JPH09186183A - Semiconductor sealing metallic mold die and semiconductor sealing device having this mold die and semiconductor device resin sealing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mold a lead frame assembly efficiently suppressing the generation of burs by using a small-sized semiconductor-sealing metallic mold die. SOLUTION: A lead frame assembly 7 is molded with a mold die 20, by outsertion-molding resin 5 for sealing a semiconductor chip 2 mounted on a lead frame 10 having a cull section 17 and a runner section 18 formed on the same surface. The mold die 20 has upper and lower mold members 22, 21, and is provided with a material resin supply mechanism 29 for supplying material resin 8 to the cavity, an ejecting mechanism 32 for ejecting the molded lead frame assembly 7, and a mold tightening mechanism for tightening and self-holding the upper and lower mold members 22, 21. This mold 20 is carried and circulated intermittently at every molding process, in a molding device. In the molding device, drive mechanisms for the material resin supply mechanism and the ejecting mechanism, and a heating mechanism for the mold 20 are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor encapsulating mold device for outsert-molding encapsulating resin for encapsulating a semiconductor chip with respect to a semiconductor device lead frame on which a semiconductor chip is mounted and wired. The present invention relates to a semiconductor encapsulating device using a stopping die device and a method for molding resin for encapsulating a semiconductor device.

[0002]

2. Description of the Related Art Generally, a semiconductor device 1, as shown in FIG. 1, has a semiconductor chip 2 on which predetermined circuits and the like are integrated and mounted on a conductive metal thin plate, and leads formed on the metal thin plate. It is configured such that it is electrically connected to the terminal group 3 and sealed with a sealing resin 5 made of a thermosetting synthetic resin such as an epoxy resin. The lead terminal group 3 has one end extending to the outer peripheral portion of the semiconductor chip 2 and the other end protruding and exposed from the encapsulating resin 5 to form the connection terminal piece 4. The semiconductor device 1 includes a sealing resin 5
A positioning index 6 for displaying the mounting position and the like, a specification display not shown, and the like are provided on the surface of the. The positioning index 6, the specification display, and the like are formed by a semiconductor-sealing mold device, for example, during insert molding of the encapsulating resin 5.

For manufacturing the above-described semiconductor device 1, FIG.
A strip-shaped lead frame 200 is used by using the conductive metal thin plate shown in FIG. This lead frame 200 employs a so-called multi-cavity configuration in order to improve production efficiency, and a plurality of chip mounting portions 201 on which the semiconductor chips 2 are mounted are arranged at predetermined intervals in the longitudinal direction. It is provided by. Chip mounting part 2
In 01, for example, an opening for accommodating and storing the semiconductor chip 2 is formed in the central portion thereof, and a large number of lead terminal portions 202 whose one end extends to the peripheral portion of the opening are formed in respective regions. ing.

Further, the lead frame 200 is formed with a conveyance guide portion 203 along both side edges in the width direction. This conveyance guide section 203 has a large number of perforations 204A, 204B opened at regular intervals.
It is constituted by. Therefore, the lead frame 200 is transported by the transport means (not shown) while being positioned by the transport guide portion 203, and the mounting process of the semiconductor chip 2 and the wiring by the wire bonding method or the like between the semiconductor chip 2 and the lead terminal group 3 are performed. The semiconductor device 1 is continuously manufactured by performing a process, a resin encapsulation process of encapsulating the semiconductor chip 2 with a thermosetting synthetic resin using a semiconductor encapsulation mold device, a process of cutting the outer peripheral lead portion, and the like. To do.

In the manufacture of the semiconductor device 1, a pair of the first lead frames 200A are generally used together with the above-mentioned structure for taking a large number of lead frames 200 in order to improve production efficiency.
The second lead frame 200B and the second lead frame 200B are in parallel with each other, and are simultaneously transported by the transporting means through the above-described steps. Note that FIG. 39 shows a schematic configuration diagram of the resin encapsulation process, and a semiconductor encapsulating mold device arranged across the first lead frame 200A and the second lead frame 200B is not shown. Omitted. The semiconductor encapsulating mold device is composed of a pair of upper and lower mold members that are moved toward and away from each other, and the first lead frame 20 is provided between the facing surfaces.
0A and the second lead frame 200B are passed through, and cavities for outsert-molding the encapsulating resin 5 for encapsulating the semiconductor chip 2 mounted and filled with the material resin are formed.

The semiconductor encapsulating mold device is also provided with a first lead frame 200A and a second lead frame 200B.
And a material resin supply section is disposed on the lower mold member side between the two. The material resin supply unit is provided with a heating means, and an extruding member is movably arranged on the bottom surface. A material resin such as a tablet-shaped epoxy resin is loaded in the material resin supply unit.

In the semiconductor encapsulating mold device, the material resin supply portion 207, the runner portion, and the cavity are heated to 175 ° C., which is the melting temperature of the material resin 211, by heating means.
The temperature is controlled to some extent. The material resin 211 is brought into a molten state with low viscosity by being pressurized and heated in the material resin supply unit 207.

The semiconductor encapsulation mold device is provided with a runner portion which extends from the material resin supply portion 207 to the first lead frame 200A and the second lead frame 200B.
Further, a gate portion is provided between the runner portion and the cavity. When the first lead frame 200A and the second lead frame 200B each having the semiconductor chip 2 mounted on the chip mounting portion 201 are conveyed, the semiconductor encapsulating mold device moves upward with respect to the lower mold member. The mold member moves and the mold clamping operation is performed. In the mold device for semiconductor encapsulation, the extruding member is operated in this mold clamped state, and the material resin 2 in the molten state is supplied from the material resin supply unit 207.
Push 11 into each runner. The material resin 211 is
The runners are filled into the cavities via the gates.

The semiconductor encapsulation mold device is configured such that the upper mold member and the lower mold member are held in a clamped state and heated for a predetermined time to cure the material resin 211, and then the lower mold member. On the other hand, the upper mold member is moved and the mold opening operation is performed. As a result, the encapsulation resin 5 for encapsulating the outer peripheral portion of the semiconductor chip 2 is outsert-molded on the lead frame 200. In the mold device for semiconductor encapsulation, the next area of the lead frame 200 is carried to the carrying position by the carrying means, and the outsert molding of the encapsulating resin 5 described above is performed.

Thereafter, the outsert molding of the encapsulating resin 5 is sequentially performed, and the encapsulating step of the plurality of semiconductor chips 2 mounted on the lead frame 200 with the encapsulating resin 5 is completed. The encapsulating resin 5 is used for the lead frame 200.
The lead terminal portion 202 formed in the above is sealed up to the vicinity of the tip portion.

The lead frame 200 is conveyed to the step of cutting the outer peripheral lead portion by the conveying means when the encapsulating process of the encapsulating resin 5 on the mounted semiconductor chip 2 is completed. The cutting of the outer peripheral lead portion is performed using, for example, an outer shape punching die. The outer shape punching die has the above-described semiconductor device 1 shown in FIG. 1 by cutting and removing the other outer peripheral portion of the lead frame 200 while leaving the tip portion of the lead terminal portion.
To complete.

In this cutting step, the gate resin portion 209 existing between the encapsulating resin 5 and the runner resin portion 208 shown in FIG. 42 is also cut. The gate resin portion 209 is located below the lead frame 200 in the area of the lead terminal portion. Gate resin part 209
When the semiconductor device 1 is left in a state of being largely projected, it becomes a great obstacle when the semiconductor device 1 is mounted on a circuit board or the like, and therefore must be precisely cut. Therefore, according to the conventional semiconductor manufacturing method, the dedicated gate cutting machine is used to cut the gate resin portion 209 from the lead frame 200.

[0013]

In the conventional outsert molding method of the encapsulating resin 5 for the lead frame 200 described above, burrs of the material resin 211 occur at various portions. As for the burr of the material resin 211, as shown in FIG. 42, a loading part burr 212 generated around the opening end of the material resin supply part 207 and a runner part guided from the material resin supply part 207 cross the lead frame 200. It is roughly classified into a transverse portion burr 213 generated in a portion or a terminal portion burr 214 generated around the lead terminal portion 202.

The loading portion burr 212 is used for the material resin supply portion 20.
It occurs when the material resin 211 protrudes and hardens at the mating surfaces of the upper mold member and the lower mold member that form No. 7. The charging portion burr 212 can be removed by air treatment or brushing treatment after insert molding.

The loading portion burr 212 does not affect the semiconductor device 1 because the lead portion of the lead frame 200 is cut and removed in the next cutting step as described above. However, when the semiconductor device 1 is manufactured by an automatic machine, the loading portion burr 212 is not preferable because it may cause the lead frame 200 to be caught or misaligned during the transportation to the next process. Further, since the loading portion burr 212 adheres in an unstable state, the loading portion burr 212 may fall off during transportation, causing a problem that the operation of the movable mechanism portion or the like is hindered.

The transverse burr 213 is formed on the lead frame 20.
It occurs when the material resin 211 guided from the material resin supply portion 207 arranged outside 0 to the cavity of the semiconductor encapsulation mold device through the runner portion protrudes and hardens at the side end portion of the lead frame 200. . That is, the lead frame 200 has its perforation 2
The guide pin is relatively engaged with 04 so that the lower mold is mounted in the lead frame mounting portion of the lower mold in a positioned state.

In the lead frame 200, the space between the center of the perforation 204 and the side end and the inner diameter of the perforation 204 are defined with a predetermined tolerance. For example, this tolerance is ± 0.05mm each
It has been. Further, in the lead frame 200, the guide pin is smoothly engaged with the perforation 204, so that an appropriate clearance is set. For example, the clearance is set to 0.01 mm.

The lead frame 200 and the lower mold member are
In addition to the above-mentioned conditions, the perforation 204 and the guide pin are configured to be engageable with each other and positioned in consideration of a processing error or an assembly error of each part. Further, the lead frame 200 and the lower mold member are configured such that the perforation 204 and the guide pin are engageable with each other and positioned in consideration of the dimensional change due to thermal expansion of the lead frame 200.

Therefore, a gap 221 is formed between the side end portion and the lead frame mounting wall in the lead frame 200 and the lower mold member. The size of this gap reaches up to 0.12 mm.

As described above, the lower mold member has a construction in which the material resin supply portion 107 is arranged outside the mounting portion of the lead frame 200. The runner part is the lead frame 20.
It is led to the cavity across zero. Therefore, the material resin 2 extruded from the material resin supply unit 207
In the runner portion, No. 11 protrudes from the gap and hardens to generate a transverse portion burr 213.

The cross-section burr 213 has no influence on the semiconductor device 1 since the lead portion of the lead frame 200 is cut and removed in the next cutting step, like the above-described loading part burr 212. However, when the semiconductor device 1 is manufactured by an automatic machine, the cross-section burr 213 causes the lead frame 20 to be transported to the next step.
It is not preferable because it causes 0 hooking, positioning failure and the like. Further, the cross-section burr 213 is formed on the lead frame 200.
Since it adheres in an unstable state, it may fall off during transportation, causing a problem that the operation of the movable mechanism part is hindered.

The terminal portion burr 214 is formed on the chip mounting portion 201.
Along the lead terminal portion punched out around the chip mounting portion 201 from the mating surface of the upper mold member and the lower mold member forming the cavity of the encapsulating resin 5 for encapsulating the semiconductor chip 2 mounted on It occurs when the protruding material resin 211 is cured. This terminal part burr 214 is
It is a thin film burr that straddles between the lead terminals.
Since it is generated in the lead frame 200, it is less affected during transportation such as the loading portion burr 212 and the traverse burr 213 described above.

That is, the lead frame 200 is generally formed by punching with a precision press using the above-mentioned thin metal plate as a material. Due to the characteristics of the press work, the lead frame 200 has a sagging portion and a burring portion on the sheared end surface, which makes it difficult to form a precise uniform surface. In addition, the lead frame 200 is bent as a whole due to a so-called springback phenomenon.

Therefore, in the conventional semiconductor encapsulation mold device, both ends of the lead frame 200 in which the sagging portion and the burring portion are generated are strongly pressed by the upper die member and the lower die member. Terminal part burr 214
Was configured to prevent the occurrence of. The mold clamping force between the upper mold member and the lower mold member is determined by a portion corresponding to the gate portion from one end of the lead frame 200 across which the runner portion traverses, and an outer peripheral portion of the cavity filled with the encapsulating resin 5.
The mold clamping force was large at the portion corresponding to the positioning portion of the encapsulating resin 5 and the other end portion of the lead frame 200. As described above, in the conventional mold device for semiconductor encapsulation, since the mold clamping force is different in each part, the structure is complicated and the adjustment of the mold clamping force is extremely troublesome.

Further, in the resin sealing device, the opening of the material resin supply portion 207 provided in the lower mold member and the main surface of the upper mold member are provided so that no gap is formed in the outer peripheral portion of the cavity in the mold clamped state. A minute gap is maintained between the and. The lead frame 200 is formed with a thickness tolerance of ± 0.01 mm. Therefore, this distance is 0.01m
It will be set to m to 0.02 mm.

As described above, in the semiconductor encapsulating mold device, the mold clamping force in the material resin supply portion 207 is substantially reduced to secure a sufficient mold clamping force in the cavity, and the outer peripheral portion of the cavity is secured. Therefore, the occurrence of the terminal portion burr 214 at the time is suppressed. In other words, in the semiconductor sealing mold device, the terminal portion burr 21
By adopting the configuration of suppressing No. 4, the above-mentioned loading portion burr 212 is inevitably generated in the opening of the material resin supply unit 207.

Thus, the conventional lead frame 200
In the outsert molding method of the encapsulating resin 5 for
Due to the configuration of the lead frame 200 and the semiconductor encapsulation mold device, burrs of the material resin 211, that is, the loading portion burrs 212, the transverse burrs 213, the terminal burrs 214, and the like inevitably occur at various portions. These burrs have caused problems such as a catching phenomenon of the lead frame 200 during transportation or the like, and obstacles to a movable part or the like due to dropping.

Further, according to the conventional outsert molding method for the encapsulating resin 5 with respect to the lead frame 200, the mold device for semiconductor encapsulation adjusts the mold clamping force partially by finishing each part with high accuracy. Is composed of
There is a problem that the manufacturing cost of this semiconductor encapsulation mold device becomes extremely high. Further, the semiconductor encapsulation device has a problem that it becomes large and expensive because a large mold clamping force is applied to the semiconductor encapsulation mold device.

Furthermore, the conventional lead frame 200
In the outsert molding method of the encapsulating resin 5 for
Lead frame 2 leaving the tip of the lead terminal portion 202
00, a lead outer shape punching die for cutting and removing the other outer peripheral portion and a dedicated gate cutting machine for cutting the gate resin portion 209 are required, and there is a problem that the entire equipment becomes large and there are many steps. It was In addition, since the gate resin portion 209 is cut in a state in which the gate mark is projected on the peripheral surface of the encapsulating resin 5, the gate mark may cause a problem of damaging the lead outer shape punching die. It was

Furthermore, the conventional lead frame 200
In the outsert molding method of the encapsulating resin 5 for
Since the material resin supply part 207 is provided outside the lead frame 200 and the material resin 211 is drawn into the cavities 205A and 206A through the runner part 224, a large amount of the material resin 211 is required and the cavity Since the filling time into 205A and 206A also becomes long, there is a problem that the molding cycle becomes long.

Further, in the conventional outsert molding method for the encapsulating resin 5 with respect to the lead frame 200, the outer shape and the like are changed according to the specifications of the semiconductor chip 2 and the semiconductor device 1 itself. There has been a problem that a lot of time is required for the setup such as the replacement of the stopping die device, the position adjustment of the conveyer such as the conveyor, or the replacement of the supply mechanism of the lead frame 200, which deteriorates the productivity. Further, since the semiconductor encapsulating mold device has a high temperature and is extremely heavy, there is a problem that not only the handling work such as replacement is troublesome but also dangerous.

Therefore, according to the present invention, in the molding die device for semiconductor encapsulation, in which the encapsulating resin is outsert-molded on the lead frame on which the semiconductor chip is mounted to form the lead frame assembly, the burrs of the material resin are generated in each part. The present invention has been proposed for the purpose of providing a semiconductor encapsulating mold device that suppresses the above-mentioned problems and rationalizes the entire process, and that achieves downsizing, cost reduction, and material resin miniaturization.

Further, according to the present invention, a rationalized process and a semiconductor encapsulating mold apparatus, which is miniaturized, reduced in cost or reduced in material resin, is cyclically conveyed corresponding to each process. The present invention has been proposed for the purpose of providing a semiconductor encapsulation device capable of efficiently producing a semiconductor device.

Further, according to the present invention, a semiconductor device is manufactured with high productivity by a streamlined process by using a resin sealing device in which the size is reduced, the cost is reduced or the amount of material resin is reduced. It has been proposed for the purpose of providing the encapsulating resin molding method of

[0035]

A semiconductor encapsulating mold apparatus according to the present invention that achieves this object is a sealing resin for mounting a semiconductor chip-mounted lead frame and encapsulating the semiconductor chip in the lead frame. And a first mold member having a first cavity forming a cavity of an encapsulating resin that is outsert molded to mold the lead frame assembly, and is detachable from the first mold member. The second mold member is arranged to face each other and has a second cavity forming a cavity of the encapsulating resin in cooperation with the first cavity.
The semiconductor encapsulation mold device is configured such that a material resin loading section in which a material resin made of a thermosetting synthetic resin is loaded and a material resin loaded in the material resin loading section and in a molten state are introduced into the cavity. Inside the first mold member, there are a material resin supply mechanism including an extruding means for supplying, and an eject mechanism having an eject pin for ejecting a lead frame assembly in which a semiconductor chip is sealed by a sealing resin from a cavity and releasing the lead frame assembly. It is provided and configured. The semiconductor encapsulating mold device is configured by providing a mold clamping holding mechanism for self-maintaining a mold clamped state on the first mold member and the second mold member.

According to the semiconductor encapsulating mold apparatus of the present invention having the above-described structure, the material resin loading section is provided in the material resin loading section when the first mold member and the second mold member are in the mold open state. Material resin is loaded and it is in a molten state inside,
Further, the lead frame having the semiconductor chip mounted thereon is mounted on the first mold member in a positioned state. In the semiconductor encapsulating mold device, the first mold member and the second mold member are clamped, and the mold clamping holding mechanism self-maintains the mold clamping state, and the material resin supply mechanism operates. Then, the material resin in a molten state is extruded from the material resin loading portion into the cavity by the extrusion means.

In the semiconductor encapsulation mold device, the mold clamping state by the mold clamping holding mechanism is self-maintained until the material resin filled in the cavity is cured, and the mold clamping holding mechanism is released to release the first metal mold. When the mold member and the second mold member are opened, the eject mechanism is driven to form the lead frame assembly outsert-molded with the encapsulating resin for encapsulating the semiconductor chip by the eject pin from the first mold member. Stick out.

The semiconductor encapsulating mold device outserts a sealing resin for sealing a semiconductor chip on a lead frame having a cull portion corresponding to a material resin supply portion in which a material resin is loaded. Since the lead frame assembly is manufactured in accordance with the present invention, the cross section of the lead frame is not formed in the runner portion connecting the material resin supply portion and the cavity, and the lead frame assembly is shortened. Therefore, the semiconductor encapsulating mold device does not generate burrs that occur in the lead frame crossing portion of the runner portion, does not require a post-process for the treatment, and cuts the outer peripheral portion and the gate by the same process. It is possible to carry out the process, rationalize the process, and reduce unnecessary material resin.

The semiconductor encapsulation mold device is supplied with one lead frame on which a semiconductor chip is mounted, so that the encapsulating resin for encapsulating the semiconductor chip is outsert-molded to form a lead frame assembly. Mold. Therefore, the mold device for semiconductor encapsulation is downsized and the handling is extremely simple, and since it is possible to carry out the transfer using the self-holding of the mold clamping state by the mold clamping holding mechanism,
The lead frame assembly is continuously manufactured by cyclically carrying a plurality of pieces by the carrying mechanism.

Further, in the semiconductor encapsulating apparatus using the semiconductor encapsulating mold apparatus according to the present invention, the lead frame on which the semiconductor chip is mounted is loaded and the encapsulating resin for encapsulating the semiconductor chip in the lead frame is out. A first mold member having a first cavity forming a cavity of the encapsulating resin for forming a lead frame assembly, which is formed by a salt molding, and faces the first mold member so as to be able to come into contact with and separate from the first mold member. A second mold member formed with a second cavity that is arranged and cooperates with the first cavity to form a cavity for the encapsulating resin, wherein the first mold member has a thermosetting property. A material resin loading section for loading a material resin made of synthetic resin, and an extrusion means for feeding the material resin loaded in the material resin loading section and in a molten state into the cavity. A material resin supply mechanism and an eject mechanism having an eject pin for ejecting a lead frame assembly in which a semiconductor chip is sealed with a sealing resin from a cavity and releasing the lead frame assembly are provided, and the first mold member and the second mold are provided. A semiconductor encapsulating mold device is used in which a mold clamping holding mechanism that self-holds a mold clamping state is provided on a mold member. The semiconductor encapsulation device drives a conveying mechanism that intermittently cyclically conveys the semiconductor encapsulation mold device in each encapsulation resin outsert molding process, and an extrusion unit of a material resin supply mechanism of the semiconductor encapsulation mold device. Then, the material resin supply drive mechanism for filling the material resin into the cavity and the outsert molding of the encapsulating resin are performed on the lead frame assembly to form the first mold member and the second mold member. And an eject drive mechanism for driving the eject mechanism to eject the lead frame assembly from the first mold member in the opened state.

Further, the semiconductor encapsulation device is provided with a first transfer guide frame and a second transfer guide frame which are vertically spaced apart from each other and are opposed to each other. The first transfer guide frame and the second transfer guide frame are provided. The first transfer space portion configured between the transfer guide frame and the second transfer guide frame constitutes a mold clamping transfer space portion in which the transfer mechanism transfers the first mold member and the second mold member in the mold clamp state. Then, the second transfer space portion formed below the first transfer guide frame constitutes a first mold opening transfer space portion for transferring the first mold member in the mold open state by the transfer mechanism. , The third transfer space part formed above the second transfer guide frame constitutes the other mold opening transfer space part for transferring the second mold member in the mold open state by the transfer mechanism. The first transfer guide frame and the second transfer guide frame are provided with heating means for heating the first mold member and the second mold member.

According to the semiconductor encapsulating apparatus using the semiconductor encapsulating mold apparatus according to the present invention configured as described above, the material resin supply mechanism and the eject mechanism of the semiconductor encapsulating mold apparatus are driven. By including the material resin supply drive mechanism and the eject drive mechanism, it is possible to reduce the size of the semiconductor encapsulation mold device, and to easily and safely handle the replacement and the like.

The semiconductor encapsulation apparatus intermittently cyclically conveys the semiconductor encapsulation mold apparatus in which the mold clamping state is held by the mold clamping holding mechanism, so that continuous production of lead frame assemblies is performed. And improve productivity.
Further, the semiconductor encapsulation apparatus uses the heating means provided on the first transfer guide frame and the second transfer guide frame to transfer the first mold member and the second mold member in the process of transferring the semiconductor encapsulating mold apparatus. By heating and holding the die member, the heating process is not required, and the manufacturing time of the lead frame assembly is shortened.

Further, in the resin molding method for semiconductor device encapsulation using the semiconductor encapsulation mold apparatus according to the present invention, a lead frame on which a semiconductor chip is mounted is loaded and a semiconductor chip is encapsulated in the lead frame. A first mold member having a first cavity forming a cavity of the encapsulating resin for molding the lead frame assembly by outsert molding the resin, and contacting with and separating from the first mold member. And a second mold member that is freely opposed to each other and cooperates with the first cavity to form a second cavity that forms a cavity for the encapsulating resin. The second mold member is formed in the first mold member. Is a material resin loading section in which a material resin made of a thermosetting synthetic resin is loaded, and the material resin loaded in the material resin loading section and in a molten state is supplied into the cavity. A first resin mold member including a material resin supply mechanism including an ejecting means, and an eject mechanism including an eject pin for ejecting a lead frame assembly in which a semiconductor chip is encapsulated by encapsulating resin from a cavity and releasing the lead frame assembly. And the second mold member is provided with a mold-sealing mold mechanism for self-holding the mold-molded state. A semiconductor device encapsulation resin molding method includes at least a resin loading step of loading a material resin into the material resin loading portion of the first mold member in a state where the semiconductor sealing mold device is opened, and a semiconductor sealing process. A lead frame mounting step of mounting a lead frame on which a semiconductor chip is mounted on a first mold member in a state where the mold stopping device is opened, and a semiconductor sealing mold device is clamped and clamped and held. A mold filling process that holds the mold clamped state by a mechanism, a resin filling process that fills the cavity with the material resin by the material resin supply mechanism, and a mold clamp holding that keeps the mold clamped state of the semiconductor sealing mold device by the clamp holding mechanism. Steps and opening of the mold device for semiconductor encapsulation, and the lead frame assembly in which the encapsulating resin is outsert-molded onto the lead frame is ejected from the first mold member. Consisting of the eject process.

The semiconductor encapsulating mold device is cyclically driven in each of the above steps to perform outsert molding of the encapsulating resin on the lead frame, so that the semiconductor device is continuously and efficiently manufactured.

In the encapsulating resin molding method for a semiconductor device using the semiconductor encapsulating mold apparatus according to the present invention, one lead frame is mounted on the semiconductor encapsulating mold apparatus, and the lead frame is attached to the lead frame. Outsert molding of encapsulating resin for encapsulating a semiconductor chip is performed through the above steps.
Individual leadframe assemblies are manufactured.

Further, in the encapsulating resin molding method for a semiconductor device using the semiconductor encapsulating mold device according to the present invention, the first conveying guide frame and the second conveying guide frame which are vertically spaced apart from each other are disposed to face each other. Of the first mold member and the second mold member in the mold clamped state by the carrier guide frame, and the first mold member in the mold open state. And a second transfer space part in the lower part where the second mold member is transferred, and a first mold opening transfer space part in the upper part where Outsert molding of encapsulating resin for encapsulating the semiconductor chip is performed on the lead frame, and the first mold member and the second mold member, which have been mold opened, are connected to the first mold opening transfer space portion and the second mold member. Patrol to the initial position of the mold clamping transfer space via the mold opening transfer space By sending, for continuous molding.

In the encapsulating resin molding method for a semiconductor device using the semiconductor encapsulating mold device, in the process of conveying the semiconductor encapsulating mold device by the conveying mechanism according to each process, the first conveying guide frame and Since the first mold member and the second mold member are heated and held by the heating means provided in the second transport guide frame, the heating step is unnecessary, the manufacturing time is shortened, and the lead frame assembly is manufactured. To manufacture.

[0049]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments of the present invention will be described in detail below with reference to the drawings. The semiconductor device 1 is manufactured through the respective manufacturing steps shown in FIG. 4 using the lead frame 10 formed of a conductive thin metal plate made of an alloy of nickel and iron as a raw material. That is, in the first lead frame manufacturing process, the lead frame 10, which will be described in detail later, is formed by subjecting a thin metal plate to precision press working. Of course, the lead frame 10
Is formed by not only precision press working but also etching working and the like. In the second semiconductor chip mounting process, the lead frame 10 formed in the first process
On the other hand, the semiconductor chip 2 on which a predetermined circuit or the like is integrated is formed.

In the third wire bonding step, a large number of lead terminal pieces 3 formed on the lead frame 10 and the connection terminals of the mounted semiconductor chip 2 are electrically connected via wires by an automatic wiring device or the like. Connected. In the fourth resin molding step, the semiconductor encapsulation device 9 that cyclically conveys a plurality of semiconductor encapsulation mold devices 20 is used.

The lead frame 10 is the semiconductor encapsulation device 9
3 are respectively supplied to the semiconductor encapsulating mold device 20 that is cyclically conveyed, and the encapsulating resin 5 that encloses the outer peripheral portion of the semiconductor chip 2 is outsert-molded by the semiconductor encapsulating mold device 20 and the lead frame shown in FIG. The assembly 7 is formed. The lead frame assembly 7 manufactures the semiconductor device 1 shown in FIG. 1 by cutting and removing the outer peripheral portion by a cutting device such as a laser cutter in the fifth lead frame cutting step.

As shown in FIG. 1, the semiconductor device 1 manufactured through the above manufacturing steps is entirely made of a sealing resin 5 made of a thermosetting synthetic resin such as an epoxy resin or a polyphenylene sulfide (PPS) resin. Along with being sealed, a large number of connecting terminal pieces 4 formed by one end of the lead terminal piece 3 are exposed and exposed on the outer peripheral portion of the sealing resin 5. The semiconductor device 1 is provided with a positioning index 6 for mounting on a circuit board or the like on the surface of the encapsulating resin 5, a specification display not shown, and the like. Encapsulation resin 5
Is formed by outsert molding the material resin 8 on the lead frame 10 by the semiconductor encapsulation mold device 20, as described later.

The lead frame 10 formed by the first lead frame manufacturing process has a substantially square shape as a whole as shown in FIG. The lead frame assembly 7 is formed by being supplied. In this lead frame 10, a chip mounting opening 11 having an opening size slightly larger than the outer size of the semiconductor chip 2 is formed in a substantially central portion, and a large number of lead terminal pieces are respectively provided in the four areas. 3 are formed by stamping in a radial pattern.
These lead terminal pieces 3 are held at a minute distance from each other, and one end of each lead terminal piece 3 faces the chip mounting opening 11 and the other end thereof extends outward.

Further, one end of these lead terminal pieces 3 facing the chip mounting opening 11 constitutes a connecting portion with the semiconductor chip 2, and the other end thereof is connected with a circuit board or the like on which the semiconductor device 1 is mounted. The terminal portion 4 is configured. The other end portions of these lead terminal pieces 3 are integrally connected via the bridge portion 12, and are separated from each other when the outer peripheral portion is cut and removed from the bridge portion 12 in the fifth lead frame cutting step. The connection terminal portion 4 is formed.

As shown by the chain line in FIG. 2, the lead frame 10 is filled with the material resin 8 in the inner peripheral region where the tip of the connecting terminal portion 4 is left by the semiconductor encapsulating mold device 20 as described later. To form the resin filling region 13 for outsert molding the encapsulating resin 5. Further, in order to precisely punch and form each lead terminal piece 3 on the lead frame 10, as shown in FIG.
A terminal forming guide portion 14 is formed by punching and is located on the outer side of 2 and has a large number of rectangular openings corresponding to the respective lead terminal pieces 3.

Further, the lead frame 10 is formed with a notch 15 for positioning at one corner of the outer periphery, and the positioning holes 16A to 16C are located at the outermost peripheral regions of the two sides sandwiching the notch 15. Have been opened respectively. These positioning notches 15 and positioning holes 16
A to 16C have a positioning action when the lead frame 10 is mounted on a semiconductor-sealed mold device 20 described later. The first positioning hole 16A is configured as a round hole. Further, the second positioning hole 16B is configured as an elliptical elongated hole so as to have an adjusting action at the time of mounting. The third positioning hole 16C is formed by a long hole continuously provided at one end of a rectangular opening parallel to the terminal forming guide portion 14 on the other side. These positioning holes 16
A to 16C not only have a positioning function when mounted in the semiconductor encapsulation mold apparatus 20 described above, but also a conveyance guide with which a guide pin or the like of a conveyance mechanism relatively engages when the lead frame 10 is conveyed between steps. Also works.

The lead frame 10 has a cull portion 17 located inside the positioning notch 15.
The cull part 17 has an annular shape corresponding to the material resin loading part 28 provided on the semiconductor encapsulation mold device 20 side when the lead frame 10 is mounted on the semiconductor encapsulation mold device 20, as described later. Is configured as an opening. The cull portion 17 is provided with a runner portion 18 which is a passage communicating with the chip mounting opening 11 in a part thereof. The runner portion 18 is configured such that the tip portion thereof is gradually narrowed toward the chip mounting opening portion 11 so that the gate portion 19 is formed.

The lead frame 1 configured as described above
0, the semiconductor chip 2 is mounted in the chip mounting opening 11 in the second semiconductor chip mounting step. In the lead frame 10, in the third wire bonding step, each lead terminal piece 3 and each terminal of the semiconductor chip 2 are electrically connected by a wire or the like. After that, the lead frame 10 is supplied to the semiconductor encapsulation mold apparatus 20 for performing the fourth encapsulating resin outsert molding step.

As shown in FIG. 5, the semiconductor encapsulation mold apparatus 20 is composed of a lower mold member 21 and an upper mold member 22. The lower mold member 21 and the upper mold member 22 can be brought into contact with and separated from each other, and constitute a cavity 23 in which main surfaces facing each other in a butted state are filled with the encapsulating resin 5. The semiconductor encapsulation mold apparatus 20 is cyclically conveyed by the semiconductor encapsulation apparatus 9 to be described later in detail to continuously manufacture the lead frame assemblies 7.

As shown in FIG. 6, the lower die member 21 has a precision smooth surface on the main surface 24 facing the upper die member 22.
On the main surface 24, a lead frame receiving portion 25 having an outer shape that is substantially equal to the outer diameter of the lead frame 10 is integrally projected. The lead frame receiving portion 25 is provided with a cavity concave portion 26 that constitutes a lower portion of the cavity 23 filled with the encapsulating resin 5. Also. In the lead frame receiving portion 25, positioning pins 27 are provided so as to protrude from the outer peripheral portion of the cavity recess 26 in correspondence with the positioning holes 16 of the lead frame 10.

The lower mold member 21 is provided with a material resin loading portion 28 (pot) corresponding to the cull portion 17 of the lead frame 10. This material resin loading section 28 is
As shown in FIG. 7, the whole penetrates the lower mold member 21, the upper portion 28A has a slightly larger diameter, and the lower portion 28C has a larger diameter again through the small-diameter portion 28B in the central portion. It is configured as a stepped circular hole.

A material resin supply mechanism 29 including a material resin extruding member 30 is provided inside the material resin loading section 28. As shown in FIG. 7, the material resin extruding member 30 forms a filling space of the material resin 8 in the material resin loading portion 28 by the normal cylinder portion 30A being located at the lowermost part of the upper large diameter portion 28A. . The material resin loading portion 28 has a tablet-shaped material resin 8 on the upper large diameter portion 28A.
Is loaded.

The material resin 8 is the heating mechanism 8 of the semiconductor encapsulation device 9 provided with this semiconductor encapsulation mold device 20 described later.
Lower mold member 21 and upper mold member 2 by 0, 87, 90
By heating 2 and 2 respectively, they are melted inside the material resin loading portion 28. In the material resin filling step, the material resin 8 is pushed up by the resin supply driving mechanism 81 of the semiconductor encapsulation device 9 as shown in FIG. It is extruded from the portion 28 into the cavity 23.

As shown in FIG. 6, the lower die member 21 has
Located in the cavity recess 26, the pair of eject holes 3
1 is provided. These eject holes 31 are shown in FIG.
As shown in, the whole penetrates the lower mold member 21,
Large diameter portions 31A and 31B are formed in the central portion and the lower portion, respectively. An eject mechanism 32 is provided inside the eject hole 31. Eject mechanism 32
Is the eject pin 33 and the eject spring 34.
It is composed of

One end of the eject pin 33 has an outer diameter substantially equal to the small diameter portion of the eject hole 31, and the other end has a flange portion 33A having substantially the same shape as the central large diameter portion 31A.
Are formed integrally with each other. The eject spring 34, the central large diameter portion 31A of the eject hole 31, and the flange portion 33A of the eject pin 33 are assembled in a slightly compressed state. Therefore, as shown in FIG. 7, the eject pin 33 is normally pushed down by the elastic force of the eject spring 34 to a position where its tip end surface is flush with the cavity recess 26.

The eject pin 33 is pushed up by the eject drive mechanism 98 of the semiconductor encapsulation device 9 as shown in FIG. 9 in the eject step described later, so that the lead frame assembly attached to the lower mold member 21 is assembled. The solid 7 is ejected to the outside.

Further, as shown in FIG. 6, the lower mold member 21 is provided with positioning recesses 35 located at the outer peripheral edges of the respective sides of the main surface 24. These positioning recesses 35 are engaged with positioning protrusions 47 formed on the upper mold member 22 when the lower mold member 21 and the upper mold member 22 are clamped, as will be described later. This ensures that both members are clamped accurately.

Further, as shown in FIG. 6, the lower mold member 21 is provided with a pair of left and right toggle mold clamping mechanisms 36 which constitute a mold clamping holding mechanism for self-maintaining the mold clamping state with the upper mold member 22. It is attached to two opposite sides. These mold clamping holding mechanisms are configured by a toggle mold clamping mechanism 36 provided on the lower mold member 21 side and an engagement pin 48 described later provided on the upper mold member 22 side. The toggle mold clamping mechanism 36 is provided on each of two opposite side surfaces of the lower mold member 21, and has one end rotatably supported by the support shafts 37A and 37B and first link levers 38A and 38B, and these first and second link levers 38A and 38B. 1
Second link levers 39A and 39B rotatably supported on the free ends of the link levers 38A and 38B, and the second link levers 39A and 39B.
The link levers 39A and 39B are formed of a connecting member 40 that connects the free ends of the link levers 39A and 39B.

As shown in FIG. 6, the first link levers 38A and 38B have arc-shaped guide protrusions 41 on their outer edges.
Engagement recesses 42A and 42B are formed through A and 41B, respectively. The connecting member 40 constitutes an operating portion that is pressed in the height direction by a front toggle mold clamping drive mechanism 92 of the semiconductor encapsulation device 9 to be described later and is pulled up by a rear toggle mold clamping drive mechanism 94. Therefore, in the toggle type tightening mechanism 36, when the connecting member 40 is pressed, the second link levers 39A and 39B swing outward, respectively, and the second link lever 39 is moved.
First link levers 38A, 38B linked with A, 39B
Also swings outward with the support shafts 37A and 37B as fulcrums.

In this state, the toggle mold clamping mechanism 36 is in a state in which the connecting member 40 is located below the neutral point and is on the lower side as shown in FIG. On the other hand, the upper mold member 22 is held in the mold clamped state. The toggle mold clamping mechanism 36 self-maintains the mold clamping state of the lower mold member 21 and the upper mold member 22 until the connecting member 40 is returned to the return motion as described later.

The lower mold member 21 configured as described above is intermittently circulated and conveyed in each step by the semiconductor encapsulation device 9 described later. The lower mold member 21 has a bottom surface portion 43 in which one end portions of the material resin loading portion 28 and the ejection hole 31 are opened as a conveyance surface. The lower mold member 21 will be described in detail later, but the semiconductor sealing device 9
The first heating mechanism 80 and the second heating mechanism 87 control the heating temperature from the bottom surface portion 43 to about 175 ° C. and configure the working surfaces of the resin supply driving mechanism 82 and the eject driving mechanism 98.

The lower die member 21 is heated by the first heating mechanism 80 and the second heating mechanism 87 to heat and melt the material resin 8 loaded in the material resin loading portion 28, and at the same time, to attach the lead frame. Heat 10. Therefore, the material resin 8 is kept in a stable state during the filling process into the cavity 23 described later.
3 into.

As shown in FIGS. 10 and 11, the upper mold member 22 is configured as a molding surface with the surface 44 facing the lower mold member 21 being a precise smooth surface, and the outer dimension thereof is a lead. It is formed to be slightly larger than the outer dimensions of the frame 10. As shown in FIG. 11, the upper mold member 22 is provided with a cavity recess 45, which constitutes the upper portion of the cavity 23 filled with the encapsulating resin 5 in the main surface 44 thereof. Further, the upper mold member 22 is provided with positioning recesses 46 corresponding to the positioning holes 16 of the lead frame 10 and the positioning pins 27 of the lower mold member 21, respectively.

As shown in FIGS. 10 and 11, the lower mold member 21 has a high height at the outer peripheral edge of each side of the main surface 44 corresponding to each positioning recess 35 of the lower mold member 21 described above. A positioning protrusion 47 protruding in the vertical direction is provided in a protruding manner. When the upper mold member 22 and the lower mold member 21 are clamped, the positioning protrusions 47 are engaged with the positioning recesses 35 of the upper mold member 22 so that both members are accurately molded. Try to be tightened.

Further, as shown in FIGS. 10 and 11, the upper die member 22 is separated in the left-right direction from the opposite side surfaces corresponding to the toggle die clamping mechanism 36 of the lower die member 21 described above. And a pair of engaging pins 47A and 47B are provided so as to project. The engagement pins 47A and 47B together with the toggle mold clamping mechanism 36 constitute a mold clamping holding mechanism that self-maintains the mold clamping state of the lower mold member 21 and the upper mold member 22.

That is, the lower mold member 21 and the upper mold member 2
2 is a direction in which the connecting member 40 of the toggle mold clamping mechanism 36 is pressed to shrink as a whole when the above-described positioning concave portion 35 and positioning convex portion 47 are engaged with each other and the mold is clamped. The guide protrusions 41A, 41B of the first link levers 38A, 38B move along the engaging pins 47A, 47B on the upper mold member 22 side by the operation. The lower mold member 21 and the upper mold member 22 are self-maintained in the mold clamping state by the engagement pins 47A and 47B reaching the bottoms of the engagement recesses 42A and 42B, respectively.

As shown in FIGS. 10 and 11, the upper mold member 22 is provided with laterally-engaged conveying engagement grooves 49 on both sides. The upper mold member 22 is cyclically conveyed through each process by the upper mold member conveying mechanism 94 of the semiconductor sealing device 9 which will be described later relatively engaging with the conveying engaging grooves 49.
In addition, the upper die member 22 has an upper surface portion 50 as a conveyance surface, and the upper surface portion 50 is moved from the upper surface portion 50 by the second heating mechanism 87 and the third heating mechanism 90 of the semiconductor sealing device 9 to about 17
The temperature is controlled by heating to 5 ° C.

The semiconductor encapsulation mold apparatus 20 configured as described above has a tablet shape inside the material resin loading section 28 in a mold open state in which the lower mold member 21 and the upper mold member 22 are separated from each other. The material resin 8 is loaded. Material resin 8
As will be described later in detail, since the lower mold member 21 is temperature-controlled to about 175 ° C. by the first heating mechanism 80 and the second heating mechanism 87 of the semiconductor sealing device 9, the material resin loading unit 28 By being pressurized and heated inside, a molten state with low viscosity is obtained.

On the lower die member 21, on its main surface 24,
The lead frame 10 on which the semiconductor chip 2 is mounted is mounted. The lead frame 10 is positioned and mounted by causing the positioning hole 16 to relatively engage with the positioning pin 25 so that the resin filling region 13 is positioned corresponding to the cavity recess 26. The cull portion 17 of the lead frame 10 is positioned corresponding to the material resin loading portion 28 of the lower mold member 21.

After that, the semiconductor encapsulation mold apparatus 20 is driven by the lower die member drive mechanism 82 and the front upper die member drive mechanism 91 of the semiconductor encapsulation apparatus 9 as described later in detail. The upper die member 22 and the upper die member 22 are joined to each other as shown in FIG. The lower mold member 21 and the upper mold member 22 are precisely assembled with each other by engaging the positioning concave portion 35 and the positioning convex portion 47 which face each other. The lead frame 10 is
When the lower mold member 21 and the upper mold member 22 are combined, the positioning pin 25 penetrating the positioning hole 16 relatively engages with the positioning recess 46,
The upper mold member 22 is also positioned.

Therefore, in the lead frame 10, the resin filling area portion 13 is positioned corresponding to the cavity concave portion 45 of the upper mold member 22, and the semiconductor encapsulating mold device 2 as a whole.
It faces the cavity 23 of 0. Further, the lead frame 10 has the cull portion 17 and the runner portion 18 in a state where the lower mold member 21 and the upper mold member 22 are clamped.
Between the lower mold member 21 and the upper mold member 22 constitutes a space portion whose periphery is sealed.

The semiconductor encapsulation mold device 20 is entirely about the melting point temperature of the material resin 8 due to the later-described first heating mechanism 80, second heating mechanism 87 and third heating mechanism 90 of the semiconductor encapsulating device 9. By controlling the temperature to 175 ° C., the tablet-shaped material resin 8 loaded in the material resin loading unit 28 is melted therein. Semiconductor sealing mold device 20
In the state shown in FIG.
Lower mold member drive mechanism 82 and front upper mold drive mechanism 91
Although the lower mold member 21 and the upper mold member 22 are clamped by means of and, as described above, the internal pressure of the cavity 23 is low, that is, a so-called low-pressure mold clamp state.

In the semiconductor encapsulation mold apparatus 20, the front die toggle die clamping drive mechanism 92 of the semiconductor encapsulation apparatus 9 presses and drives the connecting member 40, so that the toggle die clamping mechanism 36 is entirely collapsed. Driven to the state. Accordingly, the toggle mold clamping mechanism 36 is configured so that the first link lever 38
The guide protrusions 41A and 41B of A and 38B are engaged with the engaging pin 47.
A, 47B are moved and these engaging pins 47A, 4A
7B and the engagement recesses 42A and 42B are engaged with each other. As a result, in the semiconductor-sealed mold device 20, as shown in FIG. 13, the lower mold member 21 and the upper mold member 22 are firmly clamped. The lower mold member 21 and the upper mold member 22 include an engagement recess 42A, 42B and an engagement pin 47A.
Since the engaged state with 47B is maintained, the self-holding state is maintained in the mold clamping state.

In the semiconductor encapsulation mold apparatus 20, the material resin supply mechanism 29 of the semiconductor encapsulation apparatus 9 is operated by the resin supply drive mechanism 81 of the semiconductor encapsulation apparatus 9 in the above-described mold clamping state, so that the inside of the material resin loading section 28 is closed. The material resin 8 in the molten state is extruded by the material resin extruding member 30.
As shown in FIG. 8, the material resin 8 is supplied to the material resin loading unit 28 by driving the material resin extruding member 30 by the material resin supply driving mechanism 81 of the semiconductor encapsulation device 9 described later.
Is pushed out to the runner portion 18 through the cull portion 17. The material resin 8 is supplied and filled from the runner portion 18 into the cavity 23 via the gate portion 19.

The lead frame 10 is, as described above,
Since the cull portion 17 and the runner portion 18 that are located opposite to the material resin loading portion 28 of the lower mold member 21 are integrally formed in the same plane, a crossing portion is formed in the middle of a filling process of the material resin 8 described later. Without configuring the gate unit 19
It is possible to supply the material resin 8 into the cavity 23 via. The semiconductor encapsulation mold device 20 thereby forms the lead frame assembly 7 by outsert molding the encapsulating resin 5 for encapsulating the semiconductor chip 2 on the lead frame 10.

In the semiconductor encapsulating mold apparatus 20, the lower mold member 21 and the upper mold member 22 are self-maintained in the mold clamped state by the mold clamp holding mechanism including the toggle mold clamping mechanism 36 and the engaging pin 48. In this state, the semiconductor encapsulation device 9 is cyclically conveyed. The material resin 8 filled in the cavity 23 is held in a heated state by the heating mechanisms 80, 87, 90 of the semiconductor encapsulation device 9 in the lower mold member 21 and the upper mold member 22 during the carrying process. In addition, the encapsulating resin 5 corresponding to the resin-filled region portion 13 of the lead frame 10 is outsert-molded by being gradually hardened because it is held under pressure.

In the semiconductor encapsulation mold device 20, after the lead frame 10 is thus outsert-molded with the encapsulating resin 5 to form the lead frame assembly 7, a rear toggle on the semiconductor encapsulation device 9 side, which will be described later, will be described. The mold clamping drive mechanism 94 pulls up the connecting member 40 of the toggle mold clamping mechanism 36 to drive it back to the initial state. In the semiconductor encapsulation mold device 20, the toggle mold clamping mechanism 36 returns to the initial position to engage the engaging recesses 42A, 42B and the engaging pins 47A, 4A.
When the engagement state with 7B is released, the rear upper mold member drive mechanism 95 on the semiconductor sealing device 9 side, which will be described later, drives the upper mold member 22 to be pulled up and separated from the lower mold member 21. A mold opening operation is performed.

The lead frame assembly 7 formed by the semiconductor encapsulation mold apparatus 20 is attached to the lower mold member 21 side during the mold opening operation, as shown in FIG. In the semiconductor encapsulation mold device 20, as shown in FIG. 9, the eject pin 33 causes the eject spring 3 to move by the eject drive mechanism 98 on the semiconductor encapsulation device 9 side, which will be described later.
The protrusion operation is performed into the cavity 23 against the elastic force of No. 4. Therefore, the lead frame assembly 7 is ejected from the lower mold member 21 by the eject pin 33 and taken out from the lower mold member 21 by the ejecting means.

In the lead frame assembly 7, the encapsulating resin 5 is outsert-molded in the resin-filled area portion 13, and the cull portion 17 of the lead frame 10 is filled in the runner portion 18 as shown in FIG. The material resin 8 is residual cured as it is. This lead frame assembly 7
Is supplied to the next lead frame cutting step, and the semiconductor device 1 is completed by cutting and removing the outer peripheral portion of the lead terminal piece 3 by leaving the tip portion of the lead terminal piece 3 by, for example, pressing with a laser cutting machine or a punching die.

As described above, the semiconductor sealing mold device 20
Since the lead frame assembly 7 is formed by outsert molding the encapsulating resin 5 on the lead frame 10, the following operational effects are obtained. That is, in the semiconductor encapsulation mold apparatus 20, the positioning holes 16 are engaged with the positioning pins 27 of the lower mold member 21 to allow the lead frame 10 to be positioned.
Is positioned and held directly in the mold matching surface between the lower mold member 21 and the upper mold member 22, so that the lead frame 1
It is not necessary to set the tolerance in consideration of the plate thickness, processing accuracy, or dimensional change due to thermal expansion with respect to 0, and the lower mold member 21 is mounted in a precisely positioned state.

Further, since the semiconductor encapsulation mold apparatus 20 holds the lead frame 10 in its mold matching plane by the lower mold member 21 and the upper mold member 22, the lead frame 10 is held against the lead frame 10. It is sufficient to apply a uniform mold clamping force, and it is not necessary to adjust the mold clamping force, so that the structure is simplified and the mold clamping mechanism is also simplified, and the overall lead frame can be downsized. The assembly 7 eliminates the need for large tolerances with respect to the dimensions of each part of the lead frame 10 described above, and the lower mold member 21 and the upper mold member 22 hold the lead frame 10 with a uniform mold clamping force. Due to the features of the semiconductor encapsulation mold apparatus 20 such as
Molding is performed without generation of a charging portion burr in the opening of 7 and a terminal burr in the peripheral portion of the resin filling region 13.

In the semiconductor encapsulation mold apparatus 20, the cavity 23 corresponding to the encapsulating resin 5 and the cull portion 17 in which the material resin 8 is loaded are arranged in proximity to each other and the lead frame 10 is provided.
It is configured not to have a runner section that traverses. Therefore, the semiconductor encapsulation mold apparatus 20 includes the runner portion 18
The material resin 8 remaining on the runner portion 18 by shortening the
And the lead frame assembly 7 is formed in which transverse burrs are not generated. Therefore, since the lead frame assembly 7 has almost no burrs, the transfer mechanism is obstructed due to the burrs falling off during the transfer, and the deburring process is simplified.

Further, the semiconductor encapsulation mold apparatus 20 can use a thermosetting material resin having a short curing time because of the above-mentioned characteristics, and the time from filling to curing can be greatly shortened to improve productivity. To achieve.

As described later, the semiconductor encapsulation mold device 20 is provided in plural in the semiconductor encapsulation device 9 and is cyclically conveyed in each step, whereby the lead frame assembly 7 is continuously manufactured. However, it goes without saying that a simple semiconductor encapsulation device may be constructed by being constituted by an independent set, for example. In addition, the lead frame 10
For, regarding one, one semiconductor device 1 is formed,
For example, a cull part may be formed in the central part and a plurality of semiconductor manufacturing regions may be integrally formed around the cull part.

Although not described in detail, this lead frame is formed into a rectangular shape using a metal thin plate as a material, and its main surface is divided into, for example, four semiconductor manufacturing regions.
Each of these semiconductor manufacturing areas has one semiconductor device 1
Forming individual semiconductor manufacturing regions. Similar to the lead frame 10 described above, each semiconductor manufacturing region is integrally formed with a chip mounting portion on which the semiconductor chip 2 is mounted and positioned at the center thereof, and a large number of leads are provided around these chip mounting portions. The terminal piece is stamped and formed.

Further, in the lead frame, each semiconductor manufacturing region is formed with a resin filling region portion for outsert-molding the encapsulating resin 5 while leaving the tip portion of the lead terminal piece in the inner peripheral portion thereof. One material resin supply unit is opened and configured at the center of the. The material resin supply unit is provided with a runner unit that communicates with each semiconductor manufacturing region. In addition, these runners have a width gradually reduced toward each semiconductor manufacturing region, and a gate is provided at a tip end thereof.

The semiconductor device 1 is not limited to the flat package type in which the above-mentioned semiconductor chip 2 is sealed with the rectangular sealing resin 5 and a large number of connecting terminal pieces 4 are provided on the outer peripheral portion. , Connection terminal piece 4
May be a semiconductor device inserted into the lead hole and mounted on the circuit board.

A semiconductor encapsulation device 9 for molding the lead frame assembly 7 using the semiconductor encapsulation mold device 20 described above.
As shown in FIG. 14, according to the process of molding the lead frame assembly 7 from the lead frame 10 supplied to the semiconductor encapsulating mold apparatus 20, the semiconductor encapsulating mold apparatus 20 is S-1. Stations S to S-8 are disassembled into eight stations, and the semiconductor encapsulating mold apparatus 20 is intermittently cyclically conveyed. Semiconductor sealing device 9
, The takt time of each of the S-1 station to the S-8 station is set to 10 seconds. The semiconductor encapsulation device 9 processes a plurality of molding processes in each of these S-1 to S-8 stations, as described later.

In the semiconductor encapsulation device 9, one set of semiconductor encapsulation mold devices 20 is arranged in each of the S-1 station to the S-8 station, so that a total of eight semiconductor encapsulation molds are provided. A device 20 is provided. As described above, the semiconductor encapsulation mold device 20 includes one lead frame 10
Is attached and one lead frame assembly 7 is manufactured. Therefore, in the semiconductor encapsulation device 9, one lead frame assembly 7 is continuously molded in 10 seconds.

By the way, in the conventional semiconductor encapsulation device using the lead frame 100, for example, a semiconductor encapsulation mold device of 84 pieces is used, and 16 pieces (1
Two lead frame assemblies 7 are molded in 0 seconds.
Therefore, in the semiconductor encapsulation device 9, the productivity of the lead frame assembly 7 per hour is slightly lower than that of the conventional semiconductor encapsulation device. However, the semiconductor sealing device 9
Is limited because the above-mentioned compact, simple structure and easy-to-handle semiconductor encapsulation mold device 20 is provided, so that the entire device is significantly downsized and is inexpensive as will be described later. Since it is possible to install multiple units in the space and the setup work is easy, it does not require many personnel. Therefore, the semiconductor sealing device 9
With this, it is possible to substantially improve the productivity of the lead frame assembly 7 as compared with the conventional semiconductor encapsulation device.

As shown in FIG. 14, in the semiconductor encapsulation device 9, the material resin loading step S- for loading the material resin tablet 8 into the material resin loading portion 28 of the lower mold member 21 at the first station S-1. 1-1, a lead frame mounting step S-1-2 for mounting the lead frame 10 mounting the semiconductor chip 2 on the lower mold member 21, and the lower mold member 21.
And a low pressure mold clamping step S-1-3 for clamping the upper mold member 22 in a low pressure state with each other.

In the material resin loading step S-1-1, the semiconductor encapsulation mold apparatus 20 is in a mold open state in which the lower mold member 21 and the upper mold member 22 are separated from each other as shown in FIG. The tablet-shaped material resin 8 is loaded into the material resin loading portion 28 of the lower mold member 21. Lower mold member 2
In this state, 1 is preheated by each heating mechanism 80, 87, 90 provided on the semiconductor sealing device 9 side.

In the lead frame mounting step S-1-2, the semiconductor encapsulating mold apparatus 20 continues to have the lower mold member 21 and the upper mold apparatus 22 separated from each other as shown in FIG. Then, the lead frame 10 is supplied and loaded on the lower mold member 21. Lead frame 10
As described above, the positioning hole 16 and the positioning pin 27 are relatively engaged with each other, so that the positioning die 16 is mounted on the lower mold member 21 in a positioned state. The semiconductor mold device 20 heats the lead frame 10 because the lower mold member 21 is preheated by the first heating mechanism 80 and the second heating mechanism 87 which will be described in detail later.

Further, in the low-pressure mold clamping step S-1-3, the semiconductor encapsulating mold apparatus 20 further includes the lower die member driving mechanism 82 and the front upper die in the semiconductor encapsulating apparatus 9 side as shown in FIG. By pressing the bottom surface portion 43 and the top surface portion 50 by the mold member driving mechanism 91, respectively, the lower mold member 21
And the upper die member 22 are driven to approach each other and the die is clamped. The lower mold member 21 and the upper mold member 22 are precisely assembled with each other by the relative engagement of the positioning concave portion 35 and the positioning convex portion 47 as described above. Further, the lower mold member 21 and the upper mold member 22 sandwich and hold the mounted lead frame 10 between the main surfaces 24 and 44 facing each other.

The semiconductor encapsulation device 9 includes the second station S.
-2, a pre-heating step S-2-1 for transporting the lower mold member 21 and the upper mold member 22 while preheating them by respective heating mechanisms 80, 87, 90 described later, and the lower mold member 21.
Then, the upper mold member 22 and the upper mold member 22 are clamped and held by a predetermined pressure via the mold clamping mechanism, and a mold clamping / resin filling step S-2-2 of filling the material resin 8 into the cavity 23 is performed. Further, in the semiconductor sealing device 9, in the mold clamping / resin filling step S-2-2, the material resin driving mechanism 81 operates and the material resin supply mechanism 2 of the semiconductor sealing mold device 20.
9 is driven to fill the cavity 23 with the material resin 8 from the material resin loading portion 28 of the semiconductor sealing mold device 20.

In the pre-heating step S-2-1, the semiconductor encapsulating mold apparatus 20 has a lower mold member 2 as shown in FIG.
1 and the upper mold member 22 are conveyed in the low-pressure mold clamping state described above. Further, in the semiconductor encapsulation mold apparatus 20, in the die clamping / resin filling step S-2-2, the connecting member 40 of the toggle die clamping mechanism 36 is pressed by the front toggle die clamping drive mechanism 92 of the semiconductor encapsulating apparatus 9. When driven, the lower mold member 21 and the upper mold member 2 are driven as shown in FIG.
2 and the mold are clamped. Semiconductor sealing mold device 20
As described above, the lower mold is caused by the relative engagement between the engaging recess 42 provided in the first link lever 38 of the toggle mold clamping mechanism 36 and the engaging pin 48 provided in the upper mold member 22. The member 21 and the upper mold member 22 self-hold the clamped state. In the semiconductor encapsulation mold apparatus 20, the material supply drive mechanism 81 is driven in this state, and the material resin 8 loaded in the material resin loading portion 28 is filled into the cavity 23.

The semiconductor encapsulation device 9 is the third station S.
-3, heating for curing the filled material resin 8 in the cavity 23 by transporting the lower mold member 21 and the upper mold member 22 while heating by each heating mechanism 80, 87, 90 described later. The carrying step S-3-1 is performed.

In the heating and conveying step S-3-1, the semiconductor encapsulating mold apparatus 20 has an engaging recess of the first link lever 38 of the toggle mold clamping mechanism 36 which constitutes the mold clamping holding mechanism as shown in FIG. Since the 42 and the engagement pin 48 are maintained in the engaged state with each other, the lower mold member 21 and the upper mold member 2
The mold clamping state with 2 is self-maintained. Further, the semiconductor encapsulation mold device 20 includes the heating mechanisms 80 of the semiconductor encapsulation device 9,
The temperature control state of 175 ° C. is maintained and conveyed by 87 and 90.

The semiconductor encapsulation device 9 is the fourth station S.
Also in -4, the post-heating transfer step S-4-1 in which the lower mold member 21 and the upper mold member 22 are continuously transferred while being post-heated by each heating mechanism 80, 87, 90 described later is performed.

In the post-heating transfer step S-4-1, the semiconductor encapsulation mold apparatus 20 continues to use the mold clamping and holding mechanism as shown in FIG. 21 to move the lower mold member 21 and the upper mold member 22.
The mold clamping states of and are self-maintained, and post-heating is performed by the heating mechanisms 80, 87, 90 of the semiconductor sealing device 9.

The semiconductor encapsulation device 9 is the fifth station S.
Also in -5, the post-heating transfer step S-5-1 in which the lower mold member 21 and the upper mold member 22 are transferred while being post-heated by each heating mechanism 80, 87, 90 described later is performed.

In the post-heating transfer step S-5-1, the semiconductor encapsulating mold apparatus 20 continues to use the mold clamping and holding mechanism as shown in FIG. 22 to lower the upper mold member 21 and the upper mold member 22.
The mold clamping states of and are self-maintained, and post-heating is performed by the heating mechanisms 80, 87, 90 of the semiconductor sealing device 9.
The material resin 8 filled in the cavity 23 is held in the heated and pressurized state of the semiconductor encapsulation mold apparatus 20 in the above-described steps S-3-1 to S-5-1. After sufficiently cured, the lead frame 10 is outsert-molded with the encapsulating resin 5.

The semiconductor encapsulation device 9 is the sixth station S.
In -6, the semiconductor encapsulating mold apparatus 20 conveys the semiconductor encapsulating mold apparatus 20 while conveying the mold encapsulating state while holding the mold clamping state by itself. The mold clamping release step S-6-2 for driving the mold to release the mold clamp holding state and the mold opening step S-6-3 for performing the mold opening operation of the semiconductor encapsulation mold apparatus 20 are performed.

The semiconductor encapsulation mold apparatus 20 has the carrying step S-
In 6-1 as shown in FIG. 23, the lower mold member 21 and the upper mold member 22 are continuously conveyed while the mold clamping holding mechanism self-holds the mold clamping state. The semiconductor encapsulation mold apparatus 20 has the structure shown in FIG.
As shown in FIG. 4, the rear toggle mold clamping drive mechanism 94 of the semiconductor encapsulation device 9 pulls up the connecting member 40 of the toggle mold clamping mechanism 36, which constitutes the mold clamping holding mechanism, to engage the first link lever 38. The engagement state between the engagement recess 42 and the engagement pin 48 is released.

The semiconductor encapsulation mold apparatus 20 has a mold opening step S.
In -6-3, by operating the rear upper die member driving mechanism 95 of the semiconductor sealing device 9 as described above, the upper die member 22 is moved to the lower die member 21 as shown in FIG. The mold opening operation is performed by being driven to be separated. In this state, the lead frame assembly 7 in which the encapsulating resin 5 is outsert-molded on the lead frame 10 is attached to the lower mold member 21.

The semiconductor encapsulation device 9 is the seventh station S.
In -7, the carrying step S-7-1 in which the lower mold member 21 and the upper mold member 22 that have been subjected to the mold opening operation are independently carried.
And an ejecting step S-7-2 for ejecting the lead frame assembly 7 in which the encapsulating resin 5 is outsert-molded on the lead frame 10 from the lower die member 21, and the ejected lead frame assembly 7 is a lower die. The extraction step S-7-3 of extracting from the member 21 is performed.

The semiconductor encapsulation mold apparatus 20 has a carrying step S-
In 7-1, as shown in FIG. 26, the lower mold member 21 and the upper mold member 22 to which the lead frame assembly 7 is attached are the lower mold member transfer mechanism 83 and the upper mold member transfer mechanism 94.
And are transported independently of each other. In the ejecting step S-7-2 of the semiconductor encapsulating mold apparatus 20, the eject mechanism 32 is driven by the eject driving mechanism 98 of the semiconductor encapsulating apparatus 9 as shown in FIG. 27. The lead frame assembly 7 is thereby ejected from the lower mold member 21 by the eject pin 33. In the extraction step S-7-3, the semiconductor encapsulation mold apparatus 20 takes out the ejected lead frame assembly 7 from the lower mold member 21 as shown in FIG.

The semiconductor encapsulation device 9 is the eighth station S.
In -8, a conveying step S-8 for feeding the lower mold member 21 and the upper mold member 22 to the initial position by independent paths.
-1 and the material resin supply mechanism 2 of the semiconductor encapsulation mold device 20
9 and a return step S-8-2 for returning the eject mechanism 32 to the initial state.

The semiconductor encapsulation mold apparatus 20 has a carrying step S-
In 8-1, in a state where the lead frame assembly 7 is taken out from the lower mold member 21 as shown in FIG. 29, the lower mold member 21 and the upper mold member 22 are independent transfer systems in the initial position. Returned to and transported. Further, in the semiconductor encapsulating mold apparatus 20, in the returning step S-8-2, the ejecting pin 33 of the ejecting mechanism 32 returns to the initial position by the elastic force of the ejecting spring 34 as shown in FIG. Material of resin supply mechanism 29 Resin extruding member 30
Also returns to the initial position.

It is needless to say that each step of the semiconductor encapsulation device 9 described above may be appropriately changed depending on the arrangement position of each mechanism section described later and its operation specification. For example, the material resin supply mechanism 29 and the eject mechanism 32 are
Although the returning operation is performed to the initial position in the returning step S-8-2, it may be performed by the preceding step of the first station S-1.

As shown in FIGS. 31 and 34, the semiconductor encapsulation device 9 for performing the above-mentioned molding process of the lead frame assembly 7 includes a first conveyance guide frame 70 and a second conveyance guide which are installed in parallel with each other. A frame 71 and a third conveyance guide frame 72 are provided. Although not described in detail, the first transfer guide frame 70 to the third transfer guide frame 72 are held with the facing intervals by the side frames 73 and 84, respectively, and the semiconductor encapsulation mold apparatus 20 is cyclically transferred. Horizontally parallel top and bottom 3
The first transport space portion 74 to the third transport space portion 76 of the step are configured.

The first transfer space portion 74 is a lower transfer space portion formed on the first transfer guide frame 70. Specifically, as shown in FIG. 32, the lower die member 21 alone is the same. In the figure, a transport space portion is transported from the right side to the left side. In the first transport space 74, a first station 77 corresponding to the above-mentioned first station S-1 and a seventh station S7 corresponding to the above-mentioned first station S-1 are provided in the front and rear portions, respectively, as described later. And a part 78. The semiconductor encapsulation device 9 includes the first station section 77 and the seventh station section 78 between the first station section 77 and the seventh station section 78.
In the transfer space 74, the transfer step S-8-1 for the lower mold member 21 of the eighth station S-8 is performed.

The second transfer space portion 75 is a central transfer space portion formed between the second transfer guide frame 71 and the third transfer guide frame 72. Specifically, as shown in FIG. The lower mold member 21 and the upper mold member 22 that are clamped and integrated form a carrying space portion for carrying from the left side to the right side in FIG. The semiconductor sealing device 9 performs the above-described steps of the second station S-2 to the sixth station S-6 in the second transfer space 75.

The third transfer space portion 75 is a transfer space portion formed above the third transfer guide frame 72. Specifically, as shown in FIG. 32, the upper die member 22 alone is the same. In the figure, a transport space portion is transported from the right side to the left side. The semiconductor sealing device 9 performs the carrying step S-8-1 of the upper die member 22 of the eighth station S-8 in the third carrying space 75.

The semiconductor encapsulation device 9 includes the first transfer space portion 74.
And, in the second transfer space portion 75, the lower die member 22 is transferred by a transfer table which is placed in a positioned state. Although not described in detail, the transport table moves by being relatively engaged with a transport guide groove 79 provided in a first transport guide frame 70 described later. In addition, the carrier table is provided with guide grooves for each mechanism, which will be described later, that enter the lower mold member 22.

In the semiconductor encapsulation device 9, the upper mold member 2 is provided in the second transfer space 75 and the third transfer space 76.
2 is held by the holder 88 and conveyed. The holder 88 has a pair of engaging portions that are engaged with the engaging grooves 49 for conveyance provided on both side surfaces of the upper mold member 22, and the engaging portions move in the lateral direction. The upper mold member 22 is chucked or opened.

Although not shown, the semiconductor encapsulation device 9 has a conveyance mechanism for moving the semiconductor encapsulation mold device 20 from the side surface along the above-described first conveyance space 74 to the third conveyance space 76. It is attached to each station. The transfer mechanism is, for example, a transfer table or a holder 88.
Is provided with a feed lever member that is relatively engaged with the lower die member 21 and the upper die member 22 and is intermittently provided with a takt time of 10 seconds for each station described above. To be transported.

The first transport guide frame 70 extends in the front-rear direction with respect to the second transport guide frame 71 and the third transport guide frame 72. In the semiconductor encapsulation device 9, a first station portion 77 and a seventh station portion 78, which are located before and after the above-described first transfer space portion 74, are located above the front and rear extension regions of the first transfer guide frame 70. And are configured. First station section 77
Corresponds to the above-mentioned first station S-1, and the seventh station section 78 corresponds to the seventh station S-7.

In the semiconductor encapsulation device 9, a material resin supply mechanism (not shown) is arranged in the first station section 77. As shown in FIG. 32, the semiconductor sealing device 9 supplies the material resin 8 to the lower die member 21 and loads the resin material into the resin loading portion 28 by the material resin feeding mechanism as described above. Do -1. In addition, the semiconductor sealing device 9
A lead frame supply mechanism (not shown) is disposed in the first station 77. The semiconductor sealing device 9 is
As shown in FIG. 32, the above-described lead frame mounting step S-1-2 is performed in which the lead frame 10 is supplied from the lead frame supply mechanism to the lower mold member 21 and mounted on the lead frame receiving portion 25.

The first transport guide frame 70 is shown in FIG.
As shown in FIG. 33, a longitudinal transport guide groove 79 is provided at the center of the main surface in the width direction. As shown in FIG. 31, the first transport guide frame 70 has a first station portion 77 and a seventh station portion 78.
A first heating mechanism 80 is provided at positions corresponding to and.

As shown in FIG. 33, the first heating mechanism 80 is composed of a plurality of heaters arranged inside the first transport guide frame 70 and a control unit (not shown). The first heating mechanism 80 controls the temperature of the lower mold member 21 to 175 ° C., which is the melting temperature of the material resin 8 made of, for example, an epoxy resin, via the first transport guide frame 70. Therefore, since the lower mold member 21 is in the preheated state, the material resin 8 loaded in the material resin loading portion 28 thereof.
Is efficiently melted and the mounted lead frame 10 is preheated. The semiconductor encapsulation device 9 is thus shortened in the preheating process.

The first heating mechanism 80 and the second heating mechanism described later
The heating mechanism 87 and the third heating mechanism 90 each have a control unit, and control the heater by the output of the sensor to adjust the temperature of the lower mold member 21 and the upper mold member 22. Although not shown, the sensor is not a built-in type of the lower mold member 21 and the upper mold member 22, but is a detachable thermocouple inserted into each of them, for example. Of course, these heating mechanisms are not limited to such a configuration.

A material resin supply drive mechanism 81 and a lower die member drive mechanism 82 are disposed on the first transport guide frame 70 at positions corresponding to the lower portion of the first station section 77, and also at the seventh station. A lower die member transport mechanism 83 and an eject drive mechanism 98 are provided at positions corresponding to the lower portion of the portion 78.

The lower die member drive mechanism 82 is composed of, for example, an air cylinder device driven by a control unit (not shown), although its details are omitted, and its piston member is moved from the guide slit provided at the bottom of the conveyance guide groove 79 to the first slit. 1
It moves back and forth in the station section 77. The lower die member drive mechanism 82 moves the lower die member 21 to the second die member by the piston member when the air cylinder device is operated.
Push up to the height position of the transfer space 75. The semiconductor sealing device 9 moves the upper mold member 22 closer to the lower mold member 21 thus pushed up by the front upper mold member driving mechanism 91, as will be described later. By combining in a low pressure state, the above-described low pressure mold clamping step S-1-3 is performed.

The material resin supply drive mechanism 81 is described in detail below.
The lower mold member drive mechanism 82 is located on the rear stage side and slightly on the rear stage side with respect to the seventh station portion 78, and the lower mold member 21
It is arranged corresponding to the material resin loading section 28 of. The material resin supply drive mechanism 81 is configured by, for example, an air cylinder device, although details thereof are omitted, similar to the lower die member drive mechanism 82 described above. Material resin supply drive mechanism 81
Of the piston moves forward and backward in the first station 77 through a guide slit (not shown) provided at the bottom of the transport guide groove 79.

In the semiconductor encapsulation device 9, when the material resin supply drive mechanism 81 is driven to operate the air cylinder device,
The piston member is attached to the bottom opening 28 of the material resin loading portion 28.
Material resin supply mechanism 2 for the lower die member 21 by entering from C
The material resin extruding member 30 constituting 9 is pushed up and operated. The semiconductor encapsulation device 9 thereby performs the resin filling step S-2-2 in which the material resin 8 is filled and supplied into the cavity 23 of the semiconductor encapsulation mold device 20.

The filling of the material resin 8 into the cavity 23 of the semiconductor encapsulation mold apparatus 20 by the material resin supply mechanism 29 is performed by the lower mold member 21 and the upper mold member 22 as described above.
And are performed with the mold clamped. Therefore, the operation of the material resin supply mechanism 29 is performed after the operation of the front toggle mold clamping drive mechanism 92 arranged at the front stage position of the third transport guide frame 72 described later. Further, since the material resin supply mechanism 29 contracts in the cavity 23 as the material resin 8 cures, the material resin supply drive mechanism 81 compensates the material resin 8 from the material resin loading unit 28 for the amount of contraction. Supply.

The lower die member conveying mechanism 83 has a substantially cross-shaped rotating frame whose center is rotatably supported by the side frame 73, and swingably supported by each arm of the rotating frame. The four transport members 86 are formed. The rotating frame is driven by a drive mechanism (not shown).
It is intermittently rotated by 90 ° for each tact time of a second. The transport member 86 is held in a horizontal state by being supported by the swing frame in a swing shape, one of which is the first
It is located at the rear end of the transport space 74, in other words, at the rear end of the sixth station S-6.

Therefore, in the semiconductor sealing device 9, the lower mold member 21 separated from the upper mold member 22 by the rear upper mold member driving mechanism 95 is transferred to the lower mold member transport mechanism 83 as will be described later. A carrying step S-7-1 of carrying the sheet on the carrying member 86 and carrying it to the seventh station section 78 is performed. Seventh
Although not shown, the station portion 78 is provided with a lead frame assembly take-out mechanism for taking out the ejected lead frame assembly 7 from the lower mold member 21.

The eject drive mechanism 98 is also composed of, for example, an air cylinder device, although details thereof are omitted, similarly to the lower die member drive mechanism 82 described above. The eject drive mechanism 98 has its piston member move forward and backward with respect to the seventh station portion 78 via a guide slit (not shown) provided at the bottom of the transport guide groove 79.

In the semiconductor encapsulation device 9, when the eject drive mechanism 98 is driven and the air cylinder device operates, the piston member is ejected from the bottom surface portion 43 of the lower mold member 21 located in the seventh station portion 78 to the eject hole. Enter 31. The semiconductor sealing device 9 thereby pushes up the eject pin 33 of the eject mechanism 32 against the elastic force of the eject spring 34, and ejects the lead frame assembly 7 attached from the lower mold member 21. Perform 7-2.

The semiconductor encapsulation device 9 performs, in the seventh station section 78, a lead frame removing step S-7-3 for removing the lead frame assembly 7 ejected by the lead frame assembly removing mechanism from the lower mold member 21. To do. The semiconductor encapsulation apparatus 9 further carries out a carrying step S-8-1 in which the lower die member 21 is cyclically carried by the carrying member 86 from the seventh station section 78 to the first station section 77.
I do. In addition, the semiconductor encapsulation device 9 uses the carrying step S-
In 8-1, a returning step S-8-2 for returning the material resin supplying mechanism 29 and the ejecting mechanism 32 is performed.

As shown in FIG. 31, the front end portion 71A of the second transport guide frame 71 is the first station portion 7.
7, and the rear end portion 71B is located at a sixth station portion 89 described later. Also,
The second transport guide frame 71 is provided with a transport guide groove 85 in the longitudinal direction corresponding to the transport guide groove 79 of the first transport guide frame 70 along the central portion in the width direction of the main surface thereof. In the conveyance guide groove 85, the lower mold member 2
The transport table on which 1 is positioned and placed is run. As shown in FIG. 33, the second conveyance guide frame 71 includes the semiconductor mold unit 20 in which the lower mold member 21 and the upper mold member 22 are clamped and integrated with each other. Bottom part 4
3 is supported by a carrier and carried.

A second heating mechanism 87 is arranged on the second transport guide frame 71. This second heating mechanism 87
As shown in FIG. 31, it is composed of a plurality of heaters disposed on both sides of the conveyance guide groove 79 sandwiching the conveyance guide groove 79 over substantially the entire area in the longitudinal direction, and a controller (not shown). . The second heating mechanism 87 controls the temperature of the lower mold member 21 to 175 ° C., which is the melting temperature of the material resin 8 made of, for example, an epoxy resin, via the second transport guide frame 71.

As described above, the second heating mechanism 87 controls the temperature of the lower mold member 21 by controlling the control unit by the output of the sensor inserted into the lower mold member 21. In addition, the second heating mechanism 87 controls the temperature of the lower mold member 21 and the upper mold member 22 over the entire area of the second transfer space 75 by the third heating mechanism 90 as described later. Therefore, the semiconductor encapsulation device 9 includes the second heating mechanism 87 and the third heating mechanism 87.
With the heating mechanism 90, the semiconductor sealing mold device 2 between the second station S-2 to the fifth station S-5
The above heating steps for 0 are performed.

As shown in FIG. 31, the front end portion 72A of the third conveyance guide frame 72 is located at substantially the same position as the front end portion 71A of the second conveyance guide frame 71.
The rear end portion 72B is the rear end portion 7 of the second transport guide frame 71.
1B, it is located slightly on the front side corresponding to the outer dimensions of the semiconductor encapsulation mold apparatus 20. Therefore, the third transport guide frame 72 thereby constitutes a sixth station portion 89 corresponding to the sixth station S-6 that connects the second transport space portion 75 and the third transport space portion 76 at the rear end thereof. ing.

A third heating mechanism 90 is arranged on the third transport guide frame 72. This third heating mechanism 90
As shown in FIG. 33, is composed of a plurality of heaters disposed on both sides of the transport guide groove 79 across almost the entire longitudinal direction and arranged inside thereof, and a control unit (not shown). There is. The third heating mechanism 90 adjusts the temperature of the upper mold member 22 to 175 ° C., which is the melting temperature of the material resin 8 made of, for example, an epoxy resin, via the third transport guide frame 72.

As described above, the third heating mechanism 90 controls the temperature of the upper mold member 22 by controlling the control unit by the output of the sensor inserted into the upper mold member 22. As described above, the third heating mechanism 90 adjusts the temperature of the lower mold member 21 and the upper mold member 22 over the entire area of the second transfer space portion 75 by the second heating mechanism 87, and at the same time
The upper mold member 22 transported in the transport space 76 is preheated.

The third transport guide frame 72 is provided with a front upper mold member drive mechanism 91 and a front toggle mold clamping drive mechanism 92 on the front side of the third transport guide frame 72, and at the rear stage side. A mold clamping mechanism 93, a rear toggle mold clamping drive mechanism 94, and a rear upper mold member drive mechanism 95 are provided in the.

The front upper die member driving mechanism 91 is arranged in front of the front end portion 72A of the third conveyance guide frame 72, that is, corresponding to the first station portion 77. The front upper mold member driving mechanism 91 is composed of, for example, an air cylinder device driven by a control unit (not shown) although its details are omitted. The front upper mold member driving mechanism 91 operates in the vertical direction and has a suction head 91A attached to its tip. .

Therefore, the front upper die member drive mechanism 91
As shown in FIG. 31, the suction head 91A sucks and holds the holder 88 to hold the upper mold member 22 located at the first station portion 77. The front upper die member drive mechanism 91 pushes down the upper die member 22 to the position of the second transfer space portion 75 by operating the air cylinder device from this state. Semiconductor sealing device 9
Is the above-mentioned low-pressure mold clamping step S in which the upper mold member 22 is clamped to the lower mold member 21 in a low pressure state.
-1-3 is performed.

In the semiconductor sealing device 9, the lower die member 21 and the upper die member 22 are transported to the second transport space portion 75 via the transport mechanism in the low pressure mold clamping state and the second transport space. In the portion 75, the second heating mechanism 87 and the third heating mechanism 90
The carrying preheating step S-2-1 for preheating the lower mold member 21 and the upper mold member 22 is performed by the.

The front toggle mold clamping drive mechanism 92 is arranged on both sides of the second sealing space 75 corresponding to the second station, with the transportation path of the semiconductor encapsulation mold apparatus 20 in between. The front toggle mold clamping drive mechanism 92 is composed of, for example, a pair of air cylinder devices driven by a controller (not shown), although details thereof are omitted. This front toggle mold clamping drive mechanism 92 is connected to the connecting member 40 of the toggle mold clamping mechanism 36 of the semiconductor encapsulation mold apparatus 20 in which the tip of the vertically operated piston member is located at the first station 77. Corresponding position is.

Therefore, the front toggle mold clamping drive mechanism 9
In No. 2, the piston member pushes down the connecting member 40 to bring the toggle mold clamping mechanism 36 into a state where it is entirely collapsed. In the semiconductor-sealed mold device 20, the mold-clamping holding mechanism operates as described above, and the lower mold member 21 and the upper mold member 22 are self-held in the mold-clamped state.

The mold clamping mechanism 93 is disposed at a rear stage position of the front toggle mold clamping drive mechanism 92 corresponding to the second station portion of the second transfer space 75, and details thereof are omitted, but not shown. It is composed of an air cylinder device driven by a controller. In the mold clamping mechanism 93, the piston member presses the upper surface portion 50 of the upper mold member 22 when the air cylinder device is operated.

In the semiconductor encapsulation device 9, the upper mold member 22 is strongly pressed against the lower mold member 21 with a predetermined mold clamping force, whereby the mold clamping step S is performed.
-2-2. The semiconductor encapsulation device 9 has a cavity 2 for the material resin 8 by the operation of the material resin supply drive mechanism 81 described above together with the mold clamping operation of the semiconductor encapsulation mold device 20.
3 is filled and supplied.

The rear toggle-type clamping drive mechanism 94 is arranged on the rear side of the rear end portion 72B of the third transport guide frame 72, that is, on the upper side of the sixth station portion 89. The rear toggle mold clamping drive mechanism 94 is composed of, for example, a pair of air cylinder devices driven by a controller (not shown), although details thereof are omitted. These rear toggle mold clamping drive mechanism 94 includes the toggle mold clamping mechanism 36 of the semiconductor encapsulation mold device 20 in which the front end of the piston member that is vertically moved is located at the seventh station 77.
Corresponding to the connecting member 40 of FIG. Further, although details are omitted, the piston member has a hook-shaped integrally formed hook at its tip.

The rear toggle mold clamping drive mechanism 94 configured as described above is set in a state in which the whole is closed by the front toggle mold clamping drive mechanism 92 as described above, and the semiconductor encapsulation mold device 20 is mounted. Self-holding toggle type tightening mechanism 36
Drive. That is, the rear toggle mold clamping drive mechanism 94
, The piston member descends and the hook at the tip end thereof relatively engages with the connecting member 40 of the toggle mold clamping mechanism 36. Thereafter, the rear toggle mold clamping drive mechanism 94 pulls up the connecting member 40 via the hook by the air cylinder device operating to pull up the piston member. As a result, the semiconductor encapsulation device 9 is provided with the semiconductor encapsulation mold device 2
The mold clamping release step S-6-2 of releasing the self-holding state of the mold clamping by the toggle mold clamping mechanism 36 of 0 is performed.

The rear upper die member drive mechanism 95 is located at the center of the rear toggle mold clamping drive mechanism 94 and is located on the rear side of the rear end portion 72B of the third conveyance guide frame 72, that is, the sixth portion.
It is arranged above the station unit 89. The rear upper mold member driving mechanism 95 is configured by an air cylinder device driven by a control unit (not shown), although details thereof are omitted, and it operates in the vertical direction and has a suction head 95A attached to its tip.

Therefore, the rear upper die member drive mechanism 95
As shown in FIG. 31, the suction head 95A sucks and holds the holder 88 to hold the upper die member 22 located at the sixth station portion 89. The rear upper die member driving mechanism 95 pushes the upper die member 22 from the second transfer space portion 75 to the third transfer space portion 76 by operating the air cylinder device from this state. As a result, the semiconductor encapsulation device 9 is configured so that
Is opened from the lower mold member 21 to perform the mold opening step S-6-3 described above. In the semiconductor encapsulation device 9, the lower mold member 21 conveys in the second conveying space 75 to the seventh station 78, while the upper mold member 22 conveys the second mold.
The paper is transported in the transport space 75 to the sixth station 89. As described above, the lower die member 21 performs the ejecting operation and the ejecting operation of the lead frame assembly 7 in the seventh station portion 78. On the other hand, the upper mold member 21
After being moved from the sixth station section 89 to the third transfer space section 76, it is cyclically transferred to the first station section 77 by the transfer mechanism.

As described above, in the semiconductor encapsulation device 9, each of the eight sets of semiconductor encapsulation mold devices 20 is arranged along the first transfer space 74 to the third transfer space 76 in the upper and lower three stages in the horizontal direction. Each process is cyclically transported with a takt time of 10 seconds. Therefore, the semiconductor encapsulation device 9 includes the lead frame assembly 7 that is outsert-molded with the encapsulating resin 5 that encloses the outer peripheral portion of the semiconductor chip 2 mounted in the chip mounting opening 11 from the supplied lead frame 10. Produce one per second.

The semiconductor encapsulation device 9 includes the first transfer space portion 74.
Through the first transport guide frame 70 through the third transport guide frame 72 that form the third transport space portion 76
Heating mechanism 80, second heating mechanism 87, and third heating mechanism 90
Since the semiconductor encapsulation mold apparatus 20 is efficiently heated by providing the above, the heating time can be shortened, and the lead frame assembly 7 of stable quality is produced.

In addition, the semiconductor encapsulation device 9 includes the above-mentioned heating mechanisms 80, 87, 90 together with the semiconductor encapsulation mold device 2.
The semiconductor encapsulation mold apparatus 20 is small and simple by installing each mechanism for driving the mold clamping mechanism, the mold clamping release mechanism, the eject mechanism, etc. of 0 in the first transfer space portion 74 to the third transfer space portion 76. It has a different structure. Therefore, the semiconductor encapsulation device 9 can be downsized as a whole, and the semiconductor encapsulation mold device 20 can be easily replaced when the specifications are changed. Since the semiconductor encapsulation device 9 is extremely inexpensive as compared with the conventional semiconductor encapsulation device and saves space, a plurality of semiconductor encapsulation devices 9 can be installed in the same area, and the overall productivity can be improved. Achieve improvement.

As described above, the semiconductor encapsulation device 9 includes the first transfer guide frame 70 to the third guide frame 72.
The upper and lower three stages of the first transport space 74 to the third transport space 76 are parallel to each other. The semiconductor encapsulation mold apparatus 20 is provided by disposing the first heating mechanism 80, the second heating mechanism 87, and the third heating mechanism 90 inside the first transport guide frame 70 to the third guide frame 72, respectively. It is configured to be heated. Therefore, in the semiconductor encapsulation device 9, when the semiconductor encapsulation mold device 20 is not preheated, the first conveyance space portion 74 to the third conveyance space portion 76 are configured by at least upper and lower two-stage conveyance guide frames, respectively. do it.

The present invention relates to the semiconductor encapsulation mold apparatus 2 described above.
0 and the semiconductor encapsulation device 9 are not limited to the above and various developments are made as follows. In the following description, the same components as those of the semiconductor encapsulation device 9 and the semiconductor encapsulation mold device 20 are designated by the same reference numerals, and detailed description thereof will be omitted.

The semiconductor encapsulation mold apparatus 20 is developed in another embodiment shown in FIG. This semiconductor encapsulation mold device 2
No. 0 is characterized in that the lower mold member 21 and the upper mold member 22 are made cleaning-less and the eject mechanism 32 is downsized. That is, the main surface 24 of the lower mold member 21 is coated with a coating material such as DLC, TiN, ICr, or Protonics System TA to form a coating surface 55. The coating surface 55 constitutes the main surface 24 having high hardness and low surface abrasion resistance.

Similarly, the upper die member 22 has its main surface 4
A coating surface 56 is formed by subjecting 4 to a coating treatment with a coating material such as DLC, TiN, ICr, or Protonics System TA. The coating surface 56 constitutes the main surface 44 having high hardness and low surface abrasion resistance.

The characteristics of the coating treatment with the above-mentioned coating materials are as shown in Table 1 below. Regarding the DLC coating process, although the film thickness is thin, if the hardness of the base material is increased, it is possible to prevent the deformation of the lower mold member 21 and the main surfaces 24 and 44 forming the cavity 23 of the upper mold member 22. And is very suitable.

[0169]

[Table 1]

The lower mold member 21 and the upper mold member 22 require furnace treatment for baking the applied DLC coating material in order to form the above-mentioned coating surfaces 55, 56. Since the semiconductor encapsulation mold apparatus 20 is configured to be small and lightweight as described above, it does not require a large processing furnace and can realize coating processing on the main surface. Generally, conventional processing furnaces do not provide a semiconductor encapsulation mold apparatus capable of processing a lead frame assembly for forming a lead frame assembly by mounting a plurality of lead frames.

The semiconductor encapsulation mold apparatus 20 comprises the lower mold member 2
1 and the above-described coating surfaces 55 and 56 on the main surfaces 24 and 44 of the upper mold member 22, the release characteristics of the lead frame assembly 7 are improved, so that the eject mechanism 32 is simplified. To be That is, in the mold apparatus, the molded body attached to one mold member is ejected by the eject pins, and these eject pins are surely returned to the initial position. Therefore, if the mold release characteristics of the molded product are poor, the mold device
It is necessary to apply a large ejecting force to the eject pin and also a large returning force of the eject pin.

The mold device is generally provided on the back side of the mold member,
An eject plate provided with an eject pin is movably arranged, and the eject plate is returned by a return pin or a return spring. Therefore, the entire mold apparatus becomes large due to the eject plate or the return mechanism thereof.

In the semiconductor encapsulation mold apparatus 20, the release characteristics of the lead frame assembly 7 are improved by the above-described structure, so that the eject pin 33 can be returned by a relatively small elastic force. Become. As a result, in the semiconductor-sealed mold device 20, the eject pin 33 is housed inside the lower mold member 21 as described above, and the overall size is reduced.

The semiconductor encapsulation mold apparatus 20 can be applied to other embodiments shown in FIGS. 35 to 39. In this semiconductor encapsulation mold apparatus 20, the lower mold member 21 and the upper mold member 22 are more reliably self-held in their clamped states, so that the occurrence of loading portion burrs and terminal portion burrs is suppressed, and It is characterized in that the lead frame 10 is configured so that the encapsulating resin 5 is precisely outsert-molded.

That is, the semiconductor encapsulating mold apparatus 20 is provided on each of two opposing side surfaces of the lower mold member 21, and the mold clamping state between the lower mold member 21 and the upper mold member 22 is self-maintained. The pair of toggle mold clamping mechanisms 36 are provided with mold clamping springs 59, respectively. In addition,
The toggle mold clamping mechanism 36 includes a first link lever 57, a mold clamping spring 59, and a spring hooking portion 60 formed on the lower mold member 21, as compared with the first toggle mold clamping mechanism described above. The configuration is different, but other basic configurations are the same.

The toggle type tightening mechanism 36 has one end with the support shaft 3
7A and 37B, the first link levers 57A and 57B rotatably supported, and the first link levers 57A and 57B.
Second link levers 38A, 38B rotatably supported on the free end of 7B, and second link levers 38A, 3B.
It is composed of a connecting member 40 for connecting the free ends of 8B and a mold clamping spring 59. The first link lever 57 is
As shown in FIG. 36, the upper portion thereof is gently bent outward so as to form an engaging concave portion 58 at an outer edge thereof in a substantially seven-character shape.

These first link levers 57A and 57B
As shown in FIG. 35 and FIG. 36, the lower end portions of the shafts are rotatably supported by the support shaft 37 so that they do not overlap each other. Second link lever 38A, 38B
Also, the lower end portions of the first link levers 57A and 57B are rotatably supported so as not to overlap with each other and to be retained by the free ends of the first link levers 57A and 57B. The connecting member 40 integrally connects the free ends of the second link levers 38A and 38B, but as shown in FIG. 35, a spring hooking portion 61 for hooking one end of the mold clamping spring 59 is formed.

The lower die member 21 includes a support shaft 37A and a support shaft 3
A spring hooking portion 60 is provided at the center of 7B. In the mold clamping spring 59, one end 59A is engaged with the spring retaining portion 60, and
In the pulled state, the other end portion 59B is hooked on the spring hooking portion 61 on the connecting member 40 side.

In the toggle mold clamping mechanism 36 configured as described above, the required elastic force F _y of the mold clamping spring 59 is -F _y × a + 1/2 × F _y × tan θ × b-Q from FIG. 39. × sin α × c + Q × cos α × d = 0 ... Equation 1 a: Distance between the support shaft 37 and the spring retaining portion 60 b: Length of the first link lever 57 c: Support shaft 37 and upper metal Distance from the engaging pin 48 on the die member 22 side: Angle of the second link lever 39 at the initial position α: Angle of the second link lever 39 in the fastening state Q: At the engaging pin 48 via the engaging recess 58 It is obtained by the component force of the required elastic force F _y of the mold clamping spring 59 that acts.

As the mold clamping spring 59, for example, when the dimensional values of the respective parts are set next, a tension spring having an initial load of 3.1 Kg may be adopted from the above formula 1. a = 26.2 mm b = 52.778 mm c = 43.798 mm d = 0.34558 mm θ = 83 ° α = 5 ° Formula 1 = −F _y × 26.2 + 1/2 × F _y × tan 83 ° × 5
2.778-Qxsin5 ° x43.798 + Qxcos5
° × 0.34558 = 403.64F _y −3.473Q
= 0 From this, F _y = 3.473Q / 403.64 ... Equation 2 Here, the required mold clamping force P is P = Qcos α = 0.996.
Since Q, Q = 1.0038P, which is substituted into the equation (2) to obtain the required elastic force F of the mold clamping spring 59.
_{When y} is calculated, F _y = 3.473 × 1.0038P / 403.64 ...

The toggle mold clamping mechanism 36 is disposed on both side surfaces of the semiconductor encapsulation mold device 20, and when the pressure of the material resin 5 is set to P≈350 kg, the mold clamping spring 59 is provided.
The required elastic force F _y is F _y = 3.473 × 1.0038P / 403.64 = 3.473 × 1.0038 × 350
/403.64 ≈ 3.02 kg. Therefore, as the mold clamping spring 59, a tension spring having an initial load of 3.1 kg or more is used.

In the semiconductor encapsulating mold apparatus 20 constructed as described above, in the state where the lower mold member 21 and the upper mold member 22 are opened, as shown in FIG. The connecting member 40 is located above the neutral point.
In the toggle type tightening mechanism 36 shown in the figure, the connecting portion of the first link lever 57 and the second link lever 39 is located outside from the straight line connecting the support shaft 37 and the spring hooking portion 61. As a result, the elastic force of the mold clamping spring 59 acts in the direction in which the left and right first link levers 57 and the second link lever 39 are collapsed. Therefore, the front toggle mold clamping drive mechanism 92 described above locks the connecting member 40 in a pushed-up state against the elastic force of the mold clamping spring 59, and the lower mold member 21 and the upper mold member 22. It is configured as a mechanism for holding and in the mold open state.

Of course, in the toggle mold clamping mechanism 36, the connecting portion of the first link lever 57 and the second link lever 39 is positioned inside from the straight line connecting the support shaft 37 and the spring retaining portion 61, and The elastic force of the tightening spring 59 may be configured to cause the left and right first link levers 57 and the second link lever 39 to act in a direction of pulling the first link lever 57 and the second link lever 39 toward the center side. In this case, the above-described front toggle mold clamping drive mechanism 92 includes the first link lever 57 and the second link lever 3
9 and 9 are in a state of sticking to each other, and the lower mold member 2
1 and the upper mold member 22 are held in the mold open state.

In the semiconductor encapsulation mold apparatus 20, in the mold clamping step S-2-2, the connecting member 40 of the toggle mold clamping mechanism 36 is released from the locked state by the front toggle mold clamping drive mechanism 92. . In the toggle mold clamping mechanism 36, the elastic force of the mold clamping spring 59 causes the left and right first link levers 57 and the second link lever 39 to pivot outward with the support shaft 37 and the connecting portion as fulcrums, respectively, and Mold member 2
While the upper mold member 22 is attracted to 1, the overall state is reduced.

By the way, in the semiconductor encapsulation mold apparatus 20, after the material resin 8 and the lead frame 10 are mounted on the lower mold member 21, the front upper mold member driving mechanism is operated as described above. The upper die member 22 is pressed by 91, and as shown in FIG. 37, the die is clamped while being positioned with respect to the lower die member 21. Lower mold member 21
In this case, the upper mold member 22 and the upper mold member 22 are in a state of being clamped at a low pressure as described above.

In the semiconductor encapsulating mold apparatus 20, the upper mold member 22 is pressed against the lower mold member 21 with a predetermined mold clamping force by the mold clamping mechanism 93 on the semiconductor encapsulating device 9 side. Mold clamping is performed, and in this state, the material / resin supply drive mechanism 8
The operation of 1 performs a resin filling process in which the material resin supply mechanism 29 pushes the material resin 8 from the material resin loading portion 28 into the cavity 23. The material resin 8 is cured by being kept in a heated and pressurized state in the cavity 23. The semiconductor sealing mold device 20 is securely held in this mold clamped state by the toggle mold clamping mechanism 36.

As shown in FIG. 38, the toggle mold tightening mechanism 36 has the engagement recess 58 formed in the first link lever 57 and the engagement pin 48 on the upper mold member 22 side in the state where the toggle mold tightening mechanism 36 is in its entire narrowed state. Relative engagement. The engagement state between the engagement recess 58 and the engagement pin 48 is maintained by the mold clamping force of the mold clamping spring 59. Mold clamping spring 59
Has an elastic force commensurate with the required mold clamping force as described above.

Therefore, the semiconductor encapsulation mold apparatus 20 is
Even in the state where the mold clamping mechanism 93 releases the mold clamping force in the next step, the mold clamping state of the lower mold member 21 and the upper mold member 22 is self-maintained by the necessary mold clamping force. To be done. Since the semiconductor encapsulation mold apparatus 20 can perform the curing step of the material resin 8 filled in the cavity 23 by the transporting step, the tact time is significantly shortened. Further, since the semiconductor encapsulating mold apparatus 20 holds the lower mold member 21 and the upper mold member 22 with the required mold clamping force during the curing process of the material resin 8, the burrs are removed. Outsert molding is performed on the lead frame 10 in a stable state while preventing generation of the sealing resin 5.

When the semiconductor encapsulating mold apparatus 20 is conveyed to the sixth station S-6, the lower die member by the toggle mold clamping mechanism 36 described above by the rear toggle mold clamping drive mechanism 94 on the semiconductor encapsulating apparatus 9 side. The mold clamping self-holding state between 21 and the upper mold member 22 is released. That is, the toggle mold clamping mechanism 36 is pulled up against the elastic force of the mold clamping spring 59 by the hook of the rear toggle mold clamping drive mechanism 94 with which the connecting member 40 is relatively engaged. Accordingly, the toggle mold clamping mechanism 36 causes the first link lever 57 to move.
Rotates about the support shaft 37 as a fulcrum, and its engaging recess 58
The engagement state between the engagement pin 48 and the engagement pin 48 is released.

The semiconductor encapsulation device 9 can be expanded to the other semiconductor encapsulation device 100 shown in FIGS. This semiconductor encapsulation apparatus 100 is composed of four stations, and the encapsulating resin 5 is applied to the lead frames 10 which are supplied by intermittently cyclically conveying the above-described four sets of semiconductor encapsulation mold apparatuses 20 for each of these stations. The outsert-molded lead frame assembly 7 is molded. In the following description, the same components as those of the semiconductor encapsulation device 9 will be assigned the same reference numerals and detailed description thereof will be omitted.

In the semiconductor encapsulation device 100, the number of individual steps in each station is larger than that of the semiconductor encapsulation device 9 described above, and the semiconductor encapsulation mold device 20 is used in order to make the overall takt time approximately the same. Are transported at high speed between stations.

The semiconductor encapsulation device 100 includes a central transfer guide frame 101 and the central transfer guide frame 101.
And a transport guide frame (not shown) that is located above and below the sheet. In the semiconductor encapsulation device 100, upper and lower three-stage transfer spaces 102 to 104 that are parallel to each other are configured by these transfer guide frames. The first transfer space part 102 at the center constitutes a transfer space part in which the lower mold member 21 and the upper mold member 22 are transferred in a clamped state.
The second transfer space 103 on the lower side constitutes a transfer space in which the opened lower mold member 21 is independently transferred. The upper third transfer space part 104 constitutes a transfer space part in which the opened upper mold member 22 is independently transferred.

The central conveyance guide frame 101 is shown in FIG.
As shown in FIG.
Is formed with a longitudinal transport guide groove that supports and transports the bottom surface of the. In the semiconductor encapsulation device 100, first station S-1 to fourth station S-4 are configured along the transport guide groove. The portions of the first station S-1 and the fourth station S-4 communicate with the second transfer space portion 103 by opening the bottoms, although the details are omitted. Further, the upper transport guide frame (not shown) has a length corresponding to the second station S-2 and the third station S-3, so that communication portions with the third transport space 104 are formed on both sides thereof. ing.

The semiconductor encapsulation device 100 includes the first
Although not shown, a lower mold member transport mechanism and an upper mold member transport mechanism are arranged along the transport space 102 to the third transport space 104. In the semiconductor encapsulation device 100, the lower die member drive mechanism 8 is located below the first transfer space 102 and corresponds to the first station S-1 portion.
2, a material resin supply drive mechanism 81 corresponding to the second station S-2 portion, a mold clamping mechanism 105 on the lower mold member side corresponding to the third station S-3 portion, and a fourth portion.
Eject drive mechanisms 98 are arranged corresponding to the stations S-4. Each of these mechanisms is composed of an air cylinder device, similar to each mechanism of the semiconductor sealing device 9 described above.

In the semiconductor encapsulation device 100, the lead frame supply mechanism 96 is located on the left and right sides of the first transfer space 101 and corresponds to the first station S-1 portion.
And a material resin supply mechanism 109, and a lead frame assembly take-out mechanism 110 corresponding to the fourth station S-4 portion. These lead frame supply mechanism 96 and material resin supply mechanism 10
9 is composed of, for example, a robot device, and is used for the lower mold device 21 with respect to the lead frame 100 or the material resin 8.
Supply. The material resin supply mechanism 109 is held in the pot.

Further, the semiconductor encapsulation device 100 has a third
The front upper mold member drive mechanism 91 and the toggle mold clamping drive mechanism (not shown) are located above the transport space 104 and correspond to the first station S-1 portion. -2 part, the first upper mold member mold clamping mechanism 106 corresponds to the third station S-3 part, the second upper mold member mold clamping mechanism 107 corresponds to the fourth station, and the fourth station A rear upper mold member driving mechanism 95 and a toggle mold clamping release mechanism (not shown) are arranged corresponding to the S-4 portion.

[0197] The semiconductor encapsulation device 1 configured as described above.
00 is in a state in which the lower mold member 21 and the upper mold member 22 are vertically opened at the first station S-1 portion and the fourth station S-4 portion, as shown in FIG. Further, in the semiconductor sealing device 100, in the second station S-2 portion and the third station S-3 portion, as shown in the figure, the lower die member 21 and the upper die member 2 are provided.
2 and 2 are in a mold clamped state.

As shown in FIG. 41, the semiconductor encapsulation device 100 transfers the tablets of the material resin 8 to the material resin loading section 28 of the lower mold member 21 via the material resin supply mechanism 109 in the first station S-1. A material resin loading step S-1-1 for loading the lead frame 10 and a lead frame mounting step S-1-2 for loading the lead frame 10 on the lower mold member 21 via the lead frame supply mechanism 96 are performed. The semiconductor sealing device 100 further includes the first station S-1.
Low-pressure mold clamping in which the lower mold member 21 and the upper mold member 22 are clamped in a low-pressure state by the lower mold member drive mechanism 82 and the front upper mold member drive mechanism 91 and preheated by a heating mechanism (not shown). Preheating step S-1-3 and mold clamping self-holding step S-1- for operating the toggle mold clamping mechanism 36 by the toggle mold clamping drive mechanism to self-maintain the mold clamping state.
Do 4 and.

The semiconductor encapsulation apparatus 100 conveys the semiconductor encapsulation mold apparatus 20 to the second station S-2 by the conveyance mechanism in the mold clamping self-holding state. In the second station S-2, the semiconductor sealing device 100 is in a state where the lower mold member 21 and the upper mold member 22 are firmly clamped by the first upper mold member clamping mechanism 106. The resin filling step S- for supplying the material resin 8 into the cavity 23 by driving the material resin supply drive mechanism 81.
Do 2-1.

The semiconductor encapsulation apparatus 100 conveys the semiconductor encapsulation mold apparatus 20 filled with the material resin 8 to the third station S-3 by the conveyance mechanism. In this third station S-3, the semiconductor encapsulation apparatus 100 connects the lower mold member 21 and the upper mold member 22 to the lower mold member mold clamping mechanism 105, the second upper mold member mold clamping mechanism 107, and A post-heating step S-3-1 of heating while maintaining the mold clamped state by the toggle mold clamping mechanism 36 is performed. Cavity 23
The material resin 8 filled therein is gradually hardened by this.

The semiconductor encapsulation apparatus 100 conveys the semiconductor encapsulation mold apparatus 20 to the fourth station S-4 by the conveyance mechanism after a predetermined takt time. Semiconductor sealing device 1
00 is a post-heating step S-4 for subsequently heating the semiconductor encapsulation mold apparatus 20 in the fourth station S-4.
-1 and a toggle mold clamping release step S-4-2 in which the toggle mold clamping mechanism 36 is operated by a toggle mold clamping drive mechanism (not shown) to release the mold clamping state. In the fourth station S-4, the semiconductor encapsulation device 100 uses the rear upper die member drive mechanism 95 to drive the lower die member 2 into the lower die member 2.
A mold opening step S-4-3 in which the upper mold member 22 is moved away from the mold 1 is performed.

Further, the semiconductor encapsulation device 100 has the eject drive mechanism 9 at the fourth station S-4.
Lead frame assembly ejecting step S-4-4 for ejecting the lead frame assembly 7 from the lower die member 21 in which the upper die member 22 has been operated to open the die, and the ejected lead frame assembly 7 is taken out by the lead frame assembly take-out mechanism 110 and a lead frame assembly take-out step S-4-5 is performed.

Furthermore, in the semiconductor encapsulation device 100, in the fourth station S-4, the material resin supply mechanism 29 and the eject mechanism 32 of the semiconductor encapsulation mold device 20.
And a returning step S-4-6 for returning the and to the initial state. Thereafter, in the semiconductor encapsulation device 100, the lower die member 21 is passed through the second transport space portion 103 and the upper die member 22 is passed through the third transport space portion 104 by the transport mechanism to form the first station part. Make a patrol transport to.

According to the second embodiment semiconductor encapsulation apparatus 100 having the above-described structure, since the semiconductor encapsulation mold apparatus 20 is composed of four sets, it is possible to manufacture various kinds of semiconductor devices 1. Etc., semiconductor mold device 2 that conforms to specifications
Since 0 can be exchanged very easily, the setup time and the like can be greatly shortened and the productivity is improved. Further, the semiconductor encapsulation device 100 can be further downsized as a whole.

[0205]

As described above in detail, according to the semiconductor encapsulating mold apparatus of the present invention, it is possible to position the lead frame in which the material resin supply section and the runner section are formed in the same plane. Since the lead frame assembly is formed by outsert molding the encapsulating resin that seals the semiconductor chip mounted on this lead frame, the mold clamping force is uniform with respect to the lead frame in the mold clamped state. Not only the mold clamping mechanism and the overall structure are simple and downsized, but also the lead frame assembly in which burr generation is suppressed is manufactured, so that the post-process can be rationalized. Further, since the semiconductor sealing mold device is provided with the self-holding mechanism in the mold clamped state, it is possible to perform the post-heating step for curing the material resin in the carrying step. Achieve shortening. In addition, the semiconductor encapsulation mold device is light in weight and small in size, which makes it easy to handle, and even when manufacturing many types of semiconductor devices, it is easy to exchange and set up. Etc. to achieve time reduction.

Further, according to the semiconductor encapsulating apparatus using the semiconductor encapsulating mold apparatus according to the present invention, a semiconductor encapsulating mold apparatus having a small size and a self-holding mechanism in a clamped state is provided. It is configured to drive the material resin supply mechanism and the eject mechanism of the semiconductor encapsulating mold device from the outside while carrying out cyclic conveyance corresponding to the molding process and having the material resin supply drive mechanism and the eject drive mechanism. , The rationalization of the post-deburring process, etc. because the setup process for exchanging the semiconductor encapsulation mold device or the production of the lead frame assembly in which the occurrence of burrs is suppressed when manufacturing various types of semiconductor devices, etc. Is planned. Further, since the semiconductor encapsulation device is small in size and inexpensive, it is possible to install plural semiconductor encapsulation devices in the same space. Also, since a small number of personnel can deal with the semiconductor encapsulation device, it is possible to efficiently and reduce the lead frame assembly. Produce at cost.

Furthermore, according to the encapsulating resin molding method for a semiconductor device using the semiconductor encapsulating mold device according to the present invention, the semiconductor encapsulating mold is lightweight, small, and has a self-holding mechanism in a mold clamped state. Since the die device is cyclically transported corresponding to the molding process to manufacture a lead frame assembly in which burr generation is suppressed, rationalization of the post-burring process, etc. is achieved, and replacement of the semiconductor encapsulation die device And so on. Therefore, the semiconductor manufacturing method using the semiconductor encapsulating mold apparatus according to the present invention efficiently produces the lead frame assembly and achieves a significant cost reduction.

[Brief description of the drawings]

FIG. 1 is a perspective view of a semiconductor device.

FIG. 2 is a perspective view of a lead frame used in the present invention.

FIG. 3 is a perspective view of a lead frame assembly that is an intermediate body of a semiconductor device formed by performing outsert molding of encapsulating resin on the lead frame.

FIG. 4 is a schematic manufacturing process diagram illustrating a manufacturing process of a semiconductor device.

FIG. 5 is a perspective view showing a mold open state of the semiconductor sealing mold device according to the present invention.

FIG. 6 is a perspective view of a lower mold member that constitutes the semiconductor sealing mold device.

FIG. 7 is a partially cutaway side view of the lower mold member.

FIG. 8 is a vertical cross-sectional view of a lower mold member for explaining a state in which a material resin supply mechanism provided in the lower mold member pushes a molten material resin into a cavity by a material resin supply mechanism.

FIG. 9 is a vertical cross-sectional view of a lower mold member for explaining a state where an eject mechanism provided in the lower mold member operates to eject a lead frame assembly outsert-molded with a sealing resin from the lower mold member. It is a figure.

FIG. 10 is a perspective view from the upper surface of an upper mold member that constitutes the same semiconductor sealing mold device.

FIG. 11 is a perspective view from the bottom of the mold member of the same.

FIG. 12 is a perspective view showing a state in which a lower mold member and an upper mold member are clamped by a low pressure in the semiconductor sealing mold device.

FIG. 13 is a perspective view showing a state in which the lower mold member and the upper mold member are self-maintained in a mold clamped state by a mold clamp holding mechanism in the same semiconductor-sealing mold device.

FIG. 14 is an explanatory diagram of a transfer position and a molding process of the semiconductor sealing die device in the semiconductor sealing device according to the present invention.

FIG. 15 is an explanatory diagram of a state of the semiconductor encapsulation mold device in the first station based on the molding process of the semiconductor encapsulation device, in which the material resin is loaded into the material resin loading part of the lower die member. The state of a loading process is shown.

FIG. 16 is an explanatory diagram of a state of the semiconductor-sealing die device in the first station, showing a state of a lead frame attaching step of attaching the lead frame to the lower die member.

FIG. 17 is an explanatory diagram of a state of the semiconductor-sealing die device in the first station, showing a state in which the lower die member and the upper die member are clamped at a low pressure.

FIG. 18 is an explanatory diagram of a state of the semiconductor sealing mold device in the second station based on the molding process of the semiconductor sealing device, in which the lower mold member and the upper mold member are clamped at a low pressure. The state of being transported is shown.

FIG. 19 is an explanatory diagram of a state of the semiconductor sealing mold device in the second station, in which a lower mold member and an upper mold member are operated to perform a main mold clamping operation. Indicates.

FIG. 20 is an explanatory diagram of a state of the semiconductor sealing mold device in the third station based on the molding process of the semiconductor sealing device, in which the lower mold member and the upper mold member are molded by the mold clamping holding mechanism. It shows a state in which the tightened state is held by itself and is conveyed while being heated by the heating means.

FIG. 21 is an explanatory diagram of a state of the semiconductor sealing mold device in the fourth station based on the molding process of the semiconductor sealing device, in which the lower mold member and the upper mold member are self-maintained in the mold clamped state. And are conveyed while being heated by the heating means.

FIG. 22 is an explanatory diagram of a state of the semiconductor-sealing mold device in the fifth station based on the molding process of the semiconductor-sealing device, in which the lower mold member and the upper mold member self-maintained in the mold clamping state. And are conveyed while being heated by the heating means.

FIG. 23 is an explanatory diagram of a state of the semiconductor sealing mold device in the sixth station based on the molding process of the same semiconductor sealing device, and is a lower mold member and an upper mold member that are self-maintained in the mold clamped state. The state in which heating is stopped and the sheet is conveyed is shown.

FIG. 24 is an explanatory view of a state of the semiconductor sealing mold device in the sixth station, in which the mold clamping holding mechanism is driven to release the mold clamping state between the lower mold member and the upper mold member. Indicates the status.

FIG. 25 is an explanatory diagram of a state of the semiconductor-sealing mold device in the sixth station, showing a state in which the lower mold member and the upper mold member perform a mold opening operation.

FIG. 26 is an explanatory diagram of a state of a semiconductor-sealing mold device in a seventh station based on a molding process of the same semiconductor-sealing device, showing a lower mold member and an upper mold member opened by a transfer mechanism. Shows the state of being conveyed.

FIG. 27 is an explanatory diagram of a state of the semiconductor-sealing die device in the seventh station, showing a state in which the ejector mechanism is operated and the lead frame assembly attached to the lower die member is ejected.

FIG. 28 is an explanatory view of a state of the semiconductor-sealing die device in the seventh station, showing a state in which the ejected lead frame assembly is taken out.

FIG. 29 is an explanatory view of a state of the semiconductor encapsulating mold device in the eighth station based on the molding process of the semiconductor encapsulating device, showing a state where the lower mold member and the upper mold member are respectively conveyed. Show.

FIG. 30 is an explanatory diagram of a state of the semiconductor sealing die device in the eighth station, showing a state in which the material resin supply mechanism and the eject mechanism provided in the lower die member are returned.

FIG. 31 is a perspective view of an essential part of the semiconductor sealing device.

FIG. 32 is a perspective view of a principal part for explaining a carrying operation of the semiconductor-sealing die device in the semiconductor-sealing device.

FIG. 33 is a front view of relevant parts for explaining the configuration of the transfer space portion of the semiconductor sealing die device in the same semiconductor sealing apparatus.

FIG. 34 is an exploded perspective view of a semiconductor encapsulating mold apparatus according to another embodiment of the present invention, in which the cavity surface is coated.

FIG. 35 is a perspective view of a semiconductor-sealing mold device in which another embodiment of the semiconductor-sealing mold device according to the present invention is provided, and a self-holding spring is provided in the mold-clamping holding mechanism.

FIG. 36 is a side view showing a state where the lower mold member and the upper mold member are opened in the same semiconductor sealing mold device.

FIG. 37 is a side view showing a state where the lower mold member and the upper mold member are clamped at a low pressure in the semiconductor-sealing mold device.

FIG. 38 is a side view showing a state where the lower mold member and the upper mold member are clamped and self-held in the same semiconductor-sealing mold device.

FIG. 39 is a view for explaining the action of the elastic force of the self-holding spring provided in the mold holding mechanism of the semiconductor sealing mold device.

FIG. 40 is a perspective view of a main part showing another embodiment of the semiconductor sealing device according to the present invention, omitting a transfer guide frame for transferring and supporting the semiconductor sealing mold device.

FIG. 41 is an explanatory diagram showing a state of the semiconductor sealing die device in each step of the same semiconductor sealing device.

FIG. 42 is a partially cutaway perspective view illustrating a conventional outsert molding process of encapsulating resin for a lead frame.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Semiconductor chip 3 Lead terminal piece 5 Sealing resin 7 Lead frame assembly 8 Material resin 9 Semiconductor sealing device 10 Lead frame 11 Chip mounting opening (semiconductor chip mounting part) 13 Resin filling area 16 Positioning hole 17 Cull part 18 Runner part 19 Gate part 20 Semiconductor encapsulation mold device 21 Lower mold member 22 Upper mold member 23 Cavity 28 Material resin loading part 29 Material resin supply mechanism 30 Material resin extruding member 32 Eject mechanism 33 Eject pin 36 type Toggle type tightening mechanism constituting the tightening mechanism 38 First link lever 39 Second link lever 40 Connecting member 42 Engagement recess 48 Engagement pin (engagement protrusion) 55 Coating surface of lower die member 56 Upper die member Coating surface 59 Clamping spring 70 First transport guide frame 71 2nd conveyance guide frame 72 3rd conveyance guide frame 74 1st conveyance space part 75 2nd conveyance space part 76 3rd conveyance space part 80 1st heating mechanism 81 Material resin supply drive mechanism 82 Lower metal mold member drive mechanism 83 Lower metal Mold member transport mechanism 87 Second heating mechanism 90 Third heating mechanism 91 Front upper mold member transport mechanism 92 Toggle mold clamping drive mechanism 93 Mold clamping mechanism 94 Rear upper mold member transport mechanism 96 Lead frame supply mechanism 97 Material resin supply Drive mechanism 98 Eject drive mechanism

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification number Agency reference number FI Technical display location B29L 31:34

Claims (17)

[Claims] 1. A lead frame having a semiconductor chip mounted thereon is loaded, and a cavity of the encapsulating resin for molding a lead frame assembly in which the encapsulating resin for encapsulating the semiconductor chip is outsert-molded is formed in the lead frame. A first mold member in which a first cavity is formed, and the first mold member is arranged so as to come into contact with and separate from the first mold member,
A second mold member having a second cavity forming a cavity of the encapsulating resin in cooperation with the first mold cavity; and a thermosetting synthetic resin provided in the first mold member. A material resin supply mechanism including a material resin charging section for charging a material resin consisting of: and an extrusion means for supplying the material resin charged in the material resin charging section and in a molten state into the cavity. And an eject mechanism having an eject pin that is provided in the first mold member and that ejects the lead frame assembly in which the semiconductor chip is sealed by the sealing resin from the cavity and releases the lead frame assembly, The first mold member and the second mold member are provided with a mold clamping holding mechanism that self-holds in a mold clamped state, and the first mold member and the second mold member are installed. Semiconductor encapsulation die apparatus, characterized in that the material resin supply mechanism and the eject mechanism is driven by the main unit side of the drive mechanism. 2. The first mold member and the second mold member are outsert-molded with the encapsulating resin for encapsulating the semiconductor chip, in which one lead frame is loaded.
The mold device for semiconductor encapsulation according to claim 1, wherein individual lead frame assemblies are molded. 3. The pair of mold clamping holding mechanisms, wherein one end is rotatably supported by the first mold member or the second mold member and a first engaging portion is formed. Toggle including a first link lever and a pair of second link levers rotatably supported by the other end portions of the first link lever and having free end portions connected to each other via a connecting member. A mold clamping mechanism, and a pair of second engaging parts provided on the second mold member or the first mold member corresponding to the first engaging parts of the first link lever, respectively. The toggle type tightening mechanism is operated in a state where the first link lever and the second link lever are in a recessed state, so that the toggle type tightening mechanism is provided on the first link lever. The respective engaging portions of the respective relative engaging portions with the corresponding second engaging portions. The mold device for semiconductor encapsulation according to claim 1, wherein the first mold member and the second mold member are self-held in a clamped state. 4. A mold clamping elastic means having end portions fixed to side surfaces of the first mold member and the second mold member which are located on the center line of the toggle mold clamping mechanism. Are stretched in a tensioned state, and the elastic force of the elastic means for clamping mold holds the clamped state of the first mold member and the second mold member by the toggle mold clamping mechanism. The mold device for semiconductor encapsulation according to claim 3. 5. A chip mounting part and one end of the first mold member are made to face a peripheral part of the chip mounting part while the second mold member is opened. A large number of lead terminals, the other end of which is pulled out to the outer peripheral side, the runner portion, and the cull portion corresponding to the material resin loading portion of the first mold member are integrally made of a conductive thin metal plate. And a lead frame in which the semiconductor chip is electrically connected to and mounted on each of the lead terminals is mounted on the chip mounting portion, and the first mold member and the second mold member are clamped. It is operated and the mold clamped state by the toggle mold clamping mechanism is maintained, and the material resin in the molten state is extruded into the cavity by the material resin supply mechanism and cured to be mounted on the chip mounting portion. The above semi-conductor Semiconductor encapsulation mold system according to the FuSo resin FuSo chip to claim 3, characterized in that molding the lead frame assembly by outsert molding on the lead frame. 6. The first mold member and the second mold member are characterized in that the main surfaces facing each other are subjected to a high hardness coating treatment for reducing surface abrasion resistance. The mold device for semiconductor encapsulation according to 1. 7. The first mold member and the second mold member are provided with positioning means for positioning a mold matching state on the main surfaces facing each other. Mold device for semiconductor encapsulation. 8. A lead frame on which a semiconductor chip is mounted is loaded, and a sealing resin for sealing the semiconductor chip is outsert-molded on the lead frame to form a cavity of the sealing resin for molding a lead frame assembly. A first mold member having a first cavity formed therein, and a first mold member facing the first mold member so as to come into contact with and separate from the first mold member, and cooperate with the first cavity to form a cavity of the encapsulating resin. A second resin mold member in which a second cavity is formed, and a material resin charging section in which a material resin made of a thermosetting synthetic resin is charged in the first metal mold member; A material resin supply mechanism including an extruding means for supplying the material resin, which is loaded into the resin loading section and is in a molten state, into the cavity, and the semiconductor chip is sealed by the encapsulation. An eject mechanism having an eject pin for ejecting a lead frame assembly sealed with resin from the cavity and releasing the mold is provided, and the first and second mold members are self-locked. A semiconductor sealing mold device provided with a mold clamping and holding mechanism for holding is used, and a transport mechanism for cyclically transporting the semiconductor sealing mold device, and the material resin supply of the semiconductor sealing mold device. The material resin supply drive mechanism that drives the extrusion means of the mechanism to fill the material resin into the cavity, and the lead frame assembly is outsert-molded with the encapsulating resin, and the first mold is provided. Ejecting the lead frame assembly from the first mold member by driving the eject mechanism while the member and the second mold member are in the mold opening operation Semiconductor encapsulation device using a semiconductor sealing die apparatus that includes a drive mechanism. 9. The transport mechanism intermittently cyclically transports the semiconductor encapsulation mold device for each individual step of the outsert molding step of the divided encapsulating resin. A semiconductor encapsulation device using the semiconductor encapsulation mold device as described above. 10. The semiconductor encapsulating mold device is provided with a plurality of sets corresponding to the outsert molding step of the divided encapsulating resin, and the conveying mechanism intermittently cyclically conveys at a predetermined takt time. 10. The method according to claim 9, wherein
A semiconductor encapsulation device using the semiconductor encapsulation mold device according to. 11. A first transport guide frame and a second transport guide frame, which are vertically opposed to each other and are arranged to face each other, and the first transport guide frame and the second transport guide frame are provided. The first transfer space section configured between the first transfer member and the second transfer member constitutes a mold clamping transfer space section which is transferred by the transfer mechanism in the mold clamped state of the first mold member and the second mold member. The second transport space portion formed below the first transport guide frame constitutes one mold open transport space portion in which the first mold member in the mold open state is transported by the transport mechanism. The third transfer space part formed above the second transfer guide frame is the other mold open transfer space part in which the second mold member in the mold open state is transferred by the transfer mechanism. The first mold constructed and opened. 9. The semiconductor encapsulation according to claim 8, wherein the material and the second mold member are cyclically transported to the initial position via the second transport space portion and the third transport space portion. A semiconductor encapsulation device using a stopping die device. 12. The mold for semiconductor encapsulation according to claim 8, wherein at least the first transfer guide frame is provided with heating means for heating the first mold member. Semiconductor encapsulation device using the device. 13. A lead frame having a semiconductor chip mounted thereon is loaded, and a sealing resin for sealing the semiconductor chip is outsert-molded on the lead frame to form a cavity of the sealing resin for molding a lead frame assembly. A first mold member having a first cavity formed therein, and a first mold member facing the first mold member so as to come into contact with and separate from the first mold member, and cooperate with the first cavity to form a cavity of the encapsulating resin. A second resin mold member having a second cavity constituting the material, and a material resin charging section in which a material resin made of a thermosetting synthetic resin is charged in the first metal mold member and the material. A material resin supply mechanism having an extruding means for supplying the material resin, which is loaded into the resin loading section and is in a molten state, into the cavity, and the semiconductor chip is sealed by the sealing means. An ejecting mechanism having an ejecting pin for ejecting the lead frame assembly sealed with a mounting resin from the cavity and releasing the lead frame assembly, and a mold clamping state for the first mold member and the second mold member. The mold resin for semiconductor encapsulation provided with a mold clamping holding mechanism for self-holding is used, and the material resin of the first mold member in the state where the mold device for semiconductor encapsulation is opened. Similarly to the resin loading step of loading the material resin into the loading portion, the lead frame having the semiconductor chip mounted thereon is attached to the first die member in the state where the die unit for semiconductor encapsulation is opened. And a lead frame mounting step of mounting the semiconductor encapsulation mold device on the mold and holding the mold clamping state by the mold clamping holding mechanism, A resin filling step of filling the material resin in a molten state into the cavity, a mold clamping holding step of maintaining the mold clamping state of the semiconductor sealing mold device by the mold clamping holding mechanism, and the semiconductor sealing. The semiconductor die encapsulation process comprises the step of ejecting a lead frame assembly in which the sealing die device is opened and the lead frame is outsert-molded with the encapsulating resin from the first die member. A semiconductor mold device for molding, characterized in that a lead frame assembly is molded by cyclically driving a stopping mold device in each of the above steps and performing outsert molding of the encapsulating resin on the lead frame. A method for molding a resin for encapsulating a semiconductor device using the same. 14. An outsert molding of the encapsulating resin for encapsulating the semiconductor chip through the steps, wherein one lead frame is mounted on the semiconductor encapsulating mold device. The method of claim 1 wherein a single lead frame assembly is formed.
A method for molding resin for encapsulating a semiconductor device, which uses the semiconductor encapsulating mold device according to item 3. 15. The first mold member and the second mold in a mold clamped state by a first transport guide frame and a second transport guide frame that are vertically spaced apart and face each other. A mold clamping transport space in the center where the members are transported, a first mold open transport space in the upper part where the first mold member in the mold open state is transported, and the second mold member. And a second transfer space part in the lower part where the semiconductor chip is transferred. The outsert molding of the encapsulating resin for encapsulating the semiconductor chip is performed on the lead frame during the transfer step of the mold clamping transfer space part The mold closing transfer space part for the opened first mold member and the second mold member via the first mold opening transfer space part and the second mold opening transfer space part Of the lead frame assembly by patrol transportation to the initial position of FuSo resin molding method of a semiconductor device using the semiconductor encapsulation mold system according to claim 13, characterized in that the connection formed. 16. The first transport guide frame and the second transport guide frame
16. The semiconductor encapsulation device according to claim 15, wherein the heating step for heating the first mold member and the second mold member is carried out by the carrying step by the heating means provided on the carrying guide frame. A method for molding resin for encapsulating a semiconductor device using a mold device. 17. The material resin supply mechanism and the material resin supply drive mechanism are respectively driven by a driving mechanism provided outside in a state where the first mold member and the second mold member are clamped. A method for molding resin for encapsulating a semiconductor device using the semiconductor encapsulating mold device according to claim 13.