JP3511768B2 - Method for manufacturing semiconductor device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device using a semiconductor device lead frame on which a semiconductor chip is mounted and wired.

[0002]

2. Description of the Related Art In general, a semiconductor device 1 has a semiconductor chip 2 on which predetermined circuits and the like are integrated and formed as shown in FIG.
Is mounted on a conductive thin metal plate and is sealed with a sealing resin 5 made of a thermosetting synthetic resin such as epoxy resin while being electrically connected to the lead terminal group 3 formed on the thin metal plate. Is configured. The lead terminal group 3 has one end extending to the outer peripheral portion of the semiconductor chip 2 and the other end protruding and exposed from the encapsulating resin 5 to form the connection terminal piece 4. The semiconductor device 1 includes a sealing resin 5
A positioning index 6 for displaying the mounting position and the like, a specification display not shown, and the like are provided on the surface of the. The positioning index 6, the specification display, and the like are formed by a resin encapsulation mold when the encapsulation resin 5 is molded, for example.

To manufacture the above-described semiconductor device 1, FIG.
Also, a strip-shaped lead frame 100 made of the conductive metal thin plate shown in FIG. 16 is used. This lead frame 100 is designed to improve the production efficiency.
A so-called multi-cavity configuration is adopted. That is, the lead frame 100 is provided with a plurality of chip mounting portions 101 on which the semiconductor chips 2 are mounted, at predetermined intervals in the longitudinal direction. Chip mounting part 10
For example, an opening for opening the semiconductor chip 2 in the central portion is formed in the central portion 1, and a large number of lead terminal portions 102 each having one end extending to the peripheral portion of the opening are formed in each region. ing.

Further, the lead frame 100 is formed with a conveyance guide portion 103 along both side edges in the width direction. The conveyance guide unit 103 includes a large number of perforations 104A and 104B that are opened at regular intervals.
It is composed by. Therefore, the lead frame 100 is transported by a transport means (not shown) while being positioned by the transport guide portion 103, and the mounting process of the semiconductor chip 2 and wiring by the wire bonding method or the like between the semiconductor chip 2 and the lead terminal group 3 are performed. The semiconductor device 1 is continuously manufactured by performing steps, a resin encapsulation step of encapsulating the semiconductor chip 2 with a thermosetting synthetic resin, a step of cutting the outer peripheral lead portion, and the like.

In the manufacture of the semiconductor device 1, generally, in order to improve the production efficiency, the above-described multi-cavity structure of the lead frame 100 is used, and a pair of the first lead frame 100A and the second lead frame 100B are in parallel with each other. Then, the above-mentioned steps are simultaneously carried by the carrying means. FIG. 15 shows an outline of the resin encapsulation process, and illustration of the resin encapsulating device arranged across the first lead frame 100A and the second lead frame 100B is omitted. The resin sealing device is composed of a pair of upper and lower molds 105 and 106 (see FIG. 19) that are moved toward and away from each other, and pass the first lead frame 100A and the second lead frame 100B between the facing surfaces. The cavities 105A, 106A for outsert-molding the encapsulating resin 5 for encapsulating the mounted semiconductor chip 2 are respectively configured.

Further, in the resin sealing device, a resin supply section 107 is arranged on the lower die 106 side, located between the first lead frame 100A and the second lead frame 100B. Although details are omitted, the resin supply unit 107 is provided with a heating unit and a pushing unit 110 on the bottom surface.
(See FIG. 19) is movably arranged. The resin supply unit 107 is loaded with a resin material 111 such as a tablet-shaped epoxy resin.

In the resin sealing device, the resin supply section 107, the runner section 124 and the cavity 105 are heated by heating means.
The temperature of each part of A and 106A is adjusted to about 175 ° C. which is the melting temperature of the resin material 111. Resin material 111
Is made into a molten state having low viscosity by being pressurized and heated in the resin supply unit 107.

The resin sealing device is provided with a runner portion 124 that reaches the running regions of the first lead frame 100A and the second lead frame 100B from the resin supply portion 107, and the runner portion 124 and the cavity 10 are provided.
A gate portion 125 is provided between the gate portions 125 and 5A and 106A. The runner portion 124 and the gate portion 12
5 is illustrated in FIG.

When the first lead frame 100A and the second lead frame 100B, each having the semiconductor chip 2 mounted on the chip mounting portion 101, are conveyed, the resin encapsulation device moves upwards with respect to the lower mold 106. The mold 105 moves and the mold clamping operation is performed. In the resin sealing device, the pushing means 110 is operated in this state to push the molten resin material 111 from the resin supply portion 107 to each runner portion 124. The resin material 111 is transferred from the runner portion 124 through the gate portion 125 to the cavity 105.
A, 106A is filled.

The resin sealing device includes upper and lower molds 105, 106.
Is held in the mold clamped state and heated for a predetermined time to cure the resin material 111, and then the upper mold 105 is moved with respect to the lower mold 106 to perform a mold opening operation. As a result, the lead frame 100 has a structure shown in FIG.
As shown in, the encapsulating resin 5 for encapsulating the outer peripheral portion of the semiconductor chip 2 is outsert-molded. Then, in the resin sealing device, the next area of the lead frame 100 is transported to the transporting position by the transporting means, and the outsert molding of the sealing resin 5 is performed.

Thereafter, the outsert molding of the encapsulating resin 5 is sequentially performed, and the encapsulating process of the plurality of semiconductor chips 2 mounted on the lead frame 100 is completed. In addition,
As shown in FIG. 14, the encapsulating resin 5 is used for the lead frame 1
The lead terminal portion 102 formed in No. 00 is sealed up to the vicinity of the tip portion.

The lead frame 100 is conveyed to the step of cutting the outer peripheral lead portion by the conveying means after the encapsulating step of the encapsulating resin 5 on the mounted semiconductor chip 2 is completed. The cutting of the outer peripheral lead portion is performed using, for example, an outer shape punching die. The outer shape punching die completes the semiconductor device 1 shown in FIG. 14 by cutting and removing the other outer peripheral portion of the lead frame 100 while leaving the tip portion of the lead terminal portion 102.

In this cutting step, the gate resin portion 10 existing between the encapsulating resin 5 and the runner resin portion 108 is formed.
The cutting of 9 is also performed. This gate resin portion 109 is shown in FIG.
As shown in FIG. 7, it exists in the area of the lead terminal portion 102 in the lower portion of the lead frame 100. If the gate resin portion 109 is left in a state of largely protruding from the semiconductor device 1, it becomes a great obstacle when the semiconductor device 1 is mounted on a circuit board or the like, and therefore must be precisely cut. Therefore, the gate resin portion 109 is cut from the lead frame 100 by using a dedicated gate cutting machine, as shown in FIG.

[0014]

In the conventional outsert molding method of the encapsulating resin 5 for the lead frame 100 described above, burrs of the resin material 111 occur at various portions. As for the burr of the resin material 111, as shown in FIG. 15, the loading part burr 112 generated around the opening end of the resin supply part 107 and the runner part 124 guided from the resin supply part 107 traverse the lead frame 100. The cross-section burr 113 generated in the part and the terminal part burr 114 generated around the lead terminal part 102 are roughly classified.

The charging portion burr 112 is generated when the resin material 111 protrudes and hardens at the mating surfaces of the upper mold 105 and the lower mold 106 which constitute the resin supply unit 107. The charging portion burr 112 can be removed by air treatment or brushing treatment after insert molding.

The loading portion burr 112 does not affect the semiconductor device 1 because the lead portion of the lead frame 100 is cut and removed in the next cutting step as described above. However, when the semiconductor device 1 is manufactured by an automatic machine, the loading portion burr 112 is not preferable because it may cause the lead frame 100 to be caught or misaligned during the transportation to the next process. Further, since the loading portion burr 112 adheres in an unstable state, it drops off during transportation, which causes a problem that the operation of the movable mechanism portion or the like is hindered.

The transverse portion burr 113 is formed on the lead frame 10.
It is generated when the material resin 111 guided from the resin supply portion 107 arranged outside 0 to the cavities 105A and 106A via the runner portion 124 protrudes and hardens at the side end portion of the lead frame 100. That is, the lead frame 100 has its perforation 1
When the guide pin 120 is relatively engaged with 04, it is mounted in the lead frame mounting portion of the lower mold 106 while being positioned.

In the lead frame 100, as shown in FIG. 20, the distance B between the center of the perforation 104 and the side end and the inner diameter C of the perforation 104 are defined with a predetermined tolerance. ing. For example, this tolerance is ± 0.05 mm. Further, in the lead frame 100, since the guide pin 120 is smoothly and relatively engaged with the perforation 104,
Appropriate clearance is set. For example, the clearance is set to 0.01 mm.

With respect to the lead frame 100 and the lower die 106, the perforation 104 and the guide pin 1 are considered in consideration of the processing error or the assembly error of each part in addition to the above-mentioned conditions.
20 is configured to be engageable and positioned. Further, the lead frame 100 and the lower mold 106 are configured such that the perforation 104 and the guide pin 120 are engageable with each other and positioned in consideration of the dimensional change due to thermal expansion of the lead frame 100. It

The lead frame 100 is generally made of an alloy thin plate of nickel and iron having a coefficient of thermal expansion of 6.7 × 10 ⁻⁶ / ° C. Therefore, the B dimension is 5
mm and the amount of dimensional change ΔB due to thermal expansion in the range of room temperature (20 ° C.) to 175 ° C., which is the heating temperature of the lower mold 106, is ΔB = 5 (mm) × (175 ° C. -2
0 ° C) × 6.7 × 10 ⁻⁶ /°C=5.2×10 ⁻³
(Mm) must be expected.

Therefore, in the lower die 106, the dimension A of the perforation 104 and the lead frame mounting portion shown in FIG. 20 is the maximum tolerance of the spacing dimension B between the center and the side end portion of the perforation 104 described above. And the maximum change amount due to thermal expansion, the maximum tolerance of the perforation 104, and the maximum value of these processing errors. Therefore, in the lead frame 100 and the lower die 106, a gap 121 having a gap dimension D is formed between the side end portion and the lead frame mounting wall. The gap dimension D is 0.1 at maximum.
Reach 2 mm.

As described above, the lower die 106 has the resin supply portion 107 disposed outside the mounting portion of the lead frame 100, and the runner portion 124 extends from the resin supply portion 107 to the lead frame. It is led across the 100 to the cavity 106A. Therefore, the resin material 111 extruded from the resin supply unit 107 is
As shown in FIG.
By crossing over from 1 and hardening, the transverse portion burr 113
Generate.

The cross-section burr 113 does not affect the semiconductor device 1 since the lead portion of the lead frame 100 is cut and removed in the next cutting step, like the loading section burr 112 described above. However, when the semiconductor device 1 is manufactured by an automatic machine, the cross-section burr 113 is provided in the lead frame 10 when the semiconductor device 1 is transferred to the next process.
It is not preferable because it causes 0 hooking, positioning failure and the like. Further, the cross-section burr 113 is formed by the lead frame 100.
Since it adheres in an unstable state, it may fall off during transportation, causing a problem that the operation of the movable mechanism part is hindered.

The terminal portion burr 114 is formed on the chip mounting portion 101.
A lead terminal portion formed by punching around the chip mounting portion 101 from the mating surfaces of the upper mold 105 and the lower mold 106 that form the cavities 105A and 106A of the sealing resin 5 that seals the semiconductor chip 2 mounted on the It occurs when the resin material 111 protruding along the line 102 is cured. The terminal portion burr 114 is a thin film-shaped burr that straddles between the lead terminals and is generated in the lead frame 100. Therefore, like the above-described loading portion burr 112 and transverse portion burr 113, the terminal burr 114 is transported. There is little influence on the occasion.

That is, the lead frame 100 is generally formed by punching with a precision press using the above-mentioned thin metal plate as a material. Due to the characteristics of the press work, the lead frame 100 has a sagging portion 122 and a burring portion 123 as shown in FIG. 22, which makes it difficult to form a precise uniform surface. Also, the lead frame 1
00 becomes a curved state as a whole due to a so-called springback phenomenon.

Therefore, in the conventional resin sealing device, the upper and lower molds 105, 1 are connected to both ends of the lead frame 100 where the above-mentioned sag 122 and burrs 123 are generated.
Terminal part burr 1 by pressing strongly with 06
It was configured to prevent the generation of 14. As shown in FIG. 23, the mold clamping force of the upper and lower molds 105 and 106 is, as shown in FIG.
0 from one end to the gate portion 125, the outer peripheral portions 125 and 126 of the cavities 105A and 106A filled with the encapsulating resin 5, and the positioning portion 127 of the encapsulating resin 5.
The mold clamping force is large at the part corresponding to the above and the other end of the lead frame 100.

In the resin sealing device, the opening of the resin supply portion 107 provided on the lower mold 106 and the upper portion of the cavity 105A and 106A are closed so that no gap is formed in the outer peripheral portions 125 and 126 of the cavities 105A and 106A. Between the main surface of the mold 105 and FIG.
As shown in FIG. 3, a minute interval H is maintained. The lead frame 100 is formed with a thickness tolerance of ± 0.01 mm. Therefore, the interval H is 0.01 mm
It is set to 0.02 mm.

In this way, in the resin sealing device, as shown in FIG. 19, the mold clamping force in the resin supply portion 107 is made substantially small so that the cavities 105A, 1
A sufficient mold clamping force in 06A is secured, and generation of the terminal portion burr 114 in the outer peripheral portions 125 and 126 of the cavities 105A and 106A is suppressed. In other words, in the resin sealing device, by adopting the configuration that suppresses the terminal portion burr 114, the above-mentioned loading portion burr 112 is generated in the opening portion of the resin supply portion 107.

Thus, the conventional lead frame 100
In the outsert molding method of the encapsulating resin 5 for
Due to the configuration of the lead frame 100 and the resin sealing device, burrs of the resin material 111, that is, the loading portion burrs 112, the transverse burrs 113, the terminal burrs 114, and the like are inevitably generated at various portions, and these burrs are generated. Problems such as a catching phenomenon of the lead frame 100 and obstacles to a movable part due to falling of the lead frame 100 occur during transportation and the like.

Further, in the conventional outsert molding method, since the mold clamping force is partially adjusted by finishing each part of the resin sealing device with high accuracy, the resin sealing device is manufactured. There was a problem that the cost was extremely high.

Further, in the conventional outsert molding method, the lead outer shape punching die for cutting and removing the other outer peripheral portion of the lead frame 100 leaving the tip portion of the lead terminal portion 102, and the gate resin portion 109 are cut. There was a problem that a dedicated gate cutting machine was required, the equipment became large and there were many processes. Moreover, since the gate resin portion 109 is cut in a state where the gate mark 115 is projected on the peripheral surface of the encapsulating resin 5 as shown in FIG. 18,
There is also a possibility that the gate mark 115 may cause a problem of damaging the lead outer shape punching die.

Furthermore, in the conventional outsert molding method, the resin supply portion 107 is provided outside the lead frame 100, and the resin material 111 is filled with the cavities 105A and 106A through the runner portion 124.
Therefore, a large amount of the resin material 111 is required, and the filling time into the cavities 105A and 106A becomes long, so that the molding cycle becomes long.

Therefore, the present invention provides a method for manufacturing a semiconductor device using a resin molding device which is miniaturized and reduced in cost, and which is manufactured by a rationalized process and a reduced amount of resin material. It was proposed for that purpose.

[0034]

A method of manufacturing a semiconductor device according to the present invention, which achieves this object, comprises a chip mounting portion on which a semiconductor chip is mounted and one end exposed to the peripheral portion of the chip mounting portion. Lead terminal area portion in which a large number of lead terminal piece groups forming an electrical connection portion with a semiconductor chip on which the parts are mounted are formed, and a resin supply provided outside the lead terminal area portion. A lead frame is used in which the parts are integrally formed of a conductive thin metal plate.

In the method of manufacturing a semiconductor device according to the present invention, the tip end of the lead terminal piece group is exposed to the lead frame in a state where they are arranged so as to come in contact with and separate from each other and are clamped. For forming a cavity corresponding to a resin-filled area for sealing
Of the mold member and the second mold member, a pair of lock shafts provided on two facing side surfaces of the first and second mold members, and a pair of lock shafts provided on the other facing side surface of the other Of the first mold member and the second mold member.
The mold clamping mechanism that holds the mold member in the mold clamping state, and the resin material in the molten state inside the cavity from the resin supplier provided on one of the mold members corresponding to the resin supplier of the lead frame. And a semiconductor device assembly formed by filling the resin filling region of the lead frame with the resin material fed into the cavity. A resin sealing device including a die member and an ejecting mechanism protruding from one of the die members in a state where the die member is opened is used.

According to the method of manufacturing a semiconductor device of the present invention, the lead frame supplying step of mounting the lead frame in the facing space in the mold open state of the first mold member and the second mold member. And by clamping the first mold member and the second mold member by the mold clamping mechanism, the outer region of the resin filled region of the lead frame is held and the cavity corresponding to the resin filled region is formed. Forming the mold clamping step, and filling the molten resin material into the cavity by the material resin supply mechanism, and sealing the semiconductor chip mounted on the chip mounting portion with this resin material to form a semiconductor device assembly. The resin molding process and the semi-conduction by the eject mechanism from either one of the first mold member and the second mold member opened after the resin material filled in the cavity is cured. A semiconductor device assembly ejecting step of ejecting the device assembly, and the semiconductor device assembly taken out is cut and separated into a tip portion of a lead terminal piece group of a lead frame and a runner portion of a resin material supplied from a resin supply portion. A semiconductor device is manufactured by the lead frame cutting step.

[0037]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments of the present invention will be described in detail below with reference to the drawings. The semiconductor device 1 is manufactured through the steps shown in FIG. 3 using a conductive thin metal plate which is an alloy of nickel and iron as a raw material. That is, in the first lead frame manufacturing process, the lead frame 10, which will be described in detail later, is formed by subjecting a thin metal plate to precision pressing. Of course, the lead frame 10 is formed not only by precision pressing but also by etching or the like. In the second semiconductor chip mounting step, the semiconductor chip 2 in which a predetermined circuit or the like is integrated and formed is mounted on the lead frame 10 formed in the first step.

In the third wire bonding step, the lead terminal piece group 3 formed on the lead frame 10 and the mounted semiconductor chip 2 are mounted by an automatic wiring device or the like.
Are electrically connected to the respective connection terminals via wires. In the fourth resin molding step, the lead frame 10 is supplied to the resin encapsulation device 31, and the resin encapsulation device 31 outserts the encapsulation resin 5 for encapsulating the outer peripheral portion of the semiconductor chip 2 to the lead frame 10. The semiconductor device assembly 7 shown in FIG. 1 is formed by molding. In the semiconductor device assembly 7, in the fifth lead frame cutting step, the outer peripheral portion is cut and removed by a cutting device such as a laser cutter, and the semiconductor device 1 shown in FIG. 14 is manufactured. From the first lead frame manufacturing process to the fifth
The lead frame cutting process is basically the same as the conventional semiconductor device manufacturing process.

The semiconductor device 1 manufactured through the above steps
As shown in FIG. 14, the structure is basically the same as that of the conventional semiconductor device, and the whole is sealed with a sealing resin 5 made of a thermosetting synthetic resin such as an epoxy resin. A large number of connecting terminal pieces 4 are exposed and configured on the outer peripheral portion of. The semiconductor device 1 is provided with a positioning index 6 for displaying the mounting position and the like on the surface of the encapsulating resin 5, a specification display not shown, and the like. The encapsulating resin 5 is configured by a tablet-shaped resin material 8 supplied to the resin encapsulation device 31 being melted in the resin encapsulation device 31 and outsert-molded to the lead frame 10 as described later. To be done. The resin material 8 is loaded in an amount sufficient to form the encapsulating resin 5.

The lead frame 10 formed by the first lead frame manufacturing process has a substantially square shape as a whole as shown in FIG. 2, and one semiconductor device 1 is formed by one piece as described later. . This lead frame 10
A chip mounting opening 11 having an opening size slightly larger than the outer size of the semiconductor chip 2 is formed in a substantially central portion, and a large number of lead terminal pieces 12 (the above-mentioned lead terminals are provided in the four areas). The same as the piece 3) is radially punched out. These lead terminal pieces 12
Have a minute gap therebetween, one end of which faces the chip mounting opening 11 and the other end of which extends outward.

Further, one end of these lead terminal pieces 12 facing the chip mounting opening 11 constitutes a connecting portion with the semiconductor chip 2, and the other end thereof is connected with a circuit board or the like on which the semiconductor device 1 is mounted. It constitutes a terminal part. The other ends of these lead terminal pieces 12 are integrally connected via a bridge portion 14, and when the outer peripheral portion is cut and removed from the bridge portion 14 in the fifth lead frame cutting step,
Separated from each other.

In the lead frame 10, the inner peripheral region of the lead terminal piece 12 shown by the inner chain line in FIG. The resin filling region 13 for forming the encapsulating resin 5 is formed by outsert molding. In addition, in the lead frame 10, the connection area between the tip portion of each lead terminal piece 12 and the bridge portion 14, which is indicated by an outer chain line in FIG. 2, is cut in the fifth lead frame cutting step so as to be cut off.
It is said that The lead frame 10 has a bridge portion 1
In order to precisely punch and form the lead terminal strips 12 located outside the lead terminals 4, the terminal forming guide portions 15 each having a large number of rectangular openings respectively corresponding to the lead terminal strips 12 are punched and formed.

Further, the lead frame 10 is positioned in the outermost peripheral region of the two sides extending outward, and is a positioning hole for positioning when the lead frame 10 is mounted on the resin sealing device 31 described later. 16A to 16C are open. As shown in FIG. 2, the first positioning hole 16A is configured as a round hole, the second positioning hole 16B is configured as an elongated hole, and the third positioning hole 16C is a rectangular opening parallel to the terminal formation guide portion. And a long hole connected to one end thereof. These positioning holes 16A to 16C function not only as the positioning function in the resin sealing device 31 described above, but also as a transport guide with which the guide pins of the transport mechanism are relatively engaged when the lead frame 10 is transported between processes. To do.

The lead frame 10 is provided with a resin supply section 17 located at the corners of the two sides where the positioning holes 16A to 16C are formed. As shown in detail in FIG. 7, the resin supply portion 17 is configured as an annular opening portion hung by a large number of tie bars, and a part of the opening portion is provided as a passage communicating with the chip mounting opening portion 11 and a runner portion. 18 have been opened. Further, the runner portion 18 is provided with a gate portion 19 by gradually narrowing the tip end portion thereof in correspondence with the resin filling region portion 13.

The lead frame 1 constructed as described above
0, the semiconductor chip 2 is mounted at the chip mounting opening 11 in the second semiconductor chip mounting step. In the third wire bonding step, the lead frame 10 has its lead terminal piece 12 and the semiconductor chip 2
After the electrical connection by wire with the terminal of the
It is supplied to the resin sealing device 31 that performs the resin molding process of. The resin sealing device 31 includes the upper mold 20 and the lower mold 22 shown in FIGS. 4 to 6, although details thereof will be described later.

The upper die 20 has a surface facing the lower die 22 which is a precise smooth surface and is formed as a molding surface, and the outer dimension thereof is slightly larger than the outer dimension of the lead frame 10. Further, as shown in FIG. 5, the upper mold 20 is provided with a rectangular cavity 21 corresponding to the resin filling region 13 at the center of its molding surface. This upper mold 20
Is moved toward and away from the lower die 22 by a drive mechanism (not shown).

The lower die 22 has a molding surface that faces the upper die 20, which is a precise smooth surface, and the outer dimensions of this molding surface are substantially equal to the molding surface of the upper die 20. . Further, as shown in FIG. 4, the lower mold 22 has a cavity 23 corresponding to the resin-filled region 13 in the center of its molding surface. The cavity 23 cooperates with the cavity 21 of the upper mold 20 to form the cavity of the resin filling region 13 when the upper mold 20 is clamped to the lower mold 22.

Further, the lower die 22 has a lead frame 1
A resin material loading section 24 (pot) is provided corresponding to the 0 resin supply section 17. The resin material loading section 24 is
It is configured as a circular hole penetrating the lower mold 22, and a resin extruding member 35 is disposed on the bottom surface of the circular mold, although details thereof are omitted in FIG. The resin material loading unit 24 is loaded with the tablet-shaped resin material 8. Regarding the resin material loading portion 24, the lead frame 1 of the remaining resin material 8A is formed by engraving a concave portion at a position corresponding to the upper die 20.
The amount of protrusion from 0 can be averaged.

Positioning pins 25A to 25C are provided on the molding surface of the lower mold 22 so as to correspond to the positioning holes 16 of the lead frame 10, respectively. Further, the lower mold 22 is provided with a heating mechanism (not shown) including a heater and the like, and a region 2 shown by a cross line in FIG.
6, that is, the cavity 23 and its peripheral region, and the resin material loading portion 24 and its peripheral region are heated to about 175 ° C. which is the melting temperature of the resin material 8.

More specifically, the lower mold 22 is composed of a mold member having a cavity 23 formed therein and a lower mold member (not shown) to which the mold member is assembled, and they are integrated by a mounting bolt 28. The above-mentioned resin extruding member 35 driven by a driving mechanism (not shown) is movably combined with the lower mold member. As shown in FIG. 6, the lower mold 22 has a cavity 2 corresponding to the resin filling region 13.
A large number of irregularities corresponding to the lead terminal piece 12 group of the lead frame 10, the bridge portion 14 and the like are formed around the lead frame 10, so that the lead frame 10 is reliably positioned and held by the upper mold 20.

The lower mold 22 is provided with a pair of eject pins 27 facing the bottom surface of the cavity 23. Specifically, one of these eject pins 27 is arranged in the vicinity of one corner of the cavity 23 corresponding to the resin material loading section 24, and the other is in the vicinity of a corner diagonally opposite to this corner. It is arranged. Also,
These eject pins 27 usually have the tip end surface flush with the cavity 23, and are projected into the cavity 23 by a drive mechanism (not shown) during the mold opening operation to outsert the encapsulating resin 5 to the lead frame 10. The molded semiconductor device assembly 7 is projected outward from the lower mold 22.

Further, in the lower die 22, a resin material loading section 24 is provided outside the one corner of the cavity 23 in which the eject pin 27 is arranged as described above, and the resin material loading section 24 is formed. Material loading section 24 to cavity 2
A funnel-shaped runner portion 29 that communicates with 3 is recessed. A gate portion 30 is formed at the tip of the runner portion 29.

In the resin material loading section 24, the resin supply sections 17 are concentrically overlapped with each other when the lead frame 10 is mounted on the lower mold 22. The runner portion 29 overlaps the runner portion 19 of the lead frame 10. The molding die is generally inclined with respect to the cavity because the gate resin is folded and the gate is cut when the die is opened.

On the other hand, in the lead frame 10, it is not necessary to cut the gate when the mold is opened, and the gate resin is cut at the same time as the cutting of the outer peripheral portion in the fifth lead frame cutting step. 30 is the runner section 2
It is configured to be linearly connected from 9. Therefore, the gate portion 30 has a simple structure, thereby facilitating the die working of the lower die 22 and preventing the occurrence of defective molding due to abrasion.

The lower mold 22 having the above-mentioned structure is
In the mold open state in which the upper mold 20 is separated, the tablet-shaped resin material 8 is loaded into the resin material loading portion 24.
As for the resin material 8, the lower die 22 is heated to about 175 by the heating mechanism.
Since the temperature is adjusted to ° C, the molten state with low viscosity is obtained by being pressurized and heated in the resin material loading section 24. The lead frame 10 is positioned and mounted in the lower mold 22 by positioning the resin-filled region portion 13 in a position corresponding to the cavity 23 by engaging the positioning hole 16 with the positioning pin 25.

Thereafter, the upper die 20 is joined to the lower die 22 to perform the die clamping, and the lead frame 10 has its outer peripheral portion surrounded by the upper die 20 and the lower die 2.
It is firmly sandwiched by 2 and its resin filling region 13 is positioned corresponding to the cavity. Also,
As described above, in the lead frame 10 and the lower mold 22, the resin supply unit 17 and the resin material loading unit 24 overlap each other, and the runner unit 18 and the runner unit 29 overlap each other.

As shown in FIG. 8, the resin material 8 in a molten state is pushed out from the resin material loading section 24 to the runner section 29 by driving the resin extruding member 35. The resin material 8 is filled into the cavity from the runner portion 29 via the gate portion 30. Lead frame 1
In the case of 0, the material supply unit 17 located opposite to the resin material loading unit 24 and the runner unit 18 located relative to the runner unit 29 are integrally formed in the same plane, and as shown in FIG. Resin material 8 without forming a cross section
Is fed into the cavity.

In the lead frame 10, the resin material 8 is held in the pressurized state in the cavity formed by the upper die 20 and the lower die 22 and is kept in the heated state for a predetermined time to be cured. , The semiconductor device assembly 7 in which the encapsulating resin 5 is outsert-molded in a region corresponding to the resin-filled region portion 13. That is, as shown in FIG. 1, the semiconductor device assembly 7 exposes the tip portions of the lead terminal pieces 12 to the outside together with the semiconductor chip 2 mounted in the chip mounting opening 11.
The resin filling region 13 of 0 is sealed by the sealing resin 5 that is outsert-molded.

After the semiconductor device assembly 7 in which the encapsulating resin 5 is outsert-molded is formed on the lead frame 10 in this manner, the upper mold 20 and the lower mold 22 are formed on the lower mold 22. The mold opening is performed in which the mold 20 is separated. The formed semiconductor device assembly 7 is attached to the lower mold 22 and is ejected from the lower mold 22 by the operation of the eject pin 27. Hereinafter, the semiconductor device assembly 7 is formed by sequentially performing the outsert molding of the encapsulating resin 5 on the lead frame 10 described above.

As described above, the eject pins 27 are provided in the corner portion corresponding to the resin material supply portion 24 and the corner portion at the diagonal position thereof, so that the semiconductor device assembly 7 is not deformed. It surely projects from the lower mold 22. In the semiconductor device assembly 7, the encapsulating resin 5 is outsert-molded, and as shown in FIG. 1, the cured resin material 8A remains as it is from the resin supply portion 17 of the lead frame 10 to the runner portion 29. There is.

The semiconductor device assembly 7 formed by the above resin molding process is supplied to the next lead frame cutting process, and is pressed from the cutting region 15 to the lead frame 1 by, for example, a laser cutting machine or a die press.
The outer peripheral portion of 0 is cut and removed to complete the semiconductor device 1. In this case, the lead terminal pieces 12 are separated by cutting the bridge portion 14. Further, in this lead frame cutting step, as shown in FIG. 11, the resin material 8 filled in the gate portion 30 by being irradiated with the laser is also cut at the same time.

The above-mentioned lead frame 10 and upper die 20
The lower die 22 and the lower die 22 are subjected to a resin molding process to outsert the encapsulating resin 5 on the lead frame 10 to form the semiconductor device assembly 7. Therefore, the following operational effects are obtained. That is, in the lead frame 10, the positioning hole 16 is positioned in the lower die 22 and the positioning pin 25
Are positioned by engaging with the upper mold 20 and the lower mold 22 in the mold clamped state as shown in FIG.
Held within the mating plane of.

Therefore, since the lead frame 10 is directly held in the die-matching surface of the upper die 20 and the lower die 22, the tolerance of the lead frame 10 in consideration of its plate thickness, processing accuracy or dimensional change due to thermal expansion. The setting is not necessary, and the lower mold 22 is mounted in a correctly positioned state. Further, since the upper die 20 and the lower die 22 hold the lead frame 10 in the die-matching surface without holding the lead frame 10 at the outer peripheral edge portion as in the conventional case, the lead frame 10 is not held.
It suffices to apply a uniform mold clamping force to the above, and not only the structure thereof is simplified, but also the mold clamping mechanism and the like are simplified, and the overall size reduction is achieved.

As described above, the semiconductor device assembly 7 does not require a large tolerance for the size of each part of the lead frame 10, and the upper mold 20 and the lower mold 22 have a uniform mold clamping force. Therefore, the lead frame 10 is held without forming a charging portion burr in the opening of the resin supply portion 17 or a terminal burr in the peripheral portion of the resin filling area portion 13. Further, since the semiconductor device assembly 7 does not have the runner portion that crosses the lead frame 10, the semiconductor device assembly 7 is formed without the occurrence of cross-section burr. As described above, since the semiconductor device assembly 7 has almost no burrs, it is possible to simplify the deburring process and the failure of the transfer mechanism due to the burrs falling off during the transfer.

The semiconductor device assembly 7 is made of the encapsulating resin 5
The runner portion 2 is provided by arranging the cavity corresponding to
Since the lead frame 10 in which the length 9 is shortened is used, the resin material 8A remaining in the runner portion 29 is reduced. In addition, such a configuration enables the use of a thermosetting resin material having a short curing time, greatly shortens the time from filling to curing, and achieves improvement in productivity.

The upper mold 20 and the lower mold 22 described above are provided in the resin sealing device 31 shown in FIGS. 10 to 12. The resin sealing device 31 includes an upper die member 32 to which the upper die 20 is attached and fixed, and a lower die member 33 to which the upper die member 32 is freely attached and detached and the lower die 22 is attached and fixed. Composed of. Further, the resin sealing device 31 includes a mold clamping mechanism 34 that holds the upper mold 20 and the lower mold 22 in a mold clamped state. Further, the resin sealing device 31 is made up of the resin material 8
A resin supply mechanism having a resin extruding member 35 for filling the inside of the cavity is provided. Furthermore, the resin encapsulation device 31 uses the molded semiconductor device assembly 7 for the lower die 22.
An eject mechanism 36 having an eject pin 27 protruding from is provided.

The upper die member 32 has a substantially block body as a whole, and the bottom surface portion thereof constitutes a die attachment surface 37 for attaching the upper die 20. The mounting surface 37 is provided with an escape hole 38 facing the positioning pin 25 provided on the lower mold 22 side as described later. Two adjacent to the upper mold member 32
A positioning fitting convex portion 39 that protrudes downward is integrally projected on one of the side surfaces. Further, the upper mold member 32 is formed with a transporting recess 40 on two opposite side surfaces. When the resin sealing device 31 is transported, the transport recess 40 is
The holding mechanism of the carrying device (not shown) is relatively engaged.

Further, the upper mold member 32 is provided with a pair of lock shafts 41 constituting the mold clamping mechanism 34 on the upper mold side on two opposite side surfaces. The lock shafts 41 are arranged laterally spaced apart from each other on their respective side surfaces, and the upper mold member 32 and the lower mold member 33 are clamped by the relative engagement of a lock lever 48 described later. Hold.

The lower die member 33 has a substantially block shape in which the thickness dimension is slightly larger than that of the upper die member 32, and the upper die portion having substantially the same outer dimensions as the upper die member 32 has the lower die 2
A mold mounting surface 42 for mounting 2 is constructed. The lower resin member 33 is provided with the above-described material resin loading portion 24 that is open to the mold mounting surface 42 and is provided with an eject pin guide hole 44 through which the eject pin 27 is slidably assembled. Has been.

Further, the lower mold member 33 is provided with a positioning fitting concave portion 46 on two adjacent side surfaces corresponding to the positioning fitting convex portion 39 of the upper mold member 32. Further, the lower mold member 33 includes the lock shaft 41 of the upper mold member 32 described above.
A lock lever support shaft 47 that constitutes the mold clamping mechanism 34 is provided corresponding to the above.

Although not shown, the lower die member 33 is provided with a heating means such as a heater therein, so that the above-mentioned heating region is controlled to a temperature of about 175 ° C. Further, the lower mold member 33 supplies resin material to the cavity of the mold by driving the resin extruding member 35 (not shown) at the lower part of the lower mold member 33 so as to push it upward in the resin material loading portion 24. A mechanism is provided. Further, in the eject pin guide hole 44, although not shown, a spring that holds the eject pin 27 in the retracted lower position so that the tip of the eject pin 27 is flush with the cavity 23 is provided. The eject pin 27 is ejected into the cavity 23 against the elastic force of the spring by an eject mechanism 36, which is not described in detail.

The mold clamping mechanism 34 is provided on both side surfaces of the lower mold member 33, and a pair of locks whose one end is rotatably cantilevered by a lock lever support shaft 47 of the lower mold member 33. The lever 48 and a pair of link levers 50 each of which has one end rotatably supported by a link shaft 51 provided on the free end side of the lock lever 48 and whose free ends are connected to each other. . Arc-shaped cam grooves 49 are formed on the outer edges of the lock levers 48, respectively. A tubular cam 52 is attached to the link lever 50 at the connecting portion.

The mold clamping mechanism 34 is paired by a drive mechanism (not shown) in a state where the upper mold member 32 approaches the lower mold member 33 and the upper mold 20 and the lower mold 22 are clamped. The lock levers 48 are pivoted outward with the lock lever support shafts 47 serving as fulcrums. Lock lever 48
The cam groove 49 is relatively engaged with the lock shaft 41 of the upper mold member 32 by this rotating operation. This engagement state is maintained by, for example, the elastic force of a spring (not shown) that urges the cam 52 downward. Therefore, the upper mold 20 and the lower mold 22 are held in the mold clamped state.

The resin sealing device 31 configured as described above
As shown in FIG. 10, the tablet-shaped resin material 8 is loaded in the resin material loading portion 24 in the mold open state in which the upper mold member 32 is separated from the lower mold member 33. Since the upper die member 32 is heated, the resin material 8 is
It melts gradually in the resin material loading section 24. Further, the lead frame 10 is supplied to the resin sealing device 31, and the lead frame 10 is mounted on the lower mold 22 in a state of being positioned by the relative engagement of the positioning hole 16 and the positioning pin 25.

In the resin sealing device 31, the upper mold member 32 moves closer to the lower mold member 33 and the upper mold member 20 and the lower mold member 22 are moved.
Are abutted against each other, and the mold clamping mechanism 34 is driven by a drive mechanism (not shown) to be held in the mold clamping state described above. The upper mold member 32 and the lower mold member 33 are formed by the fitting protrusion 3
9 and the fitting recess 46 are engaged with each other, so that they are coupled with each other in a state of being positioned with respect to each other.

In the mold clamped state, the upper mold 20 and the lower mold 22 cooperate with each other to form a cavity corresponding to the resin filling region 13 of the lead frame 10. Thereafter, in the resin sealing device 31, the resin supply mechanism operates, and the resin extruding member 35 causes the resin material 8 in a molten state to flow from inside the resin material loading portion 24 to the runner portion 29.
Push to.

The resin material 8 is supplied from the runner portion 29 through the gate portion 30 into the cavity between the upper die 20 and the lower die 22. In the resin sealing device 31, the mold clamping mechanism 34 holds the mold clamping state of the upper mold 20 and the lower mold 22 while the resin extruding member 35 is pushed up. Therefore, the resin material 8 is cured by being kept in a pressurized and heated state in the cavity for a predetermined time, and the lead frame 10 is outsert-molded with the encapsulating resin 5 to form the semiconductor device assembly 7.

In the resin sealing device 31, after a predetermined time has elapsed, the mold clamping mechanism 34 is driven by a drive mechanism (not shown) to release the locked state, and the upper mold member 32 is separated from the lower mold member 33. In operation, the mold opening operation is performed as shown in FIG. When this mold opening operation is performed, the semiconductor device assembly 7 will have a lower mold 22 as shown in FIG.
Attach to.

In the resin sealing device 31, the eject mechanism 36 is driven in this mold open state to eject the eject pin 27 into the cavity along the eject guide hole 44. As a result, the semiconductor device assembly 7 has the lower mold 2
2 is pushed up by the ejecting mechanism not shown in FIG.
It is taken out as shown in 2. The semiconductor device assembly 7 is
As described above, the semiconductor device 1 is manufactured by being transported to the fifth lead frame cutting step of the next step and cutting and removing the outer peripheral portion of the lead frame 10 from the cutting area portion 15.

Regarding the lead frame 10 described above,
Although one semiconductor device 1 is formed by one sheet, the present invention is not limited to such a lead frame 10. For example, the lead frame may be formed by continuously forming the chip mounting portion in a plurality of regions by using a strip-shaped thin metal plate as a material like the conventional lead frame 100. In this case, in the lead frame, the lead terminal piece 12, the bridge portion 14, the positioning hole 16 or the resin supply portion 17, the runner portion 18, and the gate portion 19 described above are individually formed for each region, and both side edges are formed. A perforation for transportation is formed along.

The present invention can be further applied to a lead frame 60 for manufacturing four semiconductor devices 1 by one as shown in FIG. The lead frame 60 is made of a thin metal plate and is formed into a rectangular shape having a lateral length slightly longer.
The main surface 61 is divided into four regions 62A to 62D. Each of these regions 62A to 62D constitutes an individual semiconductor manufacturing region forming one semiconductor device 1. Similar to the lead frame 10 described above, each of the semiconductor manufacturing regions 62A to 62D has a chip mounting portion on which the semiconductor chip 2 is mounted and is formed in the central portion thereof, and lead terminal pieces are provided around the chip mounting portion. The group is stamped and formed.

Further, each semiconductor manufacturing area 62A to 62D
Is configured as resin-filled area portions 63A to 63D in which the encapsulating resin 5 is outsert-molded while leaving the tip portion of the lead terminal piece on the inner peripheral portion thereof. Of course, each semiconductor manufacturing area 6
2A to 62D are the resin filled area portions 63A to 6D.
The outer peripheral portion of 3D is used as a cutting area portion for being separated and cut.

The lead frame 60 has one resin supply portion 64 at the center position of each semiconductor manufacturing region 62A to 62D.
Has been established. The resin supply portion 64 is positioned corresponding to the resin material loading portion provided in the molding die for outsert molding the encapsulating resin 5 on the lead frame 60.
Further, in the resin supply unit 64, each semiconductor manufacturing area 62 is
Runner portions 65A to 65D that communicate with A to 62D
Have been opened respectively. These runner portions 65A to 65D are gradually reduced in width dimension toward the respective semiconductor manufacturing regions 62A to 62D, and gate portions 66A to 66D are formed at their tip portions.

Further, the lead frame 60 is provided with positioning guide portions 67 along both ends in the width direction. These guide portions 67 have a positioning action when the lead frame 60 is mounted on the molding die, and also have a guide action at the time of conveyance.

Lead frame 6 constructed as described above
According to 0, in the second semiconductor chip mounting step, the semiconductor chips 2A to 2D are mounted on the chip mounting portions, respectively. In the semiconductor chips 2A to 2D, each terminal has a lead frame 60 in the third wire bonding step.
Is electrically connected to the lead terminal piece. The lead frame 60 on which the four semiconductor chips 2A to 2D are mounted is formed in each semiconductor manufacturing region 62 by the fourth resin molding process.
The encapsulating resin 5 is outsert-molded on A to 62D.

When the lead frame 60 is positioned and mounted in the molding die, the resin material 8 loaded in the resin material loading portion is transferred from the resin supply portion 64 to the runner portions 65A to 65A.
Extruded to 5D. The resin material 8 is loaded into the resin material loading portion in an amount sufficient to outsert the four encapsulating resins 5. The lead frame 60 includes a resin supply unit 64.
Is provided in the central portion, the resin material 8 is evenly supplied to each of the semiconductor manufacturing regions 62A to 62D.

In the lead frame 60, the encapsulating resin 5 is outsert-molded in each of the semiconductor manufacturing regions 62A to 62D to form one semiconductor device assembly. Therefore, in the next lead frame cutting step, the semiconductor device assembly is cut into each of the semiconductor manufacturing regions 62A to 62D by a cutting device such as a laser cutter to manufacture four semiconductor devices 1 at the same time.

The lead frame 60, like the lead frame 10 described above, has a resin supply portion 64 and a runner portion 65.
And the gate portion 66 is formed in each of the semiconductor manufacturing regions 62A to 62D.
By being formed in the same plane as, the plate thickness,
It is not necessary to set a tolerance in consideration of processing accuracy or dimensional change due to thermal expansion, and the device is mounted in a state of being accurately positioned with respect to the molding die. In addition, the lead frame 60 not only simplifies the structure of the molding die but also simplifies the mold clamping mechanism and the like, thereby achieving overall miniaturization.

Furthermore, the lead frame 60 eliminates the occurrence of burrs in the respective parts, and simplifies the deburring process and obstacles such as the transport mechanism due to the burrs falling off during transport. Furthermore, the lead frame 60 reduces the resin material 8 and enables the use of a thermosetting resin material having a short curing time, thereby significantly shortening the time from filling to curing, thereby achieving improvement in productivity. .

Regarding the above-described multi-piece lead frame 60, not only four lead frames 60 but also the resin supply section 64
It suffices if the individual semiconductor manufacturing regions are arranged at equal intervals centering on the. However, a lead frame having a larger number of semiconductor manufacturing regions is not very effective because it enlarges the molding die and the entire sealing device.

[0091]

As described above in detail, according to the method of manufacturing a semiconductor device of the present invention, the encapsulating resin for encapsulating the semiconductor chip on which the resin supply part, the runner part and the gate part are mounted is outsert. Since a lead frame formed on the same plane as the resin-filled portion to be molded is used and the outer periphery of the lead frame is cut and removed to manufacture a semiconductor device, efficient manufacturing with a compact and simplified sealing device Moreover, no additional processing such as a deburring process is required, the resin material can be reduced, and a large gradual cost reduction can be achieved.

Further, according to the method of manufacturing a semiconductor device of the present invention, the lead frame is directly held within the die-matching surface between the upper die and the lower die. It is not necessary to set the tolerance considering the dimensional change due to thermal expansion, and it is mounted in a state of being accurately positioned with respect to the lower mold. Further, since the upper die and the lower die hold the lead frame in the die mating surface instead of holding it on the outer peripheral edge portion as in the conventional case, a uniform die clamping force is applied to the lead frame. Therefore, the mold clamping mechanism can be composed of a lock shaft and a lock lever, which not only simplifies the structure but also simplifies the mold clamping mechanism and reduces the overall size. Can be achieved.

Further, according to the method of manufacturing a semiconductor device of the present invention, an ejecting mechanism configured to project the assembly from the mold member into the cavity of the semiconductor device formed by encapsulating resin outsert on the lead frame. With this, it is possible to reliably project outward from the mold without causing deformation or the like.

[Brief description of drawings]

FIG. 1 is a perspective view of a semiconductor device assembly which is an intermediate body of a semiconductor device.

FIG. 2 is a perspective view of a lead frame used in the semiconductor device.

FIG. 3 is a schematic manufacturing process diagram illustrating the manufacturing process of the semiconductor device according to the invention.

FIG. 4 is a schematic plan view of a lower mold forming a resin sealing device used when manufacturing the same semiconductor device.

FIG. 5 is a bottom view for explaining a schematic configuration of an upper mold forming the resin sealing device.

FIG. 6 is a plan view illustrating a detailed configuration of the same mold.

FIG. 7 is an explanatory view showing, in a plan view, a flow state of a resin material supplied from a resin material loading portion provided in a lower mold of the resin sealing device.

FIG. 8 is an explanatory diagram showing a cross-sectional view of a flow state of a resin material supplied from a resin material loading portion provided in a lower mold of the resin sealing device.

FIG. 9 is an explanatory diagram showing a cross-sectional view of the action of preventing burrs from occurring in the lead frame.

FIG. 10 is an exploded perspective view of a resin sealing device used when manufacturing a semiconductor device according to the present invention, showing a state when a lead frame is set.

FIG. 11 is an exploded perspective view of the resin sealing device, showing a state at the time of ejecting the semiconductor device assembly that has been insert-molded.

FIG. 12 is an exploded perspective view of the resin sealing device, showing a state in which the semiconductor device assembly that has been insert-molded is taken out.

FIG. 13 is a plan view showing another lead frame.

FIG. 14 is a perspective view of a semiconductor device.

FIG. 15 is a partial cutaway perspective view illustrating a conventional resin sealing step.

FIG. 16 is a plan view of a principal part for explaining the resin sealing step.

FIG. 17 is a side view of essential parts of the semiconductor device assembly, showing a state in which the lead frame is sealed with resin by the resin sealing step.

FIG. 18 is a side view of essential parts showing a state in which the resin material of the gate portion is cut from the semiconductor device assembly.

FIG. 19 is a side view of a principal part for explaining a terminal portion burr generation preventing structure in a conventional resin sealing device.

FIG. 20 is a longitudinal sectional view of an essential part for explaining a mold structure in a conventional resin sealing device.

FIG. 21 is a side view of relevant parts for explaining a state in which a transverse portion burr is generated in the mold device.

FIG. 22 is an explanatory diagram of the shape of a lead frame.

FIG. 23 is a schematic diagram illustrating the distribution of the mold clamping force of the mold provided in the conventional resin sealing device.

[Explanation of symbols]

1 Semiconductor device 2 semiconductor chips 3 Lead terminal piece 5 Sealing resin 7 Semiconductor device assembly 8 resin materials 10 lead frame 11 Chip mounting opening (semiconductor chip mounting part) 12 lead terminal pieces 13 Resin filling area 15 Cutting area 16 Positioning hole 17 Resin supply section 18 Runner section 19 Gate 20 Upper mold 21 cavity 22 Lower mold 23 cavities 24 Resin material loading section 27 eject pin 29 Runner section 30 gate 31 Resin sealing device 34 Clamping mechanism 35 Resin Extruding Member of Resin Supply Mechanism 36 Eject mechanism

─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01L 23/50 H01L 21/56

Claims (2)

(57) [Claims] 1. A large number of leads that form an electrical connection part between a chip mounting part on which a semiconductor chip is mounted and a semiconductor chip with one end facing each peripheral part of the chip mounting part mounted. A lead frame is formed by integrally forming a lead terminal area portion formed with a terminal piece group and a resin supply portion opened outside the lead terminal area portion using a conductive thin metal plate as a material. And a first mold for forming a cavity for sealing the semiconductor chip by exposing the front end portions of the lead terminal piece groups to the lead frame in a state where they are arranged to face each other so that they can come into contact with each other and are clamped. Member and second mold member, and one of the first and second mold members facing each other.
A pair of lock shafts provided on the two side faces
Consists of a pair of lock levers on two sides
It is a mold clamping mechanism for holding the these first mold member and a second mold member in the mold clamped state, in one of the mold member to correspond to the resin supply section of the lead frame A material resin supply mechanism that supplies a molten resin material into the cavity from a resin supply portion provided, and a resin material supplied into the cavity is filled in the resin filling portion of the lead frame. In the semiconductor assembly, the first and second mold members have the mold clamping mechanism.
From one of the mold members with the mold opened by
Equipped with an eject mechanism that projects into the cavity
A resin sealing device is used , a lead frame supplying step of placing the lead frame in the cavity in a state where the first mold member and the second mold member are opened, and the mold clamping mechanism. A mold clamping step of forming a cavity by holding the outer region of the resin-filled region of the lead frame by clamping the first mold member and the second mold member with each other; A resin molding step of filling a molten resin material into the cavity by a resin supply mechanism and sealing the semiconductor chip mounted on the chip mounting portion with the resin material to form a semiconductor device assembly; The semiconducting device is opened from either side of the first mold member or the second mold member opened after the resin material filled therein is cured by the eject mechanism. A step of ejecting the semiconductor device assembly for ejecting the body device assembly, and a runner portion of the resin material supplied from the tip part of the lead terminal piece group of the lead frame and the resin supply part from the semiconductor device assembly taken out And a lead frame cutting step for cutting and separating 2. The lead frame is integrally formed with a plurality of individual semiconductor chip mounting portions including a chip mounting portion, a lead terminal area portion and a resin filling area portion around the resin supply portion. In the resin molding step, the chip mounting is performed by the resin material supplied from the resin supply section so as to expose the respective tip portions of the lead terminal piece groups to the individual semiconductor chip mounting section. The semiconductor chips mounted on the respective parts are sealed to form a semiconductor device assembly, and the lead frame cutting step is performed by removing the lead frame from the semiconductor device assembly taken out by the semiconductor device assembly removing step. Cutting and separating the tip portion of the lead terminal piece group and the runner portion of the resin material supplied from the resin supply portion, respectively. The method of manufacturing a semiconductor device according to claim 1, wherein.