KR20170132663A - Compression-molding apparatus, device for manufacturing resin-sealed component, compression-molding method and method for manufacturing resin-sealed component - Google Patents

Abstract

Provided is a compression molding device which is capable of efficiently compression molding both surfaces of a substrate without using a release film. The compression molding device of the present invention comprises a forming mold (10) including an upper mold (100) and a lower mold (200), wherein at least a portion of a top surface of a lower mold bottom surface member (220) forms a bottom surface of a lower mold cavity (201); at least a portion of an inner surface of a lower mold side surface member (230) forms a side surface of the lower mold cavity (201); the both surfaces of the substrate (1) disposed between both of the cavities are resin-sealed through compression molding by the lower mold cavity (201) and an upper mold cavity (131); the lower mold bottom surface member (220) and lower mold side surface member (230) are each separately ascended and descended to release a resin-sealed product (1B) obtained by resin-sealing the substrate (1) from the lower mold cavity (201); and an ejector pin (143) is protruded from a top surface of the upper mold cavity (131) to release the resin-sealed product (1B) from the upper mold cavity (131).

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a compression molding apparatus, a resin encapsulation article manufacturing apparatus, a compression molding method,

The present invention relates to a compression molding apparatus, a resin encapsulation article manufacturing apparatus, a compression molding method, and a manufacturing method of a resin encapsulation article.

In the case of compressing and molding one surface or both surfaces of a substrate, separation is carried out using a release film in order to easily separate a compression molded (resin sealed) resin sealing product (for example, Patent Document 1).

Japanese Patent Application Laid-Open No. 2005-225133

However, the use of a release film increases the cost. Recently, for example, there have been varieties in which the thickness of a package is increased to resin-encapsulate a power device (power semiconductor device), and resin sealing is applied to both sides of the frame (substrate). In this case, if the depth of the cavity is increased to increase the thickness of the package, the amount of the release film stretched when the release film is covered with the cavity increases, so that the release film tears and the molding can not be performed.

Accordingly, it is an object of the present invention to provide a compression molding apparatus, an apparatus for manufacturing a resin sealing product, a compression molding method, and a method for manufacturing a resin sealing article, which can compressively mold both sides of a substrate efficiently without using a release film.

In order to achieve the above object, a compression molding apparatus of the present invention includes a molding die having upper and lower molds, the upper and lower molds each have a cavity on an opposite surface, the lower mold has a lower mold- Wherein at least a part of the upper surface of the lower mold half member constitutes the bottom surface of the lower mold cavity and at least a part of the inner side surface of the lower mold side member constitutes a side surface of the lower mold cavity, Wherein the upper mold has ejector pins which can be retracted from and retracted from the upper surface of the upper cavity, both sides of the substrate placed between the lower cavities and the upper cavities by resin molding by compression molding , The lower bottom member and the lower side member are separately lifted and lowered , The resin-sealing product obtained by the resin-sealing of the substrate and the release from the lower die cavity, and a by projecting an ejector pin from the upper surface of the mold cavity, the sealing resin product characterized by releasing from the mold cavity.

The resin seal product manufacturing apparatus of the present invention comprises a material receiving module for receiving a resin material as a raw material of a fluid resin and at least one molding module,

Characterized in that the molding module comprises the compression molding device of the present invention and at least one of the molding modules is removable relative to the material receiving module and at least one of the molding modules is removable relative to the other molding modules .

The compression molding method of the present invention comprises: a compression molding step of resin-sealing both sides of the substrate by compression molding using the compression molding apparatus of the present invention or the resin sealing article manufacturing apparatus of the present invention; And a mold releasing step of releasing the resin encapsulant from the molding die after the compression molding, wherein in the compressing step, both sides of the substrate disposed between the two cavities by the lower mold cavity and the upper mold cavity are compression molded And the lower mold side member and the lower mold side member are separately raised and lowered in the mold releasing step so that the resin encapsulation product is released from the lower cavity and the ejector pin is protruded from the upper surface of the upper cavity, And the resin encapsulation product is released from the upper mold cavity.

The method for producing a resin encapsulation product of the present invention is characterized by producing the resin encapsulation product using the compression molding method of the present invention.

According to the present invention, it is possible to provide a compression molding apparatus, an apparatus for producing a resin sealing product, a compression molding method, and a method for manufacturing a resin sealing article, which can compression-mold both sides of a substrate efficiently without using a release film.

1 is a cross-sectional view schematically showing the structure of a molding die in the compression molding apparatus of the first embodiment.
2 is a cross-sectional view schematically showing one step of a compression molding method (a method of manufacturing a resin-sealed article) using the compression molding apparatus of FIG.
3 is a cross-sectional view schematically showing another step of the compression molding method (the method of manufacturing a resin-sealed article) same as that of Fig.
Fig. 4 is a cross-sectional view schematically showing another step of the compression molding method (a method of manufacturing a resin-sealed article) same as that of Fig. 2;
5 is a cross-sectional view schematically showing another step of a compression molding method (a method of manufacturing a resin-sealed article) similar to that of Fig.
Fig. 6 is a cross-sectional view schematically showing another step of the compression molding method (a method of manufacturing a resin-sealed article) same as that in Fig.
7 is a cross-sectional view schematically showing another step of the compression molding method (the method of manufacturing a resin-sealed article) same as that of Fig.
8 is a cross-sectional view schematically showing another step of the compression molding method (the method of manufacturing a resin-sealed article) same as that of Fig.
9 is a cross-sectional view schematically showing another step of the compression molding method (the method of manufacturing a resin-sealed article) same as that of Fig.
10 is a cross-sectional view schematically showing another step of a compression molding method (a method of manufacturing a resin-sealed article) same as that in Fig.
Fig. 11 is a cross-sectional view schematically showing another step of the compression molding method (the method of producing a resin-sealed article) same as that of Fig.
12 is a cross-sectional view schematically showing one step of a modification of the compression molding apparatus and the compression molding method (the method of manufacturing a resin-sealed article) of the first embodiment.
Fig. 13 is a cross-sectional view schematically showing another process in the same compression molding apparatus and compression molding method as in Fig. 12 (method of manufacturing a resin-sealed article).
14 is a cross-sectional view schematically showing one step of another modification of the compression molding apparatus and the compression molding method (the method of manufacturing a resin-sealed article) according to the first embodiment.
Fig. 15 is a cross-sectional view schematically showing another process in the same compression molding apparatus and compression molding method (resin sealing product manufacturing method) as in Fig. 14. Fig.
Fig. 16 is a cross-sectional view schematically showing another process in the compression molding apparatus and the compression molding method (a method of manufacturing a resin-sealed article) same as those in Fig. 14. Fig.
Fig. 17 is a cross-sectional view schematically showing another process in the same compression molding apparatus and compression molding method (resin sealing product manufacturing method) as in Fig. 14. Fig.
18 is a cross-sectional view schematically showing one step of another modified example of the compression molding apparatus and the compression molding method (resin sealed article manufacturing method) of the first embodiment.
19 is a cross-sectional view schematically showing one step of a compression molding apparatus and a compression molding method (a method of manufacturing a resin-sealed article) according to the second embodiment.
Fig. 20 is a cross-sectional view schematically showing another step of the compression molding method (the method of manufacturing a resin-sealed article) same as that of Fig.
Fig. 21 is a cross-sectional view schematically showing another step of the compression molding method (a method of manufacturing a resin-sealed article) same as that of Fig.
22 is a cross-sectional view schematically showing another step of the compression molding method (the method of manufacturing a resin-sealed article) same as that of Fig.
Fig. 23 is a cross-sectional view schematically showing another step of the compression molding method (a method of manufacturing a resin-sealed article) same as that of Fig.
Fig. 24 is a cross-sectional view schematically showing another step of the compression molding method (a method of manufacturing a resin-sealed article) same as that of Fig.
25 is a cross-sectional view schematically showing one step of a compression molding apparatus and a compression molding method (a method of manufacturing a resin-sealed article) according to the third embodiment.
26 is a cross-sectional view schematically showing another step of the compression molding method (the method of manufacturing a resin-sealed article) same as that of Fig.
Fig. 27 is a cross-sectional view schematically showing another step of a compression molding method (a method of manufacturing a resin-sealed article) same as that of Fig.
28 is a cross-sectional view schematically showing one step of a compression molding apparatus and a compression molding method (a method of manufacturing a resin-sealed article) according to the fourth embodiment.
29 is a cross-sectional view schematically showing another step of a compression molding method (a method of manufacturing a resin-sealed article) same as that of Fig.
30 is a cross-sectional view schematically showing one step of a compression molding apparatus and a compression molding method (a method of manufacturing a resin-sealed article) according to the fifth embodiment.
31 is a cross-sectional view schematically showing another step of a compression molding method (a method of manufacturing a resin-sealed article) same as that of Fig. 30;
32 is a cross-sectional view showing a mode of communicating the gap between the lower mold cavity and the sealing resin with the outer space which is the outer space of the molding die in the sixth embodiment.
Fig. 33 is a cross-sectional view showing another form of communicating the gap between the lower cavity and the sealing resin with the outer space, which is the outer space of the molding die.
34 is a schematic plan view schematically showing an apparatus for producing a resin encapsulation product according to a seventh embodiment.

Next, the present invention will be described in more detail by way of example. However, the present invention is not limited by the following description.

In the compression molding apparatus of the present invention, for example, at least one of the lower side surface member and the lower surface side member has a through hole penetrating from the inner surface (lower cavity side) to the outer surface (outer space side) The inner surface of the bottom of the hole may be closed with respect to the inner surface of the lower cavity when the resin is sealed by the lower cavity and may be opened with respect to the inner surface of the lower cavity when releasing the resin seal from the lower cavity. Further, in the compression molding method of the present invention using the compression molding apparatus of the present invention, for example, in the resin sealing step, the lower mold inner surface side of the through hole is closed with respect to the inner surface of the lower cavity, The one side surface of the substrate is sealed by the cavity and the inner side of the lower mold of the through hole is opened with respect to the inner surface of the lower cavity when releasing the resin encapsulation product from the lower cavity in the releasing step .

In the compression molding apparatus of the present invention, for example, the lower side member has the through-hole penetrating from the inner side surface to the outer side surface thereof, and when the resin is sealed by the lower cavity, The lower side lower side member is closed by the lower side bottom face member and the lower side bottom face member is relatively lowered relative to the lower side face member when releasing the resin sealing product from the lower cavity, May be opened relative to the lower mold cavity. In the compression molding method of the present invention using the compression molding apparatus of the present invention, for example, in the resin sealing step, the inner side surface of the lower side member of the through hole is closed by the lower side surface member By lowering the lower mold base member relative to the lower mold side member when resin sealing the one surface of the substrate by the lower mold cavity and releasing the resin encapsulation product from the lower mold cavity in the mold releasing step, The inner side of the through hole of the lower side member can be opened to the lower cavity.

The compression molding apparatus according to the present invention may have a columnar member inside the through-hole, for example, as the columnar member is inserted into the inner side of the lower die of the through-hole, And the columnar member can be pulled out from the inner side of the lower mold of the through hole to open the inner side of the lower mold. Further, in the compression molding method of the present invention using the compression molding apparatus of the present invention, for example, in the resin sealing step, the columnar member is inserted into the lower inner surface side of the through hole, Sealing the one surface of the substrate by the lower cavity in the closed state and pulling the columnar member from the lower surface of the lower surface of the through hole in the releasing step to open the lower surface of the lower surface.

In addition, for example, the through-hole is provided in the lower bottom member, the through-hole of the lower bottom member penetrates from the upper surface to the lower surface of the lower member, Wherein when the resin sealing by the lower cavity is performed, the upper surface side of the through hole of the lower mold bottom member is closed by the columnar member, and when the resin-sealed substrate is released from the lower cavity, The upper surface side of the through hole of the lower bottom member can be opened with respect to the inner surface of the lower cavity by relatively lowering the upper member relative to the lower bottom member.

In the compression molding apparatus of the present invention, for example, the lower side member has a frame floating pin, and the frame floating pin is capable of loading and unloading from the upper surface of the lower side member while allowing the substrate to be mounted thereon. Further, in the compression molding method of the present invention using the compression molding apparatus of the present invention, for example, when the resin encapsulation product is released from the lower cavity in the mold releasing step, The frame floating pin can be projected from the upper surface of the lower side member.

In the compression molding apparatus of the present invention, for example, the frame floating pin is provided so as to protrude upward from the upper surface of the lower side member, and the frame floating pin is mounted on the upper surface of the lower side member, can do. Further, for example, the frame floating pin includes a projection-like substrate positioning portion at its tip, and the substrate positioning portion is inserted into the through hole provided in the substrate, so that the frame floating pin can mount the substrate have.

In the compression molding method of the present invention, for example, the compression molding step includes a step of filling the upper mold cavity and the lower mold cavity with a fluid resin, a step of tightening the molding mold, (Sealing resin) by curing the fluid resin in the step (a).

The compression molding apparatus of the present invention includes a lower base, a support member installed upright on the lower base, an upper base provided on the upper portion of the support member and opposed to the lower base, A first driving mechanism mounted on the lower base, a second driving mechanism mounted on the lifting and lowering unit, a main connecting member connecting the first driving mechanism and the lifting and lowering unit, And a second sub connecting member connected to the lower bottom connecting member, wherein the upper mold is mounted to the upper base, the first sub connecting member is connected to the elevating and lowering unit, The second sub-connecting member is connected to the second driving mechanism, and the lower side member is moved up and down by the lift mechanism by the first driving mechanism Ha is driven, the lower die bottom surface member can be driven up and down by the second drive mechanism. Further, the compression molding method of the present invention using such a compression molding apparatus is a method in which both the lower side member connected to the first sub-connecting member and the lower member connected to the second sub- A step of bringing the lower side surface member into contact with a member existing on the upper side and subsequently raising the lower side surface side member; a step of forming the lower type cavity by stopping the lower side surface side member at a predetermined position; After the step of molding the cured resin, the lower side member is lowered from the inner side (inner peripheral surface) of the lower side member with the lower surface (inner bottom) of the lower base member supporting the lower surface Separating the outer surface (outer peripheral surface) of the cured resin after the step of molding the cured resin, (Lower surface) of the cured resin from the upper surface (inner bottom surface) of the lower mold bottom member by lowering the lower mold bottom member in a state in which the outer surface (outer peripheral surface) of the cured resin is supported by the side , A step of lowering both the lower side member and the lower member, and a step of pulling out the resin-sealed product, wherein the first driving mechanism provided in the lower base of the compression molding apparatus is used, And the lower side member connected to the lifting and lowering unit is lifted and lowered via the first sub-connection member by using the second driving mechanism provided in the lifting and lowering unit, The lower bottom surface member connected to the second driving mechanism can be raised and lowered via the two sub-connection members.

The compression molding apparatus of the present invention includes a lower base, a support member provided upright on the lower base, an upper base provided on the upper portion of the support member and opposed to the lower base, A first driving mechanism mounted on the lower base, a second driving mechanism mounted on the lifting and lowering unit, a main connecting member connecting the first driving mechanism and the lifting and lowering unit, Further comprising a second sub connection member connected to the first sub connection member and the lower type bottom side member connected to each other, wherein the upper type is mounted to the upper base and the first sub connection member is connected to the second driving mechanism, Wherein the second sub connecting member is connected to the lifting and lowering unit, and the lower bottoming member is moved up and down by the lifting and lowering unit And the lower side member can be driven up and down by the second driving mechanism. Further, the compression molding method of the present invention using such a compression molding apparatus is a method in which the lower side member connected to the first sub-connecting member and the lower side bottom member connected to the second sub- A step of continuously raising the lower mold half member after bringing the lower mold side member into contact with the upper mold member, a step of forming the lower mold cavity by stopping the lower mold half member at a predetermined position, (Outer circumferential surface) of the cured resin from the inner side (inner circumferential surface) of the lower side member by lowering the lower side surface member after the step (Lower inner surface) of the lower mold bottom member by lowering the lower mold base member, A step of lowering the bottom side member and the bottom side member, and a step of pulling out the resin sealing product, wherein the first driving mechanism provided in the lower base of the compression molding apparatus is used And the second lower connecting member connected to the elevating and lowering unit is moved up and down via the second sub connecting member by driving the elevating and lowering unit up and down via the main connecting member to use the second driving mechanism provided in the elevating and lowering unit And the lower side member connected to the second driving mechanism is moved up and down via the first sub-connecting member.

The compression molding apparatus of the present invention further includes, for example, an ejector pin lowering restraining member, wherein the ejector pin lowering restraining member is configured to lift and lower the lower bottom member and the lower side member, It is possible to suppress a force for lowering the ejector pin from being applied when releasing from the lower mold cavity. In this case, for example, the lower die may have the ejector pin descent inhibiting member, and in the state of the mold fastening and the intermediate mold fastening, an upward force may be applied to the ejector pin by the ejector pin descent restraining member . When the resin sealing member is released from the lower cavity by raising and lowering the lower bottom member and the lower side member separately from each other, a force for lowering the ejector pin by the upward force can be suppressed have. More specifically, for example, in the state of the mold clamping and the intermediate mold clamping, the ejector pin fall suppressing member is brought into contact with a part of the member (ejector plate and return pin) engaged with the ejector pin , An upward force is applied to a member (ejector plate and return pin) engaged with the ejector pin by the ejector pin descent inhibiting member, thereby pushing the member (ejector plate and return pin) engaged with the ejector pin An upward force can be indirectly applied to the ejector pin.

Further, in the compression molding apparatus of the present invention, the through-hole of the lower mold is provided, for example, in the lower mold, and the through-hole communicates with the lower cavity inner surface (lower cavity surface) It can be empty. The communication hole may include, for example, an opening formed by the communication hole on the inner surface of the cavity. Further, in the compression molding method of the present invention using such a compression molding apparatus, for example, after the step of molding the cured resin, a mold surface provided in the lower mold and constituting the lower mold cavity, And a step of communicating the surface of the cured resin with the outer space via an opening of the communicating hole, the communicating hole communicating with the outer space, the communicating hole being provided in a mold surface constituting the lower cavity.

In addition, in the compression molding apparatus of the present invention, for example, the communication hole is provided in the lower side member, and the position where the communication hole is provided is determined by a gap between the mold surface of the lower side member and the sealing resin in the lower cavity May be a position that allows the gap to communicate with the outer space after it has started to be formed. Further, in the compression molding method of the present invention using such a compression molding apparatus, for example, a step of communicating the surface of the cured resin in the step of separating the end surface of the cured resin can be performed.

Further, in the compression molding apparatus of the present invention, for example, the communication hole is provided in a communication member composed of at least one of the lower side surface member and the lower surface side member, and a columnar member A top surface provided in the columnar member and inserted into the opening, and a rear wall extending from a position retracted from the opening toward a communication direction extending in a direction in which the communication hole extends from the opening, Wherein the columnar member is advanced toward the lower cavity until the upper surface reaches the opening, and the upper end of the columnar member is advanced toward the lower cavity until the upper end reaches the opening, The surface closes the opening, and the columnar member retreats toward the communicating direction And the communicating hole including the opening and the extending portion can communicate with the external space. Further, in the compression molding method of the present invention using such a compression molding apparatus, for example, before the step of filling the upper mold cavity and the lower mold cavity with the fluid resin, the upper end face of the column- By moving the columnar member toward the lower cavity until the columnar member is advanced toward the lower cavity so as to close the opening by using the upper face and then molding the hardened resin, Can be performed.

Further, in the compression molding apparatus of the present invention, for example, the first sub-connection member is connected to the lower side member each having a plurality of molding dies, and the second sub- The branch can be connected to the lower bottom member.

Further, the compression molding apparatus of the present invention is a compression molding apparatus which is provided, for example, between the upper base and the first sub-connection member and at least a space including the lower cavity and the upper cavity is made a closed space At least one sealing member provided between the upper base and the first sub connecting member, and decompression means connected to the closed space and depressurizing the closed space. Further, the compression molding method of the present invention using such a compression molding apparatus is characterized in that, for example, at least a step of forming a closed space by blocking a space including at least the lower cavity and the upper cavity from outside air, And a step of decompressing the closed space until completion of the operation.

The term " resin sealing " in the present invention means, for example, that the resin is cured (solidified), but not limited thereto. That is, in the present invention, " resin sealing " means that at least the resin may be in a state filled in the mold cavity when the mold is clamped, and the resin may not be cured (solidified) and may be in a fluidized state.

In the present invention, " mounting " includes " fixing ".

In general, the term " electronic component " refers to both a case where the chip is sealed before resin sealing and a case where the chip is sealed with resin. In the present invention, (Electronic component as a finished product) in which the chip is resin-sealed. In the present invention, the term " chip " refers to a chip in which at least a part of the chip is not subjected to resin sealing and is exposed, and at least one of a chip before resin sealing, Chip. The "chip" in the present invention specifically includes, for example, a chip such as an IC, a semiconductor chip, and a power control semiconductor device. In the present invention, a chip in which at least a part is not subjected to resin sealing but is exposed is referred to as " chip " for the sake of convenience in distinguishing it from an electronic component after resin sealing. However, the " chip " in the present invention is not particularly limited as long as at least a part of the chip is not sealed with resin and is exposed, and may not be a chip.

The substrate to be resin-sealed (also referred to as a frame or interposer) by the resin-sealing apparatus or the resin-sealing method of the present invention is not particularly limited and may be, for example, a lead frame, a wiring board, a wafer, For example, a circuit board such as a printed board. In the present invention, for example, only one surface of the substrate can be resin-sealed, and both surfaces can be resin-sealed. Further, the substrate may be, for example, a mounting substrate on which chips are mounted on one surface or both surfaces thereof. The method of mounting the chip is not particularly limited, and examples thereof include wire bonding and flip chip bonding. In the present invention, for example, an electronic part in which the chip is resin-sealed can be manufactured by resin-sealing one surface or both surfaces of the mounting board. The application of the resin-sealed substrate by the resin-sealing apparatus of the present invention is not particularly limited, and examples thereof include a high-frequency module substrate for a portable communication terminal, a module substrate for power control, and a substrate for device control. In the present invention, on the other hand, the " substrate " may be, for example, a lead frame or a silicon wafer. The shape of the substrate may be any shape and shape as long as it can be formed. For example, a rectangular or circular substrate may be used in plan view.

In the present invention, the term " flip chip " refers to an IC chip having a lump-shaped protruding electrode called a bump in an electrode (bonding pad) on the surface of the IC chip, or a chip form thereof. This chip can be down-mounted (facedown) and mounted on a wiring portion such as a printed circuit board. The flip chip is used, for example, as a chip for wireless bonding or as a mounting method.

In the present invention, the " resin encapsulated article " is not particularly limited, but may be, for example, an electronic component in which a chip is resin-sealed by compression molding or the like. In the present invention, the " resin sealing product " may be an intermediate product for manufacturing a single or plural electronic components such as semiconductor products, circuit modules, and the like. In the present invention, the " resin encapsulation product " is not limited to an electronic component in which a chip is resin-sealed and an intermediate product thereof, but may be a resin encapsulation product or the like other than the electronic component.

The resin for sealing the resin in the present invention is not particularly limited and may be, for example, a thermosetting resin such as an epoxy resin or a silicone resin, and may be a thermoplastic resin. Further, it may be a composite material containing a thermosetting resin or a thermoplastic resin as a part. Examples of the form of the resin to be fed to the resin-sealing apparatus include a granular resin, a fluid resin, a sheet resin, a tablet resin, and a powdered resin.

In the present invention, the " fluid resin " is not particularly limited as long as it is a resin having fluidity, and examples thereof include a liquid resin and a molten resin. In the present invention, the term " liquid phase " means fluidity at normal temperature (room temperature) and flowing by applying a force, and it has high or low fluidity, in other words, viscosity. That is, in the present invention, the term " liquid resin " refers to a resin having fluidity at room temperature (room temperature) and flowing by applying a force. The term " molten resin " in the present invention refers to, for example, a resin which is in a liquid state or has fluidity by melting. The shape of the molten resin is not particularly limited, but can be supplied to, for example, a cavity or a port of a molding mold.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. The drawings are schematically shown by omission and exaggeration for the sake of convenience of explanation.

≪ Example 1 >

1 schematically shows an example of the configuration of the compression molding apparatus of the present invention. 1, for the sake of simplicity, the parts other than the molding die (drive mechanism, etc.) are not shown. As shown, this compression molding apparatus includes a molding die 10 having a top mold 100 and a bottom mold 200. The upper mold 100 has an upper mold cavity 131. The lower mold 200 has a lower mold cavity 201. The lower mold 200 has a lower mold bottom member 220 and a lower mold side member 230. As shown in the figure, the upper surface of the lower mold half member 220 constitutes the bottom surface of the lower mold cavity 201. In addition, a part of the inner surface of the lower side member 230 constitutes a side surface of the lower cavity 201. The lower bottom member 220 and the lower side member 230 are connected to a driving mechanism (not shown), respectively, and can be elevated separately. The upper mold 100 has an ejector pin 143 that can protrude and retract from the upper surface of the upper mold cavity 131. By the lower mold cavity 201, one surface of the substrate can be resin-sealed by compression molding as described later. The upper mold cavity 131 can resin-seal one surface of the substrate by compression molding as described later. As described later, the resin-sealed resin encapsulated article can be released from the lower cavity 201 by raising and lowering the lower bottom member 220 and the lower side member 230 separately. In addition, by ejecting the ejector pin 143 from the upper surface of the upper mold cavity 131, the resin encapsulation product can be released from the upper mold cavity 131.

The configuration of the forming mold 10 of Fig. 1 will be described in more detail. The upper mold 100 is constituted by the upper mold base block 110, the upper mold side block 120, the upper mold cavity block 130, the ejector plate 140 and the upper mold outer air blocking member 150. The upper mold base block 110 includes a first upper mold base block 111, a second upper mold base block 112, and a third upper mold base block 113 stacked and fixed in this order from the bottom up. The first upper base block 111 and the second upper base block 112 are stacked and fixed only in the central portion of the lower surface of the third upper base block 113. [ On the other hand, in the present invention, "A is fixed to B" includes a case where "A is attached to another member (including an elastic body) and B is fixed to the other member".

The ejector plate 140 has the first ejector plate 141 and the second ejector plate 142 stacked and fixed in this order from below. The ejector pins 143 and the return pins 144 are fixed to the second ejector plate 142 so as to protrude from the lower surface of the second ejector plate 142, respectively. The ejector pin 143 and the return pin 144 pass through the upper mold cavity block 130, respectively. The ejector pin 143 can move up and down from the upper surface of the upper mold cavity 131 by upward and downward movement. The return pin 144 is capable of projecting and retracting to the outside of the upper mold cavity 131 at the lower surface of the upper mold cavity block 130 by the upward and downward movement.

The first and second upper mold base blocks 111 and 112 have through holes, respectively. A collar 116 is inserted into the through hole of the first upper base block 111 and a bolt 117 is inserted into the through hole of the collar 116. The bolt (17) is movable up and down in the through hole of the collar (116). The head portion of the bolt 117 is disposed in the through hole of the second upper type base block 112. The tip of the bolt 117 opposite to the head portion is fixed in the screw hole in the second ejector plate 142. As a result, the bolt 117 and the ejector plate 140 are prevented from dropping by engaging the head portion of the bolt 117 on the upper surface of the first upper type base block 111. The outside of the collar 116 is surrounded by an elastic member 119 which can be stretched up and down. A stopper 115 is provided on the lower surface of the first upper base block 111. When the ejector plate 140 rises, the upper surface of the ejector plate 140 (the upper surface of the second ejector plate 142) comes into contact with the stopper 115, and further rise of the ejector plate 140 is stopped.

The upper mold side block 120 is arranged so as to surround the periphery of the ejector plate 140. The upper end of the upper mold side block 120 is fixed to the lower face of the first upper mold base block 111 and the lower end of the upper mold side block 120 is fixed to the upper face of the upper mold cavity block 130 respectively. Accordingly, the upper mold block 130 is fixed to the upper mold base block 110 via the upper mold side block 120. [ The ejector plate 140 can be moved up and down in a space surrounded by the upper mold base block 110, the upper mold side block 120, and the upper mold cavity block 130. A through hole is provided at the center of the ejector plate 140, and a support member 118 is penetrated. The support member 118 is disposed between the upper mold block 130 and the upper mold base block 110 and serves to support the upper mold side block 120 (supporting the upper mold cavity block 130). The support member 118 may be fixed to at least one of the first upper mold base block 111 and the upper mold cavity block 130.

In the third hinge base block 113, a hole (through hole) 114 is provided outside the portion where the first hinge base block 111 and the second hinge base block 112 are stacked. The inside of the molding die 10 can be depressurized through the through holes 114, as will be described later. The upper mold base block 110, the upper mold side block 120, the upper mold cavity block 130, and the ejector plate 140 are formed on the lower surface of the through hole 114 in the third upper mold base block 113, Shaped outer air blocking member 150 is fixed so as to surround the outer side of the upper outer air blocking member 150. [ An O-ring 150A is mounted on the lower surface of the upper-type outer-air shielding member 150. On the other hand, the O-ring 150A may be a sealing member having the same function instead of the O-ring. The attachment position of the O-ring (sealing member) is not particularly limited. For example, an O-ring (sealing member) can be mounted on the lower-type outer-air shielding member, which will be described later, instead of the upper- Further, the O-ring (sealing member) may be mounted as long as it can block the outside air.

The frame floating pin (substrate pin) 231 is provided so as to protrude upward from the upper surface of the lower side member 230 in a state of being mounted on the elastic member 233 inside the lower side member 230. 1, the frame floating pin 231 is a stepped pin and includes a substrate positioning portion 232 in the form of a projection at the tip thereof. The frame floating pin 231 can mount the substrate in a free state from the upper surface of the lower side member 230. Specifically, for example, by inserting the substrate positioning portion 232 into the through hole provided in the substrate, the lower side member 230 can be fixed in a free state. However, the structure of the frame floating pin in the present invention is not limited to this. For example, the frame positioning pin may be omitted. Further, for example, a hole (through hole) for inserting the substrate positioning portion may be provided I can not.

The substrate positioning portion 232 of the frame floating pin 231 is insertable into the retraction hole 132 of the lower surface of the upper mold cavity block 130. Thus, as will be described later, when the mold is clamped, a gap can be avoided between the substrate and the lower surface of the upper mold block 130.

In the lower side surface member 230, a push pin (ejector pin lowering restraining member) 234 is mounted on the elastic member 235 inside the lower side surface member 230 on the outer side of the frame floating pin 231 And protrudes upward from the upper surface of the lower side member 230. The push pin 234 is provided at a position opposed to the upper return pin 144, and the push pin 234 and the return pin 144 are in contact with each other when the mold is clamped, as described later.

In addition, the lower side member 230 is provided with a through hole 236. The through hole 236 penetrates from the inner side surface to the outer side surface of the lower side member 230. The inner side surface of the through hole 236 provided in the lower side surface member 230 is closed by the lower surface side surface member 220 when the resin is sealed by the lower mold cavity 201 as described later. When lowering the lower mold member 220 relative to the lower mold member 230 at the time of releasing the resin sealing member from the lower mold cavity 201, the through hole 236 of the lower mold member 230 And the inner side is opened with respect to the lower cavity 201.

In the lower mold base block 210, the first lower mold base block 211 and the second lower mold base block 212 are stacked and fixed in this order from above. The lower side member 230 is fixed on the first lower base block 211.

A lower type outer air blocking member 250 is fixed to the periphery of the upper surface of the second lower base block 212 to surround the first lower base block 211, the lower bottom member 220 and the lower side member 230 . The lower-type outer-air shielding member 250 is disposed at a position facing the upper-outer-type air blocking member 150. As described later, the upper end of the lower mold outer-air shielding member 250 is brought into contact with the O-ring 150A at the time of mold clamping.

The lower mold base block 210 is connected to a driving mechanism (not shown) and is movable up and down together with the lower side member 230 and the lower mold outer air blocking member 250.

A lower mounting member (mounting member) 221 is fixed to the lower surface of the lower mold base member 220. The mounting member 221 passes through the first lower die base block 211 and the second lower die base block 212. The mounting member 221 is connected to a driving mechanism (not shown) and is movable up and down independently of the lower base block 210, the lower side member 230 and the lower air atmosphere blocking member 250.

Next, an example of a compression molding method (a method of manufacturing a resin-sealed article) using the compression molding apparatus of Fig. 1 will be described with reference to Figs. 2 to 11. Fig.

First, as shown in Fig. 2, a granular resin (resin material) 20a is fed into the lower cavity 201. Fig. At this time, prior to the supply of the granular resin 20a, the entire lower mold 200 can be heated by a heating mechanism (not shown) in advance. The method of supplying the granular resin 20a is not particularly limited, and for example, the granular resin 20a can be transported to the position of the lower mold cavity 201 by using a transport mechanism (not shown) or the like. In addition, a suitable amount of the granular resin 20a can be supplied into the lower mold cavity 201, for example, by using a metering mechanism (not shown) or the like.

On the other hand, the resin material 20a exemplifies the granular resin in the present embodiment, but is not limited thereto. For example, the resin material 20a may be in any shape (e.g., powder, granule, agglomerate, sheet, flake shape, etc.) as long as it is solid at room temperature. The resin material 20a may be, for example, a thermosetting resin (for example, an epoxy resin, a silicone resin, or the like), and may be a thermoplastic resin.

Next, the substrate (frame) 1 is supplied (mounted) to the frame floating pin 231 as shown in Fig. Concretely, the substrate 1 is supplied (mounted) to the frame floating pin 231 by inserting the substrate positioning portion 232 at the front end of the frame floating pin 231 into the hole 3 of the substrate 1 . On the other hand, in Fig. 3, chips (electronic components that are not resin-sealed) 2 are fixed on both sides of the substrate 1 to constitute a pre-sealing substrate 1A. However, the substrate in the present invention is not limited thereto. For example, a substrate on which a chip is not fixed may be used, and a hole may not be provided in the substrate as described later. Although not shown, for example, the chip 2 and the substrate 1 may be connected by a bonding wire (wire bonding) for electrically connecting the chip 2 and the substrate (frame) 1 have.

3, the granular resin 20a is melted by the heat of the lower mold 200 to form a fluid resin (molten resin) 20b ). As described above, prior to the supply of the granular resin 20a, the entire lower mold 200 can be heated by the heating mechanism in advance.

Next, as shown in Fig. 4, the entirety of the lower mold 200 is raised in the direction of the arrow X1 to perform the intermediate mold clamping. More specifically, the lower type outside air shutoff member 250 (not shown) is provided by the drive mechanism (mold opening / closing mechanism, not shown) provided below the lower mold and connected to the lower side member 230 via the lower mold base block 210 ) And the O-ring 150A (middle mold clamping position). As a result, the molding die 10 is cut off from the outside air. The substrate 1 (the substrate 1A before the sealing) is not clamped (sandwiched) by the lower side member 230 and the upper mold cavity block, and the frame floating pin 231 is not clamped And is floating from the upper surface of the lower side member 230. Further, the tip of the push pin 234 of the lower die comes into contact with the tip of the upper return pin 144, so that the entire ejector plate 140 is slightly pushed up by the push pin 234.

On the other hand, for example, the O-ring (sealing member) 150A starts to be deformed by the contact with or contact with the lower-type outer-air shielding member 250 in the intermediate mold clamping state, but is not completely squashed.

5, the air in the molding die 10 is sucked in the direction of the arrow Y1 from the hole 114 of the third upper mold base block 113 and forced out, The inside of the mold 10 is decompressed. A sucking mechanism (not shown) can be used for sucking air. The suction mechanism is not particularly limited, but a vacuum pump or the like can be used, for example.

Next, as shown in Fig. 6, mold clamping (also referred to as final clamping or full mold clamping) is performed. Specifically, as shown in the drawing, the entire lower mold 200 is further raised in the direction indicated by the arrow X2, and the substrate 1 (substrate 1A before the sealing) (Sandwiched) by the spring 130. At this time, the entire ejector plate 140 is pushed up by the push pin 234 via the return pin 144 and raised. As shown in the drawing, the upper surface of the second ejector plate 142 comes into contact with the stopper 115, so that the elevation of the ejector plate 140 is stopped.

The substrate 1 (the substrate 1A before the sealing) is clamped (fitted) by the lower side member 230 and the upper mold cavity block 130, . The sealing member 150A is, for example, in a state in which it is sandwiched between the upper-type outer-air shielding member 150 and the lower-type outer-air shielding member 250. FIG.

Next, as shown in Fig. 7, the lower side bottom face member 220 is raised so that both sides of the substrate 1 are compression-molded. That is, as shown in the figure, the lower bottom member 220 is moved in the direction of the arrow Z1 by the drive mechanism (the bottom member drive mechanism, not shown) connected to the lower mold member 220, which is different from the mold opening / . The molten resin 20b flows into the upper mold cavity 131 from the hole 3 of the substrate 1 as shown in the drawing and the upper mold cavity 131 The resin is filled in the lower mold cavity 201 and the fluid resin 20b is pressed. On the other hand, the upper mold 100 can be heated by a heating mechanism (not shown) in advance. The heating mechanism of the upper die 100 may be the same as or different from the heating mechanism of the lower die 200.

Then, as time elapses, as shown in Fig. 8, the fluid resin 20b is cured to form a resin sealing product (resin molded article, package) 1B. On the other hand, for example, when the fluid resin 20b is thermosetting, the upper mold 100 and the lower mold 200 can be cured (solidified) by further heating. Further, for example, when the fluid resin 20b is thermoplastic, the upper mold 100 and the lower mold 200 can be cured by stopping heating. The resin encapsulation product 1B comprises the substrate 1 (including the hole 3 of the substrate), the encapsulating resin 20 and the chip 2 which is fixed to the substrate 1 and resin-sealed by the encapsulating resin 20, As shown in Fig. 8, the lower bottom member 220 is lowered in the direction of the arrow Z2 and the lower package bottom (the resin sealing product 1B) is lowered And the bottom surface of the sealing resin 20 on the lower cavity side). At this time, the sliding gap (not shown) between the through hole 236 provided in the lower side member 230 and the lower side side member 220 and the lower side member 230 is communicated with the lower cavity 201. Thereby, an air passage is formed between the lower mold cavity 201 and the outer surface of the lower side member 230. Accordingly, the space between the bottom surface of the bottom package formed by the release and the top surface of the bottom bottom member 220 is reduced by the lowering of the bottom bottom member 220 so that the bottom package (the sealing resin 20 on the bottom cavity side) Can be prevented from being pulled in. At this time, as shown in the drawing, the depressurization due to suction can be released from the upper hole 114.

Next, as shown in Fig. 9, the lower bottom member 220 is lifted in the direction of the arrow Z3 by the bottom member driving mechanism so that the lower package bottom (the lower end of the lower package cavity 1B) (The bottom surface of the resin 20). This is to suppress the deformation of the substrate 1 when releasing the lower package side (the side of the sealing resin 20 on the lower cavity side in the resin sealing product 1B) in the next step.

Then, as shown in Fig. 10, the lower mold side member 230 is lowered by the mold opening / closing mechanism to release the lower mold package side. At this time, the lower bottom member 220 is pressed (raised) in the direction of arrow Z3 by the bottom member driving mechanism so as not to descend. 10, even if the lower side member 230 is lowered, the force for pushing up the upper return pin 144 by the push pin 234 of the lower die is not released. This is because a force for pushing up the push pin 234 is applied by the elastic member 235 disposed below the push pin 234. As a result, even when the lower side member 230 is lowered, a force for lowering the upper ejector pin 143 is prevented or suppressed.

On the other hand, in the present invention, the push pin and the return pin may be provided arbitrarily or not. 10, if the return pin 144 and the lower side member 230 are brought into contact with each other without providing the push pin 234, when the lower side member 230 is lowered, the return pin 144 The force to push up is released. In this case, the elastic force of the elastic member 119 above the second ejector plate 142 is transmitted to the upper package (the sealing resin 20 on the upper mold cavity side in the resin sealing product 1B) via the ejector pin 144 Respectively. It is preferable to provide a push pin in order to prevent damage to the upper package due to this force.

Further, as shown in Fig. 11, the entire lower mold 200 is further lowered in the direction of the arrow X4 by the mold fastening mechanism. At this time, the force for pushing up the resin-sealed product 1B by the lower bottom member 220 is released. By further lowering the lower mold 200 in the direction of the arrow X4, the force to push up the return pin 144 by the push pin 234 is released. The elastic force of the elastic member 119 above the second ejector plate 142 pushes the upper mold package through the ejector pin 144 so that the upper mold package is released by the ejector pin 144 . In this way, the release of the double-sided package (sealing resin 20 on both sides of the resin-sealed article 1B) is completed.

As described above, the compression molding method (the method of producing the resin encapsulation product) of the present embodiment can be carried out as described in Figs. However, the compression molding method of the present invention and the method of producing the resin encapsulated article are not limited thereto.

According to the present invention, as described in, for example, Figs. 1 to 11, the ejector pins are protruded from the upper surface of the upper mold cavity to release the resin encapsulation product from the upper cavity, and the lower side bottom member and the lower side member So that the resin encapsulation product is released from the lower mold cavity. Thereby, both sides of the resin encapsulation product formed by resin-sealing both sides of the substrate by compression molding can be stably released without using a release film. That is, according to the present invention, both sides of the substrate can be compression-molded efficiently.

Further, in the present invention, the frame floating pin may be provided arbitrarily or not. For example, the substrate can be directly mounted (set) on the upper surface of the lower mold side member without providing a frame floating pin. However, by setting the substrate (frame) on the frame floating pin, it is possible to prevent the substrate from covering the lower cavity as a cover for the lower cavity, so that it is possible to reliably depressurize the inside of the lower cavity. Further, by using the frame floating pin, it is possible to suppress or prevent contact of the foamed resin with the frame even when the resin is foamed (for example, by gas generated from the inside of the resin) by depressurization. Accordingly, it is possible to suppress or prevent the resin from leaking through the frame.

On the other hand, in the compression molding method (the method of manufacturing the resin encapsulation product) of Figs. 2 to 11, the bottom face of the lower mold package was first released, and then the side face was released. However, by reversing this order, the sides of the lower package can be first released, and then the bottom can be released.

Figs. 12 and 13 show modifications of the compression molding apparatus, the compression molding method, and the resin sealing method of Figs. 1 to 11. Fig. In this example, the substrate 1 is set on the upper mold 100 instead of the lower mold 200. [ Further, in the compression molding apparatus, the structure of the upper mold differs from that of FIG. 1 to FIG. 12, the upper mold 101 of the compression molding apparatus includes an ejector plate 140, a return pin 144, a stopper 115, a collar 116, a bolt 117, (118) and the elastic member (119). The upper mold base block 111 is fixed directly to the upper mold cavity block 130. The upper mold 101 has an ejector pin 143A inside the upper mold block 130 and the first upper mold base block 111 instead of the ejector pin 143 of Figs. The ejector pin 143A is capable of projecting and retracting from the upper surface of the upper mold cavity 131 by an ejector pin driving mechanism 143B provided inside the second upper mold base block 112 and the third upper mold base block 113. In addition, the retraction hole 132 in the upper mold block 130 is not shown in Fig. However, the upper cavity block 130 of FIG. 12 may have a retracting hole into which the substrate positioning portion of the lower frame floating pin is inserted as in FIGS. In addition to the above, the upper die 101 of Fig. 12 is the same as the upper die 100 of Figs. Although the lower mold is omitted in Fig. 12, it may be the same as the lower mold 200 in Figs. 1 to 11, for example. Further, for example, there may be no push pin 234 and elastic member 235 of the lower mold. This is because the upper die 101 in Fig. 12 has no return pin contacting the push pin 234.

(A method for producing a resin encapsulation product) using the compression molding apparatus shown in Fig. 12 is not particularly limited. For example, the substrate 1 (pre-encapsulation substrate 1A) (Fixed) on the lower surface of the base plate 130, as shown in Figs. 12 shows a state in which the resin encapsulation product 1B is formed and the lower package (the encapsulation resin 20 on the lower cavity side in the resin encapsulation product 1B) is completely released. As shown in the figure, the resin-sealed product 1B is set (fixed) on the lower surface of the upper mold block 130. [ In this state, as shown in the figure, after the forming mold is opened, the substrate (frame) retrieval mechanism 300 is disposed below the resin sealing product 1B. The substrate retrieving mechanism 300 is capable of mounting the peripheral edge of the substrate 1 which is not sealed with the sealing resin 20 in the resin sealing product 1B as shown in Fig. 13, the ejector pin is projected from the upper surface of the upper mold cavity 131 by the ejector pin driving mechanism 143B, and the upper mold cavity (the resin sealing product 1B) ). Then, as shown in the figure, the resin sealing product 1B is mounted on the substrate recovery mechanism 300 and recovered.

Figs. 14 to 17 show other modified examples of the compression molding apparatus, the compression molding method, and the resin sealing method of Figs. 1 to 11. Fig. In this example, after the compression molding, the upper mold is released first, and then the lower mold is released. 1 to 11 except for the above. 14 to 17, the frame floating pin 231, the substrate positioning portion 232, the elastic member (not shown) of the lower side member 230, 233, the push pin 234, and the elastic member 235 are omitted from the drawing for the sake of simplification.

The compression molding method (the method of producing a resin-sealed article) according to Figs. 14 to 17 will be described in more detail. First, as shown in Fig. 14, the substrate 1 (the substrate 1A before the sealing) is set on the lower mold and a state in which the fluid resin (molten resin) 20b is present in the lower mold cavity 201 . This process can be carried out in the same order as in Figs. 2 and 3. Fig.

Next, as shown in Fig. 15, the lower mold 200 is raised, both the lower mold cavity 201 and the upper mold cavity 231 are filled with the fluid resin 20b, and both sides of the substrate 1 are resin-sealed . This process can be carried out in the same manner as in Figs. 4 to 7. Fig.

Next, after the fluid resin is hardened to form the sealing resin 20 to form the resin sealing product 1B and after the compression molding (resin sealing) is completed, as shown in Fig. 16, And is lowered by a mold opening mechanism (drive mechanism) to release the upper mold package. Specifically, when the entire lower mold 200 is lowered, the force for pushing the entire lower side of the ejector plate 140 through the upper return pin 144 is released. Accordingly, the ejector pin 143 is lowered together with the entire ejector plate 140, so that the upper package is pressed down by the ejector pin 143 and released.

17, the lower bottom member 220 is lifted by the bottom member driving mechanism to release the lower package side. Thereafter, the lower mold package bottom is released. In this manner, the compression molding method (the method of producing the resin-sealed article) of Figs. 14 to 17 can be performed. 17, after the substrate 1 is clamped by the upper mold cavity member 130 and the lower mold side side member 230, the process of releasing the lower mold package bottom surface is completed. Only the lower bottom member 220 can be lowered. In addition, it is possible to reverse the sides of the lower package and to release the side after releasing the bottom first.

18 shows another modification of the compression molding apparatus, the compression molding method, and the method of manufacturing the resin-sealed article shown in Figs. 1 to 11. Fig. As shown in the figure, this example is the same as Figs. 1 to 11 except that the hole 3 is not provided in the substrate 1. Fig. The structure of the molding die 10 of Fig. 18 is completely the same as that of Figs. 18, since the hole 3 is not provided in the substrate 1, the fluid resin 20b in the lower cavity 201 can not flow toward the upper mold cavity 131 side. Therefore, granular resin (resin material) 30a is mounted on the upper surface (upper cavity side) of the substrate 1 separately from the resin on the lower cavity side, as shown in the drawing. On the other hand, the resin material 30a exemplifies the granular resin, but it is not limited to the granular resin like the resin material 20a, and may be any thermoplastic resin, for example, it may be a thermoplastic resin.

18 shows a state in which the substrate 1 (substrate 1A before sealing) is mounted on the frame floating pin 231 and the fluidic resin 20b is filled in the lower mold cavity 201. FIG. Such a process can be carried out in the same order as in, for example, Fig. 2 and Fig. The granular resin 30a on the substrate 1 can be set on a molding mold after the granular resin 30a is mounted on the substrate 1. After the substrate 1 is set on the molding mold, The granular resin 30a may be supplied. In the substrate 1, for example, a flip chip can be used for the chip 2 on which the granular resin 30a is mounted.

≪ Example 2 >

Next, another embodiment of the present invention will be described with reference to Figs. 19 to 24. Fig.

As described above, in Figs. 1 to 18, in order to explain the structure and operation of the molding die in the compression molding apparatus, the parts other than the molding die (the driving mechanism for moving the lower mold up and down) Respectively. In the present embodiment, the structure and operation of a portion other than the molding die (in particular, a driving mechanism for moving the lower mold vertically) in the compression molding apparatus of the present invention will be described in detail. A compression molding method and a method for manufacturing a resin-sealed article using the same will also be described.

19 schematically shows the structure of the compression molding apparatus of this embodiment. As shown, this compression molding apparatus has a lower base 301. Four tie bars 302, which are support members, are fixed to the four corners of the lower base 301. An upper base 303 facing each other is fixed to the lower base 301 on top of the four tie bars 302 extending upward. Between the lower base 301 and the upper base 303, the elevator 304 opposing to each of the lower base 301 and the upper base 303 is fitted to the four tie bars 302. The lifting and lowering plate 304 is lifted or lowered by being driven by one driving mechanism described later.

The upper die (100) is fixed to the lower surface of the upper base (303). An upper mold cavity 131 is provided at the center of the lower surface of the upper mold 100. 12 and 13, the upper mold 100 is provided with an ejector pin 143A capable of projecting and retracting from the upper surface of the upper mold cavity 131 and an ejector pin driving mechanism 143B for driving the ejector pin 143A. Below the upper mold 100, a frame-shaped lower side member 230 is provided directly below the periphery of the upper mold 100 (around the upper mold cavity 131). The upper surface of the lower side member 230 faces the lower surface of the upper mold 100. At the center of the lower side member 230, a rectangular through-hole is provided in a plan view. The lower bottom member 220 is fitted to the through hole of the lower side member 230 to have a rectangular planar shape. The lower side surface member 230 and the lower surface side surface member 220 are driven up and down by two driving mechanisms described later. Accordingly, the lower side surface member 230 and the lower surface side surface member 220 can be raised or lowered independently of each other.

The lower side surface member 230 and the lower surface side surface member 220 constitute the lower mold 200 together. The upper mold 100 and the lower mold 200 constitute a set of molding molds 10 (hereinafter simply referred to as " molding molds 10 "). The upper mold 100 and the lower mold 200 are provided with a heating mechanism (not shown).

On the other hand, the forming mold 10, the upper mold 100 and the lower mold 200 shown in Fig. 19 can be formed by using the molding die 10, the upper mold 100 and the lower mold 100 in the first embodiment (Figs. 1 to 18) 200, but in FIG. 19, the structure is simplified and illustrated and explained. The same holds true for the molding die 10 of each of the following drawings.

On the upper surface of the lower mold 200, a lower cavity 201 made of a space filled with a fluid resin is formed. Hereinafter, the portion surrounding the periphery of the lower mold cavity 201 is referred to as the " side " of the lower cavity, and the portion constituting the bottom of the lower cavity 201 may be referred to as the " bottom " The side surface of the lower mold cavity 201 is constituted by the inner peripheral surface (inner surface) 230A of the lower side member 230. [ The bottom surface of the lower mold cavity 201 is constituted by the upper end surface (upper surface) of the lower mold bottom surface member 220. In the following description, the upper end surface (upper surface) of the lower bottom member 220 may be referred to as the " inner bottom surface 220A of the lower bottom member 220 ". The lower mold cavity 201 is a space surrounded by the inner circumferential surface 230A of the lower side member 230 and the inner bottom surface 220A of the lower member 220. [

The lower mold cavity 201 is supplied with granular resin (resin material) 20a. On the other hand, the resin material 20a is not limited to a granular resin and may be any thermoplastic resin, for example, and may be a thermoplastic resin.

On the lower base 301, a motor 311 is fixed as a first driving mechanism. The motor 311 has a ball screw 312 and a ball nut 313 is fitted to the ball screw 312. A mounting plate 314 for the elevating and lowering members is fixed to a lower surface of the elevating and lowering plate 304 and a ball nut 313 is fixed to the mounting plate for elevating and lowering members 314.

A frame member 213 is fixed to the upper surface of the lifting and lowering member 304 and a lower base block 210 is fixed to the upper surface of the frame member 213. The frame-shaped member 213 may be a plurality of plate-shaped members, columnar members, and the like. A plurality of elastic members (coil springs, disc springs, etc.) 22 are disposed on the upper surface of the lower base block 210 and the lower side member 230 is placed on the elastic member 22. With this configuration, the motor 311 rotates to rotate the ball nut 313, the mount plate 314 for the elevator and the elevator, the elevation plate 304, the frame member 213, the lower die base block 210, 22 in this order so that the lower side member 230 is lifted and lowered.

A motor 224 is fixed as a second driving mechanism at a position corresponding to the center of the lower bottom member 220 in plan view on the lifting and lowering base 304. [ The motor 224 has a ball screw 223 and the ball nut 222 is fitted with a ball nut 222. The ball nut 222 is fixed to the bottom member mounting member 221 fixed to the lower portion of the bottom member 220. An elastic body (not shown) may be provided between the lower bottom member 220 and the bottom member mounting member 221.

The bottom member mounting member 221 can be lifted and lowered from the through hole 225 provided in the center of the lower mold base block 210. A sealing member 226 made of fluorine rubber or the like is provided over the entire circumference of the through hole 225 between the inner circumferential surface of the lower mold base block 210 and the outer circumferential surface of the mounting member 221 for the bottom surface member in the through hole 225 do. The space between the lower mold base member 220 and the lower mold base block 210 and the space below the lower mold base block 210 and inside the frame member 213 are cut off.

On the upper surface of the lower mold base block 210, a frame-like outer air blocking member 150 is fixed. A sealing member 150B made of fluorine rubber or the like is provided between the constituent elements (including the upper base 303 and the lower mold base block 210) existing between the upper base 303 and the lower mold base block 210. [ A sealing member 150A is provided on at least one of the upper surface of the outside air blocking member 150 and the lower surface of the upper base 303 between the upper surface of the outside air blocking member 150 and the lower surface of the upper base 303 do. The sealing member 150B is similarly provided between the lower surface of the outer air blocking member 150 and the upper surface of the lower base block 210. [ On the other hand, the sealing member 150A and the sealing member 150B may be an O-ring, for example, like the O-ring 150A of the first embodiment. Further, only one of the sealing member 150A and the sealing member 150B can be provided. Shaped outer airblock members can be mounted on the upper surface of the lower base block 210 and the lower surface of the upper base 303 so as to face each other. In this case, the sealing member is provided on at least one of the mutually facing surfaces of the two frame-shaped outside air blocking members.

On the other hand, in the molding die 10 of the first embodiment, the upper-type outer-air shielding member 150, the O-ring (sealing member) 150A and the lower-type outer-air shielding member 250 are provided. Instead, At least one of the outside air blocking member 150, the sealing member 150A, and the sealing member 150B may be provided as in the embodiment.

A through hole (suction hole) 321 is provided on the outer side of the lower side member 230 in a plan view in the lower die base block 210. The through hole 321 is connected to a depressurizing source (suction mechanism) 323 such as a vacuum pump or a decompression tank via a suction pipe 322. The suction pipe 322 is provided with a switching valve 324 for connecting the through hole 321 to either the reduced pressure source 323 or the atmosphere.

On the lower surface of the upper mold 100, the pre-sealing substrate 1A is temporarily fixed according to a known method such as suction, clamping, or the like. The pre-encapsulation substrate 1A has a substrate (circuit substrate) 1 and a chip 2 mounted thereon. The chip 2 is made of, for example, a semiconductor chip or the like. The connection terminals of the substrate 1A before the sealing and the connection terminals of the chip 2 are electrically connected by a conductive material (not shown) such as a wire or a bump. The predetermined area and the chip 2 on the front surface (the lower surface in the drawing) of the substrate 1A before the sealing are resin-sealed by the molding resin that is hardened by the fluidizing resin in the lower cavity 201. [ The lower mold side member 230 is provided with a lower mold cavity 201 and one or a plurality of through holes 212 communicating with an outer space E as a space inside the mold 10, (Communication hole) 236 is provided. The through hole 236 is provided at a position slightly below the position corresponding to the thickness of the sealing resin to be molded (see FIG. 21).

The ball nut 313, the mounting plate 314 for the elevating and lowering platform, the lifting and lowering plate 304, the frame member 213, and the frame member 311 (first driving mechanism) The lower die base member 210 and the plurality of elastic members 22 are sequentially passed through the lower side member 230 to move up and down. Thus, the motor 311 lifts the lower side member 230 up and down.

Second, as the motor 224 (second driving mechanism) rotates, the lower bottom member 220 is lifted and lowered sequentially through the ball nut 222 and the bottom member mounting member 221. Thus, the motor 224 lifts the lower mold member 220 up and down.

Third, when the motor 311 rotates or stops, the motor 224 fixed on the lifting and lowering table 304 is lifted or stopped. As the motor 224 moves up and down, the lower bottom member 220 mechanically connected with the ball nut 222 and the bottom member mounting member 221 is sequentially raised and lowered. Thus, as the motor 311 rotates, both the lower side member 230 and the lower member 220 are raised and lowered.

The motor 311 and the motor 224 can be controlled by the following three embodiments so that one of the lower side member 230 and the lower member 220 can be raised and lowered while maintaining the same height position have. As the motor 311 rotates in one direction, as the motor 224 rotates to the other side while raising both the lower side surface member 230 and the lower surface side surface member 220 at the speed V, the lower side surface member 220 ) Is lowered at the speed V. In this case, as viewed from the outside of the compression molding apparatus, the lower side member 230 rises at the speed V in a state where the lower side bottom member 220 is stopped.

As the motor 221 rotates in one direction while both the lower side member 230 and the lower side bottom member 220 are lowered at the speed V by rotating the motor 311 to the other side, 220) at the speed V is increased. In this case, the lower side member 230 descends at the speed V in a state where the lower side bottom member 220 is stopped when viewed from the outside of the compression molding apparatus.

As the third mode, the lower mold half member 220 is moved up and down at the speed V as the motor 224 rotates while the motor 311 is stopped. In this case, the lower mold half member 220 ascends and descends at the speed V in a state where the lower mold side member 230 is stopped as viewed from the outside of the compression molding apparatus. In summary, the lower side member 230 and the lower side member 220 can be raised and lowered independently by appropriately controlling the motor 311 and the motor 224.

A compression molding method (a method for producing a resin-sealed article) of the present embodiment will be described with reference to schematic cross-sectional views schematically shown in Figs. 19 to 24. Fig. Fig. 19 shows a state immediately after the lower mold starts to rise. Fig. 20 shows a state immediately after the lower mold bottom member starts to rise after the sealing member starts to be deformed. Fig. 21 shows a state in which the lower mold side member is raised to maintain a predetermined height position after the lower mold side member clamps the substrate. 22 shows a state in which the lower side member is lowered while the lower base member remains at the height position after the hardened resin is formed in the lower cavity and the upper cavity. 23 shows a state immediately before the lower side member is lifted and the substrate is clamped again while the lower base member maintains its height position. Fig. 24 shows a state in which the lower bottom member is lowered while the lower side member maintains its height position. Fig. Hereinafter, this will be described more specifically.

First, as shown in Fig. 19, the substrate 1A is fixed (set) on the lower surface of the upper mold 100. Next, as shown in Fig. The fixing method is not particularly limited, and for example, a clamp (not shown) or the like can be used. Next, a granular resin material 20a is supplied to the lower mold cavity 201, for example. Further, power is applied to the motor 311 while the motor 224 is stopped, and the motor 311 is rotated in one direction, thereby raising the lifting unit 304 in the direction of the arrow X5. And lifts up the next two systems fixed to the lift unit 304 at the same speed. The first system is a system including a frame member 213, a lower base block 210, a plurality of elastic members 22, a lower side member 230 and an outer air blocking member 150. The second system is a system including a motor 224, a ball screw 223, a ball nut 222, a mounting member 221 for a bottom surface member, and a bottom surface member 220. Therefore, by rotating the motor 311 in one direction, the lower side member 230, the lower side bottom member 220 and the outside air blocking member 150 can be lifted at the same speed.

Next, intermediate mold clamping is performed as shown in Fig. Concretely, the lower side surface member 230, the lower surface side surface member 220 and the outside air blocking member 150 are raised at the same speed in the directions of the arrows X6 and Z4, respectively, in FIG. Then, the sealing member 150A provided on the upper surface of the outside air blocking member 150 is brought into contact with the lower surface of the upper base 303. As a result, the sealing member 150A starts to be deformed. On the other hand, as in the first embodiment, the intermediate mold clamping state is, for example, a state from when the sealing members 150A and 150B begin to deform to when they are crushed.

Next, as shown in Fig. 20, after the intermediate mold is engaged, the switching valve 324 is used to communicate the space inside the outside air shutoff member 150 and the pressure reduction source 323. Then, air is sucked in the direction of the arrow Y2 from the space inside the outside air shutoff member 150 to be in a depressurized state. In this process, the gas contained in the fluid resin 20b is discharged to the outside of the molding die 10.

21, mold clamping (also referred to as final clamping or full mold clamping) is performed. Concretely, the motor 311 is continuously rotated in one direction, so that the side member 230 is continuously lifted. When the upper surface of the lower side member 230 presses and clamps the circuit board 1, the lower side member 230 presses the motor 311 to press the circuit board 1 in the direction of arrow X7 by a certain pressure . At this time, the sealing members 150A and 150A are in a collapsed state. The space inside the outside air shutoff member 150 becomes a closed space which is a space blocked from the outside air. In parallel therewith, the resin material 20a is melted by heating to produce a fluid resin (molten resin) 20b. At an appropriate time after the full mold clamping state has been established, the outer space E is communicated with the atmosphere by using the switching valve 324. As a result, air enters the outer space E in the direction of the arrow Y3 and the decompression of the outer space E is released. 22 to Fig. 24, similarly to the arrow Y3 (Fig. 22), Y5 (Fig. 23) and Y6 And the decompression of the outer space E is released. In addition, arrows indicated by thick broken lines in the drawing (for example, arrow X7) indicate that, from the outside of the compression molding apparatus, the components to which such arrows have been moved have not yet moved, )) Is operating. Hereinafter, the same applies.

Next, as shown in Fig. 21, by applying power to the motor 224 and rotating the motor 224 in one direction, the lower bottom member 220 is raised. The lower bottom member 220 is lifted until the inner bottom surface 220A of the lower bottom member 220 reaches a position (predetermined position) separated from the upper surface of the lower side member 230 by a predetermined length. Thus, a lower cavity 201 having a predetermined depth equal to the length is formed. The lower bottom member 220 presses the fluid resin 20b in the direction of the arrow Z5 by a predetermined pressure to maintain the predetermined position of the lower mold half member 220. When the lower mold half member 220 ascends to the predetermined position, ).

The molding die 10 is completely molded by the above steps. In this state, the length between the upper surface of the lower side member 230 and the upper surface (inner bottom surface) 220A of the lower base member 220 corresponds to the thickness of the sealing resin 20 (FIG. 22) do.

Subsequently, the fluid resin 20b is heated for a predetermined curing time. Thus, the fluid resin 20b is cured to form a sealing resin 20 made of a cured resin as shown in Fig. By the above steps, the completed substrate 1B is completed. The sealed substrate 1B corresponds to a resin encapsulated product including a cured resin (encapsulating resin 20) formed by curing the fluid resin 20b.

After the sealing resin (cured resin) 20 is formed by curing the fluid resin 20b, the side surface of the lower package is released as shown in Fig. Specifically, first, the motor 311 and the motor 224 are rotated in the following manner while maintaining the upper surface of the lower side member 230 pressed and clamped on the circuit board 1 (see FIG. 21) . That is, first, by rotating the motor 224 in one direction, the lower bottom member 220 is raised in speed V as viewed from the motor 224. At the same time, the motor 311 is rotated to the other side so that the elevating and lowering plate 304 is lowered in the direction of the arrow X8 at the speed V. With these two operations, the lower side member 230 is lowered at the speed V in the direction of arrow X8 when the lower base member 220 is stopped, as viewed from the outside of the compression molding apparatus. The inner bottom surface 220A of the lower mold bottom surface member 220 which keeps the stationary state of the compression molding apparatus as viewed from the outside pressurizes the end surface (lower surface in the figure) of the sealing resin 20 in the direction of the arrow Z6 The outer peripheral surface (lower package side) of the sealing resin 20 on the lower cavity side is separated from the inner peripheral surface (inner side surface) of the lower side surface member 230.

Next, the lower mold package bottom surface (lower surface of the sealing resin 20 on the lower cavity side) is released. Concretely, first, the motor 224 is rotated from the state shown in Fig. 22 to the other. Accordingly, as viewed from the motor 224, the lower mold half member 220 tries to descend in the direction of the arrow Z7 at the speed V. [ In parallel with this, the motor 311 is rotated in one direction, thereby raising the lifting and lowering plate 304 in the direction of the arrow X9 at the speed V. By these two operations, the lower side member 230 is lifted in a state where the lower base member 22 is stopped when viewed from the outside of the compression molding apparatus. Thus, the circuit board 1 is clamped again by the upper surface of the lower side member 230. 23 shows a state immediately before clamping the circuit board 1 again. As shown in the figure, the lower side member 230 controls the motor 311 to press the circuit board 1 with a certain pressure.

Next, as shown in Fig. 24, while the circuit board 1 is pressed by the lower side member 230 at a constant pressure, the motor 224 is continuously rotated to the other side. Thus, as viewed from the motor 224, the lower mold half member 220 is lowered in the direction of the arrow Z8 at the speed V. [ The upper surface of the lower side member 230 holding the stationary state as viewed from the outside of the compression molding apparatus is clamped by clamping the circuit board 1 in the direction of the arrow X10 and the upper side of the lower side member 230 (Bottom side) of the lower package bottom (lower side of the lower side cavity) of the lower mold cavity 220 from the inner bottom face of the lower side bottom face member 220 while the inner circumferential face supports the outer peripheral face (side face) Bottom). 24, the clearance S between the inner bottom surface of the lower bottom member 220 and the end surface of the sealing resin 20 communicates with the outer space E, which is atmospheric pressure, do. As a result, breakage of the sealed substrate 1B due to the following two causes, caused by the separation of the end surface of the sealing resin 20 from the inner bottom surface of the lower bottom member 220, can be suppressed.

The first cause of the breakage of the above-mentioned sealed substrate 1B is a phenomenon that occurs when separating the inner bottom surface of the lower bottom member 220 having a wide area from the end surface of the sealing resin 20, And the inner bottom surface of the lower mold bottom member 220 pulls down the upper surface of the sealing resin 20 downward. In this case, the lower side surface member 230 and the sealing resin 20, which are generated immediately after the outer bottom surface of the end surface of the sealing resin 20 starts separating the inner bottom surface of the lower surface bottom member 220 from the end surface of the sealing resin 20, (S) between the first and second electrodes 20 becomes an atmospheric pressure at the same time as the generation. As a result, the inner bottom surface of the lower mold bottom member 220 and the end surface of the encapsulating resin 20 are easily separated from each other, so that breakage of the encapsulated substrate 1B can be suppressed.

The second cause is that when separating the end surface of the sealing resin 20 from the inner bottom surface of the lower mold bottom member 220, a non-sealing surface (upper surface in the figure) including the outer circumference of the circuit board 1 When a slight gap is formed between the lower surface of the upper mold 100, the atmospheric pressure is a downward force applied to the seal-completed substrate (resin-sealed article) 1B. In this case, since the gap S has become the atmospheric pressure, downward force applied to the seal-completed substrate (resin-sealed article) 1B does not occur. Thus, breakage of the sealed substrate 1B can be prevented.

12 and 13, the ejector pin 143A is moved from the upper surface of the upper mold cavity 131 by the ejector pin driving mechanism 143B after releasing the lower mold package (the lower mold cavity sealing resin 20) . Thus, the upper mold package (sealing resin 20 on the upper mold cavity) is released (not shown).

According to the present embodiment, as described with reference to Figs. 19 to 24, the lower side surface member 230 and the lower surface side surface member 220 are driven by different driving mechanisms. Specifically, the lower side member 230 is driven by the motor 311 only. Further, the lower mold half member 220 is driven by the motor 311 and is also driven by the motor 224 alone. In other words, the lower bottom member 220 is driven separately by the motor 311 and the motor 224. [ In addition, the lower bottom member 220 is simultaneously driven by the motor 311 and the motor 224 in parallel. Thereby, the lower side surface member 230 and the lower surface side surface member 220 can move independently of each other. Therefore, first, the lower side member 230 is lowered in a state in which the end surface of the sealing resin 20 is supported by the inner bottom surface 220A of the lower surface bottom member 220. Thus, the outer peripheral surface of the sealing resin 20 can be separated from the inner peripheral surface 230A of the lower side member 230. [ Second, the lower mold bottom member 220 is lowered in a state in which the outer peripheral surface of the sealing resin 20 is supported by the inner peripheral surface 230A of the lower mold side surface member 230. Thus, the end surface of the sealing resin 20 can be separated from the inner bottom surface 220A of the lower mold bottom member 220. [ Thereby, the sealed substrate 1B can be released from the mold surface of the molding die 10 without applying a large external force to the sealed substrate (resin-sealed article) 1B.

In the compression molding apparatus of the present embodiment, a lower mold 200 is provided. The lower mold 200 has a mold surface constituting the lower mold cavity 201 and a through hole 236 communicating the outer space E from the outside of the lower mold 200. As described above, in the step of separating the sealing resin 20 from the mold surface constituting the lower mold cavity 201, the outer space E and the surface of the sealing resin 20 are communicated with each other. Thus, first, it is possible to suppress breakage of the sealed substrate 1B caused by the force that the inner bottom surface of the lower bottom member 220 pulls the end surface of the sealing resin 20 downward. Secondly, it is possible to prevent the seal-completed substrate (resin-sealed article) 1B from being pressed against the gap S due to the atmospheric pressure, so that breakage of the seal-completed substrate 1B can be prevented.

According to this embodiment, since the lower side member 230 and the lower side bottom member 220 are driven separately when the sealed substrate (resin-sealed article) 1B is manufactured, the lower side member 230 and the lower side The member 220 can move independently. Accordingly, the lower cavity 201 having various depths can be easily formed. Therefore, it is possible to easily manufacture a plurality of types of the sealed substrates 1B having the sealing resin 20 of various thicknesses by using one compression molding apparatus. Therefore, according to this embodiment, it is possible to easily manufacture from the sealed finished substrate 1B requiring a small thickness to the sealed finished substrate 1B requiring a large thickness. The sealed substrate 1B requiring a small thickness is used, for example, for manufacturing a semiconductor product for a cellular phone. The sealed substrate 1B, which requires a large thickness, is used, for example, to manufacture a power semiconductor device (circuit module, etc.).

On the other hand, for example, one semiconductor product can be manufactured from the encapsulated substrate 1B. However, the present invention is not limited to this. For example, the circuit board 1 on which chips are mounted in a plurality of regions divided along a predetermined boundary line may be resin-sealed. Thus, a plurality of semiconductor products can be manufactured from the sealed substrate 1B, for example, by individualizing the sealed substrate 1B after resin sealing, along the boundary line.

≪ Example 3 >

Next, another embodiment of the present invention will be described with reference to schematic cross-sectional views of Figs. 25 to 27. Fig. On the other hand, in Figs. 25 to 27 of this embodiment, the same constituent elements as those of Figs. 19 to 24 are denoted by the same reference numerals, and a description of such constituent elements is omitted as appropriate. The same applies to the following drawings and examples.

Fig. 25 shows a state immediately after the cured resin is formed in the lower cavity. 26 shows a state in which the lower side member is lowered while maintaining the height position of the lower member. Fig. 27 shows a state in which the bottom member is lowered while the lower side member maintains its height position after the lower side member is lifted and clamps the substrate again.

Compared with the compression molding apparatus shown in Figs. 19 to 24 of the second embodiment, the compression molding apparatus of the present embodiment has the lower side member 230 and the lower side bottom member 220 driven by the motor 311 and the motor 224 ) Is reversed. In other words, the lifting and lowering unit 304 is driven by the lower motor 311 (corresponding to the motor 311 in Figs. 19 to 24). The motor 224 is fixed on the lifting and lowering plate 304. The lower side member 230 is driven by the motor 224 via the lower base block 210 and the elastic body 22. The lower bottom member 220 is fixed on the lifting and lowering base 304 with the bottom member mounting member 221B and the bottom member mounting member 221 interposed therebetween. The lower side member 230 and the lower side bottom member 220 fixed to the lifting and lowering unit 304 at the upper side of the lifting and lowering unit 304 are simultaneously driven by the lower motor 311 in parallel.

According to the present embodiment, the lower side surface member 230 and the lower surface side surface member 220 are driven by different driving mechanisms. Specifically, the lower bottom member 220 is driven by the lower motor 311. Further, the lower side member 230 is driven only by the motor 311 and the motor 224. In other words, the lower side member 230 is driven separately by the lower motor 311 and the motor 224. In addition, the lower side member 230 is simultaneously driven by the lower motor 311 and the motor 224 in parallel. Thereby, the lower side surface member 230 and the lower surface side surface member 220 can independently move. First, the lower side surface member 230 is lowered in a state in which the bottom surface of the lower package (the sealing resin 20 on the lower cavity side) is supported by the inner bottom surface 220A of the lower surface bottom surface member 220. Thus, the outer peripheral surface of the sealing resin 20 can be separated from the inner peripheral surface 230A of the lower side member 230. [ Second, the lower mold bottom member 220 is lowered in a state in which the outer peripheral surface of the sealing resin 20 is supported by the inner peripheral surface 230A of the lower mold side surface member 230. Thus, the end surface of the sealing resin 20 can be separated from the inner bottom surface 220A of the lower mold bottom member 220. [ Thereby, the sealed substrate 1B can be released from the mold surface of the molding die 10 without applying a large external force to the sealed substrate (resin-sealed article) 1B. Therefore, this embodiment has the same effect as the effect of the first embodiment with respect to releasing the sealed substrate 1B.

The compression molding apparatus shown in Figs. 25 to 27 includes a through hole 236, a reduced pressure source 323, and a switching valve 324, as in Figs. Therefore, this embodiment has the same effect as that of the second embodiment in that breakage of the sealed substrate 1B can be prevented.

25 to 27, the lower side surface member 230 and the lower surface side surface member 220 can move independently of each other, similarly to the second embodiment. Therefore, the present embodiment has the same effect as the second embodiment in that the sealed substrate 1B of various thicknesses can be easily manufactured by using one compression-molding apparatus.

<Example 4>

Next, another embodiment of the present invention will be described with reference to schematic cross-sectional views of Figs. 28 and 29. Fig. 28 and 29, the members of the outside air blocking member 150, the sealing members 150A and 150A, the through holes 321, and the suction pipe 322 are omitted. 30 and 31 (Embodiment 5) described later are the same.

28 shows a state in which the lower side member is lowered while maintaining the height position of the bottom member after the cured resin is formed in the cavity with respect to the two sets of molding molds. Fig. 29 shows a state in which the bottom member is lowered while the lower side member maintains its height position after the lower side member is lifted and clamped again.

The compression molding apparatus of this embodiment is the same as the compression molding apparatus of the second embodiment except that the compression molding apparatus of the second embodiment (Figs. 19 to 24) is different from that of the second embodiment in that two molding dies 10 are provided. Therefore, according to the present embodiment, the manufacturing capability exhibited by one compression-molding apparatus is doubled. The present embodiment has the same effect as the second embodiment. The molding die 10 is two in Figs. 28 and 29, but is not limited thereto and may be three or more.

In the present embodiment, it is preferable to provide an elastic body (not shown) between each lower bottom member 220 and the bottom member mounting member 221. Accordingly, even when the thickness of the plurality of circuit boards 1 (two in Figs. 28 and 29) is uneven, it is possible to suppress unevenness in the thickness of the sealing resin 20 of each of the sealed substrates 1B, The completed substrate 1B can be manufactured.

&Lt; Example 5 >

Next, another embodiment of the present invention will be described with reference to schematic schematic cross-sectional views of Figs. 30 and 31. Fig. 30 shows a state in which the lower side member is lowered while maintaining the height position of the bottom member after the cured resin is formed in the cavity with respect to the two sets of molding molds. Fig. 31 shows a state in which the bottom member is lowered while the lower side member maintains its height position after the lower side member is lifted and the substrate is clamped again.

The compression molding apparatus of this embodiment is the same as the compression molding apparatus of the third embodiment except that the compression molding apparatus of the third embodiment (FIGS. 25 to 27) is different from the compression molding apparatus of the second embodiment in that two molding molds 10 are provided. Therefore, according to the present embodiment, the manufacturing capability exhibited by one compression-molding apparatus is doubled. The present embodiment has the same effects as those of the first and second embodiments. In addition, although two molds 10 are shown in Figs. 30 and 31, they are not limited thereto and may be three or more.

In the present embodiment, it is preferable to provide an elastic body (not shown) between each lower bottom member 220 and the bottom member mounting member 221. Accordingly, even when the thickness of the plurality of circuit boards 1 (two in Figs. 30 and 31) is uneven, it is possible to suppress unevenness in thickness of the sealing resin 20 of each of the sealed substrates 1B, The completed substrate 1B can be manufactured.

&Lt; Example 6 >

Next, another embodiment of the present invention will be described with reference to schematic schematic cross-sectional views of Figs. 32 and 33. Fig.

The present embodiment relates to an aspect in which the gap S is communicated with the external space E which is a space outside the molding die 10 by using the through holes 236 shown in Figs. Figs. 32 to 33 are partial cross-sectional views for explaining the configuration of the communication hole by omitting the illustration of the upper figure. Fig.

32 and 33 show the positions of the through holes 236 shown in Figs. 19 to 31. Fig. As shown in Fig. 32, in the lower side member 230, at a position lower than the position corresponding to the thickness of the sealing resin 20 (see Fig. 21) to be formed from the upper surface of the lower side member 230, (236). The opening 236A of the through hole 236 is formed in the inner peripheral surface 230A of the lower side member 230 (the surface extending downwardly from the inner peripheral surface 230A shown by the thick line in the figure). The gap between the inner peripheral surface 230A of the lower side member 230 and the outer peripheral surface of the lower member 220 communicates with the opening 236A. The gap S between the inner bottom surface 220A of the lower bottom member 220 and the sealing resin 20 and the gap between the inner peripheral surface 230A and the lower mold 230A immediately after the lower mold half member 220 starts to descend with respect to the sealing resin 20, The gap between the outer peripheral surfaces of the bottom member 220, the opening 236A, and the through hole 236 are communicated with each other. Therefore, the gap S between the inner bottom surface 220A of the lower bottom member 220 and the sealing resin 20 shown in Fig. 23 can be made atmospheric pressure by communicating with the outer space E.

The position where the through hole 236 is provided in the lower side member 230 is, for example, two aspects shown in FIG. According to the first embodiment, as shown by the solid line in Fig. 32, the through hole 236 is provided below the position corresponding to the thickness of the sealing resin by a certain length. In this case, after the inner bottom surface 220A is positioned above the upper end of the through-hole 236, the resin material is supplied to the lower cavity 201 (see FIG. 19) (Not shown). Thus, the sealing resin 20 having a thickness corresponding to the length of the predetermined length (L) or less can be molded. The predetermined length L is a length obtained by subtracting the accuracy when the inner bottom surface 220A is positioned at the length between the upper surface of the lower side member 230 and the upper end of the through hole 236. [ Therefore, the sealing resin 20 can be molded with the lower limit of the thickness corresponding to the length L, by using one set of the lower molds 200.

According to the second embodiment, as shown by the broken line in FIG. 32, the through hole 236 is provided just below the position corresponding to the thickness of the sealing resin 20 to be molded. The gap between the lower mold half member 220 and the sealing resin 20 through the opening 236A and the through hole 236 immediately after the lower mold half member 220 starts to descend with respect to the sealing resin 20 S) at atmospheric pressure.

Fig. 33 shows an embodiment in which the through hole 236 is provided in the lower bottom member 220. Fig. The through hole 236 extends from the opening 236A toward the lower side of the drawing. In the inside of the through hole 236, a columnar member 241 is provided so as to be movable forward and backward. The columnar member 241 moves forward and backward in the through hole 236 by the actuator 242. The upper end face 243 (upper face in the figure) of the columnar member 241 constitutes a part of the inner bottom face 220A of the lower face bottom face member 220 when the columnar member 241 is stopped at a predetermined position . In other words, the upper surface (upper surface) 243 of the columnar member 241 closes the opening 236A in the inner bottom surface 220A of the lower bottom member 220.

Toward the outer side (the lower side in the figure) of the lower bottom member 220 in which the through hole 236 extends from a position slightly inserted from the opening 236A in the through hole 236, (244) having a larger cross-section than the cross-section of the recess (236). As shown in the drawing, the cross-sectional shape of the extending portion 244 includes a cross-sectional shape of the columnar member 241 in plan view, and has a portion wider than the cross-sectional shape of the columnar member 241. For example, the diameter of the expanded portion 244 can be made larger than the diameter of the opening 236A by making the opening 236A and the extending portion 244 concentric. After the sealing resin 20 is formed, the columnar member 241 is lowered before the lower bottom member 220 begins to descend. The surface of the sealing resin 20 in the opening 236A is exposed to the outside through the through hole 236 having the opening 236A and the extending portion 244 before the lower bottom member 220 starts to descend. And communicates with the space (E). In other words, at this point, the surface of the sealing resin 20 at the opening 236A can be exposed to atmospheric pressure. Therefore, immediately after the lower mold half member 220 starts to descend with respect to the sealing resin 20, the lower mold half member 220 and the sealing resin (not shown) are passed through the through- 20) (see Fig. 23) can be made at atmospheric pressure.

Further, for example, the configurations shown in Figs. 32 and 33 can be combined. Specifically, for example, in the lower side member 230 shown in Fig. 32, a through hole 236 having an opening 236A and an extending portion 244, and a columnar member 234 provided inside the through hole 236, (See Fig. 33). In this case, it is preferable that the position of the opening 236A is a position overlapping with the upper surface of the lower bottom member 220 as viewed from the position or the side shown in Fig.

According to the present embodiment, the sealing resin 20 is adhered to the outer space E immediately after the lower bottom member 220 starts to descend with respect to the sealing resin 20 or before the lower bottom member 220 starts to descend. . Accordingly, immediately after or immediately after the lower mold half member 220 starts to descend with respect to the sealing resin 20, the distance between the lower mold half member 220 and the sealing resin 20 through the opening 236A and the through hole 236 The gap S can be made at atmospheric pressure. Therefore, breakage of the sealed substrate 1B can be more effectively prevented.

&Lt; Example 7 >

Next, another embodiment of the present invention will be described.

34 schematically shows an apparatus 1000 for manufacturing a resin sealing product of this embodiment. Fig. 34 is a schematic plan view of the apparatus 1000 for manufacturing a resin sealing product, assuming that the upper mold member is removed. As shown in the figure, the resin sealing product manufacturing apparatus 1000 has one material receiving module 400, four forming modules 2000, and one taking out module 500. The molding module 2000 has a compression molding apparatus of the present invention. The compression molding apparatus may be, for example, the same compression molding apparatus as those of the first to sixth embodiments. The resin sealing product manufacturing apparatus 1000 includes a power supply 401 for supplying electric power and a control section 402 for controlling each component, with respect to the whole resin sealing product manufacturing apparatus 1000 as a whole.

The material receiving module 400 and the leftmost forming module 2000 in Fig. 34 are mountable and detachable with respect to each other. Further, adjacent molding modules 2000 can be mounted and separated from each other. The rightmost molding module 2000 and the take-out module 500 can be mounted and separated from each other in FIG. The positioning method for mounting the above-described components is not particularly limited, but can be performed by well-known means such as positioning holes and positioning pins. The mounting method is not particularly limited, but can be carried out by well-known means such as screw fixing using bolts and nuts.

The material receiving module 400 has a substrate material receiving portion 403, a resin material receiving portion 404, and a material conveying mechanism 405. The substrate material carry-in portion 403 receives the substrate before sealing from the outside of the resin seal material manufacturing apparatus 1000. The resin material receiving portion 404 receives the resin material 20a made of the solid resin from the outside of the resin sealing product manufacturing apparatus 1000. [ Fig. 34 shows a particulate resin as the resin material 20a.

The X direction guide rail 406 is provided along the X direction across the take-out module 500 via the four molding modules 2000 from the material carry-in module 400 to the resin seal article manufacturing apparatus 1000. [ The X-direction guide rail 406 is provided so that the main transport mechanism 407 can move along the X-direction. A Y-direction guide rail 408 is provided in the main transport mechanism 407 along the Y direction. The sub-transport mechanism 501 of the main transport mechanism 407 is provided on the Y-direction guide rail 408 so as to be movable along the Y direction. The sub conveying mechanism 501 accommodates the substrate 1A before the sealing and accommodates the resin material 20a in the lower portion and is disposed above the X direction guide rail 406 and the lower mold 200 ) Of the lower mold cavity (201). The sub conveying mechanism 501 supplies the substrate 201 with the resin material 20a to the lower cavity 201 of the lower mold 200 by supplying the unsealed substrate 1A to the lower surface of the upper mold (not shown).

The resin sealing product manufacturing apparatus 1000 has a control unit 402. The rotational direction, the number of rotations, and the torque of the motors 311 and 224 (see Fig. 19) are controlled in accordance with the signal of the control driver included in the control section 402. [ The control unit 402 also controls the operations of the main transport mechanism 407 and the sub transport mechanism 501. [

In this embodiment, the transport mechanism comprising the main transport mechanism 407 and the sub transport mechanism 501 includes a pre-encapsulation substrate 1A and a chip 2 (see Fig. 1) mounted on the pre- Sealed substrate 1B, which is a resin-sealed product molded by resin sealing. According to this configuration, the structure of the resin-sealed article manufacturing apparatus 1000 is simplified because the transport mechanism including the main transport mechanism 407 and the sub transport mechanism 501 also serves as a carry-in mechanism and a carry-out mechanism.

The unloading module 500 has a resin sealing article transfer mechanism 502 for transferring the sealed substrate 1B and a magazine 503 for accommodating the sealed substrate 1B. The export module 500 has a vacuum pump (not shown). The vacuum pump is a decompression source for adsorbing the pre-sealing substrate 1A, the sealed substrate 1B, and the like, with respect to the entire resin sealing product manufacturing apparatus 1000. [ The vacuum pump may be provided in the material receiving module 400.

The vacuum pump is also used as a decompression source for sucking the outer space for air containing the lower cavity 201 as a space between an upper mold (not shown) and a lower mold 200. The outside air blocking space includes the lower mold cavity 201 as a space between the upper mold and the lower mold 200 until the molding of the molding mold 10 is completed after the resin material 20a is supplied to the lower mold cavity 201 As shown in FIG. More specifically, a space including the lower cavity 201 as a space between the upper mold and the lower mold 200 is sealed from the outside air by using a sealing member (see the sealing members 150A and 150B in Figs. 19 to 24) . By sucking the outside air blocking space, generation of bubbles (voids) in the sealing resin 20 shown in Figs. 21 to 31 is suppressed. A decompression tank sucked by the vacuum pump and having a large capacity may be used as a decompression source.

According to the present embodiment, neighboring molding modules 2000 among the four molding modules 2000 can be mounted and separated from each other. Accordingly, the molding module 2000 can be increased according to an increase in demand, and the molding module 2000 can be reduced in accordance with a decrease in demand. For example, when the demand for a specific product is increased in an area where the factory A is located, the plant B is used for producing the specific product from the resin sealing product manufacturing apparatus 1000 of the plant B located in an area where the demand is not increased The molding module 2000 is removed. The separated molding module 20002 is transported to the factory A, and the transported molding module 2000 is mounted on the resin encapsulation article manufacturing apparatus of the factory A. In other words, the molding module 2000 is installed in the resin sealing product manufacturing apparatus. Accordingly, it is possible to meet the increased demand in the area where Factory A is located. Therefore, according to the present embodiment, it is possible to realize a resin-sealed article manufacturing apparatus capable of flexibly responding to increase or decrease in demand.

As the resin sealing article manufacturing apparatus 1000, for example, the following modified examples can be employed. In the first modification example, the material receiving module 400 and the unloading module 500 are integrated so that one integrated receiving / unloading module 500 is connected to one end of the resin sealing product manufacturing apparatus 1000 Left or right end). In this case, since one or a plurality of molding modules 2000 are exposed at the other end (right end or left end in Fig. 34) of the apparatus for manufacturing a resin sealing article, the molding module 2000 can be easily mounted and separated.

In the second modified example, the one material carry-in module 400 and the molding module 2000 are integrated, and one integrated transfer / molding module 2000 is attached to one end of the resin seal material manufacturing apparatus 1000 Left or right end). In this case, one molding module 2000 is mounted on the carrying / molding module 2000, or a plurality of molding modules 2000 are sequentially mounted on the carrying module 2000. And the take-out module 500 is mounted on the molding module 2000 located at the other end (right end or left end in FIG. 34) to constitute a resin sealing article manufacturing apparatus.

In the third modified example, the resin sealing product manufacturing apparatus 1000 includes a main transport mechanism 407 and a sub transport mechanism 501 as carry-in mechanisms, and a carry-out mechanism is provided separately from the carry-in mechanism. In this case, since the carry-in mechanism and the carry-out mechanism operate independently, the efficiency of molding operation is improved in the resin-sealed article manufacturing apparatus 1000.

The present invention is not limited to the above-described modified examples. For example, the molding module 2000 adjacent to each other in the resin-seal-product manufacturing apparatus 1000 can be mounted and detached from each other. The present invention can be applied to an apparatus for manufacturing a resin-sealed article structured as described above.

As described above, after the resin sealing (compression molding) is completed, the lower side member 230 is first lowered in a state where the lower side bottom member 220 is stopped when viewed from the outside of the resin sealing product manufacturing apparatus 1000 . The present invention is not limited thereto and the lower mold member 220 may be first lowered while the lower mold side member 230 is stopped from the outside of the resin sealing apparatus 1000, .

Further, after the molding resin 20 is molded and opened, the lower side member 230 and the lower side bottom member 220 can be raised or lowered relatively. 32 and 33) of the lower side face member 230 and the outer peripheral face of the lower side face side member 220 can be scraped into at least one of the upper side and the lower side of the lower side have. The resin residue made of the scraped resin is removed by a cleaner having a suction mechanism. The resin residue scraped down into the lower mold can be accommodated in the box and the resin residue collected in the box can be discarded. This makes it possible to continuously and stably operate the resin encapsulation article manufacturing apparatus.

Further, for example, a structure using a so-called hold frame, in which a lower base, an upper base, and two columnar members for coupling them are integrated, may be employed instead of the structure using four tie bars. In this case, the two columnar members correspond to the respective support members. The lower base, the upper base, and the two columnar members for joining them may be constituted by one frame member and four members may be assembled by assembling.

The positions of the two driving mechanisms (motors 311 and 224) are not limited to the central portion of the lower base 301 and the central portion of the elevating and lowering unit 304. The motor 311 may be disposed at a portion near the periphery of the lower base 301. [ The motor 224 may be disposed at a portion near the periphery of the lifting unit 304. [ In this case, for example, from the rotating shaft of the motors 311 and 224 to the center ball screws 312 and 223 are mechanically connected via a motor pulley, a timing belt, and a ball and a using pulley sequentially.

Further, for example, a hydraulic mechanism or a pneumatic mechanism may be used instead of a transmission mechanism composed of a motor. Toggle mechanisms can be combined with these mechanisms.

In the present invention, the sealed substrate 1B as a resin encapsulation product includes an intermediate product used for manufacturing semiconductor products such as IC (Integrated Circuit) and LED (Light Emitting Diode). The sealed substrate 1B may itself be a semiconductor product. The sealed substrate 1B includes an intermediate product for producing a combination circuit module for electronic components such as passive components such as resistors, capacitors, and inductors, sensors, filters, and the like on the semiconductor chip. The circuit module includes a control circuit module used for controlling the internal combustion engine, the control of the electric motor, the steering system, the braking system, and the like in the transportation equipment. The circuit module includes a so-called power control circuit module used for control in power generation and transmission and distribution.

The circuit board 1 is not limited to a circuit board such as a printed board. The circuit board may be a semiconductor wafer such as a silicon wafer, a ceramic substrate, or a metal lead frame.

In addition, in the present invention, the resin encapsulation product to be produced is not limited to the encapsulated substrate 1B, but may be a general resin encapsulation product other than those related to electronic components and semiconductors. For example, the present invention can be applied to a case where an optical component such as a lens, an optical module, and a light guide plate is manufactured by resin molding or a general resin sealing product is manufactured. In other words, in the above description, the description about the resin-sealed article manufacturing apparatus 1000 is also applied to a general resin-sealed article manufacturing apparatus.

On the other hand, in the present embodiment, the case where the lower shape bottom member 220 has a rectangular shape is described. However, the present invention is not limited to this, and the bottom surface of the bottom member 220 may have a circular shape or an irregular shape (a shape having a concave-convex shape in a circular shape, a shape in which a concave- In this case, the planar shape of the through-hole formed at the center of the lower side member 230 may be a shape corresponding to the planar shape of the lower base member 220 (a shape having concavity and convexity in a circular shape, Shape, etc.).

For example, a resin (jelly-like resin) exhibiting a jelly shape at room temperature can be used as the resin material 20a supplied to the lower mold cavity 201, and a resin material (liquid resin) have. In the latter case, the liquid resin supplied to the lower mold cavity 201 is the fluid resin 20b itself. Instead of the thermosetting resin, a thermoplastic resin may be used.

The present invention is not limited to the above-described embodiments, and can be appropriately combined, changed or selected as needed within the scope of the present invention.

This application claims priority based on Japanese Patent Application No. 2016-103683, filed on May 24, 2016, the disclosure of which is incorporated herein by reference in its entirety.

1: substrate (circuit board) 1A: pre-sealing substrate
1B: Sealed substrate (resin sealed product) 2: Chip
3: hole of substrate 10: molding mold
20a: resin material (granular resin) 20b: fluid resin
20: sealing resin (cured resin) 22: elastic member
100: Upper mold 110: Upper mold base block
111: first phase type base block 112: second phase type base block
113: Third phase type base block 114: hole (through hole)
115: stopper 116: collar
117: bolt 118: support member
119: elastic member 120: upper side block
130: Upper mold cavity block 131: Upper mold cavity
132: Retraction hole 140: Ejector plate
141: first ejector plate 142: second ejector plate
143, 143A: Ejector pin 143B: Ejector pin drive mechanism
144: return pin
150: Outer air blocking member (upper outer air blocking member)
150A, 150B: sealing member (O-ring) 200:
201: Lower mold cavity
210: Lower die base block (lower plate side member mounting plate, first connecting member)
211: first lower die base block 212: second lower die base block
213: a frame-shaped member (first connecting member)
220: lower mold bottom face member 220A: inner bottom face
221, 221B: lower type bottom surface member mounting member (second connection member)
222: ball nut (second connecting member) 223: ball screw (second connecting member)
224: motor (second driving mechanism) 225: through hole
226: sealing member 230: lower side member
230A: inner peripheral surface 231: frame floating pin (substrate pin)
232: substrate positioning portion 233: elastic member
234: push pin (ejector pin descent inhibiting member)
235: elastic member 236: through-hole (communication hole)
236A: opening 241: columnar member
242: actuator 243: upper surface
244:
250: Outer air blocking member (lower outer air blocking member)
301: lower base 302: tie bar
303: upper base 304:
311: motor (first driving mechanism) 312: ball screw (main connecting member)
313: Ball nut (main connecting member)
314: Mounting plate for lifting and lowering (main connecting member)
321: hole for suction 322: pipe for suction
323: vacuum pump (decompression source) 324: switching valve
400: Material Transfer Module 401: Power Supply
402: control unit 403: substrate material carrying unit
404: resin material feeding portion 405: material feeding mechanism
406: X-direction guide rail 407: Main transport mechanism
408: Y-direction guide rail 500:
501: Subtransport mechanism 502: Resin sealing article transfer mechanism
503: Magazine 1000: Resin sealing article manufacturing apparatus
2000: Molding module E: Outer space
S: Clearance
X1 to X17: Arrow indicating the moving direction of the lower side member or the direction in which the force is applied
Y1 to Y9: arrows indicating the flow of air between the external space (E) and the atmosphere
Z1 to Z15: arrows indicating the direction of movement of the bottom member or the direction in which the force is applied

Claims (13)

And a molding die having a top mold and a bottom mold,
Wherein the upper mold and the lower mold each have a cavity on an opposite surface,
Wherein the lower mold has a lower bottom member and a lower side member,
At least a part of the upper surface of the lower mold half member constitutes the bottom surface of the lower mold cavity,
At least a part of the inner surface of the lower side member constitutes a side surface of the lower cavity,
Wherein the lower bottom member and the lower side member are separately liftable,
Wherein the upper mold has an ejector pin that can protrude / retract from the upper surface of the upper mold cavity,
Sealing both sides of the substrate disposed between the two cavities by the lower cavity and the upper cavity by compression molding,
The lower mold bottom member and the lower mold side member are separately lifted and lowered to release the resin encapsulation product obtained by resin sealing of the substrate from the lower mold cavity,
And the ejector pin is protruded from the upper surface of the upper mold, thereby releasing the resin sealing product from the upper mold cavity. The method according to claim 1,
At least one of the lower side member and the lower member has a through hole penetrating from the inner side to the outer side,
Wherein the lower inner surface side of the through hole is closed with respect to the inner surface of the lower mold cavity when the resin is sealed by the lower cavity and is opened to the inner surface of the lower cavity when releasing the resin sealing product from the lower cavity. 3. The method of claim 2,
The lower side member has the through-hole penetrating from its inner side to its outer side,
Wherein when the resin is sealed by the lower cavity, the inner side surface side of the lower side member of the through hole is closed by the lower side bottom surface member,
Wherein the lower side lower surface member is relatively lowered relative to the lower side surface member so that the inner side surface of the through hole of the lower side surface member opens toward the lower cavity when the resin encapsulation product is released from the lower cavity, Device. 3. The method of claim 2,
A columnar member inside the through-hole,
The columnar member can close the inner surface of the lower mold as it is inserted into the lower inner surface of the through hole,
And the columnar member is drawn out from the inner side of the lower mold of the through-hole to open the inner side of the lower mold. The method according to claim 1,
Said lower side member having a frame floating pin,
Wherein the frame floating pin is capable of loading a substrate and can be projected from the upper surface of the lower side member. 6. The method of claim 5,
The frame floating pin is provided so as to protrude upward from the upper surface of the lower side member,
Wherein the frame floating pin mounts the substrate in a frozen state from the upper surface of the lower side member. 6. The method of claim 5,
Wherein the frame floating pin includes a substrate positioning portion in the shape of a projection at a tip thereof,
Wherein the substrate positioning portion is inserted into a through hole provided in the substrate so that the frame floating pin mounts the substrate. The method according to claim 1,
A lower base;
A support member provided upright on the lower base;
An upper base provided on the support member and opposed to the lower base;
A lifting and lowering member mounted on the supporting member so as to be able to move up and down in a middle portion thereof;
A first driving mechanism mounted on the lower base;
A second driving mechanism mounted on the lift unit;
A main connecting member connecting the first driving mechanism and the lifting and lowering unit;
A first sub connecting member connected to the lower side member; And
And a second sub connection member connected to the lower bottom surface member
The upper die is mounted on the upper base,
The first sub-connection member is connected to the lifting and lowering unit,
The second sub-connection member is connected to the second driving mechanism,
Wherein the lower side member is vertically driven by the lifting and lowering unit driven up and down by the first driving mechanism,
And the lower mold member is vertically driven by the second driving mechanism. The method according to claim 1,
A lower base;
A support member installed upright on the lower base;
An upper base provided on the support member and opposed to the lower base;
A lifting and lowering member mounted on the supporting member so as to be able to move up and down in a middle portion thereof;
A first driving mechanism mounted on the lower base;
A second driving mechanism mounted on the lift unit;
A main connecting member connecting the first driving mechanism and the lifting and lowering unit;
A first sub connecting member connected to the lower side member; And
A second sub-connection member connected to the lower bottom member; Further comprising:
The upper die is mounted on the upper base,
The first sub-connection member is connected to the second driving mechanism,
The second sub-connection member is connected to the lifting and lowering unit,
Wherein the lower bottom member is vertically driven by the lifting and lowering unit driven up and down by the first driving mechanism,
And the lower side member is driven up and down by the second driving mechanism. The method according to claim 1,
Further comprising an ejector pin descent inhibiting member,
Wherein the ejector pin lowering restraining member is configured to move up and down the lower bottom member and the lower side member so that when the resin sealing member is released from the lower cavity, Molding device. A material receiving module for receiving a resin material as a raw material of the fluid resin;
At least one molding module,
Wherein the molding module has the compression molding apparatus according to claim 1,
Wherein at least one of the molding modules is detachable with respect to the material receiving module, and at least one of the molding modules is attachable to and detachable from the other molding modules. A compression molding apparatus according to any one of claims 1 to 10 or a resin sealing product manufacturing apparatus according to claim 11,
A compression molding step of resin-sealing both sides of the substrate by compression molding;
And a mold releasing step of releasing the resin sealing product from the molding die after the compression molding,
In the compression step,
Sealing both sides of the substrate disposed between the two cavities by the lower cavity and the upper cavity by compression molding,
In the mold release step,
The lower mold member and the lower mold member are separately lifted and lowered to release the resin sealing member from the lower mold cavity,
And ejecting the ejector pin from the upper surface of the upper mold to release the resin sealing product from the upper mold cavity. A method for producing a resin encapsulated article, wherein the resin encapsulation article is produced by using the compression molding method according to claim 12.

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