CN112309898A - Resin plastic package mould - Google Patents

Abstract

The invention provides a resin mold which can perform resin molding without damage even if a workpiece is heated from the resin mold and becomes a warped state. A resin mold (10) carries in and resin-molds a workpiece (W) that holds an electronic component (Wb) on a base material (Wa) together with a molding resin (R), and is provided with: and a workpiece position specifying unit (50) that specifies an allowable outer edge position of the workpiece (W) when the workpiece (W) is set in the resin mold (10), wherein the workpiece position specifying unit (50) is provided so as to be movable outward along the mold surface upon receiving a predetermined force when the workpiece (W) is deformed during mold clamping.

Description

Resin plastic package mould

Technical Field

The invention relates to a resin plastic package mold for resin plastic package (resin molded) of a workpiece (work).

Background

In order to improve the production efficiency of semiconductor devices with the miniaturization and thinning of electronic devices, a method for manufacturing a semiconductor device has been proposed, in which: semiconductor chips and the like are attached to a carrier plate (carrier plate), resin-molded, and then cut into individual pieces. For example, a semiconductor chip or the like is attached to a carrier board using a tape and resin-molded. Then, the carrier sheet and the tape are peeled off, and then electrode-molded or polished to produce individual pieces, thereby producing semiconductor devices (see patent document 1: Japanese patent laid-open No. 2006-287235).

[ Prior art documents ]

[ patent document ]

[ patent document 1] Japanese patent application laid-open No. 2006-287235

Disclosure of Invention

[ problems to be solved by the invention ]

However, in the method for manufacturing a semiconductor device as exemplified in patent document 1, when a workpiece holding electronic components such as semiconductor chips on a base material such as a carrier board is carried into a resin mold heated up and resin-molded, the following cases are not rare: due to a difference in linear expansion coefficient between the front and back surfaces of the workpiece, the workpiece is heated from the die and is warped such that, for example, the outer edge portion is separated from the die surface.

When resin molding is performed while maintaining this state, when the resin mold is clamped, the workpiece is clamped by the mold to correct the warpage of the workpiece, and the outer edge portion is deformed so as to extend outward. In this case, the outer edge portion of the workpiece is pressed against the positioning member due to the deformation of the workpiece, and the workpiece is damaged.

[ means for solving problems ]

In view of the above circumstances, an object of the present invention is to provide a resin mold capable of resin molding without causing damage even to a workpiece which is heated from the resin mold and thus warped.

The present invention solves the above problems by the following solution means described as an embodiment.

The resin mold according to the present invention is a resin mold for carrying in and resin-molding a workpiece holding an electronic component on a base material together with a mold resin, and is characterized by comprising a workpiece position specifying part for specifying an allowable outer edge position of the workpiece when the workpiece is set in the resin mold, the workpiece position specifying part being provided so as to be movable outward along a mold surface upon receiving a predetermined force when the workpiece is deformed when the mold is closed.

Thus, when the workpiece is set, the workpiece position specifying unit can specify the allowable outer edge position of the workpiece. Further, the workpiece position regulation portion can be moved along the die surface by a force that corrects the warpage of the workpiece and deforms the outer edge portion so as to extend outward at the time of clamping. Therefore, even if the outer edge portion of the workpiece is deformed so as to extend outward in a state of being in contact with the workpiece position regulation portion, the workpiece can be prevented from being damaged by the reaction force received from the workpiece position regulation portion.

Preferably, the workpiece position specifying portion has a protruding portion that is provided so as to protrude from the die surface, and the predetermined biasing force has a value set to: namely: the work position specifying portion is immovable by a force of contact when the work is set in the resin mold, and is movable by a force of elongation when the work, which is set in the resin mold in a state of being warped by preheating, is warped by correction at the time of mold clamping. Thus, the workpiece can be positioned in the predetermined region without moving the protruding portion outward when the workpiece is set. Further, when the warping of the workpiece is corrected at the time of mold clamping and the outer edge portion is deformed so as to extend outward, the protruding portion can be moved outward, and thus the breakage of the workpiece can be prevented.

Further, it is preferable that the protruding portion is supported so as to be movable outward along the mold surface by rotating or sliding via a biasing member. This makes it possible to realize a projection that moves outward along the die surface upon receiving a predetermined biasing force when the workpiece is deformed during mold clamping.

Preferably, the workpiece position specifying unit is provided so as to be movable from the mold surface in a direction of entering the mold during mold clamping. This makes it possible to retract the workpiece position specifying portion into the mold during mold clamping.

Preferably, the workpiece position specifying portion is provided in a lower die, and the lower die has a suction mechanism for sucking and holding a lower surface of the workpiece. This makes it possible to reliably suck and hold the workpiece at the predetermined position of the lower mold during mold clamping.

[ Effect of the invention ]

According to the present invention, resin molding can be performed without causing damage even when a workpiece is heated from a resin molding die and thus warped.

Drawings

Fig. 1 is a device configuration diagram showing an example of a resin molding device including a resin molding die according to an embodiment of the present invention.

Fig. 2 is a schematic view (front cross-sectional view) showing an example of a resin mold according to an embodiment of the present invention.

Fig. 3 is a schematic view (plan view) showing an example of a lower mold of the resin mold of fig. 1.

Fig. 4 is a schematic view (plan view) showing another example of a lower mold of the resin mold of fig. 1.

Fig. 5 is an enlarged view showing an example of a workpiece position specifying portion of the resin mold of fig. 1.

Fig. 6 is an enlarged view showing another example of the workpiece position specifying portion of the resin mold of fig. 1.

Fig. 7 is a schematic view (plan view) showing an example of a lower mold of a resin mold according to a comparative example, and is an explanatory view for explaining a problem to be solved by the present invention.

Description of the symbols

10: resin plastic package mould

12: lower die

12a, 14 a: mold surface (parting surface)

14: upper die

14b, 14c, 46: suction path

16: die cavity

22: lower plate

24: upper plate

26: mold cavity insert

28: die clamper

28 a: through hole

32: a first force applying member

34: sealing member

36: die cavity plate

40: suction mechanism

50: workpiece position specifying part

52: nose (Pin)

54: third force application member

56: second force application member

100: resin plastic packaging device

100A: workpiece/resin supply part

100B: pressurization part

100C: formed product storage part

100D: conveying part

102. 118: material storage device

104. 114: placing table

106: dispenser

110: pressure device

112: film supply mechanism

122. 124: loading device

126: guide part

F: release film

R: plastic-sealed resin

W: workpiece

Wa: base material

Wb: electronic component

And (Wp): molded article

V is position

Detailed Description

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Fig. 1 is a schematic diagram showing an example of a configuration of a resin molding apparatus 100 including a resin molding die 10 according to an embodiment of the present invention. Fig. 2 is a front cross-sectional view (schematic view) showing an example of the resin mold 10 according to the embodiment of the present invention. For convenience of explanation, the vertical, horizontal, and front-rear directions of the resin molding apparatus 100 and the resin molding die 10 may be described by arrows indicated in the drawings. In all the drawings for describing the embodiments, members having the same functions are denoted by the same reference numerals, and redundant description thereof may be omitted.

The resin mold 10 of the present embodiment is a mold used for a resin mold (not shown) for resin molding a workpiece (article to be molded) W with a mold resin (sometimes simply referred to as "resin") R. Here, a case where a compression molding apparatus is used as an example of the resin molding apparatus will be described.

First, as an example of the workpiece W to be molded, a workpiece holding an electronic component Wb such as a semiconductor chip on a base material Wa such as a carrier can be used. Such a workpiece W is used in, for example, a resin sealing method called embedded chip-scale ball grid array (eWLB). Specifically, for example, the following works can be used: a work having a plurality of semiconductor chips Wb is attached in a matrix on a circular metal (Stainless Steel, SUS) carrier Wa having a diameter of 12 inches (about 300mm) and the same size as the semiconductor chips by using a thermal peeling tape (not shown). The carrier plate Wa may have a rectangular shape. The work W is not limited to the above configuration, and a work in which the semiconductor chip Wb is attached to a carrier Wa made of glass or the like with another adhesive may be used. Further, the workpiece may be a rectangular workpiece W having a side of 500mm or more.

Here, the adhesive tape is a thermal release tape having thermal foaming properties, and has a property that adhesiveness is reduced by heating. Therefore, the following advantages are provided: by heating after resin molding, only the base material Wa can be easily peeled from the resin molded body obtained by molding the electronic component Wb.

On the other hand, the molding resin R is, for example, a thermosetting resin (for example, an epoxy resin containing a filler), and may be in a liquid, powder, sheet, or pellet form, or may be in a solid form represented by a tablet (mini tablet).

Next, an outline of the resin molding apparatus 100 of the present embodiment will be described. As shown in fig. 1, the resin molding apparatus 100 includes: a workpiece/resin supply unit 100A for supplying a workpiece W and a mold resin R; a pressurization part 100B for resin plastic packaging of the workpiece W; a molded article storage section 100C that stores a molded article Wp molded with resin; and a conveying unit 100D for conveying the workpiece W (including the mold resin R) and the molded product Wp. Further, a preheating section (not shown) may be provided as needed.

First, the workpiece/resin supply section 100A includes a stocker (stocker)102, and the stocker 102 accommodates a cassette (magazine) in which the workpieces W are stored. The workpiece W is taken out from each cassette and placed on the mounting table 104.

The workpiece/resin supply unit 100A includes a dispenser 106, and the dispenser 106 supplies the mold resin R to the workpiece W mounted on the mounting table 104. The workpiece W on which the mold resin R is mounted is transferred to the pressing section 100B by a loader (loader)122 of the conveying section 100D.

Next, the pressing unit 100B includes a pressing device 110, and the pressing device 110 opens and closes the heated resin mold 10 to clamp the workpiece W and perform resin molding. The pressing device 110 includes a conventional mold clamping mechanism that pushes the resin mold 10 in the mold opening/closing direction, a film supply mechanism 112 that supplies a release film (release film) F to the mold surface of the resin mold 10, and the like. The molded article Wp after resin molding is transferred from the loader 124 of the conveyor 100D to the molded article storage 100C.

Next, the molded article storage section 100C includes a mounting table 114, and the mounting table 114 mounts the resin-molded article Wp. The molded articles Wp placed on the mounting table 114 by the loader 124 are stored in a storage cassette and then sequentially stored in the stocker 118.

As described above, the conveying unit 100D includes the loader 122 that carries the workpiece W into the pressing unit 100B, and the loader 124 that carries the molded article Wp out of the pressing unit 100B.

Here, the workpiece/resin supply unit 100A, the pressing unit 100B, and the molded article storage unit 100C are configured by connecting the unitized stands to each other. Guide portions 126 are provided on the back side of each unit, and the guide portions 126 are assembled to be linearly connected to each other, thereby forming a guide rail. The loader 122 and the loader 124 are provided so as to be linearly movable forward and backward along the guide rail from predetermined positions on the guide portion 126 toward the workpiece/resin supply portion 100A, the pressing portion 100B, and the molded article storage portion 100C.

Therefore, by changing the configuration of the unit, the configuration of the resin molding apparatus 100 can be changed while maintaining the state in which the guide portions 126 are coupled to each other. The example shown in fig. 1 is an example in which two sets of the pressurizing portions 100B are provided, but a configuration of one set or three or more sets may be adopted. The configuration of the workpiece/resin supply section 100A, the molded article storage section 100C, the conveying section 100D, and the like may be changed as needed.

Next, the structure of the resin mold 10 will be described with reference to fig. 2 and the like.

The resin mold 10 includes a pair of molds (for example, a plurality of mold blocks made of alloy tool steel) having a cavity and opening and closing the molds. In the present embodiment, one of the pair of dies on the lower side in the vertical direction is set as a lower die 12, and the other die on the upper side is set as an upper die 14. The resin mold 10 is closed and opened by moving a lower mold 12 and an upper mold 14 toward and away from each other. Therefore, the vertical direction is also the mold opening and closing direction.

The resin mold 10 is opened and closed by a conventional mold opening and closing mechanism (not shown). For example, the mold opening and closing mechanism includes a pair of platens (tension), a plurality of tie bars (tie bars) for mounting the pair of platens, a drive source (for example, an electric motor) for moving (raising and lowering) the platens, a drive transmission mechanism (for example, toggle links), and the like (not shown). Here, the resin mold 10 is disposed between a pair of press plates of the mold opening and closing mechanism. In the present embodiment, the lower die 12 serving as a fixed die is assembled to a fixed platen (a platen fixed to a tie rod), and the upper die 14 serving as a movable die is assembled to a movable platen (a platen that moves up and down along the tie rod). However, without being limited to the above configuration, the lower die 12 may be a movable die and the upper die 14 may be a fixed die, or both the lower die 12 and the upper die 14 may be movable dies.

First, the upper mold 14 of the resin mold 10 will be specifically described. The upper mold 14 includes an upper plate 24, a cavity piece 26, a clamp 28, and the like, and is configured by assembling these components.

The cavity piece 26 is fixedly assembled to the lower surface (the surface on the lower die 12 side) of the upper plate 24. The mold clamp 28 is configured in an annular shape so as to surround the cavity piece 26, and is assembled adjacent to the cavity piece 26 and apart from the lower surface of the upper plate 24.

In the present embodiment, upper mold 14 has cavity 16 recessed from mold surface (parting surface) 14a, but cavity piece 26 forms the inside (bottom) of cavity 16, and clamp 28 forms the side of cavity 16. Specifically, a through hole 28a having a circular shape in a die parting plane view (a plan view) is formed in a central portion of the die clamper 28 in a thickness direction (a die opening and closing direction). The cavity pieces 26 are inserted into the through holes 28a of the mold clamper 28 and assembled, thereby forming the bottom and side surfaces of the cavity 16 having a concave shape. The lower surface of the cavity 16 is surrounded by the workpiece W mounted on the lower die 12.

Here, the cavity 16 communicates with a decompression device (not shown) via an exhaust groove (not shown) formed in the mold surface 14a on the lower surface of the clamp 28 of the upper mold 14. The entire resin mold 10 may be placed in a decompression chamber (not shown) and decompressed, or the following configuration may be adopted: suction holes (not shown) leading to the exhaust grooves of the mold surface 14a are provided, and a full-circumference seal (not shown) is provided outside the suction holes of the mold surface 14 a. According to the above configuration, the pressure reducing device is driven to reduce the pressure, whereby the inside of the cavity 16 can be degassed in a clamped state. Further, as an example of the pressure reducing means, an existing vacuum pump or the like can be used.

The resin mold 10 includes a film suction mechanism that sucks the release film (sometimes simply referred to as "film") F from the mold surface 14a side of the upper mold 14. The film suction mechanism communicates with a pressure reducing device (not shown) through a suction passage 14b and a suction passage 14c disposed through the die clamper 28. Specifically, the suction passages 14b and 14c have one end connected to the die surface 14a of the upper die 14 and the other end connected to a decompression device disposed outside the upper die 14. According to the above configuration, the pressure reducing device can be driven to suck the release film F from the suction path 14b and the suction path 14c, and the release film F is sucked and held (adhered) to the mold surface 14a including the inner surface of the cavity 16. As an example of the pressure reducing means, an existing vacuum pump or the like can be used as described above.

By providing the release film F in this manner, the molded article (work W) can be easily peeled from the resin by covering the mold surface 14a of the upper mold 14 including the inner surface of the cavity 16 with the release film F, and thus can be easily taken out of the resin mold 10. For example, the release film F is a film material having heat resistance that can withstand the heating temperature of the resin mold 10, is easily peeled from the resin, and has flexibility and stretchability. Specifically, for example, a resin film such as Polytetrafluoroethylene (PTFE) or Ethylene-Tetrafluoroethylene copolymer (ETFE) (Polytetrafluoroethylene polymer) can be used.

The resin mold 10 includes a first biasing member (e.g., a spring such as a coil spring, or an elastic body such as rubber) 32 as a movable member (elastic member). The first force application member 32 is provided between the upper plate 24 and the die clamper 28. The die clamper 28 is movably assembled to the upper plate 24 via the first force application member 32. That is, the cavity piece 26 is surrounded by the clamp 28, and the cavity piece 26 and the clamp 28 are reciprocally movable in the mold opening and closing direction. At this time, the clearance between the inner peripheral surface of the through-hole 28a of the die holder 28 and the outer peripheral surface of the cavity piece 26 is secured to a predetermined dimension, so that the die holder 28 can move smoothly. In this way, in the resin mold 10, the cavity member 26 is fixedly held with respect to the upper plate 24, while the clamp 28 is movably held via the first biasing member 32 so as to be spaced apart therefrom.

The gap is included in the suction path 14c of the film suction mechanism, and the release film F is sucked in the boundary between the cavity piece 26 and the clip 28 (corner portion of the cavity 16). Thus, the film attraction mechanism includes the seal member 34 (e.g., O-ring). The sealing member 34 is provided between the cavity insert 26 and (the upper portion of) the clamp 28 to seal the gap so as not to cause air leakage by using the gap as the suction path 14 c.

The upper mold 14 includes a heater (e.g., an electric heater), an auxiliary heater (e.g., an electric heater), a temperature sensor, a control unit, a power supply, and the like (all not shown), and performs heating and control thereof. For example, the heater of the upper mold 14 is built in the upper plate 24 of the upper mold 14, and mainly heats the entire upper mold 14. The auxiliary heater is incorporated in the die clamper 28, and assists heating of the die clamper 28 in which heat transfer from the heater of the upper die 14 is difficult. The heaters and auxiliary heaters of the upper die 14 are supplied with electric power by a power supply, and emit heat. For example, the upper mold 14 is heated to a predetermined temperature (for example, 180 ℃) by a heater or an auxiliary heater. As another example, a lower mold frame may be provided below the lower mold 12, an upper mold frame may be provided above the upper mold 14, and a heater may be provided in the mold frame, without providing a heater (not shown) in the upper plate 24, the cavity member 26, and the clamp 28.

Next, the lower mold 12 of the resin mold 10 will be specifically described. The lower die 12 includes a lower plate 22, a cavity plate 36, and the like, and these members are assembled. Here, fig. 3 is a plan view (schematic view) showing an example of the lower die 12 used in a case where the workpiece W (base material Wa) has a circular shape, and fig. 4 is a plan view (schematic view) showing an example of the lower die 12 used in a case where the workpiece W (base material Wa) has a rectangular shape. As described above, the configuration of the lower die 12 and the configuration of the corresponding upper die 14 can be appropriately set according to the size and shape of the workpiece W (particularly, the base material Wa and the like).

In the lower mold 12, a cavity plate 36 is used instead of the fixed cavity piece 26 and the movable clamp 28 provided on the upper plate 24 of the upper mold 14 described above. The cavity plate 36 is fixedly assembled with respect to the upper surface (the surface on the upper die 14 side) of the lower plate 22.

The lower mold 12 includes a heater (e.g., an electric heater), a temperature sensor, a control unit, a power supply, and the like (all not shown) and performs heating and control. For example, the heater of the lower mold 12 is built in the lower plate 22 of the lower mold 12, and mainly heats the entire lower mold 12. The heater of the lower mold 12 receives power supply from a power supply, and releases heat. For example, the lower mold 12 is heated to a predetermined temperature (for example, 180 ℃) by a heater. As described above, the heater may be provided in the lower mold frame, and the heater may not be provided in the cavity plate 36 and the lower plate 22. In this case, since the heater is not provided in the resin mold 10, there is an advantage that the resin mold 10 can be easily replaced at the time of product replacement.

Here, the lower mold 12 of the resin mold of the comparative example is shown in fig. 7 (a view at the same position as the V portion in fig. 2), and the problem to be solved by the present invention will be described with reference to this drawing. When the workpiece W is set on the lower die 12, heat is received from the heated lower die 12 (or other component) as described above, causing the face of the workpiece W that faces the die (i.e., the lower face of the workpiece W) to be relatively greatly elongated compared to the face that does not face the die (i.e., the upper face of the workpiece W). Therefore, although the lower surface of the workpiece W (base material Wa) and the surface of the die surface 12a of the lower die 12 are designed to be in close contact with each other, actually, due to the influence of the heat (difference in linear expansion coefficient, etc.), as shown in fig. 7, the outer edge portion of the workpiece W (base material Wa) may be warped so as to be separated from the die surface 12a (a state called a "smile curve"). Elongation of the workpiece W that may cause such a phenomenon may cause a problem that breakage of the base material Wa may occur (details will be described later). Here, the influence of the above problem is particularly large for a large-sized workpiece W whose side exceeds 500 mm.

As shown in fig. 5, the lower die 12 according to the present embodiment, which can solve the above-described problems, includes: a workpiece position specifying unit 50 for specifying an allowable outer edge position of the workpiece W when the workpiece W is set; and a suction mechanism 40 for suction-holding the lower surface of the workpiece W.

First, the suction mechanism 40 includes: the suction passage 46 is disposed through the cavity plate 36 and the lower plate 22. A plurality of suction passages 46 are provided at appropriate positions, and each of the suction passages communicates with a pressure reducing device (not shown). Thus, the work W can be sucked and held on the die surface (parting surface) 12a of the lower die 12 by driving the decompression device to cause the suction force to act from the suction passage 46. Further, as an example of the pressure reducing means, an existing vacuum pump or the like can be used.

Next, the workpiece position specifying unit 50 includes: the protruding portion 52 is provided upright so as to protrude upward from a die surface (parting surface) 12a of the lower die 12. In the present embodiment, the protrusion 52 is configured as a rod-shaped pin, but is not limited thereto, and a plate, block, or the like (not shown) may be used. The pins 52 are arranged so as to surround the outer edge so as to restrict the movement of the workpiece W, and a plurality of pins 52 are provided, and the arrangement interval of the pins 52 is set to a dimension obtained by adding a predetermined tolerance to the dimension of the corresponding position of the workpiece W. Thereby, the work W can be smoothly set through the gap. When the workpiece W is set, the outer edge of the workpiece W is brought into contact with the pin 52, whereby the allowable outer edge position of the workpiece W is defined, and the workpiece W is arranged in a predetermined region.

Here, the pin 52 is fixed to the lower die 12 in an upwardly biased state by a second biasing member (e.g., a spring such as a coil spring, an elastic body such as rubber) 56 that generates a biasing force. Thus, when the mold is closed, the tip of the pin 52 abuts against the mold surface 14a of the upper mold 14 and is pushed downward, so that the entire pin 52 can retreat (move) from the mold surface 12a in a direction of entering (being pulled into) the mold (the lower mold 12). Therefore, the mold can be clamped without providing a recess or the like corresponding to the pin 52, and resin molding can be performed. At this time, the molding may be performed without deformation of the release film F due to press-fitting of the pin 52, for example.

The workpiece position specifying unit 50 includes a third biasing member (e.g., a spring such as a coil spring, an elastic body such as rubber, etc.) 54, and the third biasing member 54 biases the pin 52 in a direction approaching (contacting) the outer edge of the workpiece W. This allows the pin 52 to be held at a predetermined position that defines the allowable outer edge position of the workpiece W. On the other hand, when a force exceeding the biasing force (set to a "predetermined biasing force" described later) applied by the third biasing member 54 acts, the pin 52 can be moved outward along the die surface 12 a.

At this time, the biasing force applied to the pin 52 by the third biasing member 54 is set to a value of "predetermined biasing force". More specifically, the "predetermined force" is a force whose value is set to: the pin 52 is immovable by a force of contact when the workpiece W is set in the resin mold (here, the lower mold 12), and the pin 52 is movable by a force of deformation such that the outer edge portion is extended outward by correcting warpage of the workpiece W set in the resin mold (here, the lower mold 12) in a state of warpage due to preheating. That is, the urging force of the pin 52 is set to: the force applied to the pins 52 through the workpiece W is greater than when the workpiece W is held and conveyed by the loader 122 with a predetermined margin and set in the mold, and is less than the force that does not generate relief due to linear expansion of the workpiece W.

If the pin 52 is configured not to move outward along the die surface, there is no portion where the outer edge of the workpiece W abuts against the pin 52 and then escapes, and stress (compressive force) acts on the outer edge portion. Therefore, the following problems may occur: when the kind of the base material Wa constituting the work W is, for example, a glass carrier, breakage occurs, and when the kind is a stainless steel carrier, deformation occurs. When the work W is set on the lower die 12, the suction mechanism 40 is used to suck and hold the lower surface of the work W (here, the base material Wa), and therefore the phenomenon of breakage of the base material Wa occurs more remarkably.

In contrast, according to the configuration of the present embodiment, at the time of mold clamping, warpage is corrected and the workpiece W is deformed to extend, and a "predetermined biasing force" is generated. As a result, the following effects can be obtained: the outer edge portion of the workpiece W moves the pin 52 outward along the die surface by the above-described "predetermined urging force". Thus, the solution of the problem can be achieved. Further, the work W may be positioned by the pin 52.

As an example, as shown in fig. 5 (an enlarged view of a V portion in fig. 2), the pin 52 is supported by the lower die 12 in such a manner that: in a state of being urged by the third urging member 54, it is movable outward along the die surface by rotational movement.

Alternatively, as a modification, as shown in fig. 6 (a view at the same position as the V portion in fig. 2), the pin 52 may be configured to be supported by the lower die 12 in such a manner that: in a state of being urged by the third urging member 54, it is movable outward along the die surface by a sliding movement.

Although the description has been given by taking an example of a configuration in which the workpiece W is placed on the lower die 12, the present invention is not limited to this, and may be applied to a configuration in which the workpiece W is placed on the upper die 14. In this case, the lower die 12 and the upper die 14 may be replaced with each other, and further, it is preferable to provide a gripper or the like in the upper die 14 in order to reliably hold the workpiece W (not shown).

As described above, according to the resin mold of the present invention, when the workpiece is set in the resin mold, the workpiece can be positioned at the predetermined position by including the workpiece position specifying portion. On the other hand, for a workpiece that is warped due to heat received from the resin mold, the following can be prevented: when the warpage is corrected and the workpiece is deformed to extend at the time of mold clamping, the workpiece receives a reaction force from the workpiece position regulation portion and is damaged.

The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. In particular, if the pin is configured to be able to escape outward, the second biasing member does not necessarily need to be provided. In this case, the recess into which the pin can be inserted may be provided on the upper die side. With this configuration, the workpiece can be prevented from being damaged.

The workpiece is described by taking an example of a configuration in which a semiconductor chip is mounted on a base material, but the workpiece is not limited to this. For example, resin molding can be similarly performed even for a workpiece on which a member to be mounted such as another substrate is used instead of a base material, or a workpiece on which a member to be mounted such as another element is used instead of a semiconductor chip. Further, although the effect is large as the work is large, the work may be damaged even if the work is not necessarily large as 500mm on one side, and therefore, the same configuration may be adopted for a work of a normal size such as a so-called strip substrate.

Further, the resin mold package of the compression molding system including the cavity in the upper mold is described as an example, but the present invention is also applicable to a configuration including the cavity in the lower mold, a transfer molding system, and the like.

Claims (5)

1. A resin mold for resin molding, wherein a work piece having an electronic component held on a base material is carried in together with a mold resin and resin molding is performed, the resin mold comprising:

a workpiece position specifying unit that specifies an allowable outer edge position of the workpiece when the workpiece is set in the resin mold,

the workpiece position specifying unit is provided so as to be movable outward along the die surface upon receiving a predetermined urging force when the workpiece is deformed during die clamping.

2. The resin mold according to claim 1, wherein,

the workpiece position specifying section includes: a protrusion portion provided upright so as to protrude from the mold surface,

with respect to the predetermined force, the value of the force is set to: the workpiece position specifying portion is immovable by a force of contact when the workpiece is set in the resin mold, and is movable by a force of elongation when the workpiece set in the resin mold in a state of being warped by preheating is corrected in warping at the time of mold clamping.

3. The resin mold according to claim 2, wherein,

the protruding portion is supported so as to be movable outward along the mold surface by rotating or sliding via a biasing member.

4. The resin mold according to any one of claims 1 to 3,

the workpiece position specifying unit is provided so as to be movable from the mold surface in a direction of entering the mold during mold clamping.

5. The resin mold according to any one of claims 1 to 3,

the workpiece position specifying part is provided on the lower die,

the lower die has: and a suction mechanism for sucking and holding the lower surface of the workpiece.

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