CN112219267A - Method for encapsulating electronic components mounted on a carrier using expansion spaces absorbing local foil layer displacements, foil, mould part and surface layer - Google Patents
Method for encapsulating electronic components mounted on a carrier using expansion spaces absorbing local foil layer displacements, foil, mould part and surface layer Download PDFInfo
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- CN112219267A CN112219267A CN201980037500.3A CN201980037500A CN112219267A CN 112219267 A CN112219267 A CN 112219267A CN 201980037500 A CN201980037500 A CN 201980037500A CN 112219267 A CN112219267 A CN 112219267A
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- 239000011888 foil Substances 0.000 title claims abstract description 178
- 239000010410 layer Substances 0.000 title claims abstract description 99
- 238000000034 method Methods 0.000 title claims abstract description 50
- 239000002344 surface layer Substances 0.000 title claims abstract description 39
- 238000006073 displacement reaction Methods 0.000 title claims description 34
- 239000000463 material Substances 0.000 claims abstract description 65
- 239000002184 metal Substances 0.000 claims abstract description 14
- 238000000465 moulding Methods 0.000 claims description 28
- 239000012778 molding material Substances 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 239000007779 soft material Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
- B29C2045/14844—Layers protecting the insert from injected material
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention relates to a method of encapsulating electronic components mounted on a carrier, the method comprising the following process steps: wrapping the mold part with a foil layer; placing a carrier with electronic components between two mould parts; moving the mold parts relative to each other; bringing the encapsulating material into the mould cavity; the mould parts are separated and the carrier with the moulded electronic components is removed. The invention also relates to a foil and a mould part for encapsulating electronic components according to the method of the invention. The invention also relates to a surface layer for detachable attachment to a metal mould base body.
Description
The invention relates to a method of encapsulating electronic components mounted on a carrier. The invention also relates to a foil and a mould part for encapsulating electronic components according to the method of the invention. The invention also relates to a surface layer for detachable attachment to a metal mould base body.
It is known to encapsulate electronic components mounted on a carrier with an encapsulating material. On an industrial scale, such electronic components have packages, typically cured epoxy packages, to which a filler material is added. There is a trend in the market to package a large number of relatively small electronic components at the same time. Electronic components such as, generally, smaller and smaller semiconductors (chips, although LEDs are also to be considered semiconductors in this respect) are conceivable here. Once the encapsulating material has been provided, the collectively encapsulated electronic components are placed in an encapsulation (package) which is provided on one side of the carrier, and sometimes on both sides of the carrier. The encapsulating material is typically in the form of a flat layer connected to the carrier, but alternative specific packages may also be molded depending on the component to be molded and its application. The carrier may consist of a leadframe, a multi-layer carrier (also referred to as a board or substrate, etc.) partially made of epoxy, or another carrier structure.
In the packaging of electronic components mounted on a carrier, a press having two mold halves, at least one of which is recessed to form one or more mold cavities, is generally packaged according to the prior art. After the carrier with the electronic components to be encapsulated is placed between the mold halves, the mold halves are moved, for example, relative to each other, so that the carrier is clamped by the mold halves. The normally heated liquid encapsulating material is then fed into the mould cavity, usually by transfer moulding. Alternatively, it is also possible to bring encapsulating material, such as granules, into the mould cavity before closing the mould parts and then to press the parts to be moulded into the encapsulating material; this compression encapsulation process is an alternative to transfer molding. Used as an encapsulating material is an epoxy resin (also referred to as resin), usually provided with a filler material. After the encapsulating material in the mould cavity has at least partially (chemically) cured, the carrier with the encapsulated electronic components is removed from the encapsulating press and the encapsulated products can be separated from each other during further processing. A foil may be used during the encapsulation process to shield or encapsulate a portion of the electronic component that does not require encapsulation material to prevent the portion of the electronic component from being encapsulated by the encapsulation material. A foil may also or alternatively be used to shield the encapsulation material of the mould surface. Partially encased products (products that are not fully molded or "over molded" are also referred to as "bare dies" or "bare die" products) can be used in a variety of applications; such as various types of sensor components, ultra-low packages, or heat dissipation components. The packaging method is suitable for large industrial scale and can well control and package the electronic element which is not partially coated.
There is a problem that during the encapsulation process and the subsequent handling of the molded electronic component, contact of the foil with the electronic component causes local foil deformation as a function of local lateral foil material displacement. The lateral foil material displacement may cause undesirable changes in the dimensions of the post-molding encapsulation material. The dimensional inaccuracies of the molded products do not meet the ever-increasing dimensional accuracy requirements of molded electronic components on the market.
It is an object of the present invention to provide an alternative method and apparatus by which the advantages of prior art electronic packages can be maintained, but a more accurate package for dimensional control of electronic components can be achieved.
The invention provides for this purpose a method of encapsulating electronic components mounted on a carrier, the method comprising the following process steps: A) at least partially coating a contact side of a mold component with a foil layer, the coated portion of the contact side of the mold component comprising at least one recessed mold cavity; B) placing a carrier with electronic components between at least two mould parts of a mould, at least one mould part of the mould being at least partially covered by a foil layer; C) moving the mould parts relative to each other and clamping the carrier with the electronic components between the contact sides of the mould parts to laminate the foil onto the electronic components, and the mould parts and the at least one mould cavity enclose the electronic components to be encapsulated; D) bringing the encapsulating material into the mould cavity; E) the mould parts are separated from each other and the carrier with the moulded electronic component is removed from the mould parts, wherein the surface of the foil layer facing the electronic component is impermeable to the moulding material and wherein local displacement of the foil layer caused by the local pressure exerted by the foil layer on the electronic component is at least partly absorbed by the expansion space of the foil layer. Local foil material displacement (dwell of lateral foil material displacement) before and during the moulding process may be caused by an uneven pressure load distribution on the foil layer surface. One of the reasons for such a displacement of the foil material may be that in case the foil is pressed against the electronic component, the foil is (limited) compressed due to the locally higher pressure applied to the foil from the opposite side. Another cause of displacement of the foil material may be irregularities in the distance (height) of the electronic components protruding from the carrier end or variations in the size of the carrier. Dimensional variations of the mounted electronic components and the carrier may result in (limited) height variations on the surface of the electronic components that the foil contacts, which may also result in differences in the local pressure applied to the foil.
As a result, the foil material may bulge (alternative wording: pop-up or protrusion) at certain locations along the sides of the area (surface) where the foil contacts the electronic component. The foil material of the bumps may cause undesired local immersion resulting in measurement differences (variations) of the molded material portion of the molded electronic component. This "bulging effect" of the pressure induced displacement of the lateral foil material can be prevented (or limited) by the method of the invention, since the expansion space will absorb any lateral foil material displacement and will thus prevent (or limit) the bulging foil material. In addition to the convex absorption of the expansion spaces, it also has the positive effect of homogenizing the pressure exerted on the mould part (mould) during the moulding process. According to the prior art and depending on, for example, the size of the electronic component, the mold cavity, the mold part, the clamping force and/or the pressure gradient of the molding material that may be generated on the mold part, this pressure gradient may influence the accuracy of the molding process. The invention may reduce the occurrence of pressure gradients during moulding and may thus prevent (or limit) pressure gradients, since the expansion spaces may absorb any (lateral) foil material displacement. The dimensions of the molded electronic component can be better controlled.
Local foil layer displacements may be absorbed by the foil layer expansion space, which may be provided for this in the contact side of the foil and/or the mould part. The expansion space must be "compressible" so that it can be filled with gas, or with a porous material or any other material that compresses with a load less than that which effects displacement of the foil material. Thus, the compressibility of the expansion space may be related to the "softness" of the material it comprises. Thus, preferably, the "softness" is obtained by a sufficiently low compression modulus (also called "bulk modulus"). On the other hand, it is preferable that the indentation hardness of the material is sufficiently high to prevent the material from flowing due to plastic deformation.
In case the expansion space is filled with a gas, the expansion space may be open, but alternatively or additionally the expansion space may be closed, thereby being embedded in the foil material. When the expansion space is open, the expansion space may be open to a side of the foil opposite to a side of the foil contacting the molding material. Thereby, the expansion space can be closed at least during the closing of the electronic component by the at least one mold cavity, such that the gas is contained and compressed, closed within the expansion space. Alternatively, the expansion space may also be open to the side of the foil which is in contact with the moulding material. In case the expansion space is open at the side of the foil in contact with the moulding material, the foil material may be attached to the epoxy resin during the moulding process, e.g. by using tapered holes.
In another alternative, the local foil displacement may be absorbed by a laminated foil layer having a surface layer facing the electronic component and a support layer comprising expansion spaces, the surface layer being impermeable to the molding material. For such layered or laminated foil materials it is easier to optimize the various functions that the foil must fulfil (impermeable coating of the moulding material and local foil layer displacements spread over the laminated layers).
Alternatively (or additionally) local foil displacement may be absorbed by foil expansion spaces provided in a surface layer of the foil contact surface of the mould part. The surface layer of the foil contacting side of the mould part may be detachably connected to the metal mould part. The surface layer of the mould part on the side in contact with the foil may additionally be formed by a surface layer of a soft material, which thus typically has a lower compression modulus than the metal mould part. Alternatively, foil expansion spaces may be provided in the metal layer of the mould part or in an insert layer being part of the mould part. This alternative allows the use of prior art foil material, since the surface layer of the mould part serves the function of absorbing local foil displacements. Furthermore, since the surface layer of the molded article is isolated from the molding material by the foil layer, the surface layer of the molded article can be used for multiple molding cycles, and thus this alternative would likely result in a reduction in variable molding costs. This alternative also has the advantage that a thinner (and thus cheaper) foil can be used.
Local foil displacements can be absorbed by evenly distributed expansion spaces, here meaning that the expansion spaces are evenly distributed over the foil and/or evenly distributed over the surface layer of the foil contacting side of the mould part. However, local foil layer displacements may alternatively be absorbed by expansion spaces which are irregularly distributed over the foil and/or evenly distributed over the surface layer of the foil contacting side of the mould part. In the case of said irregular distribution, the expansion spaces are distributed unevenly/in groups in number and/or size, depending on, for example, the position of the mold cavities and/or the position of the electronic components. As an example, the spatial density of the expansion at the location where the foil contacts the electronic component may be greater than the spatial density of the expansion at the location where the foil does not contact the electronic component, thereby producing more absorption of the dimensional change at the desired location or expected amount of absorption. One can also choose to limit the expansion space density at locations where more pressure is required for the electronic component during molding, such as where the semiconductor is supported by the raised contacts. The expansion spaces can also be distributed in other ways, for example: related to the distance to the gate opening (feed to the mold cavity) or adjusted to a position where flash can affect the tolerances of the mold.
The invention also provides a foil for encapsulating an electronic component mounted on a carrier by the above-described inventive method, wherein the foil has an expansion space and the molding material impermeable foil layer faces a contact surface of the electronic component. As described in the method for encapsulating electronic components according to the present invention, the foil layer expansion space may be formed by a plurality of gas filled holes. The expansion space may further be opened and/or closed and the expansion space may be filled with a gas or any other compressible material. Furthermore, the foil may be distributed in layers with the expansion spaces in a layer separate from the layer configured to contact the electronic component and the molding material during molding. The expansion spaces may also be evenly distributed over the foil or irregularly distributed as described above. All the features and advantages of the various alternatives of foils using the above-described molding method are also incorporated herein in respect of the foils for encapsulating electronic components according to the invention.
The invention also provides a mould part for encapsulating electronic components mounted on a carrier by means of a method according to the invention, wherein a contact side of the mould part facing the foil layer during moulding is provided with a foil layer expansion space. As described in the method of encapsulating electronic components according to the invention, the foil layer expansion space can thus be formed by a plurality of gas-filled pores. The contact side of the mould part may comprise a surface layer detachably connected to the base body of the metal mould part and provided with foil expansion spaces. The surface layer may also be formed of a soft material, which typically has a lower compressive modulus than the compressive modulus of the metal mold part base. Furthermore, the expansion spaces (in the surface layer) may be distributed homogeneously or irregularly. All features and advantages of the various alternatives of foils using the moulding method as described above are also incorporated here in respect of the mould part according to the invention.
Finally, the invention also provides a surface layer of a soft material for detachable attachment to a metal mould part base body as part of the above-mentioned mould part according to the invention, wherein the surface layer is provided with evenly distributed or irregularly distributed foil layer expansion spaces. Also, all features and advantages of the various alternatives of foils using the moulding method as described above are also incorporated here in respect of the mould part according to the invention.
The invention is further illustrated according to the following non-limiting clauses:
1. a method of encapsulating electronic components mounted on a carrier, comprising the processing steps of:
A) at least partially coating a contact side of a mold component with a foil layer, the coated portion of the contact side of the mold component comprising at least one recessed mold cavity;
B) placing a carrier with electronic components between at least two mould parts of a mould, at least one mould part of the mould being at least partially covered by a foil layer;
C) moving the mould parts relative to each other and clamping the carrier with the electronic components between the contact sides of the mould parts to laminate the foil onto the electronic components, and the mould parts and the at least one mould cavity enclose the electronic components to be encapsulated;
D) bringing the encapsulating material into the mould cavity;
E) separating the mould parts from each other and removing the carrier with the moulded electronic components from the mould parts,
wherein the surface of the foil layer facing the electronic component is impermeable to the molding material,
the local foil layer displacement caused by the local pressure exerted by the foil layer on the electronic component is at least partially absorbed by the foil layer expansion space.
2. The method of encapsulating electronic components according to clause 1, characterized in that the local foil layer displacement is absorbed by a foil layer expansion space provided in the foil.
3. The method of encapsulating electronic components according to clause 1, characterized in that the local foil displacement is absorbed by a laminated foil layer having a molding material impermeable surface layer facing the electronic component and a support layer comprising expansion spaces.
4. The method of encapsulating electronic components according to any of the preceding clauses, characterized in that local foil layer displacements are absorbed by a foil layer expansion space provided in the surface layer of the mould part on the foil contacting side.
5. The method of encapsulating electronic components according to clause 4, characterized in that the local foil layer displacement is absorbed by a surface layer on the foil contact side of the mould part formed by a surface layer of soft material detachably connected to the metal mould part.
6. The method of encapsulating electronic components according to any of the preceding clauses wherein local foil layer displacements are absorbed by uniformly distributed expansion spaces.
7. The method of encapsulating electronic components according to any of clauses 1-5, characterized in that local foil layer displacements are absorbed by the irregularly distributed expansion spaces.
8. The method of packaging electronic components according to clause 7, wherein the density of the expansion space at the location where the foil contacts the electronic component is greater than the density of the expansion space at the location where the foil does not contact the electronic component.
9. Foil for encapsulating an electronic component mounted on a carrier by a method as in any of the preceding clauses, wherein the foil is provided with an expansion space and a molding material is impermeable for a contact surface of the foil facing the electronic component.
10. The foil for encapsulating electronic components according to clause 9, characterized in that the expansion space is closed.
11. The foil for encapsulating electronic components according to clause 9 or 10, characterized in that the foil layer is of the laminated type having: the surface of the foil layer facing the electronic component is impermeable to the moulding material and comprises a support layer for the expansion spaces.
12. A mould part for encapsulating electronic components mounted on a carrier by a method according to any of clauses 1 to 8, wherein a contact side of the mould part facing the foil layer is provided with a foil layer expansion space.
13. A mould part for encapsulating electronic components mounted on a carrier according to clause 12, characterized in that the foil contacting side of the mould part comprises a surface layer formed of a soft material, which surface layer is detachably connected to the metal mould part base body and which surface layer is provided with foil layer expansion spaces.
14. The mold part for encapsulating electronic components according to clause 13, characterized in that the expansion spaces in the surface layer are irregularly distributed depending on the position of the mold cavity.
15. The mold part for encapsulating electronic components according to any of clauses 12 to 14, characterized in that the expansion spaces in the surface layer are irregularly distributed according to the positions of the electronic components.
16. A surface layer formed of a soft material for detachable attachment to a metal mould part base as part of a mould part according to any of clauses 13-15, wherein the surface layer is provided with foil layer expansion spaces.
The invention is further elucidated on the basis of non-limitative exemplary embodiments shown in the following figures. It is shown here that:
fig. 1 is a side view in cross-section of a mold for encapsulating electronic components mounted on a carrier according to the prior art;
fig. 2 is a detailed view of a cross-section of the mold shown in fig. 1.
Fig. 3 is a detailed view of a cross-section of a mold for encapsulating electronic components mounted on a carrier according to the invention.
Fig. 4A-4C are various alternative embodiments of foils according to the invention.
Fig. 5A and 5B are detailed views of cross-sections of mold parts for encapsulating electronic components according to the invention.
Fig. 1 shows a cross-section of a mould 1 for encapsulating electronic components 2 mounted on a carrier 3. The mould 1 comprises two mould parts: a top mould part 4 and a bottom mould part 5 displaceable in relation to each other. In the situation shown in fig. 1, the mould parts 4, 5 are moved relative to each other in order to clamp the carrier 3 with the electronic components 2 between the mould parts 4, 5. The top mould part 4 has a concave mould cavity 6 for receiving the electronic component 2. A foil layer 7 is placed against the contact side of the top mold part 4, which foil layer 7 has the function of facilitating demolding of the molded electronic component 2 and leaving the top side of the electronic component 2 free of molding material 8. The molding material 8 is brought between the mold parts 4, 5, in particular into the empty spaces in the mold cavity 6 (which spaces are present between the electronic components 2 and optionally below the electronic components 2).
FIG. 2 showsA detailed view of the cross-section of the mould 1 shown in fig. 1 is shown, wherein a part of the top mould part 4 and a part of the bottom mould part 5 clamp the carrier 3, the electronic component 2 and the foil layer 7. When the pressure on the foil layer 7 above said electronic component 2 is higher than at the location where the moulding material 8 is provided, the limited foil layer 7 material above the electronic component 2 will be pushed away (according to arrow P)1Direction). Pushing the material of the foil layer 7 sideways (laterally) may cause bumps 9 (bumps) to appear where the foil material 7 is adjacent to the electronic component 2. As a result of which the moulding material 8 is provided with recesses 10 at positions corresponding to the protrusions 9 in the foil material 7. These dimples 10 (or grooves/slots/depressions) cause undesirable dimensional errors of the molded electronic component 2.
Fig. 3 shows a detailed view of a cross-section of the mould 1 shown in fig. 1, but now in combination with a foil material 11 according to the invention. The top mould part 4 and a part of the bottom mould part 5 now clamp the carrier 3, the electronic component 2 and the foil layer 11. As shown in fig. 2, the pressure on the foil layer 11 above the electronic component 2 is now higher than at the location where the moulding material 12 is provided. However, the foil material 11 is provided with a foil layer expansion space 13, and the foil layer expansion space 13 is capable of absorbing the material of the foil layer 11 above the electronic component 2 pushed aside. The expansion space 13 'above the electronic component 2 is smaller than the expansion space 13 beside the electronic component 2, because the expansion space 13' above the electronic component 2 absorbs the local foil layer displacement and thus its size is reduced. As a result, no material of the foil layer 11 is pushed to the side of the electronic component 2, so that the prior art protrusion shown in fig. 2 does not occur. Due to the foil layer 11, the upper surface of the moulding material 12 is more planar than in the prior art shown in fig. 2.
Fig. 4A shows a foil 20 for encapsulating an electronic component, said foil 20 being a single-layer soft film having a molding material-impermeable contact surface 21 for facing the electronic component and the molding material. Open expansion spaces 23 (holes) are evenly distributed on the opposite side 22 of the impermeable contact surface 21 and serve to absorb local foil layer expansion.
Fig. 4B shows a foil 25 for encapsulating electronic components, said foil 25 being formed by two layers 26, 27 of material. The harder moulding material impermeable contact layer 26 is now combined with a softer layer 27, which softer layer 27 has an evenly (homogeneously) distributed open expansion spaces 28 (pores).
Fig. 4C shows a foil 30 for encapsulating electronic components, which foil is formed by two layers 31, 32 of material. The contact layer 31, which is impermeable to the moulding material, is now combined with a support layer 32 provided with irregularly distributed open expansion spaces 33 (holes). The expansion space 33 may for example be provided at the location where the foil 30 contacts the electronic component to be moulded.
Fig. 5A shows a top mould part 40 for encapsulating an electronic component 41 mounted on a carrier 42, wherein a contact side 43 of the top mould part 40 facing the electronic component 41 is provided with a softer support layer 44 connected to a base 45 of the metal mould part. An expansion space 46 is provided in the top mold support layer 44 for local expansion of a foil layer 47 located between the mold support layer 44 and the electronic component 41. In the case shown in fig. 5A, the mold member 40 has not yet applied pressure to the electronic component 41.
Fig. 5B also shows the top mold part 40 shown in fig. 5A, but now in a position where the mold part 40 applies pressure to the electronic component 41. Because the localized pressure on the top mold support layer 44 is compensated, the expansion space 46' is now smaller than it was before the pressure application began. When the expansion space 46' is "absorbed", the material of the foil 47 is not pushed laterally (transversely) and therefore no (or less) prior art bulges as shown in fig. 2 occur. Only a slight difference in height occurs at the contact surfaces of the foil 47 at the location facing the electronic component 41 and at the location where the surface of the foil 47 does not face the electronic component.
Claims (19)
1. A method of encapsulating electronic components mounted on a carrier, comprising the processing steps of:
A) at least partially coating a contact side of a mold component with a foil layer, the coated portion of the contact side of the mold component comprising at least one recessed mold cavity;
B) placing a carrier with electronic components between at least two mould parts of a mould, at least one mould part of the mould being at least partially covered by a foil layer;
C) moving the mould parts relative to each other and clamping the carrier with the electronic components between the contact sides of the mould parts to laminate the foil onto the electronic components, and the mould parts and the at least one mould cavity enclose the electronic components to be encapsulated;
D) bringing the encapsulating material into the mould cavity;
E) separating the mould parts from each other and removing the carrier with the moulded electronic component from the mould parts, wherein the surface of the foil layer facing the electronic component is impermeable to the moulding material,
the local foil layer displacement caused by the local pressure exerted by the foil layer on the electronic component is at least partially absorbed by the foil layer expansion space.
2. The method of packaging electronic components of claim 1, wherein the local foil layer displacement is absorbed by a foil layer expansion space provided in the foil.
3. A method of encapsulating electronic components according to claim 1, characterized in that local foil displacement is absorbed by a laminated foil layer having a surface layer facing the electronic component impermeable to the moulding material and a support layer comprising expansion spaces.
4. Method for encapsulating electronic components according to any of the preceding claims, characterized in that local foil layer displacements are absorbed by a foil layer expansion space provided in a surface layer of the contact side of the mould part.
5. Method of encapsulating electronic components according to claim 4, characterized in that the surface layer of the contact side of the mould part is detachably connected to the metal mould part base.
6. Method for encapsulating electronic components according to one of the preceding claims, characterized in that local foil layer displacements are absorbed by evenly distributed expansion spaces.
7. Method for encapsulating electronic components according to any of claims 1-5, characterized in that local foil layer displacements are absorbed by irregularly distributed expansion spaces.
8. Method of encapsulating electronic components according to claim 7, characterized in that the density of the expansion space at the location where the foil contacts the electronic component is larger than the density of the expansion space at the location where the foil does not contact the electronic component.
9. Method for encapsulating electronic components according to any of the preceding claims, characterized in that the expansion space is formed by a plurality of gas-filled holes.
10. Method for encapsulating electronic components according to claim 9, characterized in that the holes are closed at least during the closing of the electronic components by means of at least one mould cavity.
11. Foil for encapsulating an electronic component mounted on a carrier by a method as claimed in any of the foregoing claims, wherein the foil is provided with an expansion space and a molding material is impermeable for a contact surface of the foil facing the electronic component.
12. Foil for encapsulating electronic components as claimed in claim 11, characterized in that the foil layer expansion space is formed by a plurality of gas-filled holes.
13. Foil for encapsulating electronic components as claimed in claim 11 or 12, characterized in that the expansion space is closed.
14. Foil for encapsulating electronic components according to any of claims 11-13, characterised in that the foil layer is of the laminate type having: a surface layer impermeable to the molding material facing the electronic component, and a support layer comprising expansion spaces.
15. A mould part for encapsulating electronic components mounted on a carrier by a method according to any of claims 1 to 10, wherein a contact side of the mould part is provided with foil layer expansion spaces.
16. The mold part for encapsulating electronic components mounted on a carrier of claim 15 wherein the foil layer expansion space is formed by a plurality of gas filled holes.
17. A mould part for encapsulating electronic components mounted on a carrier as claimed in claim 15 or 16, characterized in that the contact side of the mould part comprises a surface layer detachably connected to the base of the metal mould part, which surface layer is provided with foil expansion spaces.
18. A mould part for encapsulating electronic components according to any of claims 15-17, characterized in that the expansion in the surface layer is spatially irregularly distributed in relation to the position of the mould cavity.
19. Mould part for encapsulating electronic components according to any of the claims 15-18, characterized in that the expansion in the surface layer is spatially irregularly distributed in relation to the position of the electronic component.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2021058A NL2021058B1 (en) | 2018-06-05 | 2018-06-05 | Method, foil, mould part and surface layer for encapsulating electronic components mounted on a carrier using expansion spaces absorbing local foil layer displacements |
| NL2021058 | 2018-06-05 | ||
| PCT/NL2019/050335 WO2019235925A1 (en) | 2018-06-05 | 2019-06-04 | Method, foil, mould part and surface layer for encapsulating electronic components mounted on a carrier using expansion spaces absorbing local foil layer displacements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112219267A true CN112219267A (en) | 2021-01-12 |
Family
ID=63013077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980037500.3A Pending CN112219267A (en) | 2018-06-05 | 2019-06-04 | Method for encapsulating electronic components mounted on a carrier using expansion spaces absorbing local foil layer displacements, foil, mould part and surface layer |
Country Status (5)
| Country | Link |
|---|---|
| KR (1) | KR20210018303A (en) |
| CN (1) | CN112219267A (en) |
| NL (1) | NL2021058B1 (en) |
| SG (1) | SG11202011491RA (en) |
| WO (1) | WO2019235925A1 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1430387A (en) * | 1965-01-22 | 1966-03-04 | Emsu Company | Molding process for liquid thermosetting resins |
| US20020142153A1 (en) * | 1999-12-27 | 2002-10-03 | Toshimitsu Tachibana | Resin sealing method for semiconductors and release film used therefor |
| US20060014328A1 (en) * | 2004-07-16 | 2006-01-19 | Towa Corporation | Resin encapsulation molding for semiconductor device |
| JP2011230320A (en) * | 2010-04-26 | 2011-11-17 | Dainippon Printing Co Ltd | Release film for molding molding and method for producing the same |
| US20160361893A1 (en) * | 2013-09-27 | 2016-12-15 | Sekisui Plastics Co., Ltd. | Resin composite and method for producing resin composite |
| WO2017007308A1 (en) * | 2015-07-06 | 2017-01-12 | Besi Netherlands B.V. | Mould, moulding press and method for encapsulating electronic components mounted on a carrier using flexible micro-pillars |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110133362A1 (en) * | 2008-08-28 | 2011-06-09 | Mitsui Chemicals, Inc. | Mold release film for manufacturing semiconductor resin package and semiconductor resin package manufacturing method using same |
-
2018
- 2018-06-05 NL NL2021058A patent/NL2021058B1/en active
-
2019
- 2019-06-04 SG SG11202011491RA patent/SG11202011491RA/en unknown
- 2019-06-04 KR KR1020207036470A patent/KR20210018303A/en not_active Application Discontinuation
- 2019-06-04 CN CN201980037500.3A patent/CN112219267A/en active Pending
- 2019-06-04 WO PCT/NL2019/050335 patent/WO2019235925A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1430387A (en) * | 1965-01-22 | 1966-03-04 | Emsu Company | Molding process for liquid thermosetting resins |
| US20020142153A1 (en) * | 1999-12-27 | 2002-10-03 | Toshimitsu Tachibana | Resin sealing method for semiconductors and release film used therefor |
| US20060014328A1 (en) * | 2004-07-16 | 2006-01-19 | Towa Corporation | Resin encapsulation molding for semiconductor device |
| JP2011230320A (en) * | 2010-04-26 | 2011-11-17 | Dainippon Printing Co Ltd | Release film for molding molding and method for producing the same |
| US20160361893A1 (en) * | 2013-09-27 | 2016-12-15 | Sekisui Plastics Co., Ltd. | Resin composite and method for producing resin composite |
| WO2017007308A1 (en) * | 2015-07-06 | 2017-01-12 | Besi Netherlands B.V. | Mould, moulding press and method for encapsulating electronic components mounted on a carrier using flexible micro-pillars |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019235925A1 (en) | 2019-12-12 |
| NL2021058B1 (en) | 2019-12-11 |
| SG11202011491RA (en) | 2020-12-30 |
| KR20210018303A (en) | 2021-02-17 |
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