NL2015091B1 - Mould, moulding press and method for encapsulating electronic components mounted on a carrier using elastomeric micro-pillars. - Google Patents

Mould, moulding press and method for encapsulating electronic components mounted on a carrier using elastomeric micro-pillars. Download PDF

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Publication number
NL2015091B1
NL2015091B1 NL2015091A NL2015091A NL2015091B1 NL 2015091 B1 NL2015091 B1 NL 2015091B1 NL 2015091 A NL2015091 A NL 2015091A NL 2015091 A NL2015091 A NL 2015091A NL 2015091 B1 NL2015091 B1 NL 2015091B1
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Netherlands
Prior art keywords
mold
electronic components
micro
parts
mould
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NL2015091A
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Dutch (nl)
Inventor
Lambertus Gerardus Maria Venrooij Johannes
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Besi Netherlands Bv
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Application filed by Besi Netherlands Bv filed Critical Besi Netherlands Bv
Priority to NL2015091A priority Critical patent/NL2015091B1/en
Priority to PCT/NL2016/050474 priority patent/WO2017007308A1/en
Priority to TW105121320A priority patent/TWI648140B/en
Application granted granted Critical
Publication of NL2015091B1 publication Critical patent/NL2015091B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

The invention relates to a mould for encapsulating electronic components mounted on a carrier, comprising at least two displaceable mould parts, at least one of which provided with a mould cavity recessed in a contact side, wherein at least a part of the contact sides of one of the mould parts is provided with elastomeric micro-pillars. The invention also relates to a moulding press for encapsulating electronic components comprising such a mould and a method for encapsulating electronic components using a foil layer in the mould cavity that is at least locally supported by elastomeric micro-pillars.

Description

Mould, moulding press and method for encapsulating electronic components mounted on a carrier using elastomeric micro-pillars
The invention relates to a mould for encapsulating electronic components mounted on a carrier, comprising at least two mould parts which are displaceable relative to each other, at least one of the mould parts with a mould cavity recessed in a contact side, which mould parts are configured to engage with at least one mould cavity round the electronic components to be encapsulated. The invention also relates to a moulding press for encapsulating electronic components mounted on a carrier, as well as to a method for encapsulating electronic components mounted on a carrier.
The encapsulation of electronic components mounted on a carrier with an encapsulating material is a known art. On an industrial scale such electronic components are provided with an encapsulation, usually an encapsulation of a curing epoxy to which a filler material is added. There is a trend in the market toward simultaneous encapsulation of larger quantities of relatively small electronic components. Electronic components may be envisaged here such as semiconductors (chips, although LEDs are in this respect also deemed semiconductors) which are generally becoming increasingly smaller. Once the encapsulating material has been arranged the collectively encapsulated electronic components are situated in an encapsulation (package) which is arranged on one but sometimes also two sides of the carrier. The encapsulating material often takes the form here of a flat layer connected to the carrier. The carrier may consist of a lead frame, a multi-layer carrier - manufactured partially from epoxy - (also referred to as board or substrate and so on) or another carrier structure.
During the encapsulation of electronic components mounted on a carrier, use is usually made according to the prior art of encapsulating presses provided with two mould halves, into at least one of which is recessed one or plural mould cavities. After placing the carrier with the electronic components for encapsulating between the mould halves, the mould halves may be moved toward each other, e.g. such that they clamp the carrier. A, normally heated, liquid encapsulating material may then be fed to the mould cavities, usually by means of transfer moulding. As an alternative it is also possible to bring the encapsulating material before closure of the mould parts, e.g. as a granulate, in the mould cavity after which the components to be moulded are pressed into the encapsulating material; such compression encapsulating process is an alternative for transfer moulding. Applied as encapsulating material is epoxy (also referred to as resin) which is generally provided with filler material. After at least partial (chemical) curing of the encapsulating material in the mould cavity/cavities, the carrier with encapsulated electronic components is taken out of the encapsulating press. And the encapsulated products may be separated from each other during further processing. The use of foil during the encapsulating process may be to screen or cover a part of the electronic components to be covered with the foil and thus to prevent a part of electronic component to be covered by the encapsulating material but also may be to screen the encapsulating material from the mould surface. The partial covered product (not over moulded products are also referred to as “bare die” or “exposed die” products) may be used in various applications; like for instance various types of sensor components, ultra-low packages or heat dissipating components. This method of encapsulation is practised on large industrial scale and enables well controlled encapsulation of partially uncovered electronic components. A problem during the encapsulating process and the subsequent processing of the moulded electronic components is that the control of the accuracy of the dimensions of the moulded product is not always enough to meet the increasing accuracy demands in the market.
The present invention has for its object to provide an alternative method and device with which the advantages of the prior art method of encapsulating electronic components are maintained but that provide better/more accurate encapsulation of the electronic components.
The invention provides for this purpose a mould for encapsulating electronic components mounted on a carrier, comprising at least two mould parts which are displaceable relative to each other, at least one of the mould parts with a mould cavity recessed in a contact side, which mould parts are configured to engage with at least one mould cavity round the electronic components to be encapsulated; wherein at least a part of the contact sides of one of the mould parts is provided with elastomeric micropillars. In this respect a mould cavity recessed in a contact side is to be understood as being a part of the contact side of the mould part wherein that mould cavity is recessed. The presence of elastomeric micro-pillars on the surface of a mould part provides the opportunity to compensate small differences in the height of the electronic components to be moulded (at least partial enclosed by encapsulating material) due to the flexibility of the elastomeric micro-pillars. The elastomeric micro-pillars normally have a load-displacement curve that is linear and also the plastic deformation (compression and/or bending of the pillar shaped structures) of the micro-pillars is possible without leading to substantial bulging of the micro-pillars. Especially in the situation wherein a foil layer is pressed against the electronic components to keep a part of the electronic component to be encapsulated free of encapsulating material the variation in height compensation that may be provided by the micro-pillars is advantageous as only limited variations in the height of electronic components mounted on a carrier (dies, chips, or other components) may lead to contamination of surfaces during the encapsulation process that have to be kept free of encapsulating material. The prevention of such contamination is also referred to as bleed- and flash free moulding. According the prior art a flexible foil was used for such anticipation on limited height differences however the height adaption properties of flexibility of foil is limited due to the foil characteristics which may lead to high vertical forces and stresses in the electronic components, and/or the connections of the electronic components with the carrier (e.g. bumps or pillars in case of “flip chip connections”), as well as high stresses in the an interposer or the carrier. These high stresses have to be avoided as high stresses (high loads) may lead into cracks in the electronic components to be encapsulated, to cracks in the interconnection of the electronic components with the environment (carrier) and/or cracks in an electronic component mounting base or carrier. In situations wherein a carrier is for instance a substrate and/or a carrier made out of glass or silicon, like a wafer, enhanced stress levels may even lead to damage of such a carrier. The prior art use of foil provides build-up of local stresses in a mould only partially but the present invention further improves the limitation of build-up of local stresses in a mould and thus less damage on electronic components, their mounting and the carriers will occur. The present invention is typically favourable for electronic components mounted on a carrier wherein the carrier is a (silicon) wafer and/or a substrate in the form of a plural layered flat structure providing a carrying surface as well as an electrical conductive support structure. A further disadvantage of the prior art encapsulation of electronic components using foil that may be avoided with the present invention is that the compression of foil between an electronic component en the contact side of a mould part is that when foil material is locally compressed the material partially moves sideward where it may generate intrusions around the electronic component that is partially covered by that foil. For reliability and cosmetic reasons, especially now there is a move towards lower packages, such intrusion are not accepted anymore. The incorporation of elastomeric micro-pillars according the present invention also prevent, or at least limit the creation of package intrusions around the moulded electronic components. The elastic deformation of the micro-pillars when used in combination with a foil cover also leads to a limited load of the foil which enables that a foil layer may be re-used for many times (many encapsulating cycles) which is different from when height compensation has only to be provided by the foil. Less foil consumption in the encapsulation process has the advantage that it results in lower production costs.
In an embodiment the elastomeric micro-pillars are vertical attached to the contact side of a mould part. The flexibility of the micro-pillars normally in the vertical direction of the pillars is largest and most stable. Especially the use of the flexibility of the micropillars in their longitudinal direction (along the axis of the pillar) provides the required flexibility to compensate height differences in the electronic components to be encapsulated. Further control of the flexibility and the forces involved may be realised by placing plural elastomeric micro-pillars in an array.
To be directed towards the side of the electronic components that have to be kept free of encapsulating material moulded elastomeric the micro-pillars may be attached in a mould cavity that is recessed in a contact side of a mould part.
To enable the micro-pillars to effectively support a foil layer the micro-pillars may be microsphere-tipped on the side facing away from the contact side of the mould part where the micro-pillars are attached to. Such microspheres on the tips of the micropillars may also enhance the lifetime of the micro-pillars.
As also practised in the prior art moulds also in combination with the use of micropillars at least one of the mould parts may be provided with suction channels opening to the contact side of the mould part and/or at least one of the mould parts may be provided with a feed for encapsulating material recessed into the mould parts and connecting to a mould cavity.
The micro-pillars may be provided with a hollow kernel which may add to the flexibility of the micro-pillars. Such micro-pillars are also known under the name “micro tubes” or “nano tubes” and may for instance a tube-like structure made out of carbon, silicon, boron nitride, polydimethylsiloxane (PDMS) or any other suitable material. The size of the micro-pillars may exceed 2,000 μπι in height and 100 pm in cross section and the number of micro-pillars per square centimetre may vary from several thousand to even up to millions. The micro-pillars may for instance be fabricated by lithography, etching, deposition, moulding or any other suitable technique.
The present invention also provides a moulding press for encapsulating electronic components mounted on a carrier, comprising: a mould as claimed in any of the foregoing claims comprising at least two mould parts which are displaceable relative to each other, at least one of the mould parts with a mould cavity recessed in a contact side, which mould parts are configured to engage with at least one mould cavity round the electronic components to be encapsulated, wherein least a part of the contact sides of one of the mould parts is provided with elastomeric micro-pillars; feed means for encapsulating material to the mould cavity, and a drive system for moving the mould parts relative to each other and clamping the carrier between the mould parts with a controllable pressure, wherein the moulding press is provided with a foil handler to cover the elastomeric micro-pillars on the contact side of at least one of the mould parts. With such a moulding press the advantages as mentioned in relation to the mould according the present invention may be realised, which advantages as listed above are included here by reference. Especially the combination of at least one of the mould parts provided with a structure of plural micro-pillars in combination with the foil handler -normally designed as a foil feed roller and a foil discharge roller located on opposite sides of the mould parts - enables the support of a foil that may partially cover the electronic components during the encapsulation process. The micro-pillars attached to a mould part are providing a flexible support surface. The foil handler will be positioned such that enables to manipulated a foil against at least the mould cavity in a mould part to cover. The combination of micro-pillar support and the foil results in less production costs (due less foil cost) and better moulding result (less dwelling due to less or no plastic deformation of the foil and less bleed and/or flash on the parts of the electronic components to be kept free of encapsulation material) as the elastomeric micro pillars are used to compensate the height differences between the various electronic components to be encapsulated. The foil furthermore has a function to enable easy release of the moulded electronic components from the mould; this type of foil is also named “release foil”.
The moulding press may also be provided with suction means connecting to suction channels that open to the contact side of the mould part which may further support the positioning (an maintaining a positioning) of the foil against a mould part as it may suck the foil (due to the under-pressure in the suction channels) against the mould mart and the micro-pillars attached to that mould part.
The present invention is also providing a method for encapsulating electronic components mounted on a carrier comprising the processing steps of: A) at least partially covering with a foil layer a contact side of a mould part, the covered part of the contact side of the mould part including at least one recessed mould cavity; B) placing the carrier with electronic components between at least two mould parts of a mould of which at least one mould parts is at least partially covered with the foil layer; C) moving the mould parts towards each other, such that the mould parts are clamping the carrier between the mould parts and the at least one mould cavity is enclosing the electronic components to be encapsulated; D) bringing an encapsulating material in the mould cavity; E) moving the mould parts apart from each other, and removing the carrier with moulded electronic components from the mould parts; wherein the foil layer in the mould cavity is at least locally supported by elastomeric micro-pillars, which elastomeric micro-pillars are attached to the contact side of a mould part. Especially the electronic components to be moulded may be contacting the foil layer in the mould cavity. With such method so called “bare die” products are profitably produced. See for further explanation the advantages as listed above in relation to the mould and the moulding press according the present invention. The elastomeric micro-pillars will be compressed and/or deformed dependent on deviations in height of the electronic components to be moulded.
The encapsulating material may be brought in the mould cavity according method step D) after the mould parts are moved towards each other according method step C) by displacing liquid encapsulating material to the mould cavity enclosing the electronic component by exerting pressure on the encapsulating material. Such moulding techniques is are also known as transfer moulding and compression moulding. In an alternative moulding process the encapsulating material may be brought in the mould cavity according method step D) before the mould parts are moved towards each other according method step C). Such moulding process is also known as “compression moulding”. The present invention may be practiced independent of the specific type of moulding process. Normally the encapsulating material is heated before and/or during the moulding process but also such is not a limitation for the present invention.
The encapsulating material may at least partially be cured before moving the mould parts apart from each other according method step E) so that the mould shaped product is not losing its shape during the release from the moulded product out of the mould.
The present invention will be further elucidated on the basis of the non-limitative exemplary embodiments shown in the following figures. Herein shows: figure 1A a side-view on a cross-section through a mould according the present invention; figure IB a detail of the side-view shown in figure 1A; figure 2A an elastomeric micro-pillar in a non-loaded situation; and
Figures 2B - 2D the elastomeric micro-pillar from figure 2A in various loaded situations.
Figure 1A, as well as in detail figure IB, show a cross-section through a mould 1 for encapsulating electronic components 2 mounted on a carrier 3. The mould 1 comprises two mould parts; a top mould part 4 and a bottom mould part 5 which are displaceable relative to each other. In the situation depicted in figures 1A an IB the mould parts 4, 5 are moved towards each other such that they are clamping the carrier 3 with electronic components 2 in between the mould parts 4, 5. In the top mould part 4 mould cavity 6 is recessed wherein that receives the electronic components 2. Against the contact side of the top mould 4 a foil layer 7 is placed which has a function to enable enhanced release of moulded electronic components but also to keep the top side of the electronic components 2 free of moulding material 8. The moulding material 8 is brought in between the mould parts 4, 5, especially in the spare rooms in the mould cavity 6 (which are the locations in between the electronic components 2). In the mould cavity 6 a base plate 9 carries a large quantity of elastomeric micro-pillars 10. The elastomeric micro-pillars 10 flexibly support the foil layer 7 which provide the advantages according the present invention.
In figure 2A an elastomeric micro-pillar 11 is schematically depicted in a situation wherein the micro-pillar 11 is not loaded in axial direction so the elastomeric micropillar 11 has its unloaded length Li. In figure 2B the same elastomeric micro-pillar 11 is now depicted in a loaded situation (see force F) that reduces the effective support length L2 of the elastomeric micro-pillar 11. The effective support length L2 is realised by bending of the elastomeric micro-pillar 11. In figure 2C the same elastomeric micropillar 11 is again depicted in the same loaded situation (see force F) that reduces the effective support length again to L2 however here the length reduction is realised due to compression of the same elastomeric micro-pillar 11 is now depicted in a loaded situation (see force F) that reduces the effective support length L2 of the elastomeric micro-pillar 11. In figure 2D a situation is depicted that combines the two effects as shown in figures 2B and 2C resulting in the effective support length L2, so partial compression and partial bending of the elastomeric micro-pillar 11.

Claims (16)

1. Mal voor het inkapselen van op een drager bevestigde elektronische componenten, omvattende ten minste twee maldelen die ten opzichte van elkaar verplaatsbaar zijn, waarbij ten minste één van de maldelen een in een contactzijde uitgespaarde malholte heeft, welke maldelen zodanig zijn uitgevoerd dat ze aangrijpen op ten minste één malholte rond de in te kapselen elektronische componenten; met het kenmerk dat ten minste een deel van de contactzijden van één van de maldelen is voorzien van elastomere microzuilen.A mold for encapsulating electronic components mounted on a carrier, comprising at least two mold parts that are movable relative to each other, at least one of the mold parts having a mold cavity recessed in a contact side, which mold parts are designed such that they engage on at least one mold cavity around the electronic components to be encapsulated; characterized in that at least a part of the contact sides of one of the mold parts is provided with elastomeric micro-columns. 2. Mal volgens conclusie 1, met het kenmerk dat de elastomere microzuilen verticaal aan de contactzijde van een maldeel zijn bevestigd.Mold according to claim 1, characterized in that the elastomeric micro-columns are mounted vertically on the contact side of a mold part. 3. Mal volgens conclusie 1 of 2, met het kenmerk dat er meerdere elastomere microzuilen in een matrix zijn aangebracht.3. Mold according to claim 1 or 2, characterized in that a plurality of elastomeric micro-columns are arranged in a matrix. 4. Mal volgens één van de voorgaande conclusies, met het kenmerk dat er elastomere microzuilen zijn bevestigd in een in een contactzijde van een maldeel uitgespaarde malholte.Mold according to one of the preceding claims, characterized in that elastomeric micro-columns are mounted in a mold cavity recessed in a contact side of a mold part. 5. Mal volgens één van de voorgaande conclusies, met het kenmerk dat de microzuilen een microbolvormige punt hebben aan de zijde die is afgewend van de contactzijde van het maldeel waaraan de microzuilen zijn bevestigd.Mold according to one of the preceding claims, characterized in that the micro-columns have a micro-spherical point on the side that is remote from the contact side of the mold part to which the micro-columns are attached. 6. Mal volgens één van de voorgaande conclusies, met het kenmerk dat ten minste één van de maldelen is voorzien van opzuigkanalen die open zijn aan de contactzijde van het maldeel.Mold according to one of the preceding claims, characterized in that at least one of the mold parts is provided with suction channels that are open on the contact side of the mold part. 7. Mal volgens één van de voorgaande conclusies, met het kenmerk dat ten minste één van de maldelen is voorzien van een toevoer voor inkapselmateriaal die is uitgespaard in de maldelen en met een malholte is verbonden.Mold according to one of the preceding claims, characterized in that at least one of the mold parts is provided with a feed for encapsulating material that is recessed in the mold parts and is connected to a mold cavity. 8. Mal volgens één van de voorgaande conclusies, met het kenmerk dat de microzuilen zijn voorzien van een holle kern.Mold according to one of the preceding claims, characterized in that the micro columns are provided with a hollow core. 9. Gietpers voor het inkapselen van op een drager bevestigde elektronische componenten, omvattende: - een mal volgens één van de voorgaande conclusies, omvattende ten minste twee maldelen die ten opzichte van elkaar verplaatsbaar zijn, waarbij ten minste één van de maldelen een in een contactzijde uitgespaarde malholte heeft, welke maldelen zodanig zijn uitgevoerd dat ze aangrijpen op ten minste één malholte rond de in te kapselen elektronische componenten, waarbij ten minste een deel van de contactzijden van één van de maldelen is voorzien van elastomere microzuilen; - toevoermiddelen voor inkapselmateriaal naar de malholte, en - een aandrijfsysteem voor het verplaatsen van de maldelen ten opzichte van elkaar en het klemmen van de drager tussen de maldelen met een regelbare druk, waarbij de gietpers is voorzien van een foliebedieningsinrichting om de elastomere microzuilen aan de contactzijde van ten minste één van de maldelen te bedekken.Casting press for encapsulating electronic components mounted on a support, comprising: - a mold according to any one of the preceding claims, comprising at least two mold parts that are movable relative to each other, at least one of the mold parts being one in a contact side has a mold cavity, which mold parts are designed such that they engage at least one mold cavity around the electronic components to be encapsulated, wherein at least a part of the contact sides of one of the mold parts is provided with elastomeric micro-columns; - feed means for encapsulating material to the mold cavity, and - a drive system for displacing the mold parts relative to each other and clamping the carrier between the mold parts with a controllable pressure, wherein the casting press is provided with a foil operating device around the elastomeric micro-columns the contact side of at least one of the mold parts. 10. Gietpers volgens conclusie 9, met het kenmerk dat de foliebedieningsinrichting is voorzien van een folietoevoerrol en een folieafvoerrol die aan overliggende zijden van de maldelen zijn gelegen.10. Casting press as claimed in claim 9, characterized in that the foil operating device is provided with a foil feed roller and a foil discharge roller which are situated on opposite sides of the mold parts. 11. Gietpers volgens conclusie 9 of 10, met het kenmerk dat de gietpers is voorzien van opzuigmiddelen die zijn verbonden met opzuigkanalen welke aan de contactzijde van het maldeel open zijn.Casting press according to claim 9 or 10, characterized in that the casting press is provided with suction means which are connected to suction channels which are open on the contact side of the mold part. 12. Werkwijze voor het inkapselen van op een drager bevestigde elektronische componenten omvattende de bewerkingsstappen: A) het ten minste gedeeltelijk met een folielaag bedekken van een contactzijde van een maldeel, waarbij het bedekte deel van de contactzijde van het maldeel ten minste één uitgespaarde malholte omvat; B) het plaatsen van de drager met elektronische componenten tussen ten minste twee maldelen van een mal waarvan ten minste één maldeel ten minste gedeeltelijk met de folielaag is bedekt; C) het naar elkaar toe verplaatsen van de maldelen, zodat de maldelen de drager tussen de maldelen klemmen en de ten minste ene malholte de in te kapselen elektronische componenten omsluit; D) het brengen van een inkapselmateriaal in de malholte; E) het uit elkaar plaatsen van de maldelen, en het verwijderen van de drager met gevormde elektronische componenten uit de maldelen; waarbij de folielaag in de malholte ten minste plaatselijk wordt ondersteund door elastomere microzuilen, welke elastomere microzuilen aan de contactzijde van een maldeel zijn bevestigd.12. Method for encapsulating electronic components mounted on a carrier, comprising the processing steps: A) covering a contact side of a mold part at least partially with a film layer, wherein the covered part of the contact side of the mold part comprises at least one recessed mold cavity ; B) placing the carrier with electronic components between at least two mold parts of a mold of which at least one mold part is at least partially covered with the foil layer; C) moving the mold parts towards each other, so that the mold parts clamp the carrier between the mold parts and the at least one mold cavity encloses the electronic components to be encapsulated; D) introducing an encapsulation material into the mold cavity; E) spacing the mold parts, and removing the carrier with molded electronic components from the mold parts; wherein the film layer in the mold cavity is supported at least locally by elastomeric micro-columns, which elastomeric micro-columns are attached to the contact side of a mold part. 13. Werkwijze volgens conclusie 12, met het kenmerk dat de te gieten elektronische componenten contact maken met de folielaag in de malholte.A method according to claim 12, characterized in that the electronic components to be cast make contact with the film layer in the mold cavity. 14. Werkwijze volgens conclusie 12 of 13, met het kenmerk dat het inkapselmateriaal in de malholte wordt gebracht volgens werkwijzestap D) nadat de maldelen naar elkaar toe zijn verplaatst volgens werkwijzestap C) door het verdringen van vloeibaar inkapselmateriaal naar de de elektronische component omsluitende malholte door middel van het uitoefenen van druk op het inkapselmateriaal.A method according to claim 12 or 13, characterized in that the encapsulation material is introduced into the mold cavity according to method step D) after the mold parts have been moved towards each other according to method step C) by displacing liquid encapsulation material to the mold cavity enclosing the electronic component means of applying pressure to the encapsulating material. 15. Werkwijze volgens conclusie 14, met het kenmerk dat het inkapselmateriaal ten minste gedeeltelijk wordt uitgehard alvorens de maldelen uit elkaar te plaatsen volgens werkwijzestap E).Method according to claim 14, characterized in that the encapsulating material is cured at least partially before the mold parts are spaced apart according to method step E). 16. Werkwijze volgens conclusie 12 of 13, met het kenmerk dat het inkapselmateriaal in de malholte wordt gebracht volgens werkwijzestap D) voordat de maldelen naar elkaar toe worden verplaatst volgens werkwijzestap C).Method according to claim 12 or 13, characterized in that the encapsulation material is introduced into the mold cavity according to method step D) before the mold parts are moved towards each other according to method step C).
NL2015091A 2015-07-06 2015-07-06 Mould, moulding press and method for encapsulating electronic components mounted on a carrier using elastomeric micro-pillars. NL2015091B1 (en)

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NL2015091A NL2015091B1 (en) 2015-07-06 2015-07-06 Mould, moulding press and method for encapsulating electronic components mounted on a carrier using elastomeric micro-pillars.
PCT/NL2016/050474 WO2017007308A1 (en) 2015-07-06 2016-07-04 Mould, moulding press and method for encapsulating electronic components mounted on a carrier using flexible micro-pillars
TW105121320A TWI648140B (en) 2015-07-06 2016-07-06 Mould, moulding press and method for encapsulating electronic components mounted on a carrier using micro-pillars

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NL2021058B1 (en) * 2018-06-05 2019-12-11 Besi Netherlands Bv Method, foil, mould part and surface layer for encapsulating electronic components mounted on a carrier using expansion spaces absorbing local foil layer displacements
CN112549434A (en) * 2020-12-09 2021-03-26 扬州扬芯激光技术有限公司 Optical lens and method for encapsulating the same

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