JP2567943B2 - Positioning method for electronic parts in mold and mold device used therefor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a method for locating an in-mold electronic component when molding the resin of the mold portion of an electronic component in which leads extend from both end surfaces of the mold portion, and The present invention relates to a mold device used.

(Prior Art) A diode which is an example of an electronic component is shown in FIG. In the diode 12, leads 20 ... Are connected to both sides of the element portion 28. In this state, the periphery of the element portion 28 is sealed with resin to form the mold portion 32, and one diode 12 is completed.

In order to form the molded portion 32 on the diode 12, the element portion 28 is set when the unmolded diode 12 is set in the mold.
Must be set to correspond to the mold cavity.

A conventional method of setting in a mold will be described with reference to FIGS. 13 and 14. First, as shown in FIG. 13, a pre-molded diode 12 having a predetermined length 1 is placed on a positioning jig 102 that can move up and down at a fixed position with respect to the lower mold 100. The position of the diode 12 in the element part 28 in the length direction is determined by the jig 10
2 is determined by the side wall portions 104 and 106 formed with a predetermined distance Z. Then, the jig 102 is moved downward in the direction of the arrow X, and only the diode 12 is placed on the lower mold 100.
Then, the element part 28 is positioned at a position corresponding to the cavity 108 of the lower mold 100. And as shown in FIG. 14, the upper mold 110
When the mold is closed and the molten resin is fed into the space formed by the cavities 108 and 112 through a resin path (not shown), the mold portion 32 is formed.

(Problems to be Solved by the Invention) However, there are the following problems in the molding of the above-described conventional mold part of the electronic component.

As shown in FIG. 13, the diode 12 is positioned on the lower mold 100 because the diode 12 is located on the side wall portions 104 and 10 of the jig 102.
By being placed between 6. However, in actuality, the distance Z between the side wall portions 104 and 106 requires the clearances a and b for mounting the diode 12, and therefore the length l of the diode 12 is set.
Is set slightly larger than. Therefore, the position of the diode 12 in the length direction may be displaced by the clearances a and b, and the element portion 28 may be accurately positioned in the cavities 108 and 1.
There is a risk of not being located in the middle of twelve. Even at that time, if the length m of the mold portion 32 is sufficiently long, the element portion 28 will surely be accommodated in the mold portion 32, but recently, in order to meet the demand for the downsizing of the device, the mold portion 32 has a small size. It is necessary to make the length m as small as possible. However, the mold part 32
If the length m is reduced, there is a problem that even if the diode 12 is slightly displaced in the length direction, the sealing of the element portion 28 becomes incomplete and a defective product is produced.

Therefore, an object of the present invention is to provide a positioning method capable of accurately positioning an electronic component in a mold, and a mold device used for the positioning method.

(Means for Solving the Problem) To solve the above problem, the present invention has the following configuration.

That is, the method for positioning the electronic component in the mold is such that the lead of the electronic component formed in a predetermined length is laterally extended from both sides to seal the electronic component in which the lead is extended from both end faces of the diode or the like with resin. A first die that protrudes and on which electronic components can be temporarily placed so as to be movable in the extending direction of the lead, and a die that moves relative to and away from the first die to form the mold portion. A second mold that can be closed and opened and a second mold that is provided on both sides of the second mold so as to extend in the direction of the first mold and that matches the interval between the lead tips except the tip. The inner side surfaces of the front end portions facing each other with a certain distance are provided with one or more pairs of pushing members formed on the inclined surface with a certain length such that the distance becomes wider toward the front end, and resin sealing is performed. Leads project the electronic component formed in a predetermined length from the both side surfaces of the first mold. As described above, the first die and the second die are brought relatively close to each other, and one slope of one of the pushing pieces pushes one end of the lead of the electronic component inward. When the die closing of the first die and the second die is completed or before, the pushing of the electronic component is finished to move the electronic component to a predetermined position on the first die. A mold apparatus suitable for carrying out the positioning method is characterized in that the electronic device formed in a predetermined length is used for resin-sealing an electronic component whose leads extend from both end faces of a diode or the like. A first mold for allowing the leads of the parts to project laterally from both sides and for temporarily mounting the electronic parts so that the electronic parts can be moved in the extending direction of the leads, and a first mold for molding the mold part. A second mold that can be closed and closed by moving relative to the mold, and the second mold so as to extend in the first mold direction. Slopes of fixed length provided on both sides of the mold and facing each other with a spacing that matches the spacing between the lead tips except for the leading end, and the inner surfaces of the opposing leading ends that widen toward the tip. And one or more pairs of pushing members formed on the one end of the lead, one of the slopes is one end of the lead when the first mold and the second mold are close to each other to close the mold. And pushes inward, and pushes on the inclined surface is completed and the electronic component is positioned at a predetermined position on the first mold by the completion of mold closing.

(Operation) The operation will be described.

The pushing member on the side on which the electronic component is temporarily placed is pushed on the slope when the mold is closed and pushes the electronic component to a predetermined position. Can be positioned to a position.

(Examples) Hereinafter, preferred examples of the present invention will be described in detail with reference to the accompanying drawings. In this embodiment, a mold apparatus suitable for carrying out the method for locating an electronic component within a mold according to the present invention will be described. In addition, in the device,
An example in which the diode 12 shown in FIG. 12 is resin-sealed will be described.

 First, the configuration of the device will be described.

In FIG. 1, 10 is a lower mold which is a first mold,
The diode 12 can be mounted on the upper surface. FIG. 6 shows a plan view of the lower mold 10. The ridges 14 and 16 are provided in parallel on the upper surface of the lower die 10 at intervals n. A large number of mounting grooves 18 ... Are engraved in parallel on the upper surfaces of the ridges 14 and 16 in a direction perpendicular to the lengthwise direction of the ridges 14 and 16. The mounting grooves 18 ... Are provided for mounting the diodes 12 ..., and the cross-sectional shape is such that the upper portion is formed into a tapered portion that widens upward and the lower portion is a lead as shown in FIG. It is formed in a semi-circular portion having substantially the same curvature as the cross section of the lead 20 for positioning the lead 20 so as not to move left and right. Therefore, when the lead 20 enters the mounting groove 18, the lead 20 is guided by the taper portion and drops into the semicircular portion.
Next, in FIGS. 1 and 6, reference numerals 22 and 24 are side portions of the lower mold 10, and the distance t is formed smaller than the length 1 of the diode 12, and the diodes 12 ... When mounted in the device groove 18 of 14 and 16, the diode 12 ...
・ Leads 20 ... project to the side from both sides 22, 24. Furthermore, the mounted diode 12
.. is movable in the extension direction (length direction) of the leads 20 ... Of the diodes 12. Therefore, the mounted diodes 12 ... Place the mounting groove 18 in the longitudinal direction of the lower mold 10.
.. are held immovably by and movable in the width direction of the lower mold 10. In addition, 26 ... Is a cavity, and is a space into which a molten resin for resin-sealing the element portion 28 of the diode 12 is fed. Also,
Although not shown, the upper mold (described later) or the lower mold 10 can be moved toward and away from each other by an appropriate vertical movement mechanism for closing and opening the mold.

In FIG. 1, 30 is an upper die which is a second die,
Although not shown, a cavity corresponding to the cavity 26 of the lower mold 10 is provided on the lower surface, and when the lower mold 10 moves upward and the mold is closed, the space for accommodating the element portion 28 of the diode 12 ... The mold part 32 can be formed by forming it together with the cavity 26 of the mold 10.

34 and 36 are pushing members, which are fixed to both side parts 38 and 40 of the upper mold 30. The pushing members 34 and 36 are formed over the entire length of the upper mold 30 in the length direction (direction perpendicular to the plane of FIG. 1). The lower ends of the pushing members 34, 36 extend downward from the lower surface of the upper mold 30 by a distance p. Further, in the pushing members 34 and 36, the vertical surfaces 42 and 44 are arranged in parallel with each other with a distance l which is the same as the length of the diodes 12 ... Further, the tip end portions of the pushing members 34, 36 have inner surfaces inclined by a certain distance q,
Is formed into 48. The slopes 46 and 48 are the pushing members 3
The distances r at the lower ends of 4, 36 are formed so as to be larger than the distance l. The relationship between the distances p and q is formed so that p ≧ q so that the diode 12 can be positioned at or before the completion of mold closing.

Reference numerals 50 and 52 are jump-up preventing portions, which are provided on the upper mold 30. The jump-up preventing portions 50 and 52 are provided to prevent the leads 20 ... Of the diodes 12 ... from jumping up from the lower mold 10 when the upper mold 30 and the lower mold 10 are closed. Jump prevention part
50 and 52 are also provided over the entire length of the upper mold 30 in the longitudinal direction. The jump-up preventing portions 50 and 52 are constantly urged downward by an urging means (eg, spring) not shown, and the stopper 5
The downward movement is limited at 4, 56. Lower end is upper 10 and lower mold 30
Can contact the upper surface 58 of the lower mold 10 when they approach each other, and a notch is provided at a portion corresponding to the leads 20 ... The cutout portion will be described with reference to FIGS. 8 and 9. The size of the notch 60 ... is the lead 20
... formed to be slightly larger than the jump-up prevention part 50,
Even if the lower end of 52 contacts the upper surface 58 of the lower mold 10, the lead 20 ...
It is designed not to press. This allows the diode
12 ... is movable along its length. That is, the jump-up preventing portions 50 and 52 do not press the leads 20 ... To the upper surface 58 of the lower mold 10, but simply the leads 20 ...
It prevents you from jumping out of it. The distance s between the jump-up preventing portions 50 and 52 is smaller than the distance n (see FIG. 6) between the ridges 14 and 16 of the lower mold 10.

In FIG. 1, reference numeral 62 denotes a jig, which is the same as the jig described in the section "Prior Art". A partial plan view of the jig 62 is shown in FIG. The central portion of the jig 62 is a space, and the space is formed so that the width s is larger than the width t of the lower mold 10 and the length is larger than the length of the jig 62. That is, when the jig 62 is moved downward (in the direction of arrow A) by the vertical movement device described later, the lower die 10 is formed in a size that can pass through the space. At the edge of the space inside the jig 62, the diode support 6
4 and 65 are formed, and a large number of notches 66 ... For mounting the diodes 12 ... Although the jig 62 moves up and down, its planar position relative to the lower mold 10 and the upper mold 30 is constant, and its notch 66.
.. are formed at positions corresponding to the mounting grooves 18 of the lower mold 10 (see the partial sectional view of FIG. 11). Side wall portions 68 and 70 are formed on both outer sides of the diode support portions 64 and 65 along the entire length in the longitudinal direction, and the distance z is equal to the diode.
It is formed to be slightly larger than the length l of 12 ... This is because a work space for mounting the diodes 12 ... on the diode support portions 64 and 65 is required. The relationship between the distance r and the distance z at the lower ends of the pushing members 34 and 36 is r.
It is formed so that ≧ z. Next, the vertical movement device of the jig 62 will be described with reference to FIG. FIG. 5 shows a mold apparatus in which a plurality of rows of lower molds 10 ... Are juxtaposed, and jigs 62 ... are rods 69 of an air cylinder device whose vertical movement is controlled in synchronization. Attachment part 71 fixed to the tip of ...
・ ・ Fixed to. Therefore, as the rods 69 move up and down, the jigs 62 move up and down.

Next, the operation of the mold apparatus configured as described above and the method of positioning the electronic component within the mold will be described.

First, as shown in FIG. 1, with the upper die 30 and the lower die 10 opened, the notch 66 of the diode support portions 64, 65 of the jig 62 located above the lower die 10 is moved to the diode 12 The lead 20
... is placed and supported. At that time, the jig of the diode 12
62 or the position of the lower mold 10 in the width direction is the side wall portion 68 of the jig 62,
It is roughly determined by 70.

Next, as shown in FIG. 2, the air cylinder device is driven to move the jig 62 downward, and the rods 69 ...
Along with this lowering, the jig 62 lowers. At this time, the lower mold 10 passes through the space opened in the center of the jig 62. When the lower die 10 passes through the space, the diode 12 is the ridge 1 of the lower die 10.
It enters the mounting grooves 18 ... Engraved in 4 and 16 and is transferred to the lower mold 10. The jig 62 descends as it is and the base part of the lower mold 10
It stops at the position where it abuts 73 and waits.

Then, a vertical movement mechanism (not shown) is driven, and the upper mold 30 and the lower mold 10 are relatively close to each other to close the mold. In addition,
The approaching operation of the upper mold 30 and the lower mold 10 and the lowering of the jig 62 may be performed at the same time. However, in that case, it goes without saying that the diode 12 is delivered before the mold is closed.

When the upper die 30 and the lower die 10 approach each other, as shown in FIG.
First, the lower ends of the jump-up preventing portions 50 and 52 contact the upper surface 58 of the lower mold 10 to prevent the diode 12 from jumping up. In that state, both molds 10,
When the spring 30 is further approached against the urging force of the urging means (not shown) for urging the jump prevention portions 50 and 52 downward, as shown in FIG. The inclined surface 46 of the pushing member 34 corresponding to the side where the diode 12 is placed on one side is brought into contact with the lead 20 on the side which is placed on one side, and the lower die 10 of the pushing member 34 is pressed.
By the movement in the direction (direction of arrow B in FIG. 8), the diode 12 which has been temporarily positioned is pushed to a predetermined position (direction of arrow C in FIG. 8). Then, as shown in FIG. 4, the positioning of the diode 12 is completed when both ends of the diode 12 move from contact with the slopes 46 or 48 to contact with the vertical surfaces 42, 44. Then, while the vertical surfaces 42 and 44 of the pushing members 34 and 36 are held in that state, when the upper die 30 and the lower die 10 further approach, the die is closed and the position of the diode 12 in the die is set to a predetermined position. I can decide. Then, the mold portion 32 can be molded by feeding it into a molten resin cavity (not shown).

Although various preferred embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and it goes without saying that many modifications can be made without departing from the spirit of the invention. Is.

(Effects of the Invention) When the positioning method and the mold device according to the present invention are used, the electronic component can be positioned with high accuracy by the pushing member when the mold is closed. Since the accuracy in mounting the parts may be low, the work efficiency is improved, and it is particularly suitable for use in a mold device for molding a large number of electronic parts at one time. Further, since the positioning of the electronic component in the mold can be performed with high accuracy, there is an effect that even if the electronic component is small, there is no displacement of the mold portion and the production of defective products can be suppressed.

[Brief description of drawings]

FIG. 1 to FIG. 4 are explanatory views showing a method of positioning an electronic component in a mold according to the present invention. FIG. 5 is a front view showing a vertical movement device of the jig, FIG. 6 is a plan view of the lower mold, FIG. 7 is a sectional view showing a mounting groove of the lower mold, and FIG. 8 is a pressing member. FIG. 9 is a partial cross-sectional view illustrating the action, FIG. 9 is a partial cross-sectional view showing a state where the jump-up prevention portion is in contact with the lower die, and FIG. 10 is a partial plan view of the jig.
The figure is a partially cutaway side view thereof, FIG. 12 is a cross-sectional view of a diode, and FIGS. 13 and 14 are explanatory views showing a conventional method for positioning an electronic component within a mold. 10 …… Lower mold, 12 …… Diode, 20 …… Lead, 22,24
...... Lower mold side, 30 …… Upper mold, 32 …… Mold part, 34,3
6 …… Pushing member, 38,40 …… Upper mold side, 46,48 …… Slope.

Claims (2)

(57) [Claims] 1. A lead of an electronic component formed in a predetermined length so as to resin-encapsulate an electronic component having leads extending from both end faces of a diode or the like, and the leads extending laterally from both sides and extending the leads. A first die on which electronic components can be temporarily mounted so that the electronic parts can be moved in a predetermined direction, and a first die that can be closed and closed by moving relative to the first die to form the mold portion. The second mold is provided on both sides of the second mold so as to extend in the direction of the first mold, and is opposed to the mold with a gap that is the same as the gap between the lead tips except the tip portion. The inner surface of the distal end portion is provided with one or more pairs of pushing members formed on a slope having a constant length such that the interval becomes wider toward the distal end. The mold is temporarily placed so as to project from the both side surfaces, and the first mold and the second mold are relatively placed. When one end of one lead of the electronic component is pushed inward by the inclined surface of one of the pushing pieces, the closing of the first die and the second die is completed, or Before ending the pushing of the electronic parts,
The method for locating an electronic component in a mold is characterized in that the locating is performed at a predetermined position on the mold. 2. A lead of an electronic component formed in a predetermined length so as to resin-encapsulate the electronic component in which the lead extends from both end faces of a diode or the like, and the lead of the electronic component can protrude laterally from both sides and the lead. A first die on which electronic parts can be temporarily placed so as to be movable in the extension direction of the die, and a die can be closed and opened by moving relative to the first die to form the mold part. The second mold is provided on both sides of the second mold so as to extend in the direction of the first mold, and is opposed to the second mold with a gap that is the same as the interval between the lead tips except the tip portion. The opposing inner surfaces of the tip portion are provided with one or more pairs of pushing members formed into slopes having a constant length such that the distance between them becomes wider toward the tip. When the two molds come close to each other to close the mold, one of the slopes comes into contact with the end of one of the leads and It pushes the mold the mold apparatus, characterized in that attain located at a predetermined position on the end the pushing in the slope the electronic component of the first mold until completely closed.