WO2017007308A1 - Mould, moulding press and method for encapsulating electronic components mounted on a carrier using flexible micro-pillars - Google Patents
Mould, moulding press and method for encapsulating electronic components mounted on a carrier using flexible micro-pillars Download PDFInfo
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- WO2017007308A1 WO2017007308A1 PCT/NL2016/050474 NL2016050474W WO2017007308A1 WO 2017007308 A1 WO2017007308 A1 WO 2017007308A1 NL 2016050474 W NL2016050474 W NL 2016050474W WO 2017007308 A1 WO2017007308 A1 WO 2017007308A1
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- Prior art keywords
- mould
- pillars
- micro
- electronic components
- parts
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
Definitions
- the invention relates to a mould for encapsulating electronic components mounted on a carrier, comprising at least two displaceable mould parts, which mould parts are configured to be clamped together with their respective contact sides to form at least one mould cavity round the electronic components to be encapsulated.
- the invention also relates to a moulding press for encapsulating electronic components mounted on a carrier as well as to a method for encapsulating electronic components mounted on a carrier.
- the encapsulating material may consist of a lead frame, a multi-layer carrier - manufactured partially from epoxy - (also referred to as board or substrate and so on) or another carrier structure.
- epoxy also referred to as resin
- filler material After at least partial (chemical) curing of the
- the carrier with encapsulated electronic components is taken out of the encapsulating press.
- encapsulated products may be separated from each other during further processing.
- the use of foil during the encapsulating process may be to screen or cover a part of the electronic components to be covered with the foil and thus to prevent a part of electronic component to be covered by the encapsulating material but also may be to screen the encapsulating material from the mould surface.
- the partial covered product (not over moulded products are also referred to as "bare die” or “exposed die” products) may be used in various applications; like for instance various types of sensor components, ultra-low packages or heat dissipating components.
- This method of encapsulation is practised on large industrial scale and enables well controlled encapsulation of partially uncovered electronic components.
- a problem during the encapsulating process and the subsequent processing of the moulded electronic components is that the control of the accuracy of the dimensions of the moulded product is not always enough to meet the increasing accuracy demands in the market.
- the present invention has for its object to provide an alternative method and device with which the advantages of the prior art method of encapsulating electronic components are maintained but that provide better/more accurate encapsulation of the electronic components.
- the invention provides for this purpose a mould for encapsulating electronic components mounted on a carrier, comprising at least two mould parts which are displaceable relative to each other, which mould parts are configured to engage, e.g. configured to be clamped together respective contact sides, to form at least one mould cavity round the electronic components to be encapsulated, wherein at least one of the mould parts is provided with a mould cavity recessed in a contact side of the mould part; wherein at least a part of the surface of the mould cavity recessed in the contact side of one of the mould part is provided with flexibly micro- pillars, preferably elastomeric micro-pillars (i.e. micro-pillars made from an elastomer).
- a mould cavity recessed in a contact side is to be understood as being a part of the contact side of the mould part wherein that mould cavity is recessed.
- the presence of micro-pillars on the surface of a mould part provides the opportunity to compensate small differences in the height of the electronic components to be moulded (at least partial enclosed by encapsulating material) due to the flexibility of the micro-pillars.
- the micro-pillars normally have a load-displacement curve that is linear and also the plastic deformation
- the variation in height compensation that may be provided by the micro- pillars is advantageous as only limited variations in the height of electronic components mounted on a carrier (dies, chips, or other components) may lead to contamination of surfaces during the encapsulation process that have to be kept free of encapsulating material.
- the prevention of such contamination is also referred to as bleed- and flash free moulding.
- a carrier is for instance a substrate and/or a carrier made out of glass or silicon, like a wafer
- enhanced stress levels may even lead to damage of such a carrier.
- the prior art use of foil provides build-up of local stresses in a mould only partially but the present invention further improves the limitation of build-up of local stresses in a mould and thus less damage on electronic components, their mounting and the carriers will occur.
- the present invention is typically favourable for electronic components mounted on a carrier wherein the carrier is a (silicon) wafer and/or a substrate in the form of a plural layered flat structure providing a carrying surface as well as an electrical conductive support structure.
- a further disadvantage of the prior art encapsulation of electronic components using foil that may be avoided with the present invention is that the compression of foil between an electronic component en the contact side of a mould part is that when foil material is locally compressed the material partially moves sideward where it may generate intrusions around the electronic component that is partially covered by that foil. For reliability and cosmetic reasons, especially now there is a move towards lower packages, such intrusion are not accepted anymore.
- the incorporation of micro-pillars according the present invention also prevent, or at least limit the creation of package intrusions around the moulded electronic components.
- the elastic deformation of the micro-pillars when used in combination with a foil cover also leads to a limited load of the foil which enables that a foil layer may be re-used for many times (many encapsulating cycles) which is different from when height compensation has only to be provided by the foil. Less foil
- the micro-pillars are vertical attached to the surface of a mould part.
- the flexibility of the micro-pillars normally in the vertical direction of the pillars is largest and most stable.
- the use of the flexibility of the micro-pillars in their longitudinal direction (along the axis of the pillar) provides the required flexibility to compensate height differences in the electronic components to be encapsulated. Further control of the flexibility and the forces involved may be realised by placing plural micro-pillars in an array.
- the micro-pillars may be attached in a mould cavity that is recessed in a contact side of a mould part.
- the micro-pillars may be microsphere-tipped on the side facing away from the surface of the mould part where the micro-pillars are attached to. Such microspheres on the tips of the micro- pillars may also enhance the lifetime of the micro-pillars.
- At least one of the mould parts may be provided with suction channels opening to the contact side of the mould part and/or at least one of the mould parts may be provided with a feed for encapsulating material recessed into the mould parts and connecting to a mould cavity.
- micro-pillars may be provided with a hollow kernel which may add to the flexibility of the micro-pillars.
- Such micro-pillars are also known under the name “micro tubes” or “nano tubes” and may for instance a tube-like structure made out of carbon, silicon, boron nitride, polydimethylsiloxane (PDMS) or any other suitable material.
- the size of the micro-pillars may exceed 2,000 m in height and 100 m in cross section and the number of micro-pillars per square centimetre may vary from several thousand to even up to millions.
- the micro-pillars may for instance be fabricated by lithography, etching, deposition, moulding or any other suitable technique.
- the present invention also provides a moulding press for encapsulating electronic components mounted on a carrier, comprising:
- a mould as described above i.e. comprising at least two mould parts which are displaceable relative to each other, which mould parts are configured to engage, e.g. configured to be clamped together respective contact sides, to form at least one mould cavity round the electronic components to be encapsulated
- at least one of the mould parts is provided with a mould cavity recessed in a contact side of the mould part, and wherein at least a part of the surface of the mould cavity recessed in the contact side of one of the mould part is provided with flexibly micro-pillars, preferably elastomeric micro-pillars (i.e. micro-pillars made from an elastomer);
- the moulding press is provided with a foil handler to cover the micro-pillars on the side facing away from the surface of the mould part the micro-pillars are attached to.
- the foil handler - normally designed as a foil feed roller and a foil discharge roller located on opposite sides of the mould parts - enables the support of a foil that may partially cover the electronic components during the encapsulation process.
- the micro-pillars attached to a mould part are providing a flexible support surface.
- the foil handler will be positioned such that enables to manipulated a foil against at least the mould cavity in a mould part to cover.
- micro-pillar support and the foil results in less production costs (due less foil cost) and better moulding result (less dwelling due to less or no plastic deformation of the foil and less bleed and/or flash on the parts of the electronic components to be kept free of encapsulation material) as the micro-pillars are used to compensate the height differences between the various electronic components to be encapsulated.
- the foil furthermore has a function to enable easy release of the moulded electronic components from the mould; this type of foil is also named "release foil”.
- the moulding press may also be provided with suction means connecting to suction channels that open to the contact side of the mould part which may further support the positioning (an maintaining a positioning) of the foil against a mould part as it may suck the foil (due to the under-pressure in the suction channels) against the mould part and the micro-pillars attached to that mould part.
- the present invention is also providing a method for encapsulating electronic components mounted on a carrier comprising the processing steps of: A) at least partially covering with a foil layer a contact side of a mould part, the covered part of the contact side of the mould part including at least one recessed mould cavity; B) placing the carrier with electronic components between at least two mould parts of a mould of which at least one of the mould parts is at least partially covered with the foil layer; C) moving the mould parts towards each other, such that the mould parts are clamping the carrier between the contact sides of the respective mould parts and the at least one mould cavity is enclosing the electronic components to be encapsulated; D) bringing an encapsulating material in the mould cavity; E) moving the mould parts apart from each other, and removing the carrier with moulded electronic components from the mould parts; wherein the foil layer in the mould cavity is at least locally supported by flexible micro-pillars, preferably elastomeric micro-pillars, which micro-pillars are attached to the surface of the mould part, preferably the surface of the
- the electronic components to be moulded may be contacting the foil layer in the mould cavity. With such method so called “bare die” products are profitably produced. See for further explanation the advantages as listed above in relation to the mould and the moulding press according the present invention.
- the micro-pillars will be compressed and/or deformed dependent on deviations in height of the electronic components to be moulded.
- the encapsulating material may be brought in the mould cavity according method step D) after the mould parts are moved towards each other according method step C) by displacing liquid encapsulating material to the mould cavity enclosing the electronic component by exerting pressure on the encapsulating material.
- Such moulding techniques is also known as transfer moulding and compression moulding.
- the encapsulating material may be brought in the mould cavity according method step D) before the mould parts are moved towards each other according method step C).
- Such moulding process is also known as "compression moulding".
- the present invention may be practiced independent of the specific type of moulding process. Normally the encapsulating material is heated before and/or during the moulding process but also such is not a limitation for the present invention.
- the encapsulating material may at least partially be cured before moving the mould parts apart from each other according method step E) so that the mould shaped product is not losing its shape during the release from the moulded product out of the mould.
- figure 1A a side-view on a cross-section through a mould according the present invention
- figure 1 B a detail of the side-view shown in figure 1 A;
- figure 2A a micro-pillar in a non-loaded situation
- Figures 2B-2D the micro-pillar from figure 2A in various loaded situations.
- Figure 1 A shows a cross-section through a mould 1 for encapsulating electronic components 2 mounted on a carrier 3.
- the mould 1 comprises two mould parts; a top mould part 4 and a bottom mould part 5 which are displaceable relative to each other.
- the mould parts 4, 5 are moved towards each other such that they are clamping the carrier 3 with electronic components 2 in between the mould parts 4, 5.
- the top mould part 4 mould cavity 6 is recessed wherein that receives the electronic components 2.
- a foil layer 7 is placed which has a function to enable enhanced release of moulded electronic
- moulding material 8 is brought in between the mould parts 4, 5, especially in the spare rooms in the mould cavity 6 (which are the locations in between the electronic components 2).
- a base plate 9 carries a large quantity of micro-pillars 10, preferably elastomeric micro-pillars.
- the micro- pillars 10 flexibly support the foil layer 7 which provide the advantages according the present invention.
- a micro-pillar 1 1 e.g. elastomeric micro-pillar, is schematically depicted in a situation wherein the micro-pillar 1 1 is not loaded in axial direction so the micro-pillar 1 1 has its unloaded length .
- the same micro-pillar 1 1 is now depicted in a loaded situation (see force F) that reduces the effective support length L 2 of the micro-pillar 1 1 .
- the effective support length L 2 is realised by bending of the micro-pillar 1 1 .
Abstract
The invention relates to a mould for encapsulating electronic components mounted on a carrier, comprising at least two displaceable mould parts, which mould parts are configured to be clamped together with their respective contact sides to form at least one mould cavity round the electronic components to be encapsulated, and wherein at least one of the mould parts is provided with a mould cavity recessed in the contact side of the mould part, and wherein at least a part of the surface of the mould cavity recessed in the contact side of the mould part is provided with flexible micro-pillars. The invention also relates to a moulding press for encapsulating electronic components comprising such a mould and a method for encapsulating electronic components using a foil layer in the mould cavity that is at least locally supported by flexible, preferably elastomeric, micro-pillars.
Description
MOULD, MOULDING PRESS AND METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS MOUNTED ON A CARRIER USING FLEXIBLE M ICRO-PILLARS
The invention relates to a mould for encapsulating electronic components mounted on a carrier, comprising at least two displaceable mould parts, which mould parts are configured to be clamped together with their respective contact sides to form at least one mould cavity round the electronic components to be encapsulated. The invention also relates to a moulding press for encapsulating electronic components mounted on a carrier as well as to a method for encapsulating electronic components mounted on a carrier.
The encapsulation of electronic components mounted on a carrier with an encapsulating material is a known art. On an industrial scale such electronic components are provided with an encapsulation, usually an encapsulation of a curing epoxy to which a filler material is added. There is a trend in the market toward simultaneous encapsulation of larger quantities of relatively small electronic components. Electronic components may be envisaged here such as
semiconductors (chips, although LEDs are in this respect also deemed
semiconductors) which are generally becoming increasingly smaller. Once the encapsulating material has been arranged the collectively encapsulated electronic components are situated in an encapsulation (package) which is arranged on one but sometimes also two sides of the carrier. The encapsulating material often takes the form here of a flat layer connected to the carrier. The carrier may consist of a lead frame, a multi-layer carrier - manufactured partially from epoxy - (also referred to as board or substrate and so on) or another carrier structure.
During the encapsulation of electronic components mounted on a carrier, use is usually made according to the prior art of encapsulating presses provided with two mould halves, into at least one of which is recessed one or plural mould cavities. After placing the carrier with the electronic components for encapsulating between the mould halves, the mould halves may be moved toward each other, e.g. such that they clamp the carrier. A, normally heated, liquid encapsulating material may then be fed to the mould cavities, usually by means of transfer moulding. As an alternative it is also possible to bring the encapsulating material before closure of the mould parts, e.g. as a granulate, in the mould cavity after which the
components to be moulded are pressed into the encapsulating material; such compression encapsulating process is an alternative for transfer moulding. Applied as encapsulating material is epoxy (also referred to as resin) which is generally provided with filler material. After at least partial (chemical) curing of the
encapsulating material in the mould cavity/cavities, the carrier with encapsulated electronic components is taken out of the encapsulating press. And the
encapsulated products may be separated from each other during further processing. The use of foil during the encapsulating process may be to screen or cover a part of the electronic components to be covered with the foil and thus to prevent a part of electronic component to be covered by the encapsulating material but also may be to screen the encapsulating material from the mould surface. The partial covered product (not over moulded products are also referred to as "bare die" or "exposed die" products) may be used in various applications; like for instance various types of sensor components, ultra-low packages or heat dissipating components. This method of encapsulation is practised on large industrial scale and enables well controlled encapsulation of partially uncovered electronic components. A problem during the encapsulating process and the subsequent processing of the moulded electronic components is that the control of the accuracy of the dimensions of the moulded product is not always enough to meet the increasing accuracy demands in the market.
The present invention has for its object to provide an alternative method and device with which the advantages of the prior art method of encapsulating electronic components are maintained but that provide better/more accurate encapsulation of the electronic components.
The invention provides for this purpose a mould for encapsulating electronic components mounted on a carrier, comprising at least two mould parts which are displaceable relative to each other, which mould parts are configured to engage, e.g. configured to be clamped together respective contact sides, to form at least one mould cavity round the electronic components to be encapsulated, wherein at least one of the mould parts is provided with a mould cavity recessed in a contact side of the mould part; wherein at least a part of the surface of the mould cavity recessed in the contact side of one of the mould part is provided with flexibly micro- pillars, preferably elastomeric micro-pillars (i.e. micro-pillars made from an
elastomer). In this respect a mould cavity recessed in a contact side is to be understood as being a part of the contact side of the mould part wherein that mould cavity is recessed. The presence of micro-pillars on the surface of a mould part provides the opportunity to compensate small differences in the height of the electronic components to be moulded (at least partial enclosed by encapsulating material) due to the flexibility of the micro-pillars. The micro-pillars normally have a load-displacement curve that is linear and also the plastic deformation
(compression and/or bending of the pillar shaped structures) of the micro-pillars is possible without leading to substantial bulging of the micro-pillars. Especially in the situation wherein a foil layer is pressed against the electronic components to keep a part of the electronic component to be encapsulated free of encapsulating material the variation in height compensation that may be provided by the micro- pillars is advantageous as only limited variations in the height of electronic components mounted on a carrier (dies, chips, or other components) may lead to contamination of surfaces during the encapsulation process that have to be kept free of encapsulating material. The prevention of such contamination is also referred to as bleed- and flash free moulding. According the prior art a flexible foil was used for such anticipation on limited height differences however the height adaption properties of flexibility of foil is limited due to the foil characteristics which may lead to high vertical forces and stresses in the electronic components, and/or the connections of the electronic components with the carrier (e.g. bumps or pillars in case of "flip chip connections"), as well as high stresses in the an interposer or the carrier. These high stresses have to be avoided as high stresses (high loads) may lead into cracks in the electronic components to be encapsulated, to cracks in the interconnection of the electronic components with the environment (carrier) and/or cracks in an electronic component mounting base or carrier. In situations wherein a carrier is for instance a substrate and/or a carrier made out of glass or silicon, like a wafer, enhanced stress levels may even lead to damage of such a carrier. The prior art use of foil provides build-up of local stresses in a mould only partially but the present invention further improves the limitation of build-up of local stresses in a mould and thus less damage on electronic components, their mounting and the carriers will occur. The present invention is typically favourable for electronic components mounted on a carrier wherein the carrier is a (silicon) wafer and/or a substrate in the form of a plural layered flat structure providing a carrying surface as well as an electrical conductive support structure.
A further disadvantage of the prior art encapsulation of electronic components using foil that may be avoided with the present invention is that the compression of foil between an electronic component en the contact side of a mould part is that when foil material is locally compressed the material partially moves sideward where it may generate intrusions around the electronic component that is partially covered by that foil. For reliability and cosmetic reasons, especially now there is a move towards lower packages, such intrusion are not accepted anymore. The incorporation of micro-pillars according the present invention also prevent, or at least limit the creation of package intrusions around the moulded electronic components. The elastic deformation of the micro-pillars when used in combination with a foil cover also leads to a limited load of the foil which enables that a foil layer may be re-used for many times (many encapsulating cycles) which is different from when height compensation has only to be provided by the foil. Less foil
consumption in the encapsulation process has the advantage that it results in lower production costs.
In an embodiment the micro-pillars are vertical attached to the surface of a mould part. The flexibility of the micro-pillars normally in the vertical direction of the pillars is largest and most stable. Especially the use of the flexibility of the micro-pillars in their longitudinal direction (along the axis of the pillar) provides the required flexibility to compensate height differences in the electronic components to be encapsulated. Further control of the flexibility and the forces involved may be realised by placing plural micro-pillars in an array.
To be directed towards the side of the electronic components that have to be kept free of encapsulating material moulded the micro-pillars may be attached in a mould cavity that is recessed in a contact side of a mould part. To enable the micro-pillars to effectively support a foil layer the micro-pillars may be microsphere-tipped on the side facing away from the surface of the mould part where the micro-pillars are attached to. Such microspheres on the tips of the micro- pillars may also enhance the lifetime of the micro-pillars.
As also practised in the prior art moulds also in combination with the use of micro- pillars at least one of the mould parts may be provided with suction channels opening to the contact side of the mould part and/or at least one of the mould parts may be provided with a feed for encapsulating material recessed into the mould parts and connecting to a mould cavity.
The micro-pillars may be provided with a hollow kernel which may add to the flexibility of the micro-pillars. Such micro-pillars are also known under the name "micro tubes" or "nano tubes" and may for instance a tube-like structure made out of carbon, silicon, boron nitride, polydimethylsiloxane (PDMS) or any other suitable material. The size of the micro-pillars may exceed 2,000 m in height and 100 m in cross section and the number of micro-pillars per square centimetre may vary from several thousand to even up to millions. The micro-pillars may for instance be fabricated by lithography, etching, deposition, moulding or any other suitable technique.
The present invention also provides a moulding press for encapsulating electronic components mounted on a carrier, comprising:
a mould as described above, i.e. comprising at least two mould parts which are displaceable relative to each other, which mould parts are configured to engage, e.g. configured to be clamped together respective contact sides, to form at least one mould cavity round the electronic components to be encapsulated, wherein at least one of the mould parts is provided with a mould cavity recessed in a contact side of the mould part, and wherein at least a part of the surface of the mould cavity recessed in the contact side of one of the mould part is provided with flexibly micro-pillars, preferably elastomeric micro-pillars (i.e. micro-pillars made from an elastomer);
feed means for encapsulating material to the mould cavity; and
a drive system for moving the mould parts relative to each other and clamping the carrier between the contact sides of the mould parts with a controllable pressure,
wherein the moulding press is provided with a foil handler to cover the micro-pillars on the side facing away from the surface of the mould part the micro-pillars are attached to. With such a moulding press the advantages as mentioned in relation to the mould according the present invention may be realised, which advantages as
listed above are included here by reference. Especially the combination of at least one of the mould parts provided with a structure of plural micro-pillars in
combination with the foil handler - normally designed as a foil feed roller and a foil discharge roller located on opposite sides of the mould parts - enables the support of a foil that may partially cover the electronic components during the encapsulation process. The micro-pillars attached to a mould part are providing a flexible support surface. The foil handler will be positioned such that enables to manipulated a foil against at least the mould cavity in a mould part to cover. The combination of micro-pillar support and the foil results in less production costs (due less foil cost) and better moulding result (less dwelling due to less or no plastic deformation of the foil and less bleed and/or flash on the parts of the electronic components to be kept free of encapsulation material) as the micro-pillars are used to compensate the height differences between the various electronic components to be encapsulated. The foil furthermore has a function to enable easy release of the moulded electronic components from the mould; this type of foil is also named "release foil".
The moulding press may also be provided with suction means connecting to suction channels that open to the contact side of the mould part which may further support the positioning (an maintaining a positioning) of the foil against a mould part as it may suck the foil (due to the under-pressure in the suction channels) against the mould part and the micro-pillars attached to that mould part.
The present invention is also providing a method for encapsulating electronic components mounted on a carrier comprising the processing steps of: A) at least partially covering with a foil layer a contact side of a mould part, the covered part of the contact side of the mould part including at least one recessed mould cavity; B) placing the carrier with electronic components between at least two mould parts of a mould of which at least one of the mould parts is at least partially covered with the foil layer; C) moving the mould parts towards each other, such that the mould parts are clamping the carrier between the contact sides of the respective mould parts and the at least one mould cavity is enclosing the electronic components to be encapsulated; D) bringing an encapsulating material in the mould cavity; E) moving the mould parts apart from each other, and removing the carrier with moulded electronic components from the mould parts; wherein the foil layer in the mould cavity is at least locally supported by flexible micro-pillars, preferably
elastomeric micro-pillars, which micro-pillars are attached to the surface of the mould part, preferably the surface of the recessed mould cavity of the mould part. Especially the electronic components to be moulded may be contacting the foil layer in the mould cavity. With such method so called "bare die" products are profitably produced. See for further explanation the advantages as listed above in relation to the mould and the moulding press according the present invention. The micro-pillars will be compressed and/or deformed dependent on deviations in height of the electronic components to be moulded. The encapsulating material may be brought in the mould cavity according method step D) after the mould parts are moved towards each other according method step C) by displacing liquid encapsulating material to the mould cavity enclosing the electronic component by exerting pressure on the encapsulating material. Such moulding techniques is are also known as transfer moulding and compression moulding. In an alternative moulding process the encapsulating material may be brought in the mould cavity according method step D) before the mould parts are moved towards each other according method step C). Such moulding process is also known as "compression moulding". The present invention may be practiced independent of the specific type of moulding process. Normally the encapsulating material is heated before and/or during the moulding process but also such is not a limitation for the present invention.
The encapsulating material may at least partially be cured before moving the mould parts apart from each other according method step E) so that the mould shaped product is not losing its shape during the release from the moulded product out of the mould.
The present invention will be further elucidated on the basis of the non-limitative exemplary embodiments shown in the following figures. Herein shows: figure 1A a side-view on a cross-section through a mould according the present invention;
figure 1 B a detail of the side-view shown in figure 1 A;
figure 2A a micro-pillar in a non-loaded situation; and
Figures 2B-2D the micro-pillar from figure 2A in various loaded situations.
Figure 1 A, as well as in detail figure 1 B, show a cross-section through a mould 1 for encapsulating electronic components 2 mounted on a carrier 3. The mould 1 comprises two mould parts; a top mould part 4 and a bottom mould part 5 which are displaceable relative to each other. In the situation depicted in figures 1 A an 1 B the mould parts 4, 5 are moved towards each other such that they are clamping the carrier 3 with electronic components 2 in between the mould parts 4, 5. In the top mould part 4 mould cavity 6 is recessed wherein that receives the electronic components 2. Against the contact side of the top mould 4 a foil layer 7 is placed which has a function to enable enhanced release of moulded electronic
components but also to keep the top side of the electronic components 2 free of moulding material 8. The moulding material 8 is brought in between the mould parts 4, 5, especially in the spare rooms in the mould cavity 6 (which are the locations in between the electronic components 2). In the mould cavity 6 a base plate 9 carries a large quantity of micro-pillars 10, preferably elastomeric micro-pillars. The micro- pillars 10 flexibly support the foil layer 7 which provide the advantages according the present invention.
In figure 2A a micro-pillar 1 1 , e.g. elastomeric micro-pillar, is schematically depicted in a situation wherein the micro-pillar 1 1 is not loaded in axial direction so the micro-pillar 1 1 has its unloaded length . In figure 2B the same micro-pillar 1 1 is now depicted in a loaded situation (see force F) that reduces the effective support length L2 of the micro-pillar 1 1 . The effective support length L2 is realised by bending of the micro-pillar 1 1 . In figure 2C the same micro-pillar 1 1 is again depicted in the same loaded situation (see force F) that reduces the effective support length again to L2 however here the length reduction is realised due to compression of the same micro-pillar 1 1 is now depicted in a loaded situation (see force F) that reduces the effective support length L2 of the micro-pillar 1 1 . In figure 2D a situation is depicted that combines the two effects as shown in figures 2B and 2C resulting in the effective support length L2, so partial compression and partial bending of the micro-pillar 1 1 .
Claims
1 . Mould for encapsulating electronic components mounted on a carrier, comprising at least two mould parts which are displaceable relative to each other, which mould parts are configured to be clamped together with their respective contact sides to form at least one mould cavity round the electronic components to be encapsulated,
wherein at least one of the mould parts is provided with a mould cavity recessed in the contact side of the mould part, characterized in that at least a part of the surface of the mould cavity recessed in the contact side of the mould part is provided with flexible micro-pillars.
2. Mould as claimed in claim 1 , characterized in that the micro-pillars are made from an elastomer.
3. Mould as claimed in claim 1 or 2, characterized in that the micro-pillars are provided with a hollow kernel.
4. Mould as claimed in any of the foregoing claims, characterized in that the micro-pillars are vertical attached to the surface of the mould part.
5. Mould as claimed in any of the foregoing claims, characterized in that plural micro-pillars are placed in an array.
6. Mould as claimed in any of the foregoing claims, characterized in that the micro-pillars are microsphere-tipped on the side facing away from the surface of the mould part where the micro-pillars are attached to.
7. Mould as claimed in any of the foregoing claims, characterized in that at least one of the mould parts is provided with suction channels opening to the contact side of at least one of the mould parts.
8. Mould as claimed in any of the foregoing claims, characterized in that at least one of the mould parts is provided with a feed for encapsulating material recessed into the mould parts and connecting to the mould cavity.
9. Moulding press for encapsulating electronic components mounted on a carrier, comprising:
a mould as claimed in any of the foregoing claims;
- feed means for encapsulating material to the mould cavity; and
a drive system for moving the mould parts relative to each other and clamping the carrier between the contact sides of the mould parts with a controllable pressure,
wherein the moulding press is provided with a foil handler to cover the micro-pillars on the side facing away from the surface of the mould part the micro-pillars are attached to.
10. Moulding press as claimed in claim 9, characterised in that the foil handler is provided with a foil feed roller and a foil discharge roller located on opposite sides of the mould parts.
1 1 . Moulding press as claimed in claim 9 or 10, characterised in that the moulding press is provided with suction means connecting to suction channels that open to the contact side of at least one of the mould parts.
12. Method for encapsulating electronic components mounted on a carrier comprising the processing steps of:
A) at least partially covering with a foil layer a contact side of a mould part, the covered part of the contact side of the mould part including at least one recessed mould cavity;
B) placing the carrier with electronic components between at least two mould parts of a mould of which at least one of the mould parts is at least partially covered with the foil layer;
C) moving the mould parts towards each other, such that the mould parts are clamping the carrier between the contact sides of the respective mould parts and the at least one mould cavity is enclosing the electronic components to be encapsulated;
D) bringing an encapsulating material in the mould cavity; and
E) moving the mould parts apart from each other, and removing the carrier with moulded electronic components from the mould parts,
wherein the foil layer in the mould cavity is at least locally supported by flexible micro-pillars, preferably elastomeric micro-pillars, which micro-pillars are attached to the surface of the recessed mould cavity of the mould part.
13. Method as claimed in claim 12, characterised in that the electronic components to be moulded are contacting the foil layer in the mould cavity.
14. Method as claimed in claim 12 or 13, characterised in that the
encapsulating material is brought in the mould cavity according method step D) after the mould parts are moved towards each other according method step C) by displacing liquid encapsulating material to the mould cavity enclosing the electronic component by exerting pressure on the encapsulating material.
15. Method as claimed in claim 14, characterised in that the encapsulating material is at least partially cured before moving the mould parts apart from each other according method step E).
16. Method as claimed in claim 12 or 13, characterised in that the
encapsulating material is brought in the mould cavity according method step D) before the mould parts are moved towards each other according method step C).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2015091A NL2015091B1 (en) | 2015-07-06 | 2015-07-06 | Mould, moulding press and method for encapsulating electronic components mounted on a carrier using elastomeric micro-pillars. |
| NL2015091 | 2015-07-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2017007308A1 true WO2017007308A1 (en) | 2017-01-12 |
Family
ID=54705266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/NL2016/050474 WO2017007308A1 (en) | 2015-07-06 | 2016-07-04 | Mould, moulding press and method for encapsulating electronic components mounted on a carrier using flexible micro-pillars |
Country Status (3)
| Country | Link |
|---|---|
| NL (1) | NL2015091B1 (en) |
| TW (1) | TWI648140B (en) |
| WO (1) | WO2017007308A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL2021058B1 (en) * | 2018-06-05 | 2019-12-11 | Besi Netherlands Bv | Method, foil, mould part and surface layer for encapsulating electronic components mounted on a carrier using expansion spaces absorbing local foil layer displacements |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112549434A (en) * | 2020-12-09 | 2021-03-26 | 扬州扬芯激光技术有限公司 | Optical lens and method for encapsulating the same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030034555A1 (en) * | 2001-08-15 | 2003-02-20 | Asm Technology Singapore Pte. Ltd. | Mold |
| US20050085033A1 (en) * | 2000-12-28 | 2005-04-21 | Stmicroelectronics S.R.L. | Manufacturing method of an electronic device package |
| WO2005043612A1 (en) * | 2003-09-09 | 2005-05-12 | Fico B.V. | Method and device for encapsulating electronic components using a flexible pressure element |
| US20140127976A1 (en) * | 2012-10-29 | 2014-05-08 | Wayne O. Duescher | Pin driven flexible chamber abrading workholder |
| US20150107353A1 (en) * | 2012-04-12 | 2015-04-23 | Hitachi Automotive Systems, Ltd. | Flow Sensor and Method for Manufacturing the Same |
-
2015
- 2015-07-06 NL NL2015091A patent/NL2015091B1/en not_active IP Right Cessation
-
2016
- 2016-07-04 WO PCT/NL2016/050474 patent/WO2017007308A1/en active Application Filing
- 2016-07-06 TW TW105121320A patent/TWI648140B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050085033A1 (en) * | 2000-12-28 | 2005-04-21 | Stmicroelectronics S.R.L. | Manufacturing method of an electronic device package |
| US20030034555A1 (en) * | 2001-08-15 | 2003-02-20 | Asm Technology Singapore Pte. Ltd. | Mold |
| WO2005043612A1 (en) * | 2003-09-09 | 2005-05-12 | Fico B.V. | Method and device for encapsulating electronic components using a flexible pressure element |
| US20150107353A1 (en) * | 2012-04-12 | 2015-04-23 | Hitachi Automotive Systems, Ltd. | Flow Sensor and Method for Manufacturing the Same |
| US20140127976A1 (en) * | 2012-10-29 | 2014-05-08 | Wayne O. Duescher | Pin driven flexible chamber abrading workholder |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL2021058B1 (en) * | 2018-06-05 | 2019-12-11 | Besi Netherlands Bv | Method, foil, mould part and surface layer for encapsulating electronic components mounted on a carrier using expansion spaces absorbing local foil layer displacements |
| WO2019235925A1 (en) * | 2018-06-05 | 2019-12-12 | Besi Netherlands B.V. | Method, foil, mould part and surface layer for encapsulating electronic components mounted on a carrier using expansion spaces absorbing local foil layer displacements |
| CN112219267A (en) * | 2018-06-05 | 2021-01-12 | 贝斯荷兰有限公司 | Method for encapsulating electronic components mounted on a carrier using expansion spaces absorbing local foil layer displacements, foil, mould part and surface layer |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI648140B (en) | 2019-01-21 |
| TW201707916A (en) | 2017-03-01 |
| NL2015091B1 (en) | 2017-01-30 |
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