 116 can be sucked and fixed. The lower mold 164 approaches and separates from the upper mold 162 attached to the fixed platen 156 as the movable platen 158 moves. That is, by moving the movable platen 158, the mold 160 composed of the upper mold 162 and the lower mold 164 can be clamped and opened.

  A cavity is formed in the mold 160, and the release film 116 on which the preliminary fusion resin 106 is placed is adsorbed and fixed to the lower mold 164, whereby the preliminary fusion resin 106 is put into the mold 160. To complete.

  Next, FIG. 1 illustrates the operation of the resin sealing device 100 (also referred to as a temporary molding step of the preliminary fusion resin 106 in the preliminary fusion portion 112, a resin sealing step in the compression molding portion 114, and a resin sealing operation). This will be described with reference to FIG.

  First, the raw material supplier 126 is brought close to the release film 116 on the hot plate 128. Then, the granular resin 102 is dropped from the supply port 126A and placed on the release film 116 on the hot plate 128 (mounting process, FIG. 5A). At this time, the frame 126B has a length that covers the position B at the lower end of the supply port 126A at the position U at the upper end and is disposed in the very vicinity of the release film 116 at the position D at the lower end of the frame 126B. The scattering of the granular resin 102 to the outside of the frame 126B can be prevented. At the same time, the granular resin 102 can be accurately dropped onto a predetermined area defined by the frame 126B of the release film 116. At this time, the granular resin 102 can be spread over the predetermined area with a uniform thickness by a frame-shaped structure (not shown) between the supply port 126A and the release film 116. For this reason, the uniformity of heating of the granular resin 102 and shortening of the heating time can be ensured, and the resin flow during the resin sealing step can be reduced.

  The temperature of the hot plate 128 was raised to a temperature (about 100 degrees) to the extent that the resin particles of the granular resin 102 were softened, and dropped from the raw material feeder 126 through the release film 116. The granular resin 102 is heated (heat is applied). At a position facing the raw material feeder 126, the hot plate 128 softens the dropped granular resin 102 so that it can be fused together. Then, the resin particles of the granular resin 102 are deformed by being softened by heating, and the mutual contact area is increased. For this reason, the void | hole size between resin particles becomes small, and the thickness of the granular resin 102 becomes smaller than the thickness immediately after dropping of the granular resin 102. At the same time, the softened resin particles are coupled with a change in viscosity due to temperature, and the binding force increases. In particular, the resin particles on the side of the release film near the hot plate 128 are partially fused. For this reason, the granular resin 102 originally in the form of a particle-shaped aggregate is reduced in the number of pores and the size of the pores and is reduced to the preliminary fusion resin 106 in a form contracted in the thickness direction. Temporary molding is performed (FIG. 5B). At this time, the hot plate 128 is disposed below the release film 116 and heats the granular resin 102 from below. For this reason, more resin particles are fused on the surface (lower surface) on the release film side of the preliminary fusion resin 106 than on the surface on the opposite release film side. The number of holes existing between the two is small and the hole size is small.

  Next, the raw material supplier 126 is separated from the release film 116 together with the frame 126B. The frame 126B is provided with a recess 126BB. For this reason, since the resin particles are not fused to the side surface of the frame 126B, the frame 126B can be easily separated without changing the amount of the initially dropped granular resin 102.

  Next, the conveyance hand 130 is brought into contact with the release film 116 on the hot plate 128, and the portion outside the release film 116 on which the preliminary fusion resin 106 is mounted is adsorbed by the adsorption mechanism 132 of the conveyance hand 130. -Hold (holding step, FIG. 5C).

  Next, the transport hand 130 is sucked and raised by the suction mechanism 132 while the preliminary fusion resin 106 is stuck on the release film 116 by the triaxial moving mechanism 142 (FIG. 5D). ), Moved and arranged in the mold 160 of the compression molding unit 114 (conveying step). During this transport process (during transport on the transport path), heating (applying heat) to the preliminary fusion resin 106 by the infrared heater 134 is started according to the relationship shown in FIG. 4 (heating process). In the present embodiment, the temperature sensor 140 uses the infrared heater 134 so that the softened state is maintained for the purpose of keeping the temperature of the preliminary fusion resin 106 and the allowable curing rate (5% in this embodiment) is not more than the transport time. Is controlled. That is, the preliminary fusion resin 106 is maintained at 100 degrees which is substantially the same as the temperature at the time of temporary molding. For this reason, the electric power consumed by the infrared heater 134 can be minimized.

  Next, the release film 116 to which the preliminary fusion resin 106 is adhered is adsorbed and fixed as it is by the adsorption mechanism of the lower mold 164 of the mold 160. Then, the preliminary fusion resin 106 is heated to a molding temperature suitable for resin sealing.

  Then, the lower mold 164 is brought closer to the upper mold 162 to which the product to be molded is attached. Also, the pressure reducing operation in the cavity is started. Then, the mold is clamped at a predetermined timing, and the molded product is compression-molded to perform resin sealing.

  In the present embodiment, since the granular resin 102 mounted on the release film 116 is provided with a hot plate 128 for heating so as to be in a softened state, the granular resin 102 has a flat plate-like preliminary shape. Temporarily molded into the fusion resin 106. Since the preliminary fusion resin 106 is kept at the temperature at the time of temporary molding, the power consumed by the infrared heater 134 can be reduced. Then, since the preliminary fusion resin 106 is charged into the mold 160 at the time of resin sealing, the amount of resin charged into the mold 160 due to the scattering of the resin particles when transported to the mold 160 is achieved. Changes can be prevented.

  In this embodiment, since the hot plate 128 is disposed below the release film 116, the degree of softening of the resin particles of the granular resin 102 on the release film side is increased, and preliminary melting is performed. The number of holes and the hole size on the release film side of the resin 106 can be reduced as compared with the anti-release film side. That is, many pores remain on the surface side (reverse release film side) of the preliminary fusion resin 106. For this reason, in the resin sealing step, it is easy to discharge the holes of the preliminary fusion resin 106 into the cavity space of the mold 160 (reduction in the number of holes and the hole size). It is possible to efficiently prevent the occurrence of voids and the like in the formed molded product (improvement in yield and resin sealing quality).

  Moreover, in this embodiment, the release film 116 is used in the state made into the piece. For this reason, compared with the case of the release film supplied with a roll, arrangement | positioning of the preliminary fusion bonding part 112 and the compression molding part 114 can take a big freedom degree. In addition, it is easy to use a plurality of the preliminary fusion bonding portions 112 and the compression molding portions 114. Furthermore, since it is possible to reduce the area on which the particulate resin 102 is not placed as compared with the case where the release film 116 is supplied by a roll, the release film 116 can be used without waste. At the same time, it is possible to prevent the resin sealing device 100 from becoming large.

  In the present embodiment, the conveyance hand 130 is provided with a suction mechanism 132 for the release film 116 and an infrared heater 134, and the preliminary fusing resin 106 is heated during conveyance by the conveyance hand 130. For this reason, when the release film 116 is disposed on the mold 160, the temperature of the preliminary fusion resin 106 is increased by the amount of applied heat (in this embodiment, the preliminary fusion resin 106). The temperature is the same as the temperature at the time of temporary molding.) That is, the time for heating the preliminary fusion resin 106 to the molding temperature for resin sealing can be shortened as compared with the case where the preliminary fusion resin 106 is charged at room temperature. Referring to FIG. 6, for example, when the infrared heater is not used, the preliminary fusion resin 106 may be temporarily formed and may be lowered to room temperature during transportation (broken line graph). However, by heating with the infrared heater 134, the time to reach the molding temperature can be shortened as shown by the solid line graph. In other words, since the temperature of the preliminarily fused resin 106 to be charged is a certain temperature (preheating temperature), the temperature of the mold 160 is lowered when the preliminarily fused resin 106 is charged. It can be relaxed. For this reason, the time required for the resin sealing process can be further shortened and the cycle time can be shortened as compared with the case where the preliminary fusion resin 106 is put into the mold at room temperature. Can be improved (throughput improvement).

  Further, in this embodiment, since the temperature rise time until reaching the molding temperature for resin sealing is shortened, the curing reaction of the preliminary fusion resin 106 can be suppressed, so that the resin sealing quality is improved. Yield can be improved. For this reason, even when the molding temperature is higher than usual, the curing time can be shortened without impairing the resin sealing quality, and the productivity can be further improved.

  In this embodiment, since the infrared heater 134 heats the preliminary fusion resin 106 from the surface on the side of the releasable film during conveyance, the surface of the surface of the preliminary fusion resin 106 on the side of the releasable film is also heated. The time to reach the molding temperature can be shortened compared to the case where the molding temperature is not heated by the infrared heater 134. For this reason, in the resin sealing step, a problem that occurs when the curing reaction of the resin on the release film side proceeds ahead of the resin on the anti-release film side (for example, the molded product due to the increase in the viscosity of the resin on the release film side) It is possible to reduce / avoid problems such as deformation / short-circuiting of bonding wires connecting the inside.

  Further, since the release film 116 is used from the loading of the granular resin 102 to the sealing of the resin, it is not necessary to peel off the preliminary fusion resin 106 from the release film 116. For this reason, even if the preliminary fusion resin 106 is thin, it is possible to prevent the resin from being cracked or chipped. In other words, even when the molding thickness of the molded product is reduced, it can be easily handled, and the measurement error of the resin can be minimized by the preliminary fused portion 112 and the compression molded portion 114. Is possible. At the same time, there is no cooling process, and the equipment and man-hours can be reduced. At the same time, the expensive release film 116 can be used efficiently. For this reason, although it is the structure using the conveyance hand 130 provided with the infrared heater 134, the increase in the speed of resin sealing work and reduction in running cost can be promoted.

  Further, since the transport hand 130 includes the temperature sensor 140 that measures the temperature of the preliminary fusion resin 106, the temperature of the preliminary fusion resin 106 during the transport can be monitored by the transport hand 130. That is, it is possible to control the heating status by the infrared heater 134 and to maintain the quality of the preliminary fusion resin 106.

  That is, according to the present embodiment, at least a part of the granular resin 102 is fused, and the resin temperature is raised before being charged into the mold 160, so that the resin sealing quality is maintained. It is possible to increase the speed of the resin sealing operation in the sealing device 100, in other words, to improve / improve the throughput and cycle time of manufacturing a resin-sealed molded product.

  In the present embodiment, the heating is performed by the infrared heater 134 for the purpose of keeping the temperature at the time of pre-molding the preliminary fusion resin 106 (maintaining the softened state of the preliminary fusion resin 106). The present invention is not limited to this, and heating may be performed so as to promote fusion of the preliminary fusion resin. In other words, heating that maintains the softened state of the preliminary fusion resin with an infrared heater may be performed. In that case, the surface on the side of the releasable film of the preliminary fusion resin is heated more than the surface on the side of the releasable film, so that the fusion state on the side of the releasable film is promoted and the heat insulating layer Thus, the number of pores between the resin particles and the pore size can be further reduced from the original preliminary fusion resin to improve the thermal conductivity. For this reason, the time required for the resin sealing step can be further shortened, and the productivity of the molded product can be improved. At that time, in accordance with the temperature rise characteristics of the surface of the release film side of the preliminary fusion resin after being put into the mold, the surface of the release film side of the preliminary fusion resin is preliminarily infrared-heated. The temperature may be raised at.

  In this embodiment, energization of the infrared heater 134 is started after the preliminary fusing resin 106 is temporarily formed. However, the present invention is not limited to this, and simultaneously with the heating by the hot plate, You may energize the infrared heater arrange | positioned at the film side. In that case, since the heating is performed by sandwiching the granular resin between the hot plate and the infrared heater, the time for preliminary molding of the preliminary fusion resin can be further shortened. For this reason, the time taken for the resin sealing step can be further shortened, and the productivity of the molded product can be improved.

  In this embodiment, both the hot plate 128 and the infrared heater 134 are heated so that the resin is in a softened state, but the present invention is not limited to this. You may just apply heat.

  Next, a second embodiment of the present invention will be described with reference to FIG.

  This embodiment is different from the first embodiment in that the preliminary fusion resin 206 is sealed using a heating wire heater 234 as the first heating means, and the other parts are the same. Are the same, and the description is omitted.

  In the present embodiment, the suction mechanism 232 is provided on all sides of the support plate 238 and takes a form of sucking and holding the four sides of the release film 216. For this reason, when the release film 216 is sucked and held by the suction mechanism 232, the preliminary fusion resin 206 on the release film 216 can be sealed. The support plate 238 is provided with an air valve 238A. The air valve 238A adsorbs and holds the release film 216, and when the internal air is heated by heating of the heating wire heater 234, the air expands to bend the release film 216 to preliminarily fuse the resin. This is to prevent the 206 from being deformed or damaged. The heating wire heater 234 is disposed opposite to the preliminary fusion resin 206 on the release film 216 in the same manner as the infrared heater 134 of the first embodiment. The heating wire heater 234 indirectly heats the preliminary fusion resin 206 by heating the air inside. Note that the temperature of the heating wire heater 234 can be measured and controlled by measuring the temperature of the heating wire heater 234 with a temperature sensor such as a thermocouple. Temperature adjustment can be performed.

  In this embodiment, since the temperature sensor uses a small and low-cost thermocouple instead of the non-contact temperature, the transport hand 230 can be reduced in cost and size. In addition, since the preliminary fusion resin 206 is sealed at the time of transportation, heating can be performed uniformly and efficiently, and impurities can be prevented from adhering / mixing during transportation. Furthermore, since it is sealed, air that is heated during transportation does not escape or cold air does not enter, so that the heat retaining effect is high. Such a configuration can be applied to both keeping the preliminary fusion resin 206 warm and promoting re-fusion.

  In the above embodiment, the temperature sensor is used. However, the present invention is not limited to this, and the input power to the first heating means (infrared heater, heating wire heater) and the temperature of the preliminary fusion resin are preliminarily set. And the energization state to the first heating means may be controlled based on the correlation without using the temperature sensor. In that case, since the temperature sensor is not used, the cost of the resin sealing device can be reduced compared to the above embodiment.

  Next, a third embodiment of the present invention will be described with reference to FIG.

  The present embodiment is different from the first embodiment in that a preforming portion 312 is arranged instead of a preliminary fusion portion, and a heating forming mechanism 321A that is mainly a third heating means and a cooling mechanism 321B that is a cooling means. Since the other parts are the same, the last two digits are the same and the description is omitted.

  The preforming unit 312 includes a release film supply mechanism 318, a thermoforming mechanism 321 </ b> A, a cooling mechanism 321 </ b> B, a moving mechanism 322, a tray 323, and a raw material supplier 326.

  The release film supply mechanism 318 includes a supply roll 318A, a collection roll 318B, and a plurality of rollers 318C. The release film supply mechanism 318 supplies the continuous upper release film 317 to predetermined positions of the heat forming mechanism 321A and the cooling mechanism 321B of the preforming unit 312. The upper release film 317 is the same material as the release film 316 and is formed to an appropriate thickness with a material that has excellent heat resistance, good thermal conductivity, excellent stretchability, and easy shape recovery. . The thermoforming mechanism 321A is a granular resin mounted on the release film 316, which heats the granular resin before being transported by the transport hand 330 to a softened state, and has a predetermined shape. To form. Molding of the granular resin is performed by pressurizing the granular resin through the upper release film 317. The cooling mechanism 321B performs cooling by bringing the cooled plate into contact with the granular resin formed by the heat forming mechanism 321A from above the upper release film 317. The moving mechanism 322 is a mechanism that moves the tray 323 to predetermined positions of the raw material supply unit 326, the heat forming mechanism 321A, and the cooling mechanism 321B. The tray 323 needs to be rapidly heated and cooled to quickly shift to a high temperature state and a low temperature state, and is preferably made of a material having a high thermal conductivity and a small specific heat. In addition, since the raw material supply machine 326 is the same as 1st embodiment, description is abbreviate | omitted.

  Next, the operation in the preforming unit 312 will be described.

  First, the separated release film 316 is placed on the tray 323 and moved to the position X1 directly below the raw material supply machine 326 by the moving mechanism 322.

  Next, after loading the granular resin from the raw material supplier 326 onto the release film 316, the tray 323 is moved to a position X2 directly below the thermoforming mechanism 321A. Therefore, the thermoforming mechanism 321A causes the upper release film 317 to contact the surface of the granular resin, and heats and softens the granular resin 302 on the release film 316 to melt the resin particles. Make it ready to wear. Then, the thermoforming mechanism 321 </ b> A applies pressure to the softened powdery resin between the tray 323 and press-molds it into a flat plate shape (thermal molding step).

  Next, the pressure-molded granular resin (preliminarily molded resin 306) with the upper release film 317 adhered is moved to the position X3 of the cooling mechanism 321B by the tray 323. Therefore, the preformed resin 306 is cooled via the upper release film 317 (cooling step).

  Next, the upper release film 317 is peeled off from the preformed resin 306 (peeling step), and the preformed resin 306 is moved by the tray 323 to the position X4. Accordingly, the preforming resin 306 is adhered to the release film 316 by the transport hand 330, and the release film 316 is sucked and held to move / place the preforming resin 306 to the mold of the compression molding unit. Let During this operation, the infrared heater 334 is energized to raise the temperature of the preformed resin 306.

  Also in this embodiment, since the release film 316 is used for both the preforming part 312 and the compression molding part, the expensive release film 316 can be used efficiently. At the same time, since the release process of the release film 316 is not necessary, the cooling process and the release process can be performed in a shorter time than when the release process of the release film 316 is required. For this reason, it is possible to promote the speeding up of the resin sealing operation and the reduction of the running cost.

  In the present embodiment, the granular resin 302 is a preformed resin that has been molded into a predetermined shape through a heat molding step and a cooling step. For this reason, the number of holes and the hole size can be further reduced as compared with the preliminary fusion resin, and the thermal conductivity cannot be increased. And since it heats so that it may become a softened state with the infrared heater 334, when the release film is arrange | positioned to a metal mold | die, the temperature of the preforming resin 306 has already risen by the part which heated. For this reason, the time required for the resin sealing step can be further shortened, and the productivity of the molded product can be further improved.

  In this embodiment, the tray 323 is used to move and support the release film 316, but the tray may be provided with a heating function or a cooling function. In that case, the preformed resin can be further molded in a short time, and as a result, the speeding up of the resin sealing operation can be further promoted.

  Although the present invention has been described with reference to the above embodiment, the present invention is not limited to the above embodiment. That is, it goes without saying that improvements and design changes can be made without departing from the scope of the present invention.

  For example, in the above embodiment, when the release film is adsorbed and held by the transport hand, the granular resin is a preliminary fusion resin or a preformed resin. Without being limited, it may be a granular resin. That is, the release film may be held by the transport hand immediately after the granular resin is dropped onto the release film by the raw material feeder. In that case, at least a part of the resin particles constituting the granular resin on the release film is softened by the first heating means such as an infrared heater. For this reason, the softened resin particles become a fused resin (preliminary fused resin), and the number of pores and the size of the pores between the resin particles serving as the heat insulating layer are reduced to improve the thermal conductivity. . That is, within the transport time, the granular resin is temporarily molded into a preliminary fusion resin state. For this reason, it can be set as a simpler form than the said embodiment, and the effect of this invention corresponding also in this case will be produced.

  Moreover, in the said embodiment, although it did not demonstrate in particular as a granular resin, the said resin may be a powder form, a granular form, and a small diameter tablet may be sufficient as it. Alternatively, a mixture thereof may be used.

DESCRIPTION OF SYMBOLS 100 ... Resin sealing apparatus 102, 202 ... Granular resin 106, 206 ... Preliminary fusion resin 112 ... Preliminary fusion part 114 ... Compression molding part 116, 216, 316 ... Release film 126, 326 ... Raw material Feeder 128, 228 ... Hot plate 130, 230, 330 ... Transport hand 132, 232, 332 ... Adsorption mechanism 134, 334 ... Infrared heater 136 ... Thermal insulation member 138, 238 ... Support plate 140 ... Temperature sensor 142 ... Three-axis movement mechanism DESCRIPTION OF SYMBOLS 150 ... Compression molding machine 160 ... Mold 162 ... Upper mold 164 ... Lower mold 234 ... Heating wire type heater 306 ... Pre-molding resin 312 ... Pre-molding part 317 ... Upper release film 318 ... Release mold film supply mechanism 321A ... Heat molding Mechanism 321B ... Cooling mechanism 322 ... Moving mechanism 323 ... Tray

Claims (6)

A resin sealing device for sealing a molded product with a mold using a granular resin,
A release film on which the granular resin is mounted;
Holding means for holding the release film;
Conveying means for conveying the holding means together with the release film and disposing the release film on the mold;
A first heating unit that is provided in the transport unit and is capable of applying heat to the granular resin mounted on the release film being transported in the transport path of the transport unit;
A resin sealing device comprising: In claim 1, further comprising:
Resin sealing, comprising: a second heating unit that is the granular resin mounted on the release film and that can apply heat to the granular resin before transporting by the transporting unit. Stop device. In claim 1, further comprising:
Third, the granular resin mounted on the release film is softened by applying heat to the granular resin before being conveyed by the conveying means, and is molded into a predetermined shape. Heating means;
Cooling means for cooling the granular resin formed by the third heating means;
A resin sealing device comprising: In any one of Claims 1 thru | or 3, Furthermore,
The transporting means has a structure capable of sealing the granular resin on the release film when the release film is held by the holding means. In any one of Claims 1 thru | or 4, Furthermore,
The transporting device includes a temperature sensor that measures the temperature of the granular resin during transport. A resin sealing method for sealing a molded product with a mold using a granular resin,
A mounting step of mounting the granular resin on a release film;
Holding step for holding the release film;
A transporting process for transporting the release film and placing it on the mold;
A heating step of applying heat to the granular resin mounted on the release film during the transporting step;
A resin sealing method comprising:

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