CN116936375A - Automatic packaging machine of modification formula - Google Patents
Automatic packaging machine of modification formula Download PDFInfo
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- CN116936375A CN116936375A CN202310815471.7A CN202310815471A CN116936375A CN 116936375 A CN116936375 A CN 116936375A CN 202310815471 A CN202310815471 A CN 202310815471A CN 116936375 A CN116936375 A CN 116936375A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 68
- 230000004048 modification Effects 0.000 title description 2
- 238000012986 modification Methods 0.000 title description 2
- 239000004033 plastic Substances 0.000 claims abstract description 72
- 238000007789 sealing Methods 0.000 claims abstract description 66
- 239000000463 material Substances 0.000 claims abstract description 33
- 239000000110 cooling liquid Substances 0.000 claims abstract description 29
- 239000012530 fluid Substances 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 230000000903 blocking effect Effects 0.000 claims abstract description 4
- 238000001816 cooling Methods 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 4
- 239000005022 packaging material Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 claims description 2
- 238000002407 reforming Methods 0.000 claims 1
- 230000007306 turnover Effects 0.000 claims 1
- 238000012858 packaging process Methods 0.000 abstract description 7
- 230000008859 change Effects 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 18
- 238000000034 method Methods 0.000 description 6
- 239000012809 cooling fluid Substances 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of packaging, and discloses a modified automatic packaging machine, which comprises a plastic packaging machine, wherein an upper die and a lower die are arranged on the plastic packaging machine, heating units corresponding to the upper die and the lower die are arranged on the upper die and the lower die, a containing cavity for containing and positioning a plurality of layers of chips is arranged between the upper die and the lower die, sealing columns are arranged on the upper die and the lower die and used for blocking fluid micro-channels on the plurality of layers of chips, a driving unit is arranged on the plastic packaging machine, the output end of the driving unit is connected with the upper die and used for driving the upper die to open and close the die, the sealing columns are hollow structures with two open ends, and the input ends of the sealing columns are communicated with a cooling liquid circulation system; in the plastic packaging process, the temperature of the multi-layer chip is reduced from the inside, so that the slow temperature change of the TSV channel connection part of the multi-layer chip is controlled, the expansion of the filling material is restrained, the stress concentration of the TSV channel connection part caused by severe temperature change is eliminated, and the breakage of the TSV channel connection part is avoided.
Description
Technical Field
The invention relates to the packaging field, in particular to a modified automatic packaging machine.
Background
2.5D packaging and 3D packaging are two commonly used wafer level multilayer stacking techniques. TSV is a vertical interconnection structure penetrating through Si wafers or chips, can complete the function of communicating upper and lower layers of wafers or chips, and is a key process for effectively improving the integration degree and the efficiency of a system in a wafer-level multilayer stacking technology; the TSV process requires that holes be etched on the die to form TSV channels 21, then the TSV channels 21 are filled with material, and then vertical electrical connection structures are formed by aligning and connecting the TSV channels 21 of two layers of wafers in a multi-layer chip or wafer packaging process.
Cu is a good conductive material and is low in cost, so that the Cu is the first choice of TSV filling material.
However, due to the mismatch between the thermal expansion coefficient of Cu and the Si material, in the plastic packaging process, the Cu filled in the TSV hole is thermally expanded, so that stress at the TSV connection of the multilayer chip or wafer is easily concentrated, and displacement in the horizontal direction is generated between the bonding surfaces of the upper and lower wafers, and then the bonding surfaces are broken, thereby causing the problem of reliability of the chip.
Disclosure of Invention
The invention provides a modified automatic packaging machine, which solves the technical problem that the stress concentration at the connecting position of TSV is easy to break in the multilayer chip plastic packaging process in the related technology.
The invention provides a transformation type automatic packaging machine, which comprises a plastic packaging machine, wherein an upper die and a lower die are arranged on the plastic packaging machine, heating units corresponding to the upper die and the lower die are arranged on the upper die and the lower die, a containing cavity for containing and positioning a multi-layer chip is arranged between the upper die and the lower die, sealing columns are arranged on the upper die and the lower die and used for blocking fluid micro-channels on the multi-layer chip, a driving unit is arranged on the plastic packaging machine, the output end of the driving unit is connected with the upper die and used for driving the upper die to open and close the die, the sealing columns are hollow structures with two open ends, the input ends of the sealing columns are communicated with a cooling liquid circulation system, and when the upper die and the lower die are matched, the sealing columns are just matched with the fluid micro-channels on the multi-layer chip and are inserted into the fluid micro-channels.
In a preferred embodiment, the sealing column comprises a first sealing column and a second sealing column, the first sealing column is of a hollow structure with two open ends, the input end of the first sealing column is communicated with the cooling liquid circulating system, and the second sealing column is of a solid structure.
In a preferred embodiment, the upper die is provided with an upper die cavity, the lower die is provided with a lower die cavity, the first sealing post is arranged in the upper die cavity, and the second sealing post is arranged in the lower die cavity.
In a preferred embodiment, two first sealing columns are provided, wherein one end of the first sealing column is in communication with the output of the cooling fluid circulation system and the other end of the first sealing column is in communication with the input of the cooling fluid circulation system.
In a preferred embodiment, the cooling liquid circulation system comprises a cooling tank filled with cooling liquid, the output end of the cooling tank is connected with one of the first sealing columns through a connecting pipe, the input end of the cooling liquid is connected with the other first sealing column, and a water pump is connected between the connecting pipe and the first sealing column.
In a preferred embodiment, the upper die cavity and the lower die cavity are both matched with the multi-layer chip, the driving unit is a driving cylinder, and the heating unit is a coil heating mechanism.
In a preferred embodiment, the modified automatic packaging machine further comprises a feeding machine, a transfer feeding conveyor and a cutting blanking machine, wherein the output end of the feeding machine corresponds to the input end of the transfer feeding conveyor, the output end of the transfer feeding conveyor corresponds to the input end of the plastic packaging machine, and the output end of the plastic packaging machine corresponds to the input end of the cutting blanking machine.
In a preferred embodiment, the feeding machine consists of a product feeding frame, a lead frame feeding and discharging assembly for feeding the lead frame, a chip feeding assembly line for feeding chips, a chip carrying assembly for carrying chips and a chip preheating platform for preheating the chips, wherein the multi-layer chips are carried to the chip preheating platform for preheating through the chip feeding assembly line and the chip carrying assembly, and the lead frame is also carried to the chip preheating platform through the lead frame feeding and discharging assembly for being matched with the multi-layer chips for preheating; install the slide rail in the material loading frame, chip handling subassembly slidable mounting is on the slide rail, installs drive arrangement in the material loading frame, and drive arrangement's output is connected with chip handling subassembly, and drive arrangement is used for driving chip handling subassembly along slide rail reciprocating motion.
In a preferred embodiment, the transfer material loading conveyer comprises transfer frame, transfer transplanting platform subassembly, plastic envelope material loading subassembly, chip tool transport subassembly, plastic envelope machine material loading transport subassembly and unloading upset subassembly, and transfer material loading conveyer is arranged in carrying the multilayer chip that coordinates well with the lead frame in the material loading machine to the plastic envelope machine plastic envelope, carries back the chip preheating platform with the multilayer chip after the plastic envelope again from the plastic envelope machine to provide the plastic envelope material that is used for plastic envelope multilayer chip in the plastic envelope machine.
In a preferred embodiment, the cutting and blanking machine consists of a blanking frame, a finished chip conveying assembly, a finished chip cutting assembly and a finished chip receiving assembly, and is used for cutting and outputting finished multi-layer chips from the multi-layer chips after plastic packaging.
The invention has the beneficial effects that:
1. in the plastic packaging process, the cooling liquid is pumped into the sealing column through the cooling liquid circulation system and circulates in the fluid micro-channel, so that whether the fluid micro-channel can be normally used or not can be tested, the temperature of the multi-layer chip can be reduced, the slow change of the temperature of the connecting part of the TSV channel of the multi-layer chip can be controlled, the expansion of the filling material can be restrained, the stress concentration of the connecting part of the TSV channel caused by severe temperature change can be eliminated, and the occurrence of the cracking condition of the connecting part of the TSV channel in the plastic packaging process can be avoided.
2. In the plastic packaging process, the first sealing column and the second sealing column are respectively inserted into the corresponding fluid micro-channels, and the plastic-packaged multilayer chips are subjected to limited positioning in the horizontal direction, so that the upper layer wafer and the lower layer wafer cannot deviate in the horizontal direction, the filling material in the TSV channel cannot move in the horizontal direction after being heated and expanded, the distortion degree of the filling material in the TSV channel between the upper layer wafer and the lower layer wafer on the joint surface is reduced, and the influence of stress concentration at the TSV joint of the multilayer chips caused by expansion and distortion of the filling material is eliminated.
Drawings
Fig. 1 is a schematic view showing the overall external appearance of the automatic packaging machine of the present invention.
Fig. 2 is a schematic front view of the plastic sealing machine of the present invention.
Fig. 3 is a schematic view of the structure of the present invention from the A-A perspective in fig. 2.
Fig. 4 is a schematic view showing a first state in which the multi-layered chip of the present invention is placed in the upper and lower molds.
Fig. 5 is a schematic view showing a second state in which the multi-layered chip of the present invention is placed in the upper and lower molds.
Fig. 6 is a schematic view showing the state in which the parts of the automatic packaging machine of the present invention are separated.
Fig. 7 is a schematic structural view of the feeder of the present invention.
Fig. 8 is a schematic structural view of the transfer and loading conveyor of the present invention.
Fig. 9 is a schematic view of the structure of the cutter blanking machine of the present invention.
In the figure: 1. a plastic packaging machine; 11. an upper die; 12. a lower die; 13. a cooling liquid circulation system; 14. an upper die cavity; 15. a lower die cavity; 16. a first seal post; 17. a second seal post; 2. a multi-layer chip; 21. a TSV channel; 22. a fluid microchannel; 3. a lead frame; 4. a feeding machine; 41. a lead frame loading and unloading assembly; 42. chip feeding assembly line; 43. a chip handling assembly; 44. a chip preheating platform; 45. a slide rail; 46. a driving device; 5. a transfer loading conveyor; 51. a transfer transplanting platform assembly; 52. a plastic package material feeding assembly; 53. the chip jig carrying assembly; 54. feeding and carrying components of the plastic packaging machine; 55. a blanking overturning assembly; 6. cutting and blanking machine; 61. a finished chip transport assembly; 62. a finished chip cutting assembly; 63. and a finished chip receiving component.
Detailed Description
The subject matter described herein will now be discussed with reference to example embodiments. It is to be understood that these embodiments are merely discussed so that those skilled in the art may better understand and implement the subject matter described herein and that changes may be made in the function and arrangement of the elements discussed without departing from the scope of the disclosure herein. Various examples may omit, replace, or add various procedures or components as desired. In addition, features described with respect to some examples may be combined in other examples as well.
As shown in fig. 1-9, the improved automatic packaging machine comprises a plastic packaging machine 1, an upper die 11 and a lower die 12 are arranged on the plastic packaging machine 1, heating units corresponding to the upper die 11 and the lower die 12 are arranged on the upper die 11 and the lower die 12, a containing cavity for containing and positioning the multilayer chip 2 is arranged between the upper die 11 and the lower die 12, sealing columns are arranged on the upper die 11 and the lower die 12 and used for blocking a fluid micro-channel 22 on the multilayer chip 2, a driving unit is arranged on the plastic packaging machine 1, the output end of the driving unit is connected with the upper die 11 and used for driving the upper die 11 to open and close, the sealing columns are hollow structures with two open ends, the input ends of the sealing columns are communicated with a cooling liquid circulation system 13, and when the upper die 11 and the lower die 12 are closed, the sealing columns are just matched with the fluid micro-channel 22 on the multilayer chip 2 and are inserted into the fluid micro-channel 22, so that cooling liquid can circularly and reciprocally dissipate heat in the fluid micro-channel 22 and the cooling liquid circulation system 13.
In this embodiment, the implementation scenario specifically includes: the multi-layer chip 2 and the lead frame 3 are carried into the plastic packaging machine 1 together, the accommodating cavity between the multi-layer chip 2 and the upper die and the lower die are well corresponding, then plastic packaging epoxy resin is injected into the accommodating cavity, the driving unit drives the upper die 11 to move downwards to be matched with the lower die 12 for die assembly, in the die assembly process, the sealing column moves downwards to be inserted into an inlet and an outlet of a fluid micro-channel 22 on the multi-layer chip 2, and then the heating unit is started for melting the epoxy resin to wrap the multi-layer chip 2 and the lead frame 3, so that the elements are protected from being damaged and the internal chip is prevented from being oxidized by gas; in the heating process, the external cooling liquid circulation system 13 pumps cooling liquid into the sealing column, so that the cooling liquid enters through the inlet of the fluid micro-channel 22 and flows out from the outlet, and the cooling liquid is cooled from the inside of the multilayer chip 2, thereby being beneficial to controlling the slow change of the temperature of the connection part of the epoxy resin attached to the surface of the multilayer chip 2 to the TSV channel 21 of the chip, inhibiting the expansion of filler copper, further eliminating the stress concentration of the connection part of the TSV channel 21 caused by the severe temperature change and avoiding the breakage of the connection part of the TSV channel 21; in addition, the cooling liquid rapidly takes away the heat of the multi-layer chip 2, which is also beneficial to the molding of the epoxy resin fluid on the surface of the chip and improves the packaging efficiency.
The sealing column comprises a first sealing column 16 and a second sealing column 17, the first sealing column 16 is of a hollow structure with two open ends, the input end of the first sealing column 16 is communicated with the cooling liquid circulation system 13, and the second sealing column 17 is of a solid structure.
It should be noted that, in the process of carrying the multilayer chip 2 and the lead frame 3 into the plastic packaging machine 1 together and making the cavities between the multilayer chip 2 and the upper and lower molds correspond well, the fluid micro-channel 22 of the bottom wafer of the multilayer chip 2 is matched with the solid second sealing post 17, so that the fluid micro-channel 22 of the bottom wafer is sealed, which is favorable for avoiding the fluid epoxy resin from entering the fluid micro-channel 22 to cause blockage.
It should be further noted that, the first sealing post 16 and the second sealing post 17 are respectively inserted into the corresponding fluid micro-channels 22, and limit and position the plastic-packaged multilayer chip 2 in the horizontal direction, so that the upper layer wafer and the lower layer wafer cannot deviate in the horizontal direction, the filling material in the TSV channel 21 is ensured not to move in the horizontal direction after being heated and expanded, the distortion degree of the filling material in the TSV channel 21 between the upper layer wafer and the lower layer wafer at the bonding surface is reduced, and the influence of stress concentration at the TSV connection position of the multilayer chip 2 caused by expansion and distortion of the filling material is eliminated.
The upper die 11 is provided with an upper die cavity 14, the lower die 12 is provided with a lower die cavity 15, a first sealing column 16 is arranged in the upper die cavity 14, and a second sealing column 17 is arranged in the lower die cavity 15.
In one embodiment of the present invention, the first sealing columns 16 are provided in two, wherein one end of the first sealing column 16 is communicated with the output end of the cooling liquid circulation system 13, and the other end of the first sealing column 16 is communicated with the input end of the cooling liquid circulation system 13, so that the cooling liquid circulates in the fluid micro-channel 22 and the cooling liquid circulation system 13.
In one embodiment of the invention, the cooling fluid circulation system 13 comprises a cooling tank filled with cooling fluid, the output end of the cooling tank is connected with one of the first sealing columns 16 through a connecting pipe, the input end of the cooling fluid is connected with the other first sealing column 16, and a water pump is connected between the connecting pipe and the first sealing column 16.
The transformation type automatic packaging machine further comprises a feeding machine 4, a transfer feeding conveyor 5 and a cutting blanking machine 6, wherein the output end of the feeding machine 4 corresponds to the input end of the transfer feeding conveyor 5, the output end of the transfer feeding conveyor 5 corresponds to the input end of the plastic packaging machine 1, and the output end of the plastic packaging machine 1 corresponds to the input end of the cutting blanking machine 6.
The feeding machine 4 consists of a product feeding frame, a lead frame feeding and discharging assembly 41 for feeding the lead frame 3, a chip feeding assembly line 42 for feeding chips, a chip carrying assembly 43 for carrying chips and a chip preheating platform 44 for preheating the chips, wherein the multilayer chips 2 are carried to the chip preheating platform 44 for preheating through the chip feeding assembly line 42 and the chip carrying assembly 43, and the lead frame 3 is also carried to the chip preheating platform 44 through the lead frame feeding and discharging assembly 41 for being matched with the multilayer chips 2 for preheating; the feeding frame is provided with a sliding rail 45, the chip carrying assembly 43 is slidably arranged on the sliding rail 45, the feeding frame is provided with a driving device 46, the output end of the driving device 46 is connected with the chip carrying assembly 43, and the driving device 46 is used for driving the chip carrying assembly 43 to reciprocate along the sliding rail 45.
It should be noted that, the action flow of the feeder 4 includes that the lead frame 3 is manually placed into the lead frame loading and unloading assembly 41, then the lead frame 3 is sent into the chip loading assembly line 42 by the lead frame loading and unloading assembly 41, and is matched with the multi-layer chips 2 in the chip loading assembly line 42 to form a chip jig, and then the chip jig is conveyed from the chip loading assembly line 42 to the chip preheating platform 44 through the chip conveying assembly 43 to preheat the chip jig.
The transfer material loading conveyer 5 comprises transfer frame, transfer transplanting platform subassembly 51, plastic envelope material loading subassembly 52, chip tool transport subassembly 53, plastic envelope machine material loading transport subassembly 54 and unloading upset subassembly 55, and transfer material loading conveyer 5 is arranged in carrying the multilayer chip 2 that coordinates well with lead frame 3 in the material loading machine 4 to plastic envelope machine 1 in plastic envelope, carries back chip preheating platform 44 with the multilayer chip 2 after the plastic envelope from plastic envelope machine 1 again to provide the 2 plastic envelope material that is used for plastic envelope multilayer chip in the plastic envelope machine 1.
It should be noted that, the work flow of the transfer and loading conveyor 5: firstly, the chip jig carrying component 53 carries the chip jig from the chip preheating platform 44 to the transfer and transplanting platform component 51, then, the transfer and transplanting platform component 51 lifts the chip jig onto the plastic packaging machine feeding carrying component 54, then the plastic packaging machine feeding carrying component 52 carries the plastic packaging material into the plastic packaging machine feeding carrying component 54, the plastic packaging machine feeding carrying component 54 carries the chip jig and the plastic packaging material into the plastic packaging machine 1, after the plastic packaging is completed, the plastic packaging machine feeding carrying component 54 carries the plastic packaged chip jig out and places the plastic packaged chip jig on the transfer and transplanting platform component 51, then, the blanking overturning component 55 takes out the plastic packaged multilayer chip 2 from the jig of the transfer and transplanting platform component 51, and the chip jig carrying component 53 carries the empty chip jig back to the chip preheating platform 44.
The cutting and blanking machine 6 is composed of a blanking frame, a finished chip conveying assembly 61, a finished chip cutting assembly 62 and a finished chip receiving assembly 63, and the cutting and blanking machine 6 is used for cutting the plastic-packaged multilayer chips 2 and outputting the finished multilayer chips 2.
The operation flow of the cutting blanking machine 6 is as follows: firstly, the finished chip transporting assembly 61 takes the encapsulated multi-layer chip 2 out of the blanking overturning assembly 55 and puts it into the finished chip cutting assembly 62, then, the finished chip cutting assembly 62 cuts the encapsulated multi-layer chip 2, then, the finished chip transporting assembly 61 takes the cut multi-layer chip 2 out and puts it into the finished chip receiving assembly 63, and finally, the finished multi-layer chip 2 is manually taken out from the finished chip receiving assembly 63.
From the whole action flow of the packaging machine, the participation of personnel is reduced in the action of the whole equipment, and the working strength of the personnel is reduced, so that the manpower is reduced.
The packaging machine overcomes the defects of the existing semi-automatic packaging machine: the manpower requirement is high; the working intensity of personnel is high; the efficiency is low; the quality is easy to be poor; the working environment is high in risk. Full-automatic packaging is realized, and personnel only need to feed and receive materials.
The embodiment has been described above with reference to the embodiment, but the embodiment is not limited to the above-described specific implementation, which is only illustrative and not restrictive, and many forms can be made by those of ordinary skill in the art, given the benefit of this disclosure, are within the scope of this embodiment.
Claims (9)
1. The improved automatic packaging machine is characterized by comprising a plastic packaging machine (1), wherein an upper die (11) and a lower die (12) are arranged on the plastic packaging machine (1), heating units corresponding to the upper die (11) and the lower die (12) are arranged on the upper die (11) and the lower die (12), a containing cavity for containing and positioning a multi-layer chip (2) is arranged between the upper die (11) and the lower die (12), sealing columns are arranged on the upper die (11) and the lower die (12) and used for blocking a fluid micro-channel (22) on the multi-layer chip (2), a driving unit is arranged on the plastic packaging machine (1), the output end of the driving unit is connected with the upper die (11) and used for driving the upper die (11) to open and close, the sealing columns are hollow structures with two ends open, the input ends of the sealing columns are communicated with a cooling liquid circulation system (13), and when the upper die (11) and the lower die (12) are closed, the sealing columns are matched with the fluid micro-channel (22) on the multi-layer chip (2) and are inserted into the fluid micro-channel (22); the sealing column comprises a first sealing column (16) and a second sealing column (17), the first sealing column (16) is of a hollow structure with two open ends, the input end of the first sealing column (16) is communicated with the cooling liquid circulating system (13), and the second sealing column (17) is of a solid structure.
2. The reforming type automatic packaging machine as defined in claim 1, wherein an upper die cavity (14) is provided on the upper die (11), a lower die cavity (15) is provided on the lower die (12), the first sealing column (16) is installed in the upper die cavity (14), and the second sealing column (17) is installed in the lower die cavity (15).
3. The retrofit automatic packaging machine according to claim 2, characterized in that two first sealing columns (16) are provided, wherein the end of one first sealing column (16) is in communication with the output of the cooling liquid circulation system (13) and the end of the other first sealing column (16) is in communication with the input of the cooling liquid circulation system (13).
4. A modified automatic packaging machine as claimed in claim 3, characterized in that the cooling liquid circulation system (13) comprises a cooling tank filled with cooling liquid, the output end of the cooling tank is connected with one of the first sealing columns (16) through a connecting pipe, the input end of the cooling liquid is connected with the other first sealing column (16), and a water pump is connected between the connecting pipe and the first sealing column (16).
5. The modified automatic packaging machine according to claim 4, wherein the upper die cavity (14) and the lower die cavity (15) are both matched with the multi-layer chip (2), the driving unit is a driving cylinder, and the heating unit is a coil heating mechanism.
6. The modified automatic packaging machine according to claim 5, further comprising a feeder (4), a transfer feeder (5) and a cutting feeder (6), wherein an output end of the feeder (4) corresponds to an input end of the transfer feeder (5), an output end of the transfer feeder (5) corresponds to an input end of the plastic packaging machine (1), and an output end of the plastic packaging machine (1) corresponds to an input end of the cutting feeder (6).
7. The improved automatic packaging machine according to claim 6, wherein the feeder (4) is composed of a product feeding frame, a lead frame feeding and discharging assembly (41) for feeding a lead frame (3), a chip feeding assembly line (42) for feeding chips, a chip carrying assembly (43) for carrying chips and a chip preheating platform (44) for preheating chips, the multi-layer chips (2) are carried to the chip preheating platform (44) for preheating through the chip feeding assembly line (42) and the chip carrying assembly (43), and the lead frame (3) is also carried to the chip preheating platform (44) through the lead frame feeding and discharging assembly (41) for being matched with the multi-layer chips (2) for preheating; install slide rail (45) in the material loading frame, chip handling subassembly (43) slidable mounting is on slide rail (45), install drive arrangement (46) in the material loading frame, the output of drive arrangement (46) is connected with chip handling subassembly (43), drive arrangement (46) are used for driving chip handling subassembly (43) along slide rail reciprocating motion.
8. The automatic packaging machine according to claim 7, wherein the transfer material loading and transporting machine (5) is composed of a transfer frame, a transfer and transplanting platform assembly (51), a plastic packaging material loading assembly (52), a chip jig transporting assembly (53), a plastic packaging machine material loading and transporting assembly (54) and a blanking turnover assembly (55), the transfer material loading and transporting machine is used for transporting the multi-layer chip (2) matched with the lead frame (3) in the material loading machine (4) into the plastic packaging machine (1) for plastic packaging, and then transporting the multi-layer chip (2) after plastic packaging back to the chip preheating platform from the plastic packaging machine (1), and providing (2) plastic packaging materials for plastic packaging the multi-layer chip into the plastic packaging machine (1).
9. The retrofit automatic packaging machine according to claim 8, wherein the cut-off blanking machine (6) is composed of a blanking frame, a finished chip transporting assembly (61), a finished chip cutting assembly (62) and a finished chip receiving assembly (63), and the cut-off blanking machine (6) is used for cutting off the multi-layer chips (2) after plastic packaging and outputting finished multi-layer chips (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310815471.7A CN116936375B (en) | 2023-07-05 | 2023-07-05 | Automatic packaging machine of modification formula |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310815471.7A CN116936375B (en) | 2023-07-05 | 2023-07-05 | Automatic packaging machine of modification formula |
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| Publication Number | Publication Date |
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| CN116936375A true CN116936375A (en) | 2023-10-24 |
| CN116936375B CN116936375B (en) | 2024-01-12 |
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| CN202310815471.7A Active CN116936375B (en) | 2023-07-05 | 2023-07-05 | Automatic packaging machine of modification formula |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09186183A (en) * | 1995-12-29 | 1997-07-15 | Sony Corp | Semiconductor sealing metallic mold die and semiconductor sealing device having this mold die and semiconductor device resin sealing method |
| CN218333706U (en) * | 2022-09-14 | 2023-01-17 | 苏州赛肯智能科技有限公司 | Automatic packaging device |
| CN116013813A (en) * | 2023-01-06 | 2023-04-25 | 苏州赛肯智能科技有限公司 | Full-automatic packaging system |
-
2023
- 2023-07-05 CN CN202310815471.7A patent/CN116936375B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09186183A (en) * | 1995-12-29 | 1997-07-15 | Sony Corp | Semiconductor sealing metallic mold die and semiconductor sealing device having this mold die and semiconductor device resin sealing method |
| CN218333706U (en) * | 2022-09-14 | 2023-01-17 | 苏州赛肯智能科技有限公司 | Automatic packaging device |
| CN116013813A (en) * | 2023-01-06 | 2023-04-25 | 苏州赛肯智能科技有限公司 | Full-automatic packaging system |
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| CN116936375B (en) | 2024-01-12 |
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