JPH0620578Y2 - Semiconductor injection molding machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a semiconductor injection molding machine, and more particularly to a machine for centering a coaxial wire type semiconductor device.

[Prior Art] Conventionally, in the injection molding step (molding step) of a coaxial wire type semiconductor element, the semiconductor element is set in advance on the rotating frame 1 shown in FIGS. 6 (A) and 6 (B). After that, each loading frame 1 is placed on the mold of the injection molding machine and injection molding is performed. In addition,
2 in FIG. 6 is a positioning frame.

FIG. 7 shows a state in which the loading frame 1 is set on the chase block 3 of the mold in the injection molding machine, and X in the figure represents the center deviation at that time. Reference numeral 4 in the figure denotes a coaxial wire type semiconductor element.

[Problems to be Solved by the Invention] However, if the coaxial type semiconductor element 4 is injection-molded by the conventional loading frame 1,
Since the center of the semiconductor element 4 cannot be injection-molded due to the factors described in (1) to (3) below, there arises a problem that the center of the injection-molded resin body is displaced from the center of the center of the semiconductor element 4 to the left or right side. To do.

Mold; machining tolerance of chase block, variation of die heater temperature Loading frame; variation of temperature of loading frame 1, machining tolerance of guide part of semiconductor element 4, wear of positioning piece 2 semiconductor element; variation of total length clearance; loading The clearance for setting the frame 1 in the mold and the clearance for setting the semiconductor element 4 in the loading frame 1 have been made in view of the above circumstances. When injection molding a coaxial wire type semiconductor element, the centering of the element is performed. It is an object of the present invention to provide a semiconductor injection molding machine capable of reliably achieving the above, and thus preventing center deviation between the element and the injection-molded resin body.

[Means for Solving the Problems] The present invention relates to a semiconductor injection molding machine for resin-molding a coaxial wire type semiconductor element using a mold, wherein the mold has a lower surface on which a part of a resin body of the semiconductor element is formed. A first chase block having a first opening for accommodating the first chase block, a pair of centering plates having tapered surfaces on both sides of the first chase block and at their lower ends, respectively.
A second chase block which is provided below the chase block so as to face it and which has a second opening for accommodating the resin body together with the first opening on the upper surface and is movable up and down. It is a molding machine.

That is, the present invention does not use a conventional loading frame, but instead uses, for example, carriers aligned with semiconductor elements, just before injection molding the semiconductor elements fed into the chase block in the mold. The centering plate attached to the chase block in the mold is used for centering to prevent the center of the semiconductor element and the injection-molded resin from deviating from each other.

[Operation] According to the present invention, the centering plates are provided on both sides of the first chase block so as to face each other, and the facing surfaces of these plates and the lower end have a tapered surface. Only by moving the second chase block in the state where the element is placed upward, the ends of the leads of the semiconductor element come into contact with the tapered surface of the centering plate and the semiconductor element is pushed rightward, thereby facilitating centering. be able to.

[Embodiment] An embodiment of the present invention will be described below with reference to FIGS. 1 to 5.

First, regarding the structure of the semiconductor injection molding machine according to the present invention,
A description will be given with reference to FIG. Reference numerals 11 and 12 in the figure respectively denote first and second chase blocks provided in the mold. Of these, centering plates 13 and 14 are provided on both sides of the upper first chase block 11 so as to face each other.
13a and 14a are attached. The other second chase block 12 can be moved up and down. A vertically movable carrier transport rail 15 is arranged between the chase blocks 11 and 12, and a carrier 17 supporting a coaxial wire type semiconductor element 16 is placed on the transport rail 15. The carrier 17 supporting the semiconductor element 16 is carried to the carrier carrying rail 15 by a pull-in rail (not shown). In FIG. 1, 18 is a base for fixing the second chase block 12, and 11a, 12a are openings provided in the chase block for accommodating the resin body 16a of the semiconductor element 16.

Next, a case where a semiconductor device is centered using a molding machine having such a structure will be described with reference to FIGS.

First, the carrier 17 supporting the semiconductor element 16 is carried to the carrier carrying rail 15 by a pull-in rail (not shown).
Next, the carrier transport rail 15 is lowered. As a result,
The lead 16b of the semiconductor element 16 contacts the upper surface of the second chase block 12. Then, the transport rail 15 is further lowered (shown in FIG. 2). The semiconductor device at this point
The center offset of 16 is X.

Next, the second chase block 12 is moved slightly upward (shown in FIG. 3), and the chase block 12 is further moved to the semiconductor device.
The ends of the 16 leads are tapered surface 13 of the centering plate 13.
It is moved upward until it comes into contact with a (Fig. 4).

Next, the second chase block 12 is moved until its upper surface abuts the lower surface of the first chase block 11. As a result, the lead of the semiconductor element 16 is pushed by the tapered surface 13a of the centering plate 13 and moves to the right, and the centering is completed (shown in FIG. 5).

Therefore, according to the present invention, the centering plates 13 and 14 are provided on both sides of the first chase block 11 so as to face each other, and the tapered surfaces 13a and 14a are provided on the facing surfaces of these plates and the lower end portions. Therefore, only by moving the second chase block 12 having the semiconductor element 16 mounted on the upper surface upward, the ends of the leads 16b of the semiconductor element 16 come into contact with the tapered surface 13a of the centering plate 13 and the semiconductor element 16 is pushed to the right, making centering easy. Therefore, it is possible to reliably prevent the center deviation between the semiconductor element 16 and the injection-molded resin body.

In the above embodiment, the case where the ends of the leads of the semiconductor element contact the centering plate 13 on the left side in the drawing has been described, but the present invention is not limited to this. That is, when the ends of the leads come into contact with the centering plate 14 on the right side in the figure, the semiconductor element moves to the left side contrary to the above embodiment, and centering is performed.

[Advantages of the Invention] As described in detail above, according to the present invention, when a coaxial wire type semiconductor element is injection-molded, centering of the element can be surely performed, so that the center of the element and the injection-molded resin body is centered. A semiconductor injection molding machine that can prevent misalignment can be provided.

[Brief description of drawings]

FIG. 1 is an explanatory view of a semiconductor injection molding machine according to an embodiment of the present invention, and FIGS. 2 to 5 are explanatory views showing a process of centering a coaxial wire type semiconductor device using the molding machine, respectively. FIG. 6 (A) is a plan view of the loading frame, FIG. 6 (B) is a front view of FIG. 7 (A), and FIG. 7 is a state in which the loading frame is set on the chase block of the mold in the injection molding machine. FIG. 11,12… Chase block, 13,14… Centering plate, 13a, 14a… Tapered surface, 15… Carrier transfer rail, 16
… Semiconductor devices, 17… Carriers.

Claims (1)

[Scope of utility model registration request] 1. A semiconductor injection molding machine for resin-molding a coaxial wire type semiconductor element using a die, wherein the die has a first opening for accommodating a part of a resin body of the semiconductor element on a lower surface thereof. A first chase block and a pair of centering plates having tapered surfaces on both sides of the first chase block and at their lower ends, respectively.
Provided below the first chase block,
A semiconductor injection molding machine, comprising: a second chase block having an upper surface and a second opening that accommodates the resin body together with the first opening, and the second chase block being vertically movable.