JPH07105409B2 - Mold for resin encapsulation of semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Object of the Invention (Industrial field of application) The present invention relates to a mold for resin encapsulation of a semiconductor device, and particularly to encapsulation of a semiconductor device in which an envelope is resin-molded. It is applied to the matching mold used.

(Prior Art) A conventional resin mold for semiconductor device is shown in a sectional view in FIG. In the figure, reference numeral 101 denotes a fixed side cavity block, which is in contact with a movable side cavity block indicated by 201. Cavities 100 are formed in both cavity blocks between the contact surfaces. In addition, 100a is a runner and a gate for sending a sealing resin, for example, an epoxy resin to the cavity. The fixed side cavity block 101 is attached to the fixed side mold base 102 after being positioned by a positioning knock pin 103. The positioning knock pin 103 is the fixed side mold base 102.
From the side, fixed side cavity block 101 knock pin receiving hole 1
Driven into 03a. The fixed mold base 102 is attached to the fixed base plate 105 via the fixed spacer block 104. Further, 106 is a fixed-side ejector plate, and ejector pins 108 are planted in a fixed-side ejector holder 107 attached to the fixed-side ejector plate. The enclosed envelope is removed from the cavity 100.

Next, the movable side cavity block 201 is attached to the movable side mold base 202 after being positioned by a positioning knock pin 203. The positioning knock pin 203 is moved from the movable mold base 202 side to the movable cavity block 201.
Is driven into the knock pin receiving hole 203a. Further, the movable mold base 202 is a movable spacer block 204.
It is attached to the movable side base plate 205 via.
Further, 206 is a movable side ejector plate, and a movable side ejector pin 208 is planted in a movable side ejector holder 207 attached to the movable side ejector plate. By driving the movable side ejector plate 206, molding is performed by resin sealing. The formed envelope is separated from the cavity 100.

The fixed side cavity block 101 is guided by inserting the guide pin bush 209 of the movable side cavity block 201 into the guide pin 109 provided with the fixed side cavity block 101,
A cavity 100 is formed between the facing surfaces.

(Problems to be Solved by the Invention) Since the precision (straightness, parallelism, squareness, etc.) of the above-mentioned conventional transfer molding machine is inferior to that of the mold, extremely high precision is required for the guide pin. . Further, it is necessary to prevent the guide pin from being deformed or worn. However, the guide pin, which retains high accuracy including deformation and wear of the guide pin, is very large and has a practical problem. Therefore, as shown in FIG. 4, the formed cavity has a displacement (a) of 0.05 to 0.1 mm in the alignment (centering) of the cavity blocks on the fixed side and the movable side. It leads to poor appearance.

Further, it takes much time to remove the knock pin at the time of maintenance of the cavity block, disassembly and repair, etc., and the wear is serious.

In view of the above conventional problems, the present invention provides an improved structure for a resin sealing die.

[Structure of Invention]

(Means for Solving the Problem) In the semiconductor device resin sealing die according to the present invention, the fixed side cavity block and the movable side cavity block are attached to the fixed side base plate and the movable side base plate together with the mold base, respectively. , And both cavity blocks are positioned and attached by knock pins driven from the side of each mold base, and are formed by joining opposing surfaces with guide pins to form a resin mold for a semiconductor device. The knock pin receiving hole is formed to have a diameter larger than the diameter of the knock pin, and a convex portion whose side surface is formed as an inclined surface on the contact surface of both cavity blocks and an abutting surface of the convex portion corresponding to the convex portion. And a concave portion whose surface is formed as an inclined surface, and the inclined surfaces are brought into sliding contact with each other to align the facing surfaces of both cavity blocks. It is characterized by

(Operation) The present invention can always ensure the alignment of the fixed and movable cavity blocks without affecting the accuracy of the forming machine and the deformation and wear of the guide pins.

(Embodiment) An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. In the description, parts that are the same as the conventional ones are given the same reference numerals as the conventional ones, and the description thereof will be omitted.

FIG. 1 is a sectional view showing a resin sealing mold according to an embodiment of the present invention. In FIG. 1, reference numeral 11 denotes a fixed side cavity block, which is received by a knock pin receiving hole 12a having a radius of 0.02 to 0.1 mm on the outer circumference of the knock pin 12 driven from the fixed side mold base 102 side. In addition, the movable side cavity block 21 includes the movable side mold base 20.
For the knock pin 22 driven from the 3 side, with a radius on the outer circumference
It is received by a knock pin receiving hole 22a having a gap of about 0.02 to 0.1 mm. Since the knock pin receiving holes 12a and 22a for receiving the knock pins 12 and 22 have a gap on the outer periphery of the knock pins, the gaps are free in the lateral direction with respect to the mold bases 102 and 202, respectively.

As described above, the movable side cavity block 21 is approached from below by being guided by the guide pin 109 and the guide pin bush 209 to the upper fixed side cavity block 11, and the facing surface between both cavity blocks is formed here. There is a convex part and a corresponding concave part, and these side faces are slopes corresponding to each other.First, the slopes slide to guide both cavity blocks and the alignment is achieved. It When this alignment is achieved, the cavity 10 will be in the desired shape without misalignment, as shown in FIG.

As an example, good results were obtained by forming the height of the convex portion (which is equal to the depth of the concave portion) to 2 mm and forming the inclined surface on a surface inclined by 5 to 15 degrees with respect to the vertical surface.

〔The invention's effect〕

According to the present invention, the positioning of the fixed side cavity block and the movable side cavity block has a convex portion on one of the respective facing surfaces, and a concave portion corresponding to the convex portion on the other, and
Since each side surface is formed as an inclined surface and is achieved by sliding them on each other, the positioning knock pin for the mold base and the cavity block has a gap between this pin receiving hole. By virtue of the above, the positioning and joining of both cavity blocks are directly performed between each other and do not depend on the accuracy of the guide pin or the driving of the knock pin. Therefore, the cavity formed between the facing surfaces of both cavity blocks is as shown in FIG. 2 in which the upper die and the lower die are not displaced, and a good resin sealing shape is obtained, and the manufacturing yield, It significantly contributes to the improvement of product quality.

Next, according to the present invention, since the convex portion and the concave portion are widely slidably contacted with each other on the slopes of each other, the pin breakage, the hole clogging, etc. are generated as compared with the generally used pin and the hole for inserting the pin. There is no such thing, there is little wear, and there are remarkable advantages that high precision can be maintained for a long period of time.

Further, the present invention has an advantage of being able to cope with the correction of a large displacement by designing both slopes.

Next, when disassembling and repairing the cavity block, the positioning knock pin can be left on the mold base, and therefore the knock pin need not be removed.

Furthermore, since the alignment of both cavity blocks is made to slip by the slopes of each other, there is an advantage that less resistance can be achieved and less wear occurs.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a resin-sealing die according to an embodiment of the present invention, FIG. 2 is an enlarged cross-sectional view of the cavity of FIG. 1, and FIG. 3 is a conventional resin-sealing die. FIG. 4 is a cross-sectional view of the mold, and FIG. 4 is an enlarged cross-sectional view of the cavity portion of FIG. 11 …… Fixed side cavity block 12,22 …… Positioning knock pin 12a, 22a …… Knock pin receiving hole 21 …… Movable side cavity block 31 …… Concave section 41 …… Convex section 51 …… Slope section 100 …… Cavity 102… … Fixed side mold base 103, 203 …… Positioning knock pin 103a, 203a… Knock pin receiving hole 104 …… Fixed side spacer block 105 …… Fixed side base plate 109 …… Guide pin 201 …… Movable side cavity block 202 …… Movable side mold Base 204 …… Movable spacer block 205 …… Movable base plate 209 …… Guide pin bush

Claims (1)

[Claims] 1. A fixed-side cavity block and a movable-side cavity block are attached to a fixed-side base plate and a movable-side base plate, respectively, together with a mold base, and both cavity blocks are positioned by knock pins driven from the respective mold-base sides. In the mold for resin sealing of the semiconductor device, which is attached by attaching the guide pins to each other and the opposing surfaces are joined to each other, the knock pin receiving holes of both cavity blocks are formed to have a diameter larger than the diameter of the knock pins, and The contact surface includes a convex portion whose side surface is formed as an inclined surface, and a concave portion which corresponds to the convex portion and the opposed surface of the convex portion which is inclined surface is formed in the inclined surface. A mold for resin encapsulation of a semiconductor device, wherein the facing surfaces of both cavity blocks are aligned.