TW202103886A - Workpiece carrying-in device, workpiece take-out device, plastic sealing mould, and resin plastic sealing device including the same capable of positioning the plastic sealing mould and delivering the workpiece and/or resin by using a simplified mould structure - Google Patents

Abstract

The present invention provides a workpiece carrying-in device, a workpiece take-out device, a plastic sealing mould, and a resin plastic sealing device including the same, capable of positioning the plastic sealing mould and delivering the workpiece and/or resin by using a simplified mould structure. When delivering a workpiece (W) to a workpiece placement recess (3g) disposed on a side of a pot block (3a) (vertically movable on a lower mould clamping surface of the plastic sealing mould (1)), a workpiece holding portion (4d) in a state of holding the workpiece approaches each other to a position until the pot block (3a) in the raised position and the workpiece placement recess (3g) overlap in a plan view, and the workpiece ( W) is delivered to the workpiece placement recess (3g).

Description

Workpiece carrying-in device, workpiece carrying-out device, plastic packaging mold, and resin plastic packaging device including the device and mold

The present invention relates to a device for loading a plastic packaging mold into a workpiece (work) and a mold resin (mould resin) before forming, a resin unloading device for removing a molded workpiece and excess resin from the plastic packaging mold, a plastic packaging mold, And a resin molding device including any one of the device and the mold.

When the workpiece is carried into the plastic mold and the outer peripheral edge is clamped for transfer molding, there are concerns that due to the resin path (including runner gate, overflow gate), row Air grooves (air vents, etc.) intersect the end of the workpiece, causing the plastic resin to easily leak from the end surface, and produce resin burrs on the surface or side of the workpiece. Therefore, the following technology is proposed: the glue sleeve block provided with the glue sleeve is set up and down, the glue sleeve block is used to press the end of the workpiece, and the resin passage (bridge gate) is formed on the surface of the block. gate): bridging section).

For example, in order to prevent the plastic sealing resin from winding to the end face of the workpiece, it is necessary to position the end face of the workpiece with the opposite mold end face, and eliminate the generation of gaps as much as possible. Therefore, the following technology is proposed: one end surface of a rectangular strip substrate as a workpiece is pushed by a push block, and the opposite end surface touches and aligns the end surface of the pot insert (refer to Patent Document 1 : Japanese Patent Laid-Open No. 2015-51557). In addition, a plastic molding mold provided with a reciprocating movement mechanism has also been proposed. The reciprocating mechanism uses an air cylinder to move the semiconductor substrate receiving portion of the plastic molding mold to and from the gate block position on both sides (refer to Patent Document 2. : Japanese Patent Laid-Open No. 2015-79864). [Prior Art Literature]

[Patent Literature] [Patent Document 1] Japanese Patent Laid-Open No. 2015-51557 [Patent Document 2] Japanese Patent Laid-Open No. 2015-79864

[The problem to be solved by the invention] In recent years, in order to improve the productivity of molded products, there has been an increase in devices that include multiple (for example, three or four) molding molds in one resin molding device. Therefore, the structure of the plastic encapsulation mold is likely to become complicated for the pushing block that pushes the end face of the substrate disclosed in Patent Literature 1 and Patent Literature 2, or the mechanism that reciprocates the semiconductor substrate receiving portion relative to the gate block position. Manufacturing costs (the cost of mold sets) become expensive. Moreover, the total cost has also become expensive for an apparatus that includes multiple (for example, three or four) molding dies in one resin molding apparatus as in recent years.

Moreover, if a movable part (pushing block or reciprocating mechanism, etc.) is installed in the plastic molding mold, resin leakage or resin flash will occur. As a result, resin slag will easily enter the movable part, resulting in malfunction of the movable part. , And maintenance work is also time-consuming. Furthermore, the temperature of the plastic packaging mold changes drastically, which is likely to be deformed or deteriorated by heat, and the frequency of replacement of parts of the movable part may also increase. [Technical means to solve the problem]

The disclosure to which several embodiments described below are applied is to solve the above-mentioned problems, and its purpose is to provide a workpiece carrying-in device, a workpiece carrying-out device, a plastic molding mold, and a resin plastic-sealing device, which can The simplified mold structure is used to position the plastic packaging mold and deliver the workpiece and/or resin. The plastic packaging mold can prevent the plastic packaging resin from winding to the end surface of the workpiece and has fewer malfunctions. The resin plastic packaging device includes the workpiece carrying device and the workpiece The device and the plastic mold are carried out, thereby reducing the cost and realizing high-quality resin molding.

The disclosure related to several embodiments to be described below includes at least the following structures. That is, a workpiece loading device for loading a workpiece and a plastic molding resin into an opened plastic molding mold is characterized in that it includes: loading the device body, loading the workpiece into a workpiece mounting portion provided on the side of a rubber feeding sleeve block, and The plastic feeding sleeve block is provided on the mold clamping surface of the plastic packaging mold in a manner capable of lifting; a resin input part is provided on the carrying device body, and is inserted into the plastic feeding sleeve while maintaining the state of the plastic packaging resin The rubber feeding sleeve of the cylinder block; the workpiece holding part is provided in the carrying-in device body to maintain the state of the workpiece and move in a manner capable of approaching or away from the resin input part, the workpiece holding part to hold the The state of the workpiece is close to each other to a position where the glue-inlet sleeve block and the workpiece mounting portion in a raised position overlap in a plan view, and the workpiece is delivered to the workpiece mounting portion. In this way, the main body of the loaded device enters the opened plastic molding mold, and the resin input part is used to put the molding resin into the injection sleeve of the injection sleeve block, and the workpiece holding parts holding the workpiece before forming are brought close to each other to the raised position. The position where the glue sleeve block and the workpiece placement part coincide in a plane view, and the workpiece is delivered. Thereby, the workpiece holding part can position and carry the workpiece in the workpiece mounting part in a state of holding the workpiece without interfering with the rubber feeding sleeve block, thereby simplifying the structure of the plastic packaging mold.

The workpiece holding portion may be slidably assembled with a loading hand via a sliding mechanism with respect to the loading device body. The loading hand includes opening and closing claws that hold both sides of the rectangular substrate in the width direction and can be opened. Together. Thereby, the rectangular substrate can be clamped and reliably held by the opening and closing claws of the loading hand, and the rectangular substrate can be aligned with the workpiece placement part of the plastic molding mold by the sliding mechanism, and the rectangular substrate can be delivered by sliding movement.

The workpiece holding part may hold a pair of workpieces, and carry the pair of workpieces into the workpiece mounting parts provided on both sides of the glue sleeve block. Thereby, a plurality of workpieces can be separately positioned at the same time and carried in to the workpiece placement part.

It is preferable that the resin injection part, when delivering the work held by the pair of work holding parts to the mold clamping surface, inject the molding resin into the injection sleeve. As a result, the workpiece loading device supplies the molding resin to the injection sleeve of the injection sleeve block at the same timing as the time of loading the work into the work placement section, thereby smoothly loading the work, and performing mold clamping and utilization. The rubber sleeve block is used to clamp the positioned workpiece.

For a resin molding device including any of the above-mentioned workpiece loading devices, the structure of the mold can be simplified, the device cost is low, and no malfunction occurs, and maintenance can be easily performed.

A workpiece carrying out device for carrying out formed workpieces and excess resin from the opened plastic sealing mold, which is characterized in that it comprises: a carrying out device body, so that the formed workpiece supported by the workpiece mounting portion of the plastic sealing mold and The excess resin supported by the rubber inlet sleeve block is separated, and the molded workpiece and the excess resin are removed; the excess resin recovery part is provided on the body of the removal device to hold the rubber inlet sleeve block The remaining excess resin; and a workpiece recovery part, which is provided in the carry-out device body to maintain the state of the molded workpiece, and moves in a manner capable of approaching or away from the side of the excess resin recovery part, After the workpiece recovery part holds the formed workpiece from the workpiece placement part and the excess resin recovery part retains the excess resin, the workpiece recovery part is far away from each other so as not to be with the rubber feeding sleeve block At the disturbed position, move the shaped workpiece out.

In this way, the body of the device is moved out into the opened plastic molding mold, the excess resin recovery part keeps the excess resin supported by the injection sleeve block, and the workpiece recovery part keeps the formed workpiece, and is far away from each other so as not to reach the injection sleeve block. Move the workpiece out of the disturbed position after forming. Thereby, the workpiece recovery part can carry out the workpiece while maintaining the state of the molded workpiece without interfering with the rubber sleeve block, thereby simplifying the structure of the plastic packaging mold.

The workpiece recovery part may also hold and carry out a pair of workpieces from the workpiece mounting parts provided on both sides of the glue-in sleeve block. Thereby, a plurality of formed workpieces can be simultaneously carried out from the workpiece mounting portion.

For a resin molding device including any one of the above-mentioned workpiece carrying devices, the mold structure can be simplified, the device cost can be made cheap, no malfunctions are caused, and maintenance can be easily performed.

A plastic molding mold, which supplies a workpiece and a plastic molding resin to the opened mold through a workpiece carrying device, which is characterized by comprising: a first mold, a cavity concave portion, and a resin route connected to the cavity concave portion covered by a release film; and Two molds, with a glue-feeding sleeve block and an insert. The glue-feeding sleeve block includes a glue-feeding sleeve for putting the plastic encapsulation resin into it. The insert has workpieces on both sides of the glue-feeding sleeve block. A mounting part, the workpiece mounting part positions and mounts the workpiece carried in by the workpiece carrying device, and the glue-in sleeve block is always energized in a direction away from the clamping surface of the second mold For the workpiece positioned by the workpiece carrying device and placed on the workpiece placing portion, by clamping the mold, the glue sleeve block is pressed down by the first mold to straddle the end of the workpiece , The workpiece is clamped between the glue feeding sleeve block and the insert.

In this way, the workpiece carried by the workpiece carry-in device to the workpiece placement part of the second mold in the opened plastic mold is positioned, and the mold is clamped, and the glue sleeve block is pressed down by the first mold and crosses the end of the workpiece. The workpiece is clamped between the inserts, so the structure of the mold side becomes simple, the mold cost becomes low, the plastic sealing resin can be prevented from winding to the end surface of the workpiece, it is not easy to cause malfunction in the mold, and the maintenance can be easily performed.

Preferably, in one of the molds, the auxiliary pin that is urged toward the workpiece is projected so as to be able to touch the substrate surface other than the resin sealing area of the workpiece via the release film by opening the mold. As a result, when the mold is opened, the auxiliary pin touches the substrate surface outside the resin sealing area of the workpiece through the release film, so the gate is cut off from the excess resin by the rise of the glue sleeve block, and the auxiliary pin passes through the auxiliary pin. By pressing the substrate, the resin sealing part and the release film formed in the cavity recess can be easily released from the mold.

The workpiece mounting portion may be provided with positioning pins at a plurality of locations, and the positioning pins are fitted with a plurality of positioning holes provided in the workpiece to perform positioning. Thereby, the workpiece delivered to the workpiece placement section can be positioned without positional deviation.

The workpiece placement portion may be provided with a plurality of support pins that protrude from the second mold surface to support the workpiece when the mold is opened, and are retracted from the workpiece placement portion to the first when the mold is closed. In the second mold, the workpiece is placed on the workpiece placement part. As a result, in the mold opened state, the support pin in the workpiece placement part protrudes from the second mold surface, so that the workpiece can be opened and closed by the workpiece loading device so that the opening and closing pawls hold the two sides of the workpiece, and the workpiece is delivered to the support Pin on. Furthermore, when the mold is closed, the support pin is retracted into the second mold, whereby the workpiece can be placed on the workpiece mounting portion.

The workpiece placement portion may also be provided with an escape groove, which avoids interference with the opening and closing claws holding the workpiece when the workpiece is loaded in or out of the workpiece after forming. Thereby, even if the support pin is not provided in the workpiece mounting portion of the second mold, even if the opening and closing pawls holding the workpiece are opened and closed, the interference can be avoided by the avoiding groove, and the workpiece can be delivered or received.

It is also possible that the first mold includes a pair of cavity recesses connected by a resin path, the second mold includes a pair of inserts, the pair of inserts are provided on both sides of the glue sleeve block to position the workpiece Parallel workpiece placement section. In this way, multiple workpieces can be loaded and positioned in the plastic packaging mold at the same time, and resin plastic packaging can be performed.

For a resin molding device including any one of the plastic molding molds, the cost of the device can be suppressed, and a resin molding device with high molding quality can be realized. [Effects of the invention]

The invention can provide a workpiece carrying-in device and a workpiece carrying-out device, which can utilize a simplified mold structure to position the plastic sealing mold and deliver the workpiece and the plastic sealing resin. In addition, the present invention can provide a plastic sealing mold, which can prevent the plastic sealing resin from winding to the end surface of the workpiece and has fewer malfunctions. Moreover, the present invention can provide a resin molding device, which includes the workpiece carrying-in device, the workpiece carrying-out device, and the plastic molding mold, thereby reducing costs and realizing a resin molding with high molding quality.

Hereinafter, suitable embodiments of the workpiece carrying-in device, the workpiece carrying-out device, the plastic molding mold, and the resin molding device including the device and the mold of the present invention will be described in detail together with the drawings. Moreover, when referring to a plastic mold, it refers to an upper mold and a lower mold respectively supported on a mold base, and is called a so-called chase, which excludes the mold opening and closing mechanism (pressurizing device). Moreover, when referring to a resin molding device, it includes at least a molding mold and a mold opening and closing mechanism for opening and closing the molding mold (as an example, a pressure device such as an electric motor and a screw shaft or a toggle mechanism; not shown) The device shown), this device also includes a workpiece and resin conveying device for the purpose of automation, a formed workpiece (molded product), and a removal device of excess resin. The so-called workpiece is a quadrilateral or short strip-shaped article such as a lead frame or a multilayer substrate, and is referred to as a rectangular substrate hereinafter. It includes a transfer mechanism that is inserted into the injection sleeve to operate the plunger in the case of transfer molding, and also includes a decompression mechanism that forms a decompression space in the mold when the mold is closed. Hereinafter, the description will be focused on the structure of the plastic packaging mold. Furthermore, regarding the work W, it is assumed that a rectangular substrate on which a wafer is mounted is resin-molded. Regarding the plastic molding mold, as an example, the lower mold is a movable mold and the upper mold is a fixed mold. However, the upper mold may be a movable mold and the lower mold may be a fixed mold, or both may be movable molds.

(Plastic mold) First of all, the structure of the work-in device for loading the workpiece and the plastic-sealing resin into the plastic-sealing mold for the resin molding device, and the structure of the work-out conveying device for the molded work and the excess resin from the plastic-sealing mold are carried out together with the structure of the plastic-sealing mold. Description.

First, the structure of the plastic packaging mold 1 will be described with reference to FIGS. 7 and 12. To the opened pair of upper mold 2 (first mold) and lower mold 3 (second mold), a workpiece W (for example, rectangular substrate) and molding resin R1 (for example, resin pellets) are supplied by a workpiece loading device described later. As shown in A of FIG. 12, in the upper mold 2, an upper mold cavity recessed portion 2a is formed on the upper mold clamping surface, and a resin path including an upper mold remnant portion 2b and an upper mold runner gate 2c connected thereto is formed .

As shown in FIG. 7, the upper mold clamping surface includes the cavity recess 2a and the resin path, and is covered by the release film F. The release film F is, for example, a film material with a thickness of about 50 μm and heat resistance, which is easily peeled from the mold surface. A flexible and stretchable film can be suitably used, such as PTFE (Polytetrafluoroethylene, polytetrafluoroethylene), ETFE (Ethylene-Tetrafluoroethylene, ethylene-tetrafluoroethylene copolymer), PET (Polyethylene terephthalate, polyethylene terephthalate), FEP (Fluorinated ethylene propylene, fluorinated ethylene propylene) film, fluorine impregnated glass cloth, polypropylene film , Polyvinyl chloride, etc. as the main component of single-layer or multi-layer film. The release film F may be either a single film or a long film wound between rolls.

Moreover, as shown in A of FIG. 12, in the upper mold 2 in the area surrounded by the workpiece contour line L1 intersecting the upper mold runner gate 2c and the encapsulation portion (resin sealing portion) contour line L2, it is possible to pass A plurality of auxiliary pins 2d are provided so that the release film F touches the substrate portion other than the resin sealing area of the workpiece W. As shown in FIG. 7, the auxiliary pin 2d is provided by the elastic member provided in the upper mold|type 2 by always urging|biasing in the direction which protrudes from the upper mold clamping surface. A plurality of auxiliary pins 2d are provided so that the auxiliary pins 2d touch the workpiece W (substrate portion) by opening the mold, promote the release of the package portion from the cavity recess 2a and gate break, and retreat by clamping the mold To the upper mold 2.

In FIG. 7, in the center part of the lower mold block (not shown) in the width direction of the lower mold 3, a rubber feed sleeve block 3 a and a lower mold insert 3 b are provided. A glue sleeve 3e is embedded concentrically in the glue sleeve block 3a. The glue sleeve block 3a and the glue sleeve 3e are urged upward by the coil spring 3c with respect to the lower mold insert 3b so as to be far away from the lower mold clamping surface.

As shown in Figure 12B, in the upper end surface of the rubber inlet sleeve block 3a, a bridge portion 3d of the resin path is formed together with the opposing upper mold remnant portion 2b and upper mold runner gate 2c in the rubber inlet sleeve block. Protruding on both sides of 3a. As shown in FIG. 7, the outer peripheral edge portion of the bridge portion 3d is formed so that the plate thickness gradually becomes thinner, and the front end extends to the cavity surface, and the end portion of the workpiece W is pressed across the substrate surface. And the space part of the bridge|bridging part 3d of the glue sleeve block 3a becomes the escape space S of the opening and closing claw 4g of the loading hand 4f which grasps the workpiece|work W mentioned later. In the cylindrical hole 3e1 of the glue feeding sleeve 3e, a glue squeezing head 3f is provided in a manner capable of being raised and lowered by a driving source not shown. In the filling sleeve 3e, the molding resin R1 (for example, a resin pellet) is injected|thrown-in by the loader 4 mentioned later.

As shown in FIG. 7, in the upper surface of the lower mold insert 3b, a workpiece placement recess 3g (work placement portion) in which the workpiece W is placed is dug. The depth of the workpiece placement recess 3g corresponds to the approximate degree of the thickness of the workpiece W. As shown in FIG. 12B, along a virtual line L4 that is inside the outline L3 of the workpiece placement recess 3g, a plurality of suction holes 3h for sucking and holding the workpiece W are arranged in a circumferential manner at equal intervals. Furthermore, in the workpiece region surrounded by the imaginary line L4 provided with the plurality of suction holes 3h, a plurality of support pins 3i are arranged in a good balance so that the workpiece W can be held, and the plurality of support pins 3i are arranged as Can be raised and lowered. A plurality of support pins 3i are provided in, for example, a lower mold base not shown. When the lower mold 3 is lowered during mold opening, it protrudes from the workpiece placement recess 3g to support the workpiece W, and if the lower mold 3 rises due to mold clamping, the lower mold 3 rises from The workpiece placement recess 3g is retracted into the lower mold 3, and the workpiece W can be placed in the workpiece placement recess 3g.

Furthermore, as shown in B of FIG. 12, positioning pins 3j are protrudingly provided in a plurality of locations along the longitudinal direction of the workpiece in a region overlapping with the bridge portion 3d of the glue sleeve block 3a of the workpiece seating recess 3g. The workpiece W is provided with a positioning hole Wh (refer to FIG. 5) into which the positioning pin 3j fits along the long side of the glue sleeve side, and the upper mold 2 also has an escape hole for the positioning pin 3j. The workpiece W carried into the lower mold 3 by the loader 4 described later is aligned with the positioning pin 3j through the positioning hole Wh and fitted, and the workpiece W is positioned and placed in the workpiece placement recess 3g. As shown in Fig. 7, the glue sleeve block 3a and the glue sleeve 3e are always urged by the coil spring 3c in a direction away from the clamping surface of the lower mold 3. For the workpiece carrying device (loader 4) described later For the workpiece W positioned and placed in the workpiece seating recess 3g, by clamping the mold, the glue sleeve block 3a is pressed down by the upper mold 2 to straddle the end of the workpiece, and the workpiece W is in the glue sleeve block 3a. It is clamped with the lower mold insert 3b.

(Loader mechanism) Next, with reference to FIGS. 1 and 6, an example of the loader 4 (work loading device) that loads the work W and the molding resin R1 into the molding die 1 will be described. As shown in FIG. 1, the loader 4 loads the workpiece W and the molding resin R1 into the opened plastic mold 1 (lower mold 3). The loader body 4a is arranged to move in the X-Y direction in a horizontal plane, and can be raised and lowered relative to the lower mold clamping surface of the lower mold 3. Positioning of the workpiece W is performed with respect to the glue feeding sleeve block 3a provided on the lower mold 3 and the workpiece placement recesses 3g arranged on both sides thereof.

As shown in Fig. 6, the loader body 4a is provided with a resin input portion 4b. The resin input portion 4b puts the resin R1 (for example, resin pellets) into the rubber inlet sleeve of the rubber inlet sleeve block 3a while maintaining the state of molding resin R1 (for example, resin pellets).管3e. The resin input part 4b accommodates and conveys the molding resin R1 in a cylindrical container, and is opened and closed by the shutter 4c provided in the bottom of the container, and the molding resin R1 is injected into the injection sleeve 3e. In addition, in FIG. 1, on both sides of the resin input portion 4b, a pair of workpiece holding portions 4d that can move closer to or away from each other while holding the workpiece W (for example, a rectangular substrate) is provided. The pair of workpiece holding portions 4d is slidably assembled with a loading hand 4f via a sliding mechanism 4e with respect to the loader main body 4a. As the sliding mechanism 4e, for example, a rodless cylinder can be used, and the pair of loading hands 4f can simultaneously move in the direction of approach and the direction of separation in the left-right direction of FIG. 1. In addition, each loading hand 4f is provided with a pair of opening and closing claws 4g that can be opened and closed to hold both sides in the width direction of the workpiece W (for example, a rectangular substrate). The opening and closing pawls 4g perform opening and closing operations via a link mechanism that is driven by an air cylinder not shown to open and close, for example.

As shown in FIG. 1, the workpiece holding portion 4d is in a state of holding the workpiece W, approaching each other to a position where the rubber feeding sleeve block 3a and the workpiece seating recess 3g in the raised position overlap in a plan view, and the workpiece W is delivered to A plurality of support pins 3i protruding from the workpiece placement recess 3g. In this way, the loader body 4a is inserted into the opened molding die 1, and the molding resin R1 is injected from the resin input portion 4b into the injection sleeve 3e of the injection sleeve block 3a, and a pair of workpieces holding the workpiece W before molding The holding portion 4 d is close to each other to a position where the rubber feeding sleeve block 3 a and the workpiece placement recess 3 g overlap in a plan view, and the workpiece W is delivered to the lower mold 3. It is preferable that the resin injection part 4b injects the molding resin R1 into the injection sleeve 3e when the work W held by the pair of work holding parts 4d is delivered to the lower mold 3.

As a result, the loader 4 and the work placement recess 3g have the same timing of loading the workpiece W, and supply the plastic resin R1 to the injection sleeve 3e of the injection sleeve block 3a, so that the work can be carried in smoothly, and the assembly can be performed smoothly. The positioning work piece W is clamped by the bridge portion 3d of the rubber feeding sleeve block 3a by the mold operation. In addition, the workpiece holding portion 4d is positioned and carried into the workpiece seating recess 3g by sliding the workpiece W by the sliding mechanism 4e in a state of holding the workpiece W without interfering with the glue sleeve block 3a, so the structure of the plastic packaging mold 1 can be simplified.

(Unloader mechanism) Next, an example of the unloader 5 (work unloading device) that unloads the molded workpiece W (molded product) and excess resin R2 in the plastic packaging mold 1 will be described with reference to FIG. 13. As shown in FIG. 13, the unloader 5 unloads the molded workpiece W (molded product) and excess resin R2 from the opened plastic mold 1 (lower mold 3). If the plastic molding mold 1 is opened after resin molding, the formed workpiece W is supported by the support pins 3i protruding from the workpiece placement recess 3g of the plastic molding mold 1, and is supported by the injection sleeve block 3a away from the clamping surface of the lower mold The surplus resin R2 becomes a separated state (which will be described in the action after the mold is formed below). In this state, the unloader body 5a enters the plastic packaging mold 1 to carry out the workpiece W and the excess resin R2 (molded product residual material flow path). The unloader body 5a is provided with a residual material holding block 5b (excess resin recovery part) for recovering the surplus resin R2 from the rubber feeding sleeve block 3a while holding the surplus resin R2. The remaining material holding block 5b is suspended and supported by the coil spring 5c with respect to the unloader body 5a. The surplus material holding block 5b is pressed against the molded article surplus material flow path R2 by the suction pad 5b1 provided at the lower end, and is sucked and held. In addition, in this embodiment, the adsorption pad 5b1 is used to hold the excess resin R2, but it is not necessary to be the adsorption pad 5b1. The remaining material holding block 5b can also hold the excess resin R2 by opening and closing claws (not shown).

In addition, on both sides of the remaining material holding block 5b, a pair of workpiece collecting parts 5d which can move closer to or away from each other while holding the formed workpiece W (molded product) is provided. The pair of workpiece collecting parts 5d is slidably assembled with an unloader hand 5f with respect to the unloader main body 5a via a sliding mechanism 5e. As the sliding mechanism 5e, for example, a rodless cylinder can be used, and the pair of unloader hands 5f can simultaneously move in the direction of approach and the direction of separation in the left-right direction of FIG. 13. In addition, each unloader hand 5f is provided with openable and closable opening and closing claws 5g that hold both sides in the width direction of the workpiece W (for example, a rectangular substrate) in an openable and closable manner. The opening and closing pawl 5g performs opening and closing operations via a link mechanism that is driven by an air cylinder not shown to open and close, for example.

The remaining material holding block 5b holds the excess resin R2, the workpiece recovery part 5d holds the formed workpiece W from the workpiece placement recess 3g of the lower mold 3, and the pair of workpiece recovery parts 5d are far away from each other so as not to interfere with the rubber sleeve block 3a Position, unload the formed workpiece W. In this way, the unloader body 5a enters the opened plastic molding mold 1, the remaining material holding block 5b attracts and retains the excess resin R2 supported by the feeding sleeve block 3a, the pair of workpiece recovery parts 5d hold the formed workpiece W, and The sliding mechanism 5e is used to move away from each other to a position where it does not interfere with the rubber feeding sleeve block 3a, and the formed workpiece W is carried out. Thereby, the workpiece recovery part 5d carries out the molded workpiece W from the workpiece seating recess 3g without disturbing the glue sleeve block 3a while maintaining the molded product, so that the structure of the plastic packaging mold 1 can be simplified.

(Loader action) Here, an example of the molding operation of the resin molding device will be described together with the loading and unloading operations of the workpiece to the molding die. First, with reference to FIGS. 1 to 5, the work carrying-in operation by the loader 4 will be described. In FIG. 1, the workpiece W (rectangular substrate) and the molding resin R1 are carried into the lower mold 3 where the mold is opened. In the lower mold 3, the rubber inlet sleeve block 3a and the rubber inlet sleeve 3e are urged by the coil spring 3c, and are in a raised position compared to the lower mold clamping surface (the upper surface of the lower mold insert 3b), and the support pin 3i is at A state protruding from the workpiece placement recess 3g. The loader 4 holds the molded resin R1 in the resin input portion 4b, and the pair of work holding portions 4d hold the loader hand 4f at a position away from each other (left and right pulled apart positions) from the resin input portion 4b by a sliding mechanism 4e, and is open The claws 4g hold both sides in the short-side direction of the workpiece W (rectangular substrate), and enter the plastic packaging mold 1 in this state.

In FIG. 2, the loader 4 is lowered, and the workpiece W held by the loader hand 4f is placed on the plurality of support pins 3i protruding from the workpiece placement recess 3g. The opening and closing pawl 4g is in a state where the workpiece W is kept closed.

In FIG. 3, the slide mechanism 4e is operated, and the pair of loading hands 4f slides in the direction approaching the resin injection part 4b. At this time, the opening and closing claws 4g are located between the bridge portions 3d in a plan view, so they do not interfere with the glue sleeve block 3a, and the height of the upper surface of the workpiece W becomes a position lower than the lower surface of the bridge portion 3d Therefore, the front end of the workpiece W slides so as to sneak under the bridge portion 3d. Furthermore, since the resin input part 4b is located right above the filling sleeve block 3a, the shutter 4c is opened, and the molding resin R1 (resin pellet) is injected into the filling sleeve 3e.

In FIG. 4, the opening/closing claw 4g of the loading handle 4f is opened, and the workpiece|work W (rectangular board|substrate) is delivered to the support pin 3i. At this time, the positioning hole Wh of the workpiece W is aligned with the positioning pin 3j of the lower mold 3. The opening and closing claws 4g are arranged in the avoidance space S (refer to FIG. 12B) of the glue sleeve block 3a in a plan view, and therefore do not interfere with the bridge portion 3d. In FIG. 5, after the loader 4 delivers the workpiece W to the lower mold 3, the loader body 4 a rises and retracts from the plastic mold 1. Then, the loading of the workpiece W and the molding resin R1 into the molding mold 1 is completed, and thus the clamping operation of the molding mold 1 is performed. That is, the lower mold 3 starts to rise, and therefore the support pins 3i are relatively lowered, the positioning pins 3j are fitted into the positioning holes Wh, and the position of the workpiece W is determined and placed in the workpiece placement recess 3g. Furthermore, since air is sucked in advance from the suction hole 3h provided in the workpiece placement recess 3g, or after the workpiece is placed, the workpiece W is positioned and fixed in the workpiece placement recess 3g.

In this way, in the opened plastic sealing mold 1, the workpiece W carried in by the loader 4 is positioned in the workpiece placement recess 3g of the lower mold 3. By clamping the mold, the rubber feeding sleeve block 3a is pressed down by the upper mold 2, and the rubber sleeve block 3a is pressed down by the upper mold 2. The workpiece W is clamped between the cylinder block 3a and the lower mold insert 3b, so the structure of the mold side becomes simple, the mold cost becomes low, and the plastic resin R1 can be avoided to detour to the end surface of the workpiece, and it is not easy to cause malfunction in the mold. Moreover, maintenance can be carried out easily.

(Plastic mold action) Next, the resin molding operation performed by the molding die 1 will be described with reference to FIGS. 7 to 11. FIG. 7 shows a state in which the workpiece W is set in the workpiece setting recess 3g of the lower mold 3, and the resin pellet R is loaded in the glue sleeve 3e. The rubber inlet sleeve block 3a and the rubber inlet sleeve 3e are urged by the coil spring 3c to be in a raised position. Furthermore, the clamping surface of the upper mold 2 sucks and holds the release film F, and the auxiliary pin 2d protrudes from the upper mold clamping surface so as to press the release film F downward.

When the mold clamping action is performed and the upper mold 2 touches the rubber inlet sleeve block 3a, the rubber inlet sleeve block 3a and the rubber inlet sleeve 3e are pressed down against the force of the coil spring 3c. Next, as shown in FIG. 8, when the lower mold 3 and the upper mold 2 are closed, the rubber feeding sleeve block 3 a and the rubber feeding sleeve 3 e are sandwiched by the upper mold 2 and the lower mold 3. At this time, the bridge portion 3d provided in the glue-in sleeve block 3a straddles the outer peripheral edge portion of the workpiece W positioned in the workpiece placement recess 3g, and presses the upper surface (substrate surface) of the workpiece. Thereby, between the upper mold residual material part 2b, the upper mold runner gate 2c and the upper end surface (the upper surface of the bridge part 3d) of the injection sleeve block 3a, it is formed in multiple places (five places in FIG. 12) A resin path communicating with the upper mold cavity recess 2a. And the auxiliary pin 2d (refer FIG. 7) protruding from the upper mold|type 2 touches the board|substrate surface of the workpiece|work W which opposes, and is pressed back.

In FIG. 9, a heater (not shown) is built in the plastic molding mold 1, and the plastic molding resin R1 melted in the injection sleeve 3e is raised by the extrusion head 3f, and then passes through the upper mold remnant part 2b and the upper mold flow The resin path between the sprue 2c and the upper end surface of the injection sleeve block 3a is filled into the upper mold cavity recess 2a. The molding resin R1 filled in the cavity 2a of the upper mold is heated and hardened (cured).

In Figure 10, the plastic packaging mold 1 is opened. At this time, the lower mold 3 is lowered while sucking and holding the workpiece W in the workpiece placement recess 3g, whereby the rubber feeding sleeve block 3a and the rubber feeding sleeve 3e that are urged by the coil spring 3c rise relatively. Thereby, the encapsulation part PK (resin sealing part) of the molded workpiece W (molded product) and the excess resin R2 (molded product residual flow path) formed on the feed sleeve block 3a are gate-cut. In addition, the auxiliary pin 2d protrudes from the upper mold 2 and presses the substrate surface of the workpiece W, whereby the packaging portion PK and the upper mold cavity concave portion 2a covered with the release film F are easily demolded.

Next, in FIG. 11, when the mold is opened, the support pin 3i protrudes from the workpiece placement recess 3g, and therefore the workpiece W is pushed up from the workpiece placement recess 3g. Thereby, the workpiece W is in a state where the positioning pin 3j has come out of the positioning hole Wh. In addition, the air suction of the suction hole 3h provided in the workpiece placement recess 3g may be continued or may be stopped together with the mold opening.

(Uninstaller action) Finally, with reference to FIGS. 13 to 16, the work unloading operation performed by the unloader 5 will be described. In FIG. 13, the unloader 5 enters the opened plastic mold 1. In the lower mold 3, the rubber inlet sleeve block 3a and the rubber inlet sleeve 3e are urged by the coil spring 3c and are in a raised position relative to the lower mold clamping surface (the upper surface of the lower mold insert 3b), and the support pin 3i is positioned from the workpiece The state where the recess 3g protrudes. Therefore, the molded workpiece W (molded product) and excess resin R2 (molded product residual material flow path) are in a separated state. The unloader 5 holds the unloader hand 5f at a position (near the center) where the pair of workpiece recovery parts 5d approach the remaining material holding block 5b through the sliding mechanism 5e, and the opening and closing claws 5g are opened, and in this state, it enters the plastic package Mold 1.

In FIG. 14, the unloader 5 descends, and the opening and closing claws 5g of the unloader hand 5f enter both sides of the workpiece W supported by the support pin 3i. At this time, the opening and closing claws 5g are located between the bridge portions 3d, so they will not interfere with the glue sleeve block 3a. In addition, the workpiece W is held by closing the opening and closing claws 5g. In addition, the remaining material holding block 5b presses the adsorption pad 5b1 against the excess resin R2 (molded product remaining material flow path), thereby adsorbing and holding the excess resin R2.

In FIG. 15, the sliding mechanism 5e is operated, and the pair of unloading hands 5f are respectively slid in a direction away from the remaining material holding block 5b (left and right sides). In FIG. 16, the unloader body 5a of the unloader 5 rises while holding the molded workpiece W (molded product) and excess resin R2 (molded product residual material flow path), and is retracted from the plastic molding die 1. The unloader 5 delivers the molded product to the molded product storage section, and collects the excess resin R2 to a scrap box, thereby ending a series of resin molding operations.

Regarding the resin molding apparatus 6 including the above-mentioned molding die 1, the loader 4, and the unloader 5, it can be applied to, for example, the apparatus shown in the plan layout diagram of FIG. 25. In FIG. 25, the module-type resin molding device 6 is sandwiched between a workpiece and resin supply part 6a and a molded product and excess resin storage part 6b, and is formed by connecting a single or a plurality of pressurizing parts 6c. The loader 4 reciprocates between the workpiece and resin supply part 6a and the pressure part 6c, and the unloader 5 reciprocates between the pressure part 6c and the molded product and the accommodating part 6b of excess resin. Also, although not shown, the loader 4 and the unloader 5 can move back and forth along a moving rail that is provided for the workpiece and the resin supply part 6a, the pressure part 6c, the molded product, and the excess resin storage part 6b, or It can also move back and forth along individual moving tracks.

(Other embodiment 1) Next, with reference to FIGS. 17 to 24, other embodiments of the plastic molding mold 1 will be described. The loader 4 and the unloader 5 have the same structure, so the same components are assigned the same numbers and the description is cited.

As shown in FIG. 17, in the lower mold 3, a plurality of support pins 3i protruding in the workpiece placement recess 3g are provided, but in order to simplify the mold structure, the plurality of support pins 3i may be omitted. The structure in which a suction hole 3h for sucking the workpiece W is provided in the workpiece placement recess 3g is the same. As shown in FIG. 17, in the upper surface of the lower mold insert 3b, the workpiece|work mounting recessed part 3g (workpiece mounting part) in which the workpiece|work W is mounted is dug. The depth of the workpiece placement recess 3g corresponds to the approximate degree of the thickness of the workpiece W. FIG. 24 is a plan view of the lower mold 3. On the contour line L3 of the workpiece placement recess 3g, at a position that does not interfere with the bridge portion 3d provided in the glue sleeve block 3a, a pair of left and right opening and closing claws 4g are provided with escape recesses 3k at four places. The avoiding recessed portion 3k is a method that does not interfere with the opening and closing claws 4g of the loader 4 and the opening and closing claws 5g of the unloader 5 when the workpiece W is transferred between the lower mold 3 and the lower mold 3. The configuration corresponding to the left and right pairs. Along the imaginary line L4 which is inside the outer line L3 of the workpiece placement recess 3g, a plurality of suction holes 3h for sucking and holding the workpiece W are arranged in a circumferential manner at equal intervals.

Hereinafter, the workpiece carrying-in operation by the loader 4, the resin molding operation by the molding die 1 and the workpiece carrying-out operation by the unloader 5 will be described centering on the differences. Furthermore, the description will be centered on the workpiece carrying-in operation of carrying the workpiece into the lower mold 3 by the loader 4, and the description of the loader 4 will be cited for the workpiece carrying-out operation by the unloader 5.

(Loader action) As shown in Fig. 17, the loader 4 first holds the molded resin R1 in the resin input portion 4b, and holds the pair of workpiece holding portions 4d at a position separated from each other from the resin input portion 4b by a sliding mechanism 4e (left and right opened position). The hand 4f is loaded, and both sides of the short side direction of the workpiece W (rectangular substrate) are held by the opening and closing claws 4g, and the plastic mold 1 is entered in this state. In the lower mold 3, the rubber inlet sleeve block 3a and the rubber inlet sleeve 3e are urged by the coil spring 3c, and are in a raised position relative to the lower mold clamping surface (the upper surface of the lower mold insert 3b).

In FIG. 18, the loader body 4a is lowered to hold the workpiece W with the opening and closing claws 4g of the loading hand 4f. The opening and closing claws 4g are lowered to the upper surface of the workpiece W below the bridge portion 3d of the glue sleeve block 3a. s position. Next, the sliding mechanism 4e is operated, and the pair of loading hands 4f is slid in a direction approaching the resin input portion 4b. At this time, the opening and closing pawls 4g are located between the bridging portions 3d in a plan view, so they will not interfere with the rubber feeding sleeve block 3a. Furthermore, since the resin input part 4b is located right above the filling sleeve block 3a, the shutter 4c is opened, and the molding resin R1 (resin pellet) is injected into the filling sleeve 3e.

In FIG. 19, the loading handle 4f is further lowered, the opening and closing pawl 4g is lowered to enter the avoiding recess 3k, the opening and closing pawl 4g is opened, and the workpiece W is delivered to the workpiece placement recess 3g. At this time, the positioning hole Wh of the workpiece W and the positioning pin 3j of the lower mold 3 are aligned and fitted. Furthermore, since the suction hole 3h provided in the workpiece placement recess 3g in advance starts to suck air, the workpiece W is positioned and fixed to the workpiece placement recess 3g. The movement of the work W as a whole draws an L-shaped trajectory with an inverted L-shaped trajectory in the left and right directions.

In FIG. 20, after the loader 4 delivers the workpiece W to the lower mold 3, the loader body 4a rises and moves and retracts from the plastic mold 1 in the X-Y direction. Furthermore, since the loading of the workpiece W and the molding resin R1 is completed, the clamping operation of the molding mold 1 is performed.

(Plastic mold action) Next, the resin molding operation performed by the molding die 1 will be described with reference to FIGS. 21 to 23. FIG. 21 shows a state in which the workpiece W is set in the workpiece placement recess 3g of the lower mold 3, and the resin pellet R1 is loaded in the glue sleeve 3e. The rubber inlet sleeve block 3a and the rubber inlet sleeve 3e are urged by the coil spring 3c to be in a raised position. Furthermore, the clamping surface of the upper mold 2 sucks and holds the release film F, and the auxiliary pin 2d protrudes from the upper mold clamping surface so as to press the release film F downward.

When the mold clamping operation is performed, as shown in FIG. 22, the rubber inlet sleeve block 3 a and the rubber inlet sleeve 3 e are clamped by the upper mold 2 and the lower mold 3. At this time, the bridge portion 3d provided in the glue-in sleeve block 3a straddles the outer peripheral edge portion of the workpiece W positioned in the workpiece placement recess 3g, and presses the upper surface (substrate surface) of the workpiece. Thereby, a plurality of places (five places in Fig. 24) are formed between the upper mold remnant part 2b, the upper mold runner gate 2c, and the upper end surface (the upper surface of the bridging part 3d) of the injection sleeve block 3a A resin path communicating with the upper mold cavity recess 2a. Then, the auxiliary pin 2d protruding from the upper mold 2 touches the substrate surface of the opposing workpiece W and is pressed back.

In Fig. 22, a heater (not shown) is built in the mold base and/or the plastic molding mold 1, and the plastic resin R1 melted in the feeding sleeve 3e passes through the upper mold remnant part through the ascending of the extrusion head 3f 2b. The resin path between the upper mold runner gate 2c and the upper end surface of the injection sleeve block 3a is filled into the upper mold cavity recess 2a. The molding resin R1 filled in the cavity 2a of the upper mold is heated and hardened (cured).

In Figure 23, the plastic packaging mold 1 is opened. At this time, the lower mold 3 is lowered while sucking and holding the workpiece W in the workpiece placement recess 3g, whereby the rubber feeding sleeve block 3a and the rubber feeding sleeve 3e that are urged by the coil spring 3c rise relatively. Thereby, the molded workpiece W (molded product) and the excess resin (molded product residual material flow path) formed on the injection sleeve block 3a are gated off. Moreover, the auxiliary pin 2d protrudes from the upper mold 2 and presses the substrate surface of the workpiece W, whereby the package portion P and the upper mold cavity concave portion 2a are easily demolded.

(Uninstaller action) The unloader 5 holds the unloader hand 5f at a position (near the center) where the pair of workpiece recovery parts 5d approach the remaining material holding block 5b through the sliding mechanism 5e, and the opening and closing claws 5g are opened, and in this state, it enters the plastic package Mold 1.

As with the loader 4 shown in FIG. 19, the unloader 5 descends, and the opening and closing claws 5g of the unloader hand 5f enter the avoidance recess 3k on both sides of the workpiece W placed in the workpiece placement recess 3g. At this time, the opening and closing pawls 5g are located between the bridging portions 3d in a plan view, so they will not interfere with the glue sleeve block 3a. In addition, the pair of opening and closing claws 5g enter the avoiding recess 3k, so that they do not interfere with the workpiece placement recess 3g. Next, the workpiece W is held by closing the opening and closing claws 5g. In addition, the remaining material holding block 5b presses the adsorption pad 5b1 against the excess resin R2 (molded product remaining material flow path), thereby adsorbing and holding the excess resin R2.

In FIG. 16, the sliding mechanism 5e is operated, and the pair of unloading hands 5f are respectively slid in the direction away from the remaining material holding block 5b (left and right sides). In FIG. 16, the unloader body 5a of the unloader 5 rises while holding the molded workpiece W (molded product) and excess resin R2 (molded product residual material flow path), and is retracted from the plastic molding die 1.

At this time, it is possible to omit the multiple support pins 3i provided in the workpiece placement recess 3g of the lower mold 3 of the plastic packaging mold 1, so that the structure of the plastic packaging mold 1 can be further simplified, the device cost can be suppressed, and a high-quality resin plastic packaging can be realized. In the case of the above-mentioned embodiment, the workpiece W is slid laterally on the support pin 3i. However, in the other embodiment 1, the aspect of lateral sliding on the workpiece placement recess 3g or in the space directly above is different.

(Other embodiment 2) The described embodiment and other embodiment 1 are centered on the glue sleeve block 3a provided with a plurality of glue sleeves 3e, and are arranged such that a pair of workpieces W are on both sides and the long sides face each other. However, the workpiece W is not Two pieces are necessary, and even when one piece of work W is placed on the work placement part arranged on the side of the glue-in sleeve block 3a, the same can be implemented.

As described above, in this way, the loader body 4a is inserted into the opened plastic molding mold 1, and the resin injection portion 4b is used to inject the molding resin R1 into the injection sleeve 3e of the injection sleeve block 3a, and the workpiece W before molding is held The pair of workpiece holding portions 4d close to each other to a position where the glue sleeve block 3a in the raised position and the workpiece placement recess 3g overlap in a plan view, and the workpiece W is delivered to the mold clamping surface, thus the workpiece holding portion In 3d, the workpiece W can be positioned and carried into the workpiece placement recess 3g while maintaining the state of the workpiece W without interfering with the glue-in sleeve block 3d. Moreover, the unloader body 5a can enter the opened plastic mold 3, and the remaining material holding block 5b (excess resin recovery part) adsorbs and holds the excess resin R1 supported by the rubber feeding sleeve block 3a, and a pair of workpiece recovery parts 5d hold The formed workpieces W are kept away from each other to a position where they do not interfere with the rubber feeding sleeve block 3a, and the formed workpieces are carried out. Through the above content, the structure of the plastic packaging mold 1 can be simplified.

In this way, for the opened plastic molding mold 1, the workpiece W is carried into the workpiece placement recess 3g by the loader 4, and positioned without interfering with the glue sleeve block 3a, and the unloader 5 is used to transfer the formed workpiece W and The excess resin R2 is taken out from the workpiece placement recess 3g without interfering with the rubber inlet sleeve block 3a, so the structure of the mold side becomes simple, the mold cost becomes low, and the plastic sealing resin R1 can be prevented from winding to the end surface of the workpiece, and it is not easy to cause the mold in the mold. The operation is not good, and maintenance can be performed easily.

For the resin molding device including the molding die 1, the cost of the device can be suppressed, and resin molding with high molding quality can be realized.

In addition, the molding resin R1 is not limited to resin pellets, and for example, pelletized resin, powdered resin, liquid resin, etc. may be supplied. In the plastic packaging mold 1, the upper mold 2 is formed with a cavity recess, but the lower mold 3 may be provided with a cavity recess.

1: Plastic mold 2: upper die 2a: The concave part of the upper mold cavity 2b: Leftover part of upper die 2c: Upper mold runner gate 2d: auxiliary pin 3: Lower die 3a: Inlet sleeve block 3b: Lower mold insert 3c: coil spring 3d: bridging part 3e: Inlet sleeve 3e1: barrel hole 3f: Extrusion head 3g: Workpiece placement recess 3h: suction hole 3i: Support pin 3j: positioning pin 3k: Avoid recess 4: Loader 4a: Loader body 4b: Resin input department 4c: Ram 4d: Workpiece holding part 4e: sliding mechanism 4f: Loader 4g: opening and closing claw 5: Uninstaller 5a: Unloader body 5b: Remaining material holding block 5b1: Adsorption pad 5c: coil spring 5d: Workpiece Recycling Department 5e: sliding mechanism 5f: Uninstaller 5g: opening and closing claw 6: Resin molding device 6a: Workpiece and resin supply unit 6b: Storage area for molded products and excess resin 6c: Pressure section F: Release film L1: Workpiece outline line L2: Outline line of encapsulation part (resin sealing part) L3: Outline line L4: imaginary line PK: Encapsulation part (resin sealing part) R1: Plastic resin R2: Excess resin S: Avoid space W: Workpiece Wh: positioning hole

Fig. 1 is an explanatory diagram showing the steps of loading a workpiece and a mold of plastic molding resin by a workpiece loading device. Fig. 2 is an explanatory diagram showing a step of carrying in a mold of a workpiece and a molding resin following Fig. 1. Fig. 3 is an explanatory diagram showing the steps of carrying in the mold of the workpiece and the molding resin following Fig. 2. Fig. 4 is an explanatory diagram showing a procedure for carrying in a mold of a workpiece and a plastic molding resin following Fig. 3. Fig. 5 is an explanatory diagram showing the steps of carrying in the mold of the workpiece and the molding resin following Fig. 4; Fig. 6 is a bottom view of the workpiece loading device. Fig. 7 is an explanatory diagram of a resin molding step performed by using a molding die. Fig. 8 is an explanatory diagram of a resin molding step following Fig. 7. Fig. 9 is an explanatory diagram of a resin molding step following Fig. 8. Fig. 10 is an explanatory diagram of a resin molding step subsequent to Fig. 9. Fig. 11 is an explanatory diagram of the resin molding step following Fig. 10. Fig. 12A is a plan layout view of the upper mold, and Fig. 12B is a plan layout view of the lower mold. 13 is an explanatory diagram showing the steps of the mold unloading operation of the molded product and excess resin by the work unloading device. Fig. 14 is an explanatory diagram showing the steps of the mold unloading operation of the molded product and excess resin following Fig. 13. Fig. 15 is an explanatory diagram showing a procedure for unloading a molded product and excess resin following Fig. 14. Fig. 16 is an explanatory diagram showing the steps of the mold unloading operation of the molded product and excess resin following Fig. 15. Fig. 17 is an explanatory diagram showing steps of loading the workpiece and the molding resin into the plastic molding mold of another example by the workpiece loading device. Fig. 18 is a step explanatory diagram showing the loading operation of the workpiece and the molding resin following Fig. 17. Fig. 19 is a step explanatory diagram showing the loading operation of the workpiece and the molding resin following Fig. 18. Fig. 20 is an explanatory diagram showing the steps of the loading operation of the workpiece and the molding resin following Fig. 19. Fig. 21 is an explanatory diagram of a resin molding step by using a molding die of another example. Fig. 22 is an explanatory diagram of the resin molding step following Fig. 21. Fig. 23 is an explanatory diagram of the resin molding step following Fig. 21. Figure 24 is a plan view of the lower die. Figure 25 is a plan layout diagram of a resin molding device.

3: Lower die

3a: Inlet sleeve block

3b: Lower mold insert

3c: coil spring

3d: bridging part

3e: Inlet sleeve

3f: Extrusion head

3g: Workpiece placement recess

3h: suction hole

3i: Support pin

3j: positioning pin

4: Loader

4b: Resin input department

4c: Ram

4d: Workpiece holding part

4e: sliding mechanism

4f: Loader

4g: opening and closing claw

R1: Plastic resin

W: Workpiece

Claims (15)

A workpiece carrying device, which is characterized in that the workpiece and the plastic sealing resin are carried into the opened plastic sealing mold, and the workpiece carrying device includes: Carrying in the device body, loading the workpiece into the workpiece mounting part provided on the side of the glue feeding sleeve block, and the glue feeding sleeve block is arranged on the mold clamping surface of the plastic packaging mold in a manner capable of being lifted and lowered; The resin input part is provided in the main body of the carrying-in device, and puts the resin in the injection sleeve of the injection sleeve block while maintaining the state of the plastic-encapsulated resin; and The workpiece holding part is provided in the carrying-in device body to hold the workpiece in a state and move so as to be close to or away from the resin input part, The workpiece holding portion is to hold the workpiece, and approach each other to a position where the glue-inlet sleeve block and the workpiece mounting portion in a raised position overlap in a plan view, and deliver the workpiece to The workpiece placement part. The workpiece carrying-in device according to claim 1, wherein: The workpiece holding portion is slidably assembled with a loading hand with respect to the carrying-in device body via a sliding mechanism. The loading hand includes opening and closing claws that hold both sides of the rectangular substrate in the width direction and can be opened and closed . The workpiece carrying-in device described in claim 1 or claim 2, wherein: The workpiece holding portion holds a pair of workpieces, and carries the pair of workpieces into the workpiece mounting portions provided on both sides of the glue sleeve block. The workpiece carrying-in device described in claim 1 or claim 2, wherein: The resin injection part, when delivering the work held by the pair of work holding parts to the mold clamping surface, injects the molding resin into the injection sleeve. A resin molding device includes the workpiece carrying device according to any one of claim 1 to claim 4. A workpiece removal device, characterized in that, the formed workpiece and excess resin are removed from the opened plastic mold, and the workpiece removal device includes: The main body of the device is moved out, and the formed workpiece supported by the workpiece placement portion of the plastic packaging mold and the excess resin supported by the glue sleeve block are separated, and the molded workpiece and the excess resin are separated. Resin move out; The surplus resin recovery part is provided in the body of the carry-out device, and keeps the surplus resin remaining on the rubber inlet sleeve block; and The workpiece recovery part is provided in the carrying-out device body to maintain the state of the formed workpiece, and moves on the side of the excess resin recovery part so as to be able to approach or move away, After the workpiece recovery part holds the formed workpiece from the workpiece placement part and the excess resin recovery part retains the excess resin, the workpiece recovery part is far away from each other so as not to be in contact with the rubber feeding sleeve block At the disturbed position, move the shaped workpiece out. The workpiece unloading device according to claim 6, wherein: The workpiece recovery part holds and carries out a pair of workpieces from the workpiece mounting parts provided on both sides of the glue-in sleeve block. A resin molding device includes the workpiece carrying out device according to Claim 6 or Claim 7. A plastic sealing mold is characterized in that a workpiece and plastic sealing resin are supplied between the opened molds through a workpiece carrying device, and the plastic sealing mold includes: The first mold, the cavity concave portion and the resin connected to the cavity concave portion are covered with a release film; and The second mold has a rubber inlet sleeve block and an insert, the rubber inlet sleeve block includes a rubber inlet sleeve for putting the plastic encapsulation resin, and the insert is provided on both sides of the rubber inlet sleeve block A workpiece placement part that positions and places the workpiece carried in by the workpiece carry-in device, The glue-in sleeve block is always energized in a direction away from the clamping surface of the second mold, and for the workpiece positioned by the workpiece carrying device and placed on the workpiece mounting portion, the A mold, the glue feeding sleeve block is pressed down by the first mold to straddle the end of the workpiece, and the workpiece is clamped between the glue feeding sleeve block and the insert. The plastic packaging mold according to claim 9, wherein: In one of the molds, auxiliary pins that are urged toward the workpiece are provided so as to be able to touch the substrate surface other than the resin sealing area of the workpiece via the release film by opening the mold. The plastic packaging mold according to claim 9 or claim 10, wherein: The workpiece mounting portion is provided with positioning pins at a plurality of locations, and the positioning pins are fitted with a plurality of positioning holes provided in the workpiece to perform positioning. The plastic packaging mold according to claim 9 or claim 10, wherein: The workpiece placement portion is provided with a plurality of support pins that protrude from the second mold surface to support the workpiece when the mold is opened, and are retracted from the workpiece placement portion into the second mold as the mold is closed, The workpiece is placed on the workpiece placing portion. The plastic packaging mold according to claim 9 or claim 10, wherein: The workpiece placement part is provided with an avoidance groove to avoid interference with the opening and closing claws holding the workpiece when the workpiece before the forming is carried in or the workpiece after the forming is carried out. The plastic packaging mold according to claim 9 or claim 10, wherein: The first mold includes a pair of cavity recesses connected by a resin path, and the second mold includes a pair of inserts on both sides of the glue sleeve block, and the pair of inserts has a function for positioning and placing a workpiece The workpiece placement department. A resin molding device, comprising the plastic molding mold according to any one of Claim 9 to 14.

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