JPS6398405A - Preparation of switch case - Google Patents

Preparation of switch case

Info

Publication number
JPS6398405A
JPS6398405A JP61243117A JP24311786A JPS6398405A JP S6398405 A JPS6398405 A JP S6398405A JP 61243117 A JP61243117 A JP 61243117A JP 24311786 A JP24311786 A JP 24311786A JP S6398405 A JPS6398405 A JP S6398405A
Authority
JP
Japan
Prior art keywords
terminal
case
cavity
face
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61243117A
Other languages
Japanese (ja)
Inventor
Yasushi Takeda
康 武田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP61243117A priority Critical patent/JPS6398405A/en
Priority to KR1019870004885A priority patent/KR900007326B1/en
Publication of JPS6398405A publication Critical patent/JPS6398405A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C69/00Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16Making multilayered or multicoloured articles

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Of Switches (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

PURPOSE:To make a hole-filling operation unnecessary and to reduce the total cost of a switch, by bending a terminal in such a way that a convex face is formed in the opposite direction against the press-cut direction, clamping the terminal between a top force and a bottom force and contacting the concave face of the terminal to the receiving face of a cavity under pressure. CONSTITUTION:A terminal 9 of a base plate 6 is press-cut from the convex face side to the concave face side. The base plate 6 is transferred and positioned along the guide of a bottom force 13 in such a way that the convex face of the terminal 9 faces upward, and a top force 12 and the bottom force 13 are clamped. The curved terminal 9 is clamped between flat facing faces of the top and the bottom forces 12 and 13, and the free end 2a of the terminal 9 is contacted under pressure on a receiving face B due to a counterforce. After clamping the mold, a resin 15 is injected and poured in a cavity 11 from a gate 12a, and the resin is applied in the cavity 11 without penetrating between a fixed contact 2a and the receiving face B. The terminal 9 is cut off and bent and a switch case in which a case 1 and a terminal 2 are integrally combined can be thereby obtained. Since no hole communicating to the fixed contact 2a exists on the rear face of the case 1, there is no possibility of contact obstruction due to the penetration of flux.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、スイッチ接点となる端子の一部を合成樹脂製
のケースに埋設してこれらを一体化したスイッチケース
の製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a switch case in which a part of a terminal serving as a switch contact is embedded in a synthetic resin case and these are integrated.

〔従来の技術〕[Conventional technology]

この種のスイッチケースの従来例を、第6図に示すディ
ップスイッチを基に説明する。
A conventional example of this type of switch case will be explained based on a dip switch shown in FIG.

同図において、1は上面を開放面とした熱可塑性合成樹
脂よりなるケース、2は上記ケース1に一体成形によっ
てその一部を埋設された金属製の端子で、図中左右向か
い合う同志で対をなし、この対をなす端子2が紙面と直
交する方向に複数組等間隔で設置されている。2aは上
記各端子2に設けられた固定接点部であり、対をなして
向かい合う固定接点部2aの間には所定のギャップAが
形成されている。3は合成樹脂製のスライダ、4は金属
製の摺動子でスライダ3の下面にその一部を取り付けら
れている。上記スライダ3は、図示省略しであるが例え
ばケース1と一体に設けられたガイド壁および後述する
カバーのガイド溝によって、第6図左右方向にのみ摺動
自在であるようにされ、該スライダ3の摺動によって摺
動子4が対をなす前記固定接点部2aと択一的に接触・
導通可能となっている。そして、上記スライダ3は前記
対となった端子2と対応する数だけ設置されている。5
は前記ケース1の開放面を覆う熱可塑性合成樹脂よりな
るカバーで、前記スライダ3のつまみ3aが突出・摺動
するガイド溝5aが複数個設けられており、このカーパ
ー5は超音波溶着等でケース1に固着されている。
In the figure, 1 is a case made of thermoplastic synthetic resin with an open top surface, and 2 is a metal terminal that is partially embedded in the case 1 by integral molding. No, a plurality of pairs of terminals 2 are installed at equal intervals in a direction perpendicular to the plane of the paper. 2a is a fixed contact portion provided on each terminal 2, and a predetermined gap A is formed between the pair of opposing fixed contact portions 2a. 3 is a synthetic resin slider, and 4 is a metal slider, a part of which is attached to the lower surface of the slider 3. Although not shown, the slider 3 is made to be able to slide only in the left and right directions in FIG. By sliding, the slider 4 alternatively comes into contact with the paired fixed contact portion 2a.
Conduction is possible. The sliders 3 are provided in a number corresponding to the number of paired terminals 2. 5
is a cover made of thermoplastic synthetic resin that covers the open surface of the case 1, and is provided with a plurality of guide grooves 5a from which the knob 3a of the slider 3 protrudes and slides. It is fixed to case 1.

このように構成されたディップスイッチのうち、通常ケ
ース1と各端子2は金型装置を用いて一体成形され(以
下、この一体高をスイッチケースと称す)、量産性が高
められている。かかるスイッチケースの工程を第7図お
よび第8図について説明すると、まず予め準備されたフ
ープ状の金属板を順次送り、所定形状のベース板6をプ
レス加工する。このベース板6は、第7図に示すように
、多数の送り孔7を有する一対のフレーム部8から等間
隔で突出する複数の端子部9と、対向するフレーム部8
を連結する架橋部10によって概略構成されており、こ
れを図示せぬ金型装置内に送った後、図中二点鎖線で示
すキャビティ11に溶融樹脂を射出・注入する。
In a DIP switch configured in this manner, the case 1 and each terminal 2 are usually integrally molded using a molding machine (hereinafter, this integral height will be referred to as a switch case), increasing mass productivity. The process of manufacturing such a switch case will be explained with reference to FIGS. 7 and 8. First, hoop-shaped metal plates prepared in advance are sequentially fed and a base plate 6 of a predetermined shape is pressed. As shown in FIG. 7, this base plate 6 has a plurality of terminal parts 9 protruding from a pair of frame parts 8 having a large number of feed holes 7 at equal intervals, and a frame part 8 facing each other.
After this is sent into a mold device (not shown), molten resin is injected into a cavity 11 shown by a two-dot chain line in the figure.

次に、上記溶融樹脂を金型装置内で冷却固化し、第8図
に示すように、両側に複数の端子部9を備えた合成樹脂
製のケース1を成形する。
Next, the molten resin is cooled and solidified in a mold apparatus, and as shown in FIG. 8, a synthetic resin case 1 having a plurality of terminal portions 9 on both sides is molded.

最後に、第8図の破線で示す位置で、各端子部9をフレ
ーム部8から切り離し、この切り離された端子部9を折
り曲げることにより、第6図に示したケース1と端子2
の一体品、ずなわぢスイッチケースを得る。
Finally, each terminal part 9 is separated from the frame part 8 at the position shown by the broken line in FIG. 8, and by bending the separated terminal part 9, the case 1 and the terminal 2
Get the Zunawaji switch case, which is an integrated product.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ところで、上述した金型装置のうち、対をなす端子2の
対向部(固定接点部2a>近傍では、第9図に示す金型
構造が採用されている。同図において、12はゲー)1
2aを有する上型、13は突部13aを有する下型、1
4ば上型12aに一体的に設けられた押えピン、15は
樹脂で、所定形状にプレス抜きされた上記ベース板6を
、その対向する端子部9(再固定接点部2a)間に下型
I3の突部13aが位置するよう金型装置に搬送した後
、上型12と下型13を型締めし、ゲート12aより溶
融状態の樹脂15をキャビティ11内に射出・注入する
。ここで、再固定接点部2aの自由端近傍は、型締めの
際に押えビン14によって下型13の受面Bに圧接され
ているため、溶融樹脂15が固定接点部2aと下型13
の受面Bとの間に入り込むおそれはほとんどない。
By the way, in the above-mentioned mold device, the mold structure shown in FIG. 9 is adopted in the area where the pair of terminals 2 face each other (near the fixed contact portion 2a).
2a is an upper mold, 13 is a lower mold having a protrusion 13a, 1
4 is a presser pin provided integrally with the upper die 12a; 15 is a resin; the base plate 6, which has been pressed into a predetermined shape, is held between the opposing terminal portions 9 (refixed contact portions 2a) of the lower die; After conveying to the mold apparatus so that the protrusion 13a of I3 is positioned, the upper mold 12 and lower mold 13 are clamped, and molten resin 15 is injected into the cavity 11 through the gate 12a. Here, the vicinity of the free end of the re-fixed contact part 2a is pressed against the receiving surface B of the lower mold 13 by the presser bottle 14 during mold clamping, so that the molten resin 15 is transferred between the fixed contact part 2a and the lower mold 13.
There is almost no possibility that it will get between it and the receiving surface B.

しかしながら、かかる金型構造にあっては、キャビティ
11内に達する押えビン14によって固定接点部2aを
受面Bに圧接固定しているため、熔融樹脂15を冷却固
化してスイッチケースを金型装置から取り出すと、第5
図に示すように、ケース1の下面に押えピン14による
孔1aが形成されてしまい、フラックス等がこの孔1a
を通って固定接点部2aに達し、スイッチ接点の短絡や
腐食等の接触障害を誘発するという不具合があった。こ
のため、従来のディップスイッチでは、スイッチケース
の成形後に孔1aを塞ぐ工程、例えば孔1aに別の樹脂
を充填したりケース1の下面にシール用の粘着テープを
貼着する工程が必要となり、製造コストの高騰を余儀な
くされていた。
However, in such a mold structure, the fixed contact portion 2a is pressed and fixed to the receiving surface B by the presser pin 14 that reaches into the cavity 11, so the molten resin 15 is cooled and solidified, and the switch case is attached to the mold device. When taken out, the fifth
As shown in the figure, a hole 1a is formed on the lower surface of the case 1 by the presser pin 14, and flux, etc.
There is a problem in that the contact reaches the fixed contact portion 2a through the contact point, inducing contact failure such as short circuit or corrosion of the switch contact. For this reason, conventional dip switches require a step of closing the hole 1a after molding the switch case, such as filling the hole 1a with another resin or pasting adhesive tape for sealing on the bottom surface of the case 1. Manufacturing costs were forced to rise.

従って、本発明の目的は、上記従来技術の問題点を解消
し、ケースの孔埋め工程が不要でスイッチのトータルコ
ストを低減することのできるスイッチケースの製造方法
を提供するにある。
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for manufacturing a switch case, which eliminates the problems of the prior art described above, eliminates the need for a step of filling holes in the case, and reduces the total cost of the switch.

〔問題点を解決するための手段〕[Means for solving problems]

上記目的を達成するために、本発明は、所定形状にプレ
ス抜きされた端子を、その自由端がキャビティの受面と
当接するように上型と下型とで挟持し、しかる後、前記
キャビティに溶融樹脂を充填し、該溶融樹脂を冷却・固
化して合成樹脂製のケースと前記端子とを一体成形する
ようにしたスイッチケースの製造方法において、前記端
子をプレス抜きの際の抜き方向と逆方向が凸面となるよ
う屈曲した後、該端子を前記上型と下型とで挟持してそ
の凹面を前記キャビティの受面に圧接するようにしたこ
とを、その特徴とする。
In order to achieve the above object, the present invention involves sandwiching a terminal press-cut into a predetermined shape between an upper mold and a lower mold so that its free end comes into contact with the receiving surface of the cavity, and then inserting the terminal into the cavity. In a method for manufacturing a switch case, in which a synthetic resin case and the terminal are integrally molded by filling a molten resin with the molten resin and cooling and solidifying the molten resin, The terminal is characterized in that after being bent so that the opposite direction becomes a convex surface, the terminal is held between the upper mold and the lower mold, and the concave surface is pressed into contact with the receiving surface of the cavity.

〔作用〕[Effect]

フープ状の金属板から所定形状の端子をプレス加]ニす
る際、該端子をプレス抜き方向と逆方向が凸面となるよ
う屈曲し、しかる後、この端子を上型と下型との間に配
置して型締めすると、端子は屈曲方向と逆方向の押圧力
を受けるため、その反力で端子の自由端が受面に圧接さ
れる。この時、端子と受面との接触は、プレス抜きの際
に端子に生じる微細なバリを介しての線接触であるため
、上記端子自身の弾性力と相俟って、端子の自由端は受
面に密着状態となる。従って、端子を受面に圧接するた
めの押えビンを省略しても、溶融樹脂を端子と受面との
間に入り込まないようにキャビティ内に充填することが
でき、押えビンによる孔のないスイッチケースを成形で
きる。
When pressing a terminal of a predetermined shape from a hoop-shaped metal plate, the terminal is bent so that the opposite direction to the pressing direction becomes a convex surface, and then this terminal is inserted between an upper mold and a lower mold. When placed and clamped, the terminal receives a pressing force in a direction opposite to the bending direction, and the free end of the terminal is pressed against the receiving surface by the reaction force. At this time, the contact between the terminal and the receiving surface is a line contact through the fine burrs that are generated on the terminal during press punching, so in combination with the elastic force of the terminal itself, the free end of the terminal It comes into close contact with the receiving surface. Therefore, even if the holding bottle for pressing the terminal to the receiving surface is omitted, the molten resin can be filled into the cavity without entering between the terminal and the receiving surface, and the holding bottle can be used to switch the hole-free switch. Cases can be molded.

〔実施例〕〔Example〕

以下、本発明の実施例を図面について説明する。 Embodiments of the present invention will be described below with reference to the drawings.

第1図は本発明の一実施例に係る成形用金型の型開き状
態を示す断面図、第2図はその成形用金型による射出工
程を示す断面図、第3図は固定接点部と受面との接触状
態を示す説明図、第4図はその成形用金型を用いて成形
されたスイッチケースの断面図であり、前述した従来構
成と均等の部材、部位には同一符号を付し、重複を避け
るためその説明は省略する。
FIG. 1 is a sectional view showing a mold opening state of a molding die according to an embodiment of the present invention, FIG. 2 is a sectional view showing an injection process using the molding die, and FIG. 3 is a sectional view showing a fixed contact portion and An explanatory diagram showing the state of contact with the receiving surface, and FIG. 4 is a cross-sectional view of a switch case molded using the molding die, and the same reference numerals are given to parts and parts that are equivalent to the conventional structure described above. However, the explanation will be omitted to avoid duplication.

本実施例が前記従来例と異なる点は成形用金型に供給さ
れる端子部9の形状にあり、成形用金型の基本構成は従
来例と同じである。すなわち、フープ状の金属板からプ
レス加工されたベース板6には、従来例と同様にフレー
ム部や端子部等が形成されているが(第7図参照)、そ
のうち端子部9は第1図に示すように上側が凸となるよ
うに湾曲形成され、かつ第1図からは明らかでないが、
端子部9は凸面側から凹面側に向けてプレス抜きされて
いる。
This embodiment differs from the conventional example in the shape of the terminal portion 9 supplied to the molding die, and the basic structure of the molding die is the same as the conventional example. That is, the base plate 6, which is press-worked from a hoop-shaped metal plate, has a frame portion, a terminal portion, etc. formed thereon as in the conventional example (see FIG. 7), and among these, the terminal portion 9 is formed as shown in FIG. As shown in Figure 1, it is curved so that the upper side is convex, and although it is not clear from Figure 1,
The terminal portion 9 is pressed from the convex side to the concave side.

スイッチケースを成形するに際しては、フープ状の金属
板から上記形状の端子部9等を備えたベース板6をプレ
ス加工した後、該ベース板6を端子部9の凸面が上を向
くようにして下型13のガイド部に沿って搬送・位置決
めし、上型12と下型〕3とを型締めする。かかる型締
めに際し、上面が凸となるように湾曲されていた端子部
9は、上型12と下型13の平坦な対向面によって挟持
されて平板状となるため、その反力により端子部9の自
由端(固定接点部2a)ば受面Bに圧接される。しかも
、この端子部9は、プレス抜きの際の抜き終わり側か受
面Bと対向するよう搬送されたちのであるから、第3図
に示すように、プレス抜きの際に端子部9の周縁に生じ
る微細なバリC(所謂カエリ)が受面Bと接触し、上記
した端子部9自身の受面B方向への弾性力はバリCに応
力集中することになり、固定接点部2aと受面Bとの密
着性は確実なものとなる。
When molding the switch case, after press-working the base plate 6 having the terminal portions 9 and the like having the shape described above from a hoop-shaped metal plate, the base plate 6 is pressed so that the convex surface of the terminal portion 9 faces upward. The lower mold 13 is transported and positioned along the guide portion, and the upper mold 12 and the lower mold] 3 are clamped. During such mold clamping, the terminal portion 9, which had been curved so that the upper surface was convex, is held between the flat opposing surfaces of the upper mold 12 and the lower mold 13 and becomes flat, so that the terminal portion 9 is bent due to the reaction force. The free end (fixed contact portion 2a) of is pressed against the receiving surface B. Moreover, since the terminal portion 9 is conveyed so that the end of the punching is opposed to the receiving surface B during press punching, as shown in FIG. 3, the peripheral edge of the terminal portion 9 is The resulting fine burrs C (so-called burrs) come into contact with the receiving surface B, and the elastic force of the terminal portion 9 itself in the direction of the receiving surface B causes stress to concentrate on the burrs C, causing the fixed contact portion 2a and the receiving surface to Adhesion with B is ensured.

このように型締めした後、第2図に示すように、ゲート
12aから溶融状態の樹脂15をキャビティ11内に射
出・注入すると、この樹脂15は固定接点部2aと受面
Bとの間に入り込むことなくキャビティ11内に満遍無
く充填され、これを冷却同化して型開きし、さらに端子
部9を切り離して折り曲げることにより、第4図に示す
ように、ケース1と端子2が一体化されたスイッチケー
スが得られる。
After the mold is clamped in this way, as shown in FIG. The cavity 11 is evenly filled without entering the mold, the mold is opened after being cooled and assimilated, and the terminal part 9 is separated and bent, so that the case 1 and the terminal 2 are integrated as shown in Fig. 4. A switch case is obtained.

このようにして成形されたスイッチケースは、ケース1
の下面に固定接点部2aに通じる孔がないため、フラッ
クス等の浸入に起因する接触障害のおそれはなく、また
固定接点部2aの上面に樹脂がはみ出すことがないため
、絶縁被膜に起因する接触障害のおそれもない。
The switch case molded in this way is Case 1
Since there is no hole on the bottom surface leading to the fixed contact part 2a, there is no risk of contact failure due to infiltration of flux, etc. Also, since resin does not protrude onto the top surface of the fixed contact part 2a, there is no risk of contact failure due to the insulating coating. There is no risk of injury.

第5図は本発明の他の実施例を示す成形用金型の断面図
であり、第1図に対応する部分には同一符号を付けであ
る。
FIG. 5 is a sectional view of a molding die showing another embodiment of the present invention, and parts corresponding to those in FIG. 1 are given the same reference numerals.

本実施例の場合、上型12の下面にキャビティ用凹部に
向って斜め降下する傾斜面12bを形成すると共に、下
型13の上面に、上記傾斜面12bに対応して受面Bに
向って斜め降下する傾斜面13bを形成しである。一方
、端子部9は、上面が凸となるようくの字状に折り曲げ
られると共に、凸側から凹側にプレス抜きされている。
In the case of this embodiment, an inclined surface 12b that slopes downward toward the cavity recess is formed on the lower surface of the upper mold 12, and an inclined surface 12b that slopes downward toward the receiving surface B in correspondence with the inclined surface 12b is formed on the upper surface of the lower mold 13. An inclined surface 13b that descends diagonally is formed. On the other hand, the terminal portion 9 is bent in a dogleg shape so that the upper surface thereof is convex, and is pressed from the convex side to the concave side.

従って、第5図に示す型開きの状態から上型12と下型
13とを型締めすると、端子部9は、両頭斜面1.2b
、13bおよび受面Bに沿ってプレス加工時と逆方向に
くの字状に変形され、その反力で固定接点部2aが受面
Bに圧接される。このように、本実施例では、第1実施
例に比べてより大きな力で固定接点部2aを受面Bに密
着することができる。
Therefore, when the upper mold 12 and the lower mold 13 are clamped from the open state shown in FIG.
, 13b and the receiving surface B in a dogleg shape in the opposite direction to that during press working, and the fixed contact portion 2a is pressed against the receiving surface B by the reaction force. In this way, in this embodiment, the fixed contact portion 2a can be brought into close contact with the receiving surface B with a larger force than in the first embodiment.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明によれば、端子自身の弾性
とプレス抜きの際のパリを利用して、端子の自由端をキ
ャビティの受面に密着させることができるため、従来必
要とされていたケースの孔埋め工程が省略され、スイッ
チのコストダウンを図ることができる。
As explained above, according to the present invention, the free end of the terminal can be brought into close contact with the receiving surface of the cavity by utilizing the elasticity of the terminal itself and the spacing during press-pull, which is not necessary in the past. The process of filling holes in the case is omitted, and the cost of the switch can be reduced.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図ないし第4図は本発明の一実施例に係り、第1図
は成形用金型の型開き状態を示す断面図、第2図は射出
工程時における成形用金型の要部断面図、第3図は固定
接点部と受面との接触状態を示す説明図、第4図は成形
されたスイッチケースの断面図、第5図は本発明の他の
実施例に係る成形用金型の型開き状態を示す断面図、第
6図ないし第9図は従来例に係り、第6図はディップス
イッチの断面図、第7図および第8図は端子とケースの
製造工程を示す説明図、第9図はその製造工程で用いら
れる金型装置の断面図である。 1・・・ケース、2・・・端子、2a・・・固定接点部
、6・・・ベース板、9・・・端子部、11・・・キャ
ビティ、12・・・上型、12b・・・傾斜面、13・
・・下型、+−3b・・・傾斜面、15・・・樹脂、B
・・・受面、C・・・パリ。 第1図 第2図 第4図 第5図 第6図 第7図 第8図
Figures 1 to 4 relate to one embodiment of the present invention, in which Figure 1 is a sectional view showing the mold opening state of the mold, and Figure 2 is a sectional view of the main part of the mold during the injection process. 3 is an explanatory view showing the contact state between the fixed contact part and the receiving surface, FIG. 4 is a sectional view of a molded switch case, and FIG. 5 is a molding metal plate according to another embodiment of the present invention. FIGS. 6 to 9 are sectional views showing the open state of the mold, FIGS. 6 to 9 are related to conventional examples, FIG. 6 is a sectional view of the dip switch, and FIGS. 7 and 8 are explanations showing the manufacturing process of the terminal and case. 9 are cross-sectional views of a mold device used in the manufacturing process. DESCRIPTION OF SYMBOLS 1... Case, 2... Terminal, 2a... Fixed contact part, 6... Base plate, 9... Terminal part, 11... Cavity, 12... Upper mold, 12b...・Slope surface, 13・
...Lower mold, +-3b...Slanted surface, 15...Resin, B
...Ukemen, C...Paris. Figure 1 Figure 2 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8

Claims (1)

【特許請求の範囲】[Claims] 所定形状にプレス抜きされた端子を、その自由端がキャ
ビティの受面と当接するように上型と下型とで挟持し、
しかる後、前記キャビティに溶融樹脂を充填し、該溶融
樹脂を冷却・固化して合成樹脂製のケースと前記端子と
を一体成形するようにしたスイッチケースの製造方法に
おいて、前記端子をプレス抜きの際の抜き方向と逆方向
が凸面となるよう屈曲した後、該端子を前記上型と下型
とで挟持してその凹面を前記キャビティの受面に圧接す
るようにしたことを特徴とするスイッチケースの製造方
法。
A terminal that has been pressed into a predetermined shape is held between an upper mold and a lower mold so that its free end contacts the receiving surface of the cavity.
Thereafter, in the method for manufacturing a switch case, the cavity is filled with molten resin, the molten resin is cooled and solidified, and the synthetic resin case and the terminal are integrally molded. After the terminal is bent so that it has a convex surface in a direction opposite to the direction in which it is removed, the terminal is held between the upper mold and the lower mold so that its concave surface is pressed into contact with the receiving surface of the cavity. How to manufacture the case.
JP61243117A 1986-10-15 1986-10-15 Preparation of switch case Pending JPS6398405A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP61243117A JPS6398405A (en) 1986-10-15 1986-10-15 Preparation of switch case
KR1019870004885A KR900007326B1 (en) 1986-10-15 1987-05-18 Preparation of switch case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61243117A JPS6398405A (en) 1986-10-15 1986-10-15 Preparation of switch case

Publications (1)

Publication Number Publication Date
JPS6398405A true JPS6398405A (en) 1988-04-28

Family

ID=17099049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61243117A Pending JPS6398405A (en) 1986-10-15 1986-10-15 Preparation of switch case

Country Status (2)

Country Link
JP (1) JPS6398405A (en)
KR (1) KR900007326B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101335361B1 (en) * 2013-07-31 2013-12-02 주식회사 스위치코리아 Manufacturing system and method for manufacturing tact switch

Also Published As

Publication number Publication date
KR880004930A (en) 1988-06-27
KR900007326B1 (en) 1990-10-08

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