JPH01171921A - Injection mold - Google Patents
Injection moldInfo
- Publication number
- JPH01171921A JPH01171921A JP33023287A JP33023287A JPH01171921A JP H01171921 A JPH01171921 A JP H01171921A JP 33023287 A JP33023287 A JP 33023287A JP 33023287 A JP33023287 A JP 33023287A JP H01171921 A JPH01171921 A JP H01171921A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- receiving surface
- mold
- contact point
- stationary contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002347 injection Methods 0.000 title claims abstract description 19
- 239000007924 injection Substances 0.000 title claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 27
- 238000000465 moulding Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract 1
- 229920003002 synthetic resin Polymers 0.000 description 5
- 239000000057 synthetic resin Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 235000002597 Solanum melongena Nutrition 0.000 description 1
- 244000061458 Solanum melongena Species 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/1486—Details, accessories and auxiliary operations
- B29C2045/14934—Preventing penetration of injected material between insert and adjacent mould wall
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、例えば合成樹脂製のケースの内底面に接点用
の端子を露出させたスイッチケースのように、樹脂成形
体の片面に金属製の端子を露出させた状態に一体成形さ
れる配線基板成形用の射出成形金型に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention is applicable to a switch case in which a contact terminal is exposed on the inner bottom surface of a synthetic resin case. This invention relates to an injection molding die for molding a wiring board that is integrally molded with terminals exposed.
この種の配線基板を備えた電気部品の一例として、第3
図にスライド型スイッチを示す。As an example of an electrical component equipped with this type of wiring board, the third
The figure shows a slide type switch.
同図において、1は上面が開放面となっている合成樹脂
製のケース、2はこのケースlの成形時に一部を埋設さ
れた金属製の端子で、所定のギャップAを介して向き合
う図示左右の端子2が対をなして紙面と直交する方向に
複数組設置されており、各端子2のケース1内に露出し
ている部分が固定接点部2aとなっている。3は合成樹
脂製のスライダ、4は金属製の摺動子で、この摺動子4
はスライダ3の底部に取り付けられて前記固定接点部2
aに弾接している。なお、このスライダ3は、対をなす
前記端子2と対応して紙面と直交する方向に複数個設置
されている。5は前記ケース1の開放面を覆う合成樹脂
製のカバーで、このカバー5には互いに平行な複数条の
ガイド溝5aが穿設してあり、各ガイド溝5aからそれ
ぞれ前記スライダ3のつまみ3aが突出している。した
がって、所望のつまみ3aをガイド溝5aに沿ってスラ
イド操作すると、当該スライダ3に取り付けである摺動
子4が対応する固定接点部2a上を摺動してオン・オフ
の切換えが行われる。なお、カバー5は超音波溶着等に
よってケース1に固着されている。In the figure, 1 is a synthetic resin case with an open top surface, and 2 is a metal terminal that was partially buried during the molding of this case L, and the left and right sides shown face each other with a predetermined gap A. A plurality of pairs of terminals 2 are installed in a direction perpendicular to the plane of the paper, and the portion of each terminal 2 exposed inside the case 1 serves as a fixed contact portion 2a. 3 is a synthetic resin slider, 4 is a metal slider, and this slider 4
is attached to the bottom of the slider 3 and the fixed contact part 2
It is in elastic contact with a. Note that a plurality of sliders 3 are installed in a direction perpendicular to the plane of the paper in correspondence with the pair of terminals 2. Reference numeral 5 denotes a cover made of synthetic resin that covers the open surface of the case 1. A plurality of parallel guide grooves 5a are bored in the cover 5, and each guide groove 5a leads to a knob 3a of the slider 3. stands out. Therefore, when a desired knob 3a is slid along the guide groove 5a, the slider 4 attached to the slider 3 slides on the corresponding fixed contact portion 2a to perform on/off switching. Note that the cover 5 is fixed to the case 1 by ultrasonic welding or the like.
このように構成されたスライド型スイッチは、通常、ケ
ース1と各端子2とが射出成形金型を用いて一体成形さ
れ、量産性が高められている。In the slide type switch configured in this way, the case 1 and each terminal 2 are usually integrally molded using an injection mold, and mass productivity is improved.
すなわち、まず予め準備されたフープ状の金属板を順次
送り、第4図に示すように、多数の送り孔7を有する上
下一対のフレーム部8と、このフレーム部8から互いに
平行に突出する複数の端子部9と、相対向するフレーム
部8を連結する架橋部10とによって概略構成される所
定形状のベース板6をプレス加工する。そして、このベ
ース板6を金型装置内に送った後、第4図に二点鎖線で
示すキャビティ11内に溶融樹脂を射出・注入する。次
に、この溶融樹脂を射出成形金型内で冷却・固化し、第
5図に示すように、対をなす複数組の端子部9を備えた
合成樹脂製のケース1を成形する。しかる後、第5図の
破線で示す位置で各端子部9をフレーム部8から切り離
し、この切り離された端子部9を折り曲げることによっ
て、第3図に示したケース1と端子2との一体品である
配線基板(スイッチケース)を得る。That is, first, hoop-shaped metal plates prepared in advance are sequentially fed, and as shown in FIG. A base plate 6 having a predetermined shape, which is roughly constituted by terminal portions 9 and bridging portions 10 connecting opposing frame portions 8, is press-worked. After this base plate 6 is sent into a mold apparatus, molten resin is injected into a cavity 11 shown by a two-dot chain line in FIG. Next, this molten resin is cooled and solidified in an injection mold to form a case 1 made of synthetic resin and provided with a plurality of pairs of terminal portions 9, as shown in FIG. Thereafter, each terminal part 9 is separated from the frame part 8 at the position indicated by the broken line in FIG. 5, and by bending the separated terminal part 9, the case 1 and the terminal 2 are integrated as shown in FIG. A wiring board (switch case) is obtained.
ところで、上述した射出成形金型は、従来、端子部9の
自由端部に相当する固定接点部2aの近傍で、第6図に
示す如き金型構造が採用されている。同図において、1
2はゲー)12aを有する上型、13は突部13aを有
する下型、14は上型12に一対的に設けられた押えピ
ン、15は樹脂で、対をなす端子部9間(再固定接点部
2a間)に下型13の突部13aが位置するように前記
ベース板6を金型装置に搬送した後、上型12と下型1
3を型締めし、ゲー)12aより溶融状態の樹脂15を
キャビティ11内に射出・注入する。By the way, the injection mold described above has conventionally adopted a mold structure as shown in FIG. 6 in the vicinity of the fixed contact portion 2a corresponding to the free end portion of the terminal portion 9. In the same figure, 1
Reference numeral 2 is an upper mold having a gate 12a, 13 is a lower mold having a protrusion 13a, 14 is a presser pin provided in a pair on the upper mold 12, and 15 is a resin between the pair of terminal parts 9 (refixing). After transporting the base plate 6 to the molding device so that the protrusion 13a of the lower mold 13 is located between the contact portions 2a), the upper mold 12 and the lower mold 1
3 is clamped, and molten resin 15 is injected into the cavity 11 from the gate 12a.
ここで、各端子部9の自由端子(固定接点部2a)は、
型締めの際に押えピン14によって下型13の受面Bに
圧接されるようになっているので、溶融状態の樹脂15
が固定接点部2aと受面Bとの間に入り込む広れはほと
んどなく、樹脂15を冷却・固化してなる前記ケース1
の内底面に各固定接点部2aを露出させることができる
。Here, the free terminal (fixed contact portion 2a) of each terminal portion 9 is as follows:
Since the presser pin 14 presses against the receiving surface B of the lower mold 13 during mold clamping, the molten resin 15
There is almost no spread between the fixed contact portion 2a and the receiving surface B, and the case 1 is made by cooling and solidifying the resin 15.
Each fixed contact portion 2a can be exposed on the inner bottom surface of the.
しかしながら、上述した従来の射出成形金型は、金型部
品のわずかな寸法誤差や各端子部9の厚み寸法のばらつ
きが原因で、押えピン14の先端の平坦面と受面Bとの
間に挟持されるはずの固定接点部2aが確実に挟持され
ないことがあり、その場合、樹BFi15の射出圧力に
よって固定接点部2aが受面B上でブレを生じてしまう
所謂およぎが発生し、樹脂冷却後に固定接点部2aが位
置ずれを起こしている心配がある。このため、従来は金
型部品に高い寸法精度が要求されるのみならず、型締め
時に個々の押えピン14の長さを調整しなければならな
いことがあり、結果としてコストアップを招いていた。However, in the conventional injection mold described above, due to slight dimensional errors in the mold parts and variations in the thickness of each terminal part 9, there is a gap between the flat surface of the tip of the presser pin 14 and the receiving surface B. The fixed contact part 2a that should be held may not be held securely, and in that case, the injection pressure of the resin BFi 15 may cause the fixed contact part 2a to wobble on the receiving surface B, causing the resin to cool. There is a concern that the fixed contact portion 2a may become misaligned later. For this reason, in the past, not only high dimensional accuracy was required for mold parts, but also the length of each presser pin 14 had to be adjusted during mold clamping, resulting in an increase in costs.
本発明は叙上の点に鑑みてなされたものであり、その目
的は、キャビティ内で端子の自由端部を確実に挟持でき
、しかもコストダウンが図れる、配線基板成形用の射出
成形金型を提供することにある。The present invention has been made in view of the above-mentioned points, and its purpose is to provide an injection mold for molding wiring boards, which can securely hold the free end of a terminal within the cavity, and can reduce costs. It is about providing.
上記目的を達成するために、本発明は、所定形状にプレ
ス加工された端子を挟持する上型と下型とを備え、これ
ら上型と下型との間に画成されるキャビティの受面に前
記端子の自由端部を当接させた状態で該キャビティ内に
溶融樹脂を充填し、しかる後、該溶融樹脂を冷却・固化
することにより樹脂成形体を前記端子と一体に成形する
配線基板成形用の射出成形金型において、前記キャビテ
ィの受面と対向する側に、先端部が錐状の押えピンを設
け、該押えピンの錐状先端部を前記端子の自由端部に食
い込ませた状態で型締めするように構成した。In order to achieve the above object, the present invention includes an upper mold and a lower mold that sandwich a terminal pressed into a predetermined shape, and a receiving surface of a cavity defined between the upper mold and the lower mold. A wiring board in which the cavity is filled with molten resin with the free end of the terminal in contact with the terminal, and then the molten resin is cooled and solidified to form a resin molded body integrally with the terminal. In an injection mold for molding, a presser pin having a conical tip is provided on the side facing the receiving surface of the cavity, and the conical tip of the presser pin is bitten into the free end of the terminal. The mold was configured to be clamped in this state.
すなわち、本発明は、型締め時に押えピンの錐状先端部
が端子の自由端子に食い込むので、金型部品に寸法誤差
があったり各端子の厚み寸法にばらつきがあったとして
も該錐状先端部の食い込み量が若干具なるのみであって
、挟持力が不所望に弱まる虞れはなく、そのため端子の
自由端部をキャビティの受面に確実に圧着させた状態で
溶融樹脂を射出・注入することができ、射出圧力による
該自由端部のおよぎが確実に防止できる。That is, in the present invention, the conical tip of the presser pin bites into the free terminal of the terminal when the mold is clamped, so even if there is a dimensional error in the mold parts or there is variation in the thickness of each terminal, the conical tip There is no risk that the clamping force will weaken undesirably, and the molten resin can be injected while the free end of the terminal is securely crimped to the receiving surface of the cavity. This makes it possible to reliably prevent the free end from flailing due to injection pressure.
以下、本発明の実施例を図に基づいて説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第1図は本発明の一実施例に係る射出成形金型の型開き
状態を示す断面図、第2図はこの射出成形金型の型締め
状態を示す要部断面図であって、第6図に示した従来構
成と同等の部分には同一符号が付しである。FIG. 1 is a cross-sectional view showing an injection molding die according to an embodiment of the present invention in an open state, and FIG. 2 is a cross-sectional view of essential parts showing the injection mold in a closed state. Portions equivalent to those in the conventional configuration shown in the figure are given the same reference numerals.
第1図に示すように、上型12には固定ブロック12b
が圧入固定されていて、この固定ブロック12bの下端
の所定位置に、先端部を四角錐状に形成してなる押えピ
ン20が複数本取り付けである。つまり、上型12には
、キャビティ11の受面Bと対向する位置に、錐状先端
部20aを有する押えピン20が複数本設けてあり、こ
れらの押えピン20は、ベース板6の対をなす端子部9
に対応させて2本ずつ、紙面と直交する方向に複数組配
置されている。As shown in FIG. 1, the upper mold 12 has a fixed block 12b.
is press-fitted into the fixing block 12b, and a plurality of presser pins 20 each having a square pyramid-shaped tip are attached to a predetermined position on the lower end of the fixing block 12b. That is, the upper mold 12 is provided with a plurality of holding pins 20 each having a conical tip 20a at a position facing the receiving surface B of the cavity 11, and these holding pins 20 hold the pair of base plates 6. Eggplant terminal part 9
A plurality of sets of two wires are arranged in a direction perpendicular to the paper surface, corresponding to each other.
第1図に示す型開き状態で、所定形状にプレス加工され
た端子部9付きのベース板6を下型13のガイド部13
bに沿って搬送した後、第2図に示すように型締めする
と、端子部9の基端側が上型12と下型13とで挟持さ
れるとともに、端子部9の自由端部(固定接点部2a)
が押えピン20と受面Bとの間に挟持される。このとき
、押えピン20の先端と受面Bとの間隔が端子部9の板
厚よりも小さくなるように予め設計しであるので、押え
ピン20の錐状先端部20aは固定接点部2aに食い込
んでおり、そのため固定接点部2aは受面Bに強く圧接
されている。このように型締めした後、ゲート12aか
ら溶融状態の樹脂15をキャビティ11内に射出・注入
すると、固定接点部2aは樹脂15の射出圧力にさらさ
れるが、押えピン20の食い込みによって固定接点部、
2aは受面Bに強く圧接されているのでおよぎが発生す
る広れはなく、また固定接点部2aと受面Bとの間に樹
脂15が入り込む虚れもない。こうしてキャビティll
内に樹脂15を充填した後、これを冷却・固化して型開
きし、さらに端子部9を切り離して折り曲げることによ
り、樹脂成形体と端子とが一体化された配線基板(スイ
ッチケース)が得られる。In the mold open state shown in FIG.
When the mold is clamped as shown in FIG. Part 2a)
is held between the presser pin 20 and the receiving surface B. At this time, since the distance between the tip of the presser pin 20 and the receiving surface B is designed in advance to be smaller than the thickness of the terminal portion 9, the conical tip portion 20a of the presser pin 20 is attached to the fixed contact portion 2a. Therefore, the fixed contact portion 2a is strongly pressed against the receiving surface B. After the mold is clamped in this way, when the molten resin 15 is injected into the cavity 11 from the gate 12a, the fixed contact part 2a is exposed to the injection pressure of the resin 15, but the fixed contact part 2a is bitten by the presser pin 20. ,
Since 2a is strongly pressed against the receiving surface B, there is no widening that would cause sagging, and there is no collapse that would cause the resin 15 to enter between the fixed contact portion 2a and the receiving surface B. Thus the cavity
After filling the inside with resin 15, it is cooled and solidified, the mold is opened, and the terminal portion 9 is separated and bent to obtain a wiring board (switch case) in which the resin molded body and the terminal are integrated. It will be done.
このように上記実施側番ごあっては、型締め時に押えピ
ン20の錐状先端部20aを端子部9の自由端子(固定
接点部2a)に食い込ませて挟持するので、金型部品に
寸法誤差があったり各端子部9の厚み寸法にばらつきが
あったとしても錐状先端部20aの食い込み量が若干具
なるのみであって、挟持力が不所望に弱まる広れはない
。したがって、固定接点部2aをキャビティ11の受面
Bに確実に圧着させた状態で溶融樹脂を射出・注入する
ことができ、射出圧力による固定接点部2aのおよぎが
防止できて位置ずれの危険性が除去されている。また、
金型部品の寸法誤差がある程度許容されることから、そ
の製作精度を従来品に比して緩和できるとともに、押え
ピン20の長さ調整がほとんど不要となるので、トータ
ルコストを大幅に低減することができる。In this way, with the above implementation side number, the conical tip 20a of the presser pin 20 bites into the free terminal (fixed contact part 2a) of the terminal part 9 and is held therein, so that the mold part can be dimensioned. Even if there is an error or a variation in the thickness dimension of each terminal portion 9, the amount of biting of the conical tip portion 20a is only slightly increased, and there is no widening that would undesirably weaken the clamping force. Therefore, the molten resin can be injected while the fixed contact part 2a is securely pressed against the receiving surface B of the cavity 11, and the fixed contact part 2a can be prevented from shifting due to injection pressure, thereby reducing the risk of misalignment. has been removed. Also,
Since dimensional errors in the mold parts are allowed to a certain extent, the manufacturing precision can be relaxed compared to conventional products, and there is almost no need to adjust the length of the presser pin 20, so the total cost can be significantly reduced. Can be done.
なお、上記実施例では型締め時に押えピン20と受面B
とで固定接点部2aを挟持する構成になっているが、押
えピン20と対向する位置に先端面が平坦な別の押えピ
ンを設け、これら2種類の押えピンで固定接点部2aを
挟持する構成にしてもよい。In addition, in the above embodiment, when the mold is clamped, the presser pin 20 and the receiving surface B
However, another presser pin with a flat tip is provided at a position facing the presser pin 20, and the fixed contact portion 2a is held between these two types of presser pins. It may be configured.
また、本発明が可変抵抗器やエンコーダ等の電気部品の
配線基板を成形する際にも適用可能であることは、言う
までもない。It goes without saying that the present invention is also applicable to molding wiring boards for electrical components such as variable resistors and encoders.
以上説明したように、型締め時に押えピンの錐状先端部
を端子の自由端部に食い込ませて挟持する本発明によれ
ば、金型部品に寸法誤差があったり各端子の厚み寸法に
ばらつきがあったとしても挟持力が不所望に弱まる広れ
がないので、該端子の自由端部をキャビティの受面6ζ
確実に圧着させた状態で溶融樹脂を射出・注入すること
ができ、そのため射出圧力による端子の位置ずれを確実
に防止できるとともに、金型部品の製作精度を緩和する
ことができて押えビンの長さ調整もほとんど不要となる
ので、コストダウンが図れる等、゛顕著な効果を奏する
。As explained above, according to the present invention in which the conical tip of the presser pin bites into the free end of the terminal and clamps it during mold clamping, there may be dimensional errors in the mold parts or variations in the thickness of each terminal. Even if there is, there is no widening that would undesirably weaken the clamping force, so the free end of the terminal is placed on the receiving surface 6ζ of the cavity.
The molten resin can be injected while the resin is securely crimped, and as a result, it is possible to reliably prevent the terminal from shifting due to injection pressure, and it is also possible to reduce the manufacturing precision of the mold parts, reducing the length of the presser bin. Since there is almost no need to adjust the height, significant effects such as cost reduction can be achieved.
第1図は本発明の一実施例に係る射出成形金型の型開き
状態を示す断面図、第2図はこの射出成形金型の型締め
状態を示す要部断面図、第3図はスライド型スイッチの
断面図、第4図および第5図はこのスライド型スイッチ
の製造工程を示す説明図、第6図はこの製造工程で用い
られる従来の射出成形金型の型締め状態を示す要部断面
図である。
1・・・・・・ケース、2・・・・・・端子、2a・・
・・・・固定接点部、6・・・・・・ベース板、9・・
・・・・端子部、11・・・・・・キャビティ、12・
・・・・・上型、13・・・・・・下型、15・・・・
・・樹脂、20・・・・・・押えピン、20a・・・・
・・錐状先端部、B・・・・・・受面。
第1図
13 ・
第2図
第3図Fig. 1 is a sectional view showing an injection molding die according to an embodiment of the present invention in an open state, Fig. 2 is a sectional view of essential parts showing the injection mold in a closed state, and Fig. 3 is a slide A cross-sectional view of the mold switch, FIGS. 4 and 5 are explanatory diagrams showing the manufacturing process of this slide type switch, and FIG. 6 is a main part showing the mold closing state of the conventional injection mold used in this manufacturing process. FIG. 1... Case, 2... Terminal, 2a...
... Fixed contact part, 6 ... Base plate, 9 ...
...Terminal section, 11...Cavity, 12.
...Top mold, 13...Bottom mold, 15...
...Resin, 20...Press pin, 20a...
...Conical tip, B...Receiving surface. Figure 1 13 ・ Figure 2 Figure 3
Claims (1)
型とを備え、これら上型と下型との間に画成されるキャ
ビティの受面に前記端子の自由端部を当接させた状態で
該キャビティ内に溶融樹脂を充填し、しかる後、該溶融
樹脂を冷却・固化することにより樹脂成形体を前記端子
と一体に成形する配線基板成形用の射出成形金型におい
て、前記キャビティの受面と対向する側に、先端部が錐
状の押えピンを設け、該押えピンの錐状先端部を前記端
子の自由端部に食い込ませた状態で型締めするように構
成したことを特徴とする射出成形金型。It comprises an upper mold and a lower mold that sandwich a terminal pressed into a predetermined shape, and the free end of the terminal is brought into contact with a receiving surface of a cavity defined between the upper mold and the lower mold. In an injection mold for molding a wiring board, the cavity is filled with a molten resin, and then the molten resin is cooled and solidified to form a resin molded body integrally with the terminal. A presser pin having a conical tip is provided on the side facing the receiving surface, and the mold is clamped with the conical tip of the presser pin biting into the free end of the terminal. injection mold.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62330232A JPH0763990B2 (en) | 1987-12-28 | 1987-12-28 | Injection mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62330232A JPH0763990B2 (en) | 1987-12-28 | 1987-12-28 | Injection mold |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01171921A true JPH01171921A (en) | 1989-07-06 |
JPH0763990B2 JPH0763990B2 (en) | 1995-07-12 |
Family
ID=18230334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62330232A Expired - Fee Related JPH0763990B2 (en) | 1987-12-28 | 1987-12-28 | Injection mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0763990B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013240934A (en) * | 2012-05-21 | 2013-12-05 | Yazaki Corp | Method of treating terminal of electric wire and connector |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60198076A (en) * | 1984-03-21 | 1985-10-07 | 松下電器産業株式会社 | Insert injection mold |
-
1987
- 1987-12-28 JP JP62330232A patent/JPH0763990B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60198076A (en) * | 1984-03-21 | 1985-10-07 | 松下電器産業株式会社 | Insert injection mold |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013240934A (en) * | 2012-05-21 | 2013-12-05 | Yazaki Corp | Method of treating terminal of electric wire and connector |
Also Published As
Publication number | Publication date |
---|---|
JPH0763990B2 (en) | 1995-07-12 |
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