JP2021020383A - Resin mold - Google Patents

Abstract

To provide a resin mold capable of performing resin molding without causing breakage in a work even at a warped state caused by heat reception from the resin mold.SOLUTION: A resin mold 10 according to the present invention is a resin mold for carrying in a work W holding an electronic component Wb on a base material Wa together with a mold resin R to perform resin molding, and comprises a work position specifying part 50 for specifying an allowable outer edge position of the work W when the work W is set in the resin mold 10, in which the work position specifying part 50 is provided so as to be movable outward along a mold surface by receiving a predetermined action force when the work W is deformed when the mold is closed.SELECTED DRAWING: Figure 2

Description

The present invention relates to a resin mold mold for resin molding a work.

Along with the miniaturization and thinning of electronic devices, a method for manufacturing a semiconductor device has been proposed in which a semiconductor chip or the like is attached to a carrier plate, resin-molded, and then cut into individual pieces in order to improve the production efficiency of the semiconductor device. As an example, a semiconductor chip or the like is attached to the carrier plate using an adhesive tape and resin-molded. After that, the carrier plate and the adhesive tape are peeled off, and then electrode molding and polishing are performed to separate them into individual pieces to manufacture a semiconductor device (see Patent Document 1: Japanese Patent Application Laid-Open No. 2006-287235).

Japanese Unexamined Patent Publication No. 2006-287235

However, in the method for manufacturing a semiconductor device as exemplified in Patent Document 1, a work in which an electronic component such as a semiconductor chip is held on a base material such as a carrier plate is carried into a heated resin mold. When resin molding is performed, for example, the outer edge of the work is warped so as to be separated from the mold surface due to heat reception from the mold due to the difference in linear expansion coefficient between the front and back of the work. There are not a few.

If the resin mold is performed in such a state, the work is sandwiched between the molds when the resin mold mold is closed, and the warp of the work is corrected so that the outer edge portion extends outward. Deform. At this time, there is a problem of damage to the work caused by the outer edge of the work being pressed against the positioning member due to the deformation of the work.

The present invention has been made in view of the above circumstances, and a resin mold mold capable of performing resin molding without causing damage even if the work is in a warped state due to heat reception from the resin mold mold. The purpose is to provide.

The present invention solves the above-mentioned problems by means of a solution as described below as an embodiment.

The resin mold mold according to the present invention is a resin mold mold in which a work in which electronic parts are held on a base material is carried in together with a mold resin and resin-molded, and the work is set in the resin mold mold. At that time, it has a work position defining portion that defines an allowable outer edge position of the work, and the work positioning portion receives a predetermined acting force when the work is deformed at the time of closing the mold and is along the mold surface. It is a requirement that it be provided so that it can be moved outward.

According to this, when setting the work, the allowable outer edge position of the work can be specified by providing the work position defining portion. Further, the work position defining portion can be moved along the mold surface by a force that deforms the outer edge portion so as to extend outward by correcting the warp of the work when the mold is closed. Therefore, even if the outer edge of the work is deformed so as to extend outward while in contact with the work position defining portion, it is possible to prevent the work from being damaged by receiving a reaction force from the work positioning portion. it can.

Further, the work position defining portion has a protruding portion erected so as to project from the mold surface, and the predetermined acting force comes into contact with the work when the work is set in the resin mold mold. The value of the acting force so that the work set in the resin mold mold in a state of being warped by preheating can be moved by a force that deforms so that the warp is corrected and stretched when the mold is closed. Is preferably set. According to this, when setting the work, it is possible to position the work within a predetermined area without the protruding portion moving outward. At the same time, when the warp of the work is corrected when the mold is closed and the outer edge is deformed so as to extend outward, the protruding part can be moved outward, so that the work can be prevented from being damaged. it can.

Further, it is preferable that the protruding portion is supported so as to be movable outward along the mold surface by rotation or sliding via an urging member. According to this, it is possible to realize a protruding portion that moves outward along the mold surface by receiving a predetermined acting force when the work is deformed when the mold is closed.

Further, it is preferable that the work position defining portion is provided so as to be movable in a direction of entering the mold from the mold surface when the mold is closed. According to this, when the mold is closed, the work position defining portion can be retracted in the mold.

Further, it is preferable that the work position defining portion is provided on the lower mold, and the lower mold has a suction mechanism for sucking and holding the lower surface of the work. According to this, the work can be reliably sucked and held at a predetermined position of the lower mold when the mold is closed.

According to the present invention, it is possible to perform resin molding without causing damage even if the work is in a warped state due to heat reception from the resin mold.

It is a device block diagram which shows the example of the resin molding apparatus provided with the resin molding die which concerns on embodiment of this invention. It is the schematic (front sectional view) which shows the example of the resin mold mold which concerns on embodiment of this invention. It is the schematic (plan view) which shows the example of the lower mold of the resin mold mold of FIG. It is a schematic (plan view) which shows another example of the lower mold of the resin mold mold of FIG. It is an enlarged view which shows the example of the work position definition part of the resin mold mold of FIG. It is an enlarged view which shows another example of the work position definition part of the resin mold mold of FIG. It is a schematic view (plan view) which shows the example of the lower mold of the resin mold mold which concerns on a comparative example, and is explanatory drawing for demonstrating the problem to be solved by this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic view showing a configuration example of a resin molding device 100 including a resin molding mold 10 according to an embodiment of the present invention. Further, FIG. 2 is a front sectional view (schematic view) showing an example of the resin mold mold 10 according to the embodiment of the present invention. Here, for convenience of explanation, the vertical, horizontal, front-back directions of the resin molding device 100 and the resin mold mold 10 may be described by the arrows displayed in each drawing. In all the drawings for explaining each embodiment, members having the same function may be designated by the same reference numerals, and the repeated description thereof may be omitted.

The resin mold mold 10 according to the present embodiment is used in a resin molding apparatus (not shown) that performs resin molding of a work (object to be molded) W with a mold resin (sometimes simply referred to as “resin”) R. It is a mold. Here, the case of a compression molding apparatus as the resin molding apparatus will be described as an example.

First, as an example of the work W to be molded, an electronic component Wb such as a semiconductor chip held on a base material Wa such as a carrier plate is used. Such a work W is used, for example, in a resin sealing method called eWLB (embedded Wafer Level BGA). Specifically, for example, a plurality of adhesive tapes (not shown) having heat peelability are used on a carrier plate Wa made of a round metal (SUS or the like) having a diameter of 12 inches (about 300 mm), which is the same size as a semiconductor wafer. The semiconductor chips Wb of the above are attached in a matrix. The carrier plate Wa may have a rectangular shape. Further, the work W is not limited to the above configuration, and a carrier plate Wa made of glass or the like to which the semiconductor chip Wb is attached by another adhesive may be used. Further, the size may be a rectangular work W having a side of 500 mm or more.

Here, the adhesive tape is a heat-release tape having heat foaming property, and has a property that the adhesiveness is lowered by heating. Therefore, there is an advantage that only the base material Wa can be easily peeled off from the resin molded body in which the electronic component Wb is molded by heating after the resin molding.

On the other hand, the mold resin R is, for example, a thermosetting resin (for example, an epoxy resin containing a filler), and its state is typified by liquid, powder, sheet, granule, and in some cases, a mini tablet. It may be solid.

Subsequently, an outline of the resin molding device 100 according to the present embodiment will be described. As shown in FIG. 1, the resin molding apparatus 100 houses a work / resin supply unit 100A for supplying the work W and the mold resin R, a press unit 100B for resin-molding the work W, and a molded product Wp after resin molding. It is configured to include a product storage unit 100C and a transport unit 100D for transporting the work W (including the mold resin R) and the molded product Wp. If necessary, a preheating unit (not shown) or the like may be provided.

First, the work / resin supply unit 100A includes a stocker 102 that houses a magazine containing the work W. The work W is taken out from each magazine and placed on the set table 104.

Further, the work / resin supply unit 100A includes a dispenser 106 that supplies the mold resin R to the work W placed on the set table 104. The work W on which the mold resin R is mounted is transferred to the press unit 100B by the loader 122 of the transport unit 100D.

Next, the press unit 100B includes a press device 110 that drives the temperature-raised resin mold 10 to open and close to clamp the work W and mold the work W. The press device 110 includes a known mold clamping mechanism that pushes the resin mold mold 10 in the mold opening / closing direction, a film supply mechanism 112 that supplies the release film F to the mold surface of the resin mold mold 10, and the like. .. The molded product Wp after the resin molding is transferred to the molded product storage unit 100C by the loader 124 of the transport unit 100D.

Next, the molded product storage unit 100C includes a set stand 114 on which the molded product Wp after resin molding is placed. The molded product Wp placed on the set table 114 by the loader 124 is stored in a magazine for storage, and then sequentially stored in the stocker 118.

As described above, the transport unit 100D includes a loader 122 that carries the work W into the press unit 100B and a loader 124 that carries out the molded product Wp from the press unit 100B.

Here, the work / resin supply unit 100A, the press unit 100B, and the molded product storage unit 100C have a configuration in which unitized pedestals are connected to each other. Guide portions 126 are provided on the back side of each unit, and guide rails are formed by assembling the guide portions 126 so as to linearly connect them to each other. The loader 122 and the loader 124 are respectively provided so as to be able to move forward and backward linearly from a predetermined position on the guide portion 126 toward the work / resin supply portion 100A, the press portion 100B, and the molded product storage portion 100C along the guide rail. There is.

Therefore, by changing the configuration of the unit, it is possible to change the configuration mode of the resin molding device 100 while maintaining the state in which the guide portions 126 are connected to each other. The example shown in FIG. 1 is an example in which two sets of press units 100B are provided, but one set or three or more sets may be configured. Further, the configuration mode of the work / resin supply unit 100A, the molded product storage unit 100C, the transport unit 100D, and the like can be changed by increasing or decreasing as necessary.

Subsequently, the configuration of the resin mold mold 10 will be described with reference to FIG. 2 and the like.

The resin mold mold 10 includes a pair of molds having a cavity and opening and closing the mold (for example, one in which a plurality of mold blocks made of alloy tool steel are assembled). In the present embodiment, of the pair of molds, one mold on the lower side in the vertical direction is the lower mold 12, and the other mold on the upper side is the upper mold 14. In the resin mold mold 10, the lower mold 12 and the upper mold 14 approach and separate from each other to close and open the mold. Therefore, the vertical direction is also the mold opening / closing direction.

Further, the resin mold mold 10 is opened and closed by a known mold opening / closing mechanism (not shown). For example, the mold opening / closing mechanism includes a pair of platens, a plurality of tie bars on which the pair of platens are erected, a drive source (for example, an electric motor) for moving (elevating) the platens, a drive transmission mechanism (for example, a toggle link), and the like. (Neither is shown). Here, the resin mold mold 10 is arranged between a pair of platens of the mold opening / closing mechanism. In the present embodiment, the lower mold 12 to be a fixed mold is assembled to a fixed platen (a platen fixed to a tie bar), and the upper mold 14 to be a movable mold is assembled to a movable platen (a platen that moves up and down along the tie bar). ing. However, the present invention is not limited to this configuration, and the lower mold 12 may be a movable type and the upper mold 14 may be a fixed type, or both the lower mold 12 and the upper mold 14 may be a movable type.

First, the upper mold 14 of the resin mold mold 10 will be specifically described. The upper mold 14 includes an upper plate 24, a cavity piece 26, a clamper 28, and the like, and is configured by assembling these.

The cavity piece 26 is fixedly assembled to the lower surface of the upper plate 24 (the surface on the lower mold 12 side). Further, the clamper 28 is configured in an annular shape so as to surround the cavity piece 26, and is assembled adjacent to the cavity piece 26 and separated from the lower surface of the upper plate 24.

In the present embodiment, the upper mold 14 has a cavity 16 recessed from the mold surface (parting surface) 14a, but the cavity piece 26 constitutes the inner portion (bottom portion) of the cavity 16 and the clamper 28 is on the side of the cavity 16. Make up the part. Specifically, a parting plane view (plan view) circular through hole 28a is formed in the central portion of the clamper 28 in the thickness direction (mold opening / closing direction). By inserting the cavity piece 26 into the through hole 28a of the clamper 28 and assembling it, the bottom surface and the side surface of the concave cavity 16 are formed. The lower surface of the cavity 16 is surrounded by the work W mounted on the lower mold 12.

Here, the cavity 16 communicates with the decompression device (not shown) via an air vent groove (not shown) formed on the mold surface 14a on the lower surface of the clamper 28 of the upper mold 14. The entire resin mold mold 10 may be placed in a decompression chamber (not shown) to reduce the pressure, or a suction hole (not shown) leading to an air vent groove on the mold surface 14a is provided to further suck the mold surface 14a. A structure may be provided in which a seal (not shown) is provided on the outside of the hole. According to this configuration, the inside of the cavity 16 can be degassed in a closed state by driving the decompression device to reduce the pressure. As an example of the decompression device, a known vacuum pump or the like is used.

Further, the resin mold mold 10 includes a film suction mechanism that sucks the release film (sometimes referred to simply as “film”) F from the mold surface 14a side of the upper mold 14. This film suction mechanism communicates with a decompression device (not shown) via suction paths 14b and 14c arranged so as to penetrate the clamper 28. Specifically, one end of the suction paths 14b and 14c is connected to the mold surface 14a of the upper mold 14, and the other end is connected to a decompression device arranged outside the upper mold 14. According to this configuration, the decompression device is driven to suck the release film F from the suction paths 14b and 14c, and the release film F is sucked and held (attached) to the mold surface 14a including the inner surface of the cavity 16. Can be done. Similar to the above, a known vacuum pump or the like is used as an example of the decompression device.

By providing the release film F that covers the mold surface 14a of the upper mold 14 including the inner surface of the cavity 16 in this way, the molded product (work W) can be easily separated from the resin, and thus the resin mold mold. It can be easily removed from 10. As an example, the release film F is a film material having heat resistance that can withstand the heating temperature of the resin mold mold 10, easily peeling from the resin, and having flexibility and extensibility. Specifically, for example, a resin film such as PTFE (polytetrafluoroethylene) or ETFE (polytetrafluoroethylene polymer) can be used.

Further, the resin mold mold 10 includes a first urging member (for example, a spring such as a coil spring, an elastic body such as rubber) 32 as a movable member (elastic member). The first urging member 32 is provided between the upper plate 24 and the clamper 28. The clamper 28 is movably assembled to the upper plate 24 via the first urging member 32. That is, the cavity piece 26 is surrounded by the clamper 28, and the cavity piece 26 and the clamper 28 can reciprocate relatively in the mold opening / closing direction. At this time, the clamper 28 moves smoothly because the gap between the inner peripheral surface of the through hole 28a of the clamper 28 and the outer peripheral surface of the cavity piece 26 is secured with a predetermined size. As described above, in the resin mold mold 10, the cavity piece 26 is fixedly held to the upper plate 24, while the clamper 28 is separated and held via the first urging member 32 so as to move. To.

By the way, the above gap is included in the suction path 14c of the film suction mechanism described above, and the release film F is sucked at the boundary between the cavity piece 26 and the clamper 28 (corner portion of the cavity 16). Therefore, the film suction mechanism includes a sealing member 34 (for example, an O-ring). The seal member 34 is provided between the cavity piece 26 and the clamper 28 (upper part) so that the above gap serves as a suction path 14c so that air does not leak, and seals the member 34.

Further, the upper mold 14 is provided with a heater (for example, an electric heater), an auxiliary heater (for example, an electric heater), a temperature sensor, a control unit, a power supply, and the like (all not shown), and heating and control thereof are performed. As an example, the heater of the upper mold 14 is built in the upper plate 24 of the upper mold 14, and mainly applies heat to the entire upper mold 14. Further, the auxiliary heater is built in the clamper 28, and auxiliary heat is applied to the clamper 28 in which the heat from the heater of the upper die 14 is difficult to be transferred. The heater and auxiliary heater of the upper mold 14 receive electric power from a power source to generate heat. As an example, the upper die 14 is adjusted to a predetermined temperature (for example, 180 ° C.) by a heater and an auxiliary heater and heated. As another example, a lower mold base is provided under the lower mold 12, an upper mold base is provided on the upper mold 14, a heater is provided in the mold base, and the upper plate 24, the cavity piece 26, and the clamper 28 are provided. May not be provided with a heater (not shown).

Next, the lower mold 12 of the resin mold mold 10 will be specifically described. The lower mold 12 includes a lower plate 22, a cavity plate 36, and the like, and is configured by assembling these. Here, FIG. 3 is a plan view (schematic view) showing an example of the lower mold 12 used when the work W (base material Wa) has a circular shape, and FIG. 4 is a plan view (schematic view) showing the work W (base material Wa). Is a plan view (schematic view) showing an example of the lower mold 12 used when is rectangular. In this way, the configuration of the lower mold 12 and the configuration of the upper mold 14 corresponding thereto are appropriately set according to the size and shape of the work W (particularly the base material Wa or the like).

In the lower mold 12, the cavity plate 36 is used instead of the fixed cavity piece 26 and the movable clamper 28 provided on the upper plate 24 of the upper mold 14 described above. The cavity plate 36 is fixedly assembled to the upper surface of the lower plate 22 (the surface on the upper mold 14 side).

Further, the lower mold 12 is provided with a heater (for example, an electric heater), a temperature sensor, a control unit, a power supply, and the like (all not shown), and heating and control thereof are performed. As an example, the heater of the lower mold 12 is built in the lower plate 22 of the lower mold 12 and mainly applies heat to the entire lower mold 12. The heater of the lower mold 12 receives electric power from a power source and generates heat. As an example, the lower mold 12 is adjusted to a predetermined temperature (for example, 180 ° C.) by a heater and heated. As described above, the heater may be provided in the lower mold base, and the cavity plate 36 and the lower plate 22 may not be provided with the heater. In this case, since the resin mold mold 10 is not provided with a heater, there is an advantage that the resin mold mold 10 can be easily replaced when the product type is replaced.

Here, FIG. 7 (a diagram at the same position as the V portion in FIG. 2) shows the lower mold 12 of the resin mold mold according to the comparative example, and the problem to be solved by the present invention will be described using the same diagram. To do. When the work W is set in the lower mold 12, the surface of the work W facing the mold (that is, the work W) due to the heat received from the lower mold 12 (or other configuration) heated as described above. The lower surface) extends relatively larger than the surface that does not face the mold (that is, the upper surface of the work W). Therefore, in design, the lower surface of the work W (base material Wa) and the mold surface 12a of the lower mold 12 are arranged in close contact with each other, but in reality, the influence of the above heat reception (linear expansion coefficient). As shown in FIG. 7, the outer edge of the work W (base material Wa) is warped so as to be separated from the mold surface 12a (so-called “smile curve”). There is. Due to the elongation of the work W that can cause such a phenomenon, a problem that the base material Wa is damaged (details will be described later) may occur. Here, in a large-sized work W having a side exceeding 500 mm, the influence of this problem becomes particularly large.

As shown in FIG. 5, the lower mold 12 according to the present embodiment, which makes it possible to solve this problem, has a work position defining portion 50 that defines an allowable outer edge position of the work W and a work when the work W is set. It is configured to include a suction mechanism 40 that sucks and holds the lower surface of W.

First, the suction mechanism 40 is configured to include a suction path 46 arranged so as to penetrate the cavity plate 36 and the lower plate 22. A plurality of the suction passages 46 are arranged at appropriate positions and communicate with a decompression device (not shown). According to this, the work W can be attracted to and held on the mold surface (parting surface) 12a of the lower mold 12 by driving the decompression device and applying a suction force from the suction path 46. As an example of the decompression device, a known vacuum pump or the like is used.

Next, the work position defining portion 50 is configured to include a protruding portion 52 erected so as to project upward from the mold surface (parting surface) 12a of the lower mold 12. In the present embodiment, the protruding portion 52 is configured as a rod-shaped pin, but the present invention is not limited to this, and a configuration such as a plate or a block may be used (not shown). A plurality of the pins 52 are provided so as to surround the outer edge so that the movement of the work W can be regulated, and the arrangement intervals thereof are set to the dimensions of the corresponding positions in the work W plus a predetermined tolerance. There is. According to this, the work W can be set smoothly by the gap. Further, when the work W is set, the outer edge of the work W is brought into contact with the work W, so that the allowable outer edge position of the work W is defined, and the work W is arranged in a predetermined area.

Here, the pin 52 is fixed to the lower mold 12 in a state of being urged upward by a second urging member (for example, a spring such as a coil spring, an elastic body such as rubber) 56 that generates an urging force. .. According to this, when the mold is closed, the tip of the pin 52 comes into contact with the mold surface 14a of the upper mold 14 and is pushed downward, so that the entire pin 52 is formed on the mold surface 12a rather than the mold surface 12a. It is possible to evacuate (move) in the direction of entering (pulling in) the inside (inside the lower mold 12). Therefore, the mold can be closed without providing a recess or the like corresponding to the pin 52, and the resin mold can be performed. In this case, molding is possible without causing distortion of the release film F due to, for example, pushing the pin 52.

Further, the work position defining portion 50 uses a third urging member (for example, a spring such as a coil spring, an elastic body such as rubber) 54 that urges the pin 52 in a direction of approaching (contacting) the outer edge of the work W. Have. According to this, the pin 52 can be held at a predetermined position that defines the allowable outer edge position of the work W. On the other hand, when a force exceeding the urging force (set to a "predetermined acting force" described later) by the third urging member 54 acts, the pin 52 is moved outward along the mold surface 12a. Can be made to.

At this time, the urging force that the third urging member 54 urges the pin 52 is set to the value of "predetermined acting force". More specifically, the "predetermined acting force" cannot be moved by the contact force when the work W is set in the resin mold mold (here, the lower mold 12), and the resin is warped by preheating. The value of the work W set in the mold mold (here, the lower mold 12) is set so that the work W can be moved by a force that deforms the outer edge so as to extend outward by correcting the warp when the mold is closed. It is set. That is, the urging force of the pin 52 is larger than the force applied to the pin 52 via the work W when the loader 122 gives a predetermined play and conveys the work W while holding the work W and sets the work W in the mold. , It will be set to be smaller than the force without escape generated by the linear expansion of the work W.

If the pin 52 is configured so as not to move outward along the mold surface, there is no portion where the outer edge of the work W escapes from the contact with the pin 52, and stress (compressive force) acts on the outer edge portion. .. Therefore, there may be a problem that the type of the base material Wa constituting the work W is cracked in the glass carrier and distorted in the stainless carrier, for example. Such a phenomenon that the base material Wa is damaged is a configuration in which the lower surface of the work W (here, the base material Wa) is sucked and held by using the suction mechanism 40 when the work W is set on the lower mold 12. As a result, it occurs more prominently.

On the other hand, according to the above-described configuration according to the present embodiment, when the mold is closed, the work W generates a "predetermined acting force" by correcting the warp and deforming so as to extend. As a result, the outer edge portion of the work W has an action of moving the pin 52 outward along the mold surface with the "predetermined acting force". Therefore, it is possible to solve the above problems. The work W can also be positioned by the pin 52.

As an example, as shown in FIG. 5 (enlarged view of the V portion in FIG. 2), the pin 52 is moved outward along the mold surface by rotational movement while being urged by the third urging member 54. It is configured to be supported by the lower mold 12 so that it can be moved.

Alternatively, as a modification, as shown in FIG. 6 (the figure at the same position as the V portion in FIG. 2), the pin 52 is urged by the third urging member 54 and is slid to the mold surface. It may be configured to be supported by the lower mold 12 so that it can move outward along the above.

Up to this point, the configuration in which the work W is set in the lower mold 12 has been described as an example, but the present invention is not limited to this, and the configuration can be applied to a configuration in which the work W is set in the upper mold 14. In that case, the lower die 12 and the upper die 14 may be interchanged with each other, and further, a chucking claw or the like may be provided on the upper die 14 in order to ensure the holding of the work W. Not shown).

As described above, according to the resin mold mold according to the present invention, when the work is set in the resin mold mold, it can be positioned at a predetermined position by providing the work position defining portion. On the other hand, even for a work that is in a warped state due to heat reception from the resin mold, the work exerts a reaction force from the work position defining portion when the warp is corrected when the mold is closed and the work is deformed to stretch. It is possible to prevent it from being damaged by receiving it.

The present invention is not limited to the examples described above, and various modifications can be made without departing from the present invention. In particular, the second urging member does not necessarily have to be provided as long as the pin can escape to the outside. In this case, a recess into which the pin can be inserted may be provided on the upper mold side. This configuration also prevents damage to the work.

Further, the configuration in which the semiconductor chip is mounted on the base material as the work has been described as an example, but the present invention is not limited to this. For example, a work using another substrate or the like instead of a base material as a mounted member, or a work using another element or the like instead of a semiconductor chip as a mounted member can be similarly resin-molded. .. Further, the larger the work is, the greater the influence is, but since the work may be damaged even if it is not necessarily a large work such as 500 mm on a side, the same configuration is adopted for a work of a normal size such as a so-called strip substrate. Can be done.

Further, although the compression molding type resin molding apparatus having a cavity in the upper mold has been described as an example, it can be applied to a configuration having a cavity in the lower mold, an application to a transfer molding method, and the like.

10 Resin mold mold 12 Lower mold 14 Upper mold 16 Cavity 22 Lower plate 24 Upper plate 26 Cavity piece 28 Clamper 32 First urging member 36 Cavity plate 40 Suction mechanism 46 Suction path 50 Work position defining part 52 Protruding part (pin)
54 Third urging member 56 Second urging member 100 Resin molding device F Release film R Mold resin W Work Wa Base material Wb Electronic component

Further, it is preferable that the work position defining portion is provided so as to be movable in a direction of entering the mold from the mold surface when the mold is closed. According to this, when the mold is closed, thereby removing all work position defining part in the mold.

Here, the pin 52 is fixed to the lower mold 12 in a state of being urged upward by a second urging member (for example, a spring such as a coil spring, an elastic body such as rubber) 56 that generates an urging force. .. According to this, when the mold is closed, the tip of the pin 52 comes into contact with the mold surface 14a of the upper mold 14 and is pushed downward, so that the entire pin 52 is the mold surface 12a rather than the mold surface 12a. enters the inner (the lower die 12) (drawn as) withdrawal direction avoided (mobile) can become. Therefore, the mold can be closed without providing a recess or the like corresponding to the pin 52, and the resin mold can be performed. In this case, molding is possible without causing distortion of the release film F due to, for example, pushing the pin 52.

Claims (5)

It is a resin mold mold that carries in a workpiece with electronic components held on a base material together with a mold resin and molds it with resin.
When the work is set in the resin mold, it has a work position defining portion that defines an allowable outer edge position of the work.
The resin mold mold is characterized in that the work position defining portion is provided so as to be movable outward along the mold surface by receiving a predetermined acting force when the work is deformed when the mold is closed. .. The work position defining portion has a protruding portion erected so as to project from the mold surface.
The predetermined acting force cannot be moved by a contact force when the work is set in the resin mold mold, and when the work set in the resin mold mold in a warped state due to preheating is closed. The resin mold mold according to claim 1, wherein the value of the acting force is set so that the warp is corrected and the resin mold can be moved by a force that deforms to stretch. The resin mold mold according to claim 2, wherein the protruding portion is supported so as to be movable outward along the mold surface by rotation or sliding via an urging member. The resin according to any one of claims 1 to 3, wherein the work position defining portion is provided so as to be movable in a direction of entering the mold from the mold surface when the mold is closed. Mold mold. The work position defining portion is provided on a lower mold, and the lower mold has a suction mechanism for sucking and holding the lower surface of the work, according to any one of claims 1 to 4. Resin mold mold.

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