JPH0763990B2 - Injection mold - Google Patents

Injection mold

Info

Publication number
JPH0763990B2
JPH0763990B2 JP62330232A JP33023287A JPH0763990B2 JP H0763990 B2 JPH0763990 B2 JP H0763990B2 JP 62330232 A JP62330232 A JP 62330232A JP 33023287 A JP33023287 A JP 33023287A JP H0763990 B2 JPH0763990 B2 JP H0763990B2
Authority
JP
Japan
Prior art keywords
terminal
mold
resin
receiving surface
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62330232A
Other languages
Japanese (ja)
Other versions
JPH01171921A (en
Inventor
清一郎 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP62330232A priority Critical patent/JPH0763990B2/en
Publication of JPH01171921A publication Critical patent/JPH01171921A/en
Publication of JPH0763990B2 publication Critical patent/JPH0763990B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/1486Details, accessories and auxiliary operations
    • B29C2045/14934Preventing penetration of injected material between insert and adjacent mould wall
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0014Shaping of the substrate, e.g. by moulding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、例えば合成樹脂製のケースの内底面に接点用
の端子を露出させたスイツチケースのように、樹脂成形
体の片面に金属製の端子を露出させた状態に一体成形さ
れる配線基板成形用の射出成形金型に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention is, for example, a switch case in which terminals for contacts are exposed on the inner bottom surface of a case made of synthetic resin. The present invention relates to an injection molding die for molding a wiring board, which is integrally molded in a state where the terminals are exposed.

〔従来の技術〕[Conventional technology]

この種の配線基板を備えた電気部品の一例として、第3
図にスライド型スイツチを示す。
As an example of an electric component provided with this kind of wiring board,
The slide type switch is shown in the figure.

同図において、1は上面が開放面となつている合成樹脂
製のケース、2はこのケース1の成形時に一部を埋設さ
れた金属製の端子で、所定のギヤツプAを介して向き合
う図示左右の端子2が対をなして紙面と直交する方向に
複数組設置されており、各端子2のケース1内に露出し
ている部分が固定接点部2aとなつている。3は合成樹脂
製のスライダ、4は金属製の摺動子で、この摺動子4は
スライダ3の底部に取り付けられて前記固定接点部2aに
弾接している。なお、このスライダ3は、対をなす前記
端子2と対応して紙面と直交する方向に複数個設置され
ている。5は前記ケース1の開放面を覆う合成樹脂製の
カバーで、このカバー5には互いに平行な複数条のガイ
ド溝5aが穿設してあり、各ガイド溝5aからそれぞれ前記
スライダ3のつまみ3aが突出している。したがつて、所
望のつまみ3aをガイド溝5aに沿つてスライド操作する
と、当該スライダ3に取り付けてある摺動子4が対応す
る固定接点部2a上を摺動してオン・オフの切換えが行わ
れる。なお、カバー5は超音波溶着等によつてケース1
に固着されている。
In the figure, 1 is a synthetic resin case whose upper surface is an open surface, and 2 is a metal terminal partially embedded in the case 1 when the case 1 is formed. A plurality of pairs of the terminals 2 are installed in a direction orthogonal to the paper surface, and the exposed portion of each terminal 2 in the case 1 serves as the fixed contact portion 2a. 3 is a slider made of synthetic resin, 4 is a slider made of metal, and this slider 4 is attached to the bottom of the slider 3 and is in elastic contact with the fixed contact portion 2a. It should be noted that a plurality of sliders 3 are installed in a direction orthogonal to the plane of the drawing corresponding to the pair of terminals 2. Reference numeral 5 is a cover made of synthetic resin for covering the open surface of the case 1, and a plurality of parallel guide grooves 5a are bored in the cover 5, and the knobs 3a of the slider 3 are respectively provided from the guide grooves 5a. Is protruding. Therefore, when the desired knob 3a is slid along the guide groove 5a, the slider 4 attached to the slider 3 slides on the corresponding fixed contact portion 2a to switch between on and off. Be seen. The cover 5 may be attached to the case 1 by ultrasonic welding or the like.
Is stuck to.

このように構成されたスライド型スイツチは、通常、ケ
ース1と各端子2とが射出成形金型を用いて一体成形さ
れ、量産性が高められている。
In the slide type switch configured as described above, the case 1 and the terminals 2 are usually integrally formed by using an injection molding die, and the mass productivity is improved.

すなわち、まず予め準備されたフープ状の金属板を順次
送り、第4図に示すように、多数の送り孔7を有する上
下一対のフレーム部8と、このフレーム部8から互いに
平行に突出する複数の端子部9と、相対向するフレーム
部8を連結する架橋部10とによつて概略構成される所定
形状のベース板6をプレス加工する。そして、このベー
ス板6を金型装置内に送つた後、第4図に二点鎖線で示
すキヤビテイ11内に溶融樹脂を射出・注入する。次に、
この溶融樹脂を射出成形金型内で冷却・固化し、第5図
に示すように、対をなす複数組の端子部9を備えた合成
樹脂製のケース1を成形する。しかる後、第5図の破線
で示す位置で各端子部9をフレーム部8から切り離し、
この切り離された端子部9を折り曲げることによつて、
第3図に示したケース1と端子2との一体品である配線
基板(スイツチケース)を得る。
That is, first, a hoop-shaped metal plate prepared in advance is sequentially fed, and as shown in FIG. 4, a pair of upper and lower frame portions 8 having a large number of feed holes 7 and a plurality of projecting from the frame portion 8 in parallel with each other. The base plate 6 having a predetermined shape, which is roughly configured by the terminal portion 9 and the bridge portion 10 that connects the frame portions 8 facing each other, is pressed. Then, after the base plate 6 is fed into the mold apparatus, a molten resin is injected and injected into the cavity 11 shown by the chain double-dashed line in FIG. next,
This molten resin is cooled and solidified in an injection molding die to mold a synthetic resin case 1 having a plurality of pairs of terminal portions 9 as shown in FIG. After that, each terminal portion 9 is separated from the frame portion 8 at the position shown by the broken line in FIG.
By bending the separated terminal portion 9,
A wiring board (switch case), which is an integrated product of the case 1 and the terminal 2 shown in FIG. 3, is obtained.

ところで、上述した射出成形金型は、従来、端子部9の
自由端部に相当する固定接点部2aの近傍で、第6図に示
す如き金型構造が採用されている。同図において、12は
ゲート12aを有する上型、13は突部13aを有する下型、14
は上型12に一対的に設けられた押えピン、15は樹脂で、
対をなす端子部9間(両固定接点部2a間)に下型13の突
部13aが位置するように前記ベース板6を金型装置に搬
送した後、上型12と下型13を型締めし、ゲート12aより
溶融状態の樹脂15をキヤビテイ11内に射出・注入する。
ここで、各端子部9の自由端子(固定接点部2a)は、型
締めの際に押えピン14によつて下型13の受面Bに圧接さ
れるようになつているので、溶融状態の樹脂15が固定接
点部2aと受面Bとの間に入り込む虞れはほとんどなく、
樹脂15を冷却・固化してなる前記ケース1の内底面に各
固定接点部2aを露出させることができる。
By the way, in the injection molding die described above, conventionally, a die structure as shown in FIG. 6 is adopted in the vicinity of the fixed contact portion 2a corresponding to the free end portion of the terminal portion 9. In the figure, 12 is an upper die having a gate 12a, 13 is a lower die having a protrusion 13a, 14
Is a holding pin provided on the upper die 12 in a pair, and 15 is a resin,
After transferring the base plate 6 to the mold device so that the protrusion 13a of the lower mold 13 is located between the pair of terminal portions 9 (between the fixed contact portions 2a), the upper mold 12 and the lower mold 13 are molded. Tighten and inject molten resin 15 into the cavity 11 from the gate 12a.
Here, the free terminal (fixed contact portion 2a) of each terminal portion 9 is adapted to be pressed into contact with the receiving surface B of the lower die 13 by the pressing pin 14 when the die is clamped. There is almost no possibility that the resin 15 will enter between the fixed contact portion 2a and the receiving surface B,
The fixed contact portions 2a can be exposed on the inner bottom surface of the case 1 formed by cooling and solidifying the resin 15.

〔発明が解決しようとする問題点〕[Problems to be solved by the invention]

しかしながら、上述した従来の射出成形金型は、金型部
品のわずかな寸法誤差や各端子部9の厚み寸法のばらつ
きが原因で、押えピン14の先端の平坦面と受面Bとの間
に挟持されるはずの固定接点部2aが確実に挟持されない
ことがあり、その場合、樹脂15の射出圧力によつて固定
接点部2aが受面B上でブレを生じてしまう所謂およぎが
発生し、樹脂冷却後に固定接点部2aが位置ずれを起こし
ている心配がある。このため、従来は金型部品に高い寸
法精度が要求されるのみならず、型締め時に個々の押え
ピン14の長さを調整しなければならないことがあり、結
果としてコストアツプを招いていた。
However, the conventional injection molding die described above has a gap between the flat surface of the tip of the presser pin 14 and the receiving surface B due to a slight dimensional error of the die parts and a variation in the thickness dimension of each terminal portion 9. The fixed contact portion 2a that should be sandwiched may not be reliably sandwiched, and in that case, a so-called movement occurs in which the fixed contact portion 2a is shaken on the receiving surface B due to the injection pressure of the resin 15, There is a concern that the fixed contact portion 2a may be displaced after the resin is cooled. For this reason, conventionally, not only high dimensional accuracy is required for mold parts, but also the length of each pressing pin 14 may have to be adjusted at the time of mold clamping, resulting in cost increase.

本発明は叙上の点に鑑みてなされたものであり、その目
的は、キヤビテイ内で端子の自由端部を確実に挟持で
き、しかもコストダウンが図れる、配線基板成形用の射
出成形金型を提供することにある。
The present invention has been made in view of the above points, and an object thereof is to provide an injection molding die for molding a wiring board, which can surely clamp the free end portion of the terminal in the cavity and can reduce the cost. To provide.

〔問題点を解決するための手段〕[Means for solving problems]

上記目的を達成するために、本発明は、所定形状にプレ
ス加工された端子を挟持する上型と下型とを備え、これ
ら上型と下型との間に画成されるキヤビテイの受面に前
記端子の自由端部を当接させた状態で該キヤビテイ内に
溶融樹脂を充填し、しかる後、該溶融樹脂を冷却・固化
することにより樹脂成形体を前記端子と一体に成形する
配線基板成形用の射出成形金型において、前記キヤビテ
イの受面と対向する側に、先端を尖らせた錐状の押えピ
ンを固定し、該押えピンの錐状先端部を前記端子の自由
端部に食い込ませた状態で型締めするように構成した。
In order to achieve the above object, the present invention comprises an upper die and a lower die that sandwich a terminal pressed into a predetermined shape, and a cavity receiving surface defined between the upper die and the lower die. A wiring board in which a molten resin is filled in the cavity with the free end portion of the terminal being in contact with the terminal, and then the molten resin is cooled and solidified to integrally mold the resin molded body with the terminal. In an injection molding die for molding, a conical pressing pin having a pointed tip is fixed to the side facing the receiving surface of the cavity, and the conical tip of the pressing pin is set to the free end of the terminal. The mold is clamped in the state of biting.

〔作用〕[Action]

すなわち、本発明は、型締め時に押えピンの錐状先端部
が端子の自由端子に食い込むので、金型部品に寸法誤差
があつたり各端子の厚み寸法にばらつきがあつたとして
も該錐状先端部の食い込み量が若干異なるのみであつ
て、挟持力が不所望に弱まる虞れはなく、そのため端子
の自由端部をキヤビテイの受面に確実に圧着させた状態
で溶融樹脂を射出・注入することができ、射出圧力によ
る該自由端部のおよぎが確実に防止できる。
That is, according to the present invention, the conical tip end of the presser pin bites into the free terminal of the terminal when the mold is clamped. Therefore, even if there is a dimensional error in the mold parts or there is a variation in the thickness dimension of each terminal, the conical tip end There is no risk that the clamping force will undesirably weaken because the biting amount of the part is slightly different, so the molten resin is injected and injected while the free end of the terminal is securely crimped to the receiving surface of the cavity. Therefore, it is possible to reliably prevent the free end from reaching due to the injection pressure.

〔実施例〕〔Example〕

以下、本発明の実施例を図に基づいて説明する。 Embodiments of the present invention will be described below with reference to the drawings.

第1図は本発明の一実施例に係る射出成形金型の型開き
状態を示す断面図、第2図はこの射出成形金型の型締め
状態を示す要部断面図であつて、第6図に示した従来構
成と同等の部分には同一符号が付してある。
FIG. 1 is a sectional view showing a mold open state of an injection molding die according to an embodiment of the present invention, and FIG. 2 is a sectional view showing a main part of the injection molding die in a clamped state. The same parts as those in the conventional configuration shown in the figure are designated by the same reference numerals.

第1図に示すように、上型12には固定ブロツク12bが圧
入固定されていて、この固定ブロツク12bの下端の所定
位置に、先端部を四角錐状に形成してなる押えピン20が
複数本取り付けてある。つまり、上型12には、キヤビテ
イ11の受面Bと対向する位置に、錐状先端部20aを有す
る押えピン20が複数本設けてあり、これらの押えピン20
は、ベース板6の対をなす端子部9に対応させて2本ず
つ、紙面と直交する方向に複数組配置されている。
As shown in FIG. 1, a fixed block 12b is press-fitted and fixed to the upper mold 12, and a plurality of holding pins 20 each having a quadrangular pyramid tip portion are formed at predetermined positions on the lower end of the fixed block 12b. The book is attached. That is, the upper die 12 is provided with a plurality of presser pins 20 each having a conical tip portion 20a at a position facing the receiving surface B of the cavity 11, and these presser pins 20 are provided.
Are arranged in pairs in a direction orthogonal to the plane of the drawing, in correspondence with the pair of terminal portions 9 of the base plate 6.

第1図に示す型開き状態で、所定形状にプレス加工され
た端子部9付きのベース板6を下型13のガイド部13bに
沿つて搬送した後、第2図に示すように型締めすると、
端子部9の基端側が上型12と下型13とで挟持されるとと
もに、端子部9の自由端部(固定接点部2a)が押えピン
20と受面Bとの間に挟持される。このとき、押えピン20
の先端と受面Bとの間隔が端子部9の板厚よりも小さく
なるように予め設計してあるので、押えピン20の錐状先
端部20aは固定接点部2aに食い込んでおり、そのため固
定接点部2aは受面Bに強く圧接されている。このように
型締めした後、ゲート12aから溶融状態の樹脂15をキヤ
ビテイ11内に射出・注入すると、固定接点部2aは樹脂15
の射出圧力にさらされるが、押えピン20の食い込みによ
つて固定接点部2aは受面Bに強く圧接されているのでお
よぎが発生する虞れはなく、また固定接点部2aと受面B
との間に樹脂15が入り込む虞れもない。こうしてキヤビ
テイ11内に樹脂15を充填した後、これを冷却・固化して
型開きし、さらに端子部9を切り離して折り曲げること
により、樹脂成形体と端子とが一体化された配線基板
(スイツチケース)が得られる。
In the mold open state shown in FIG. 1, after the base plate 6 with the terminal portion 9 pressed into a predetermined shape is conveyed along the guide portion 13b of the lower mold 13, the mold is clamped as shown in FIG. ,
The base end side of the terminal portion 9 is sandwiched between the upper die 12 and the lower die 13, and the free end portion (fixed contact portion 2a) of the terminal portion 9 is a holding pin.
It is sandwiched between 20 and the receiving surface B. At this time, presser pin 20
Since it is designed in advance so that the distance between the tip of the pin and the receiving surface B is smaller than the plate thickness of the terminal part 9, the conical tip part 20a of the presser pin 20 bites into the fixed contact part 2a, so that it is fixed. The contact portion 2a is strongly pressed against the receiving surface B. After the mold is clamped in this way, when the molten resin 15 is injected and injected into the cavity 11 from the gate 12a, the fixed contact portion 2a is made of the resin 15
However, since the fixed contact portion 2a is strongly pressed against the receiving surface B due to the biting of the presser pin 20, there is no fear that a squeeze will occur, and the fixed contact portion 2a and the receiving surface B are not in contact with each other.
There is no risk that the resin 15 will enter between and. After the resin 11 is thus filled in the cavity 11, the resin is cooled and solidified to open the mold, and the terminal portion 9 is separated and bent to form a wiring board (switch case) in which the resin molded body and the terminal are integrated. ) Is obtained.

このように上記実施例にあつては、型締め時に押えピン
20の錐状先端部20aを端子部9の自由端子(固定接点部2
a)に食い込ませて挟持するので、金型部品に寸法誤差
があつたり各端子部9の厚み寸法にばらつきがあつたと
しても錐状先端部20aの食い込み量が若干異なるのみで
あつて、挟持力が不所望に弱まる虞れはない。したがつ
て、固定接点部2aをキヤビテイ11の受面Bに確実に圧着
させた状態で溶融樹脂を射出・注入することができ、射
出圧力による固定接点部2aのおよぎが防止できて位置ず
れの危険性が除去されている。また、金型部品の寸法誤
差がある程度許容されることから、その製作精度を従来
品に比して緩和できるとともに、押えピン20の長さ調整
がほとんど不要となるので、トータルコストを大幅に低
減することができる。
As described above, in the above-described embodiment, the pressing pin is used when the mold is clamped.
The conical tip portion 20a of 20 is used as a free terminal (fixed contact portion 2
Since it is bitten into and clamped in a), even if there is a dimensional error in the mold parts or there is a variation in the thickness dimension of each terminal part 9, only the biting amount of the conical tip part 20a is slightly different, and it is clamped. There is no danger of undesirably weakening the force. Therefore, it is possible to inject and inject the molten resin in a state where the fixed contact portion 2a is securely crimped to the receiving surface B of the cavity 11, and it is possible to prevent the fixed contact portion 2a from being affected by the injection pressure and to prevent misalignment. The danger is eliminated. In addition, since the dimensional error of the mold parts is allowed to some extent, the manufacturing accuracy can be relaxed compared to the conventional product, and the length adjustment of the presser pin 20 is almost unnecessary, so the total cost is greatly reduced. can do.

なお、上記実施例では型締め時に押えピン20と受面Bと
で固定接点部2aを挟持する構成になつているが、押えピ
ン20と対向する位置に先端面が平坦な別の押えピンを設
け、これら2種類の押えピンで固定接点部2aを挟持する
構成にしてもよい。
In the above embodiment, the fixed contact portion 2a is sandwiched between the presser pin 20 and the receiving surface B when the mold is clamped. However, another presser pin having a flat tip surface is provided at a position facing the presser pin 20. The fixed contact portion 2a may be sandwiched between these two types of pressing pins.

また、本発明が可変抵抗器やエンコーダ等の電気部品の
配線基板を成形する際にも適用可能であることは、言う
までもない。
Further, it goes without saying that the present invention can be applied to the case of molding a wiring board of electric parts such as a variable resistor and an encoder.

〔発明の効果〕〔The invention's effect〕

以上説明したように、型締め時に押えピンの錐状先端部
を端子の自由端部に食い込ませて挟持する本発明によれ
ば、金型部品に寸法誤差があつたり各端子の厚み寸法に
ばらつきがあつたとしても挟持力が不所望に弱まる虞れ
がないので、該端子の自由端部をキヤビテイの受面に確
実に圧着させた状態で溶融樹脂を射出・注入することが
でき、そのため射出圧力による端子の位置ずれを確実に
防止できるとともに、金型部品の製作精度を緩和するこ
とができて押えピンの長さ調整もほとんど不要となるの
で、コストダウンが図れる等、顕著な効果を奏する。
As described above, according to the present invention in which the conical tip end portion of the presser pin is bitten into the free end portion of the terminal and clamped when the die is clamped, according to the present invention, there is a dimensional error in the mold component or the thickness dimension of each terminal varies. Even if this happens, there is no risk that the clamping force will be undesirably weakened, so it is possible to inject and inject the molten resin while the free end of the terminal is securely crimped to the receiving surface of the cavity. Positional displacement of the terminals due to pressure can be reliably prevented, manufacturing accuracy of mold parts can be relaxed, and adjustment of the length of the presser pin is almost unnecessary, resulting in remarkable effects such as cost reduction. .

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の一実施例に係る射出成形金型の型開き
状態を示す断面図、第2図はこの射出成形金型の型締め
状態を示す要部断面図、第3図はスライド型スイツチの
断面図、第4図および第5図はこのスライド型スイツチ
の製造工程を示す説明図、第6図はこの製造工程で用い
られる従来の射出成形金型の型締め状態を示す要部断面
図である。 1……ケース、2……端子、2a……固定接点部、6……
ベース板、9……端子部、11……キヤビテイ、12……上
型、13……下型、15……樹脂、20……押えピン、20a…
…錐状先端部、B……受面。
FIG. 1 is a cross-sectional view showing a mold open state of an injection molding die according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of an essential part showing a mold clamping state of the injection molding die, and FIG. 3 is a slide. Sectional views of the mold switch, FIGS. 4 and 5 are explanatory views showing a manufacturing process of this slide type switch, and FIG. 6 is a main part showing a mold clamping state of a conventional injection molding mold used in this manufacturing process. FIG. 1 ... Case, 2 ... Terminal, 2a ... Fixed contact part, 6 ...
Base plate, 9 ... Terminal, 11 ... Cavity, 12 ... Upper mold, 13 ... Lower mold, 15 ... Resin, 20 ... Presser pin, 20a ...
… Conical tip, B… Receiving surface.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】所定形状にプレス加工された端子を挾持す
る上型と下型とを備え、これら上型と下型との間に画成
されるキャビティの受面に前記端子の自由端部を当接さ
せた状態で該キャビティ内に溶融樹脂を充填し、しかる
後、該溶融樹脂を冷却・固化することにより樹脂成形体
を前記端子と一体に成形する配線基板成形用の射出成形
金型において、前記キャビティの受面と対向する側に、
先端を尖らせた錐状の押えピンを固定し、該押えピンの
錐状先端部を前記端子の自由端部に食い込ませた状態で
型締めするように構成したことを特徴とする射出成形金
型。
1. A free end portion of a terminal is provided on a receiving surface of a cavity defined between the upper die and the lower die, the upper die and the lower die holding a terminal pressed into a predetermined shape. Injection mold for wiring board molding, in which molten resin is filled in the cavity in a state of being in contact with the resin and then the molten resin is cooled and solidified to integrally mold the resin molded body with the terminals. In, on the side facing the receiving surface of the cavity,
An injection molding die characterized in that a conical pressing pin having a pointed tip is fixed, and the conical tip part of the pressing pin is clamped in a state of biting into the free end part of the terminal. Type.
JP62330232A 1987-12-28 1987-12-28 Injection mold Expired - Fee Related JPH0763990B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62330232A JPH0763990B2 (en) 1987-12-28 1987-12-28 Injection mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62330232A JPH0763990B2 (en) 1987-12-28 1987-12-28 Injection mold

Publications (2)

Publication Number Publication Date
JPH01171921A JPH01171921A (en) 1989-07-06
JPH0763990B2 true JPH0763990B2 (en) 1995-07-12

Family

ID=18230334

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62330232A Expired - Fee Related JPH0763990B2 (en) 1987-12-28 1987-12-28 Injection mold

Country Status (1)

Country Link
JP (1) JPH0763990B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6042635B2 (en) * 2012-05-21 2016-12-14 矢崎総業株式会社 Electrical wire terminal treatment method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60198076A (en) * 1984-03-21 1985-10-07 松下電器産業株式会社 Insert injection mold

Also Published As

Publication number Publication date
JPH01171921A (en) 1989-07-06

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