JPH0297010U - - Google Patents

Info

Publication number
JPH0297010U
JPH0297010U JP473689U JP473689U JPH0297010U JP H0297010 U JPH0297010 U JP H0297010U JP 473689 U JP473689 U JP 473689U JP 473689 U JP473689 U JP 473689U JP H0297010 U JPH0297010 U JP H0297010U
Authority
JP
Japan
Prior art keywords
mold
semiconductor element
centering
molding machine
wire type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP473689U
Other languages
Japanese (ja)
Other versions
JPH0620578Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989004736U priority Critical patent/JPH0620578Y2/en
Publication of JPH0297010U publication Critical patent/JPH0297010U/ja
Application granted granted Critical
Publication of JPH0620578Y2 publication Critical patent/JPH0620578Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例に係る半導体射出成
型機の説明図、第２図〜第５図は夫々同成型機を
用いて同軸ワイヤタイプの半導体素子をセンタリ
ングする工程を示す説明図、第６図Ａはローデイ
ングフエレームの平面図、同図Ｂは同図Ａの正面
図、第７図は射出成型機内の金型のチエイスブロ
ツクにローデイングフレームをセツトした状態の
説明図である。 １１，１２……チエイスブロツク、１３，１４
……センタリングプレート、１３ａ，１４ａ……
テーパ面、１５……キヤリア搬送レール、１６…
…半導体素子、１７……キヤリア。 FIG. 1 is an explanatory diagram of a semiconductor injection molding machine according to an embodiment of the present invention, and FIGS. 2 to 5 are explanatory diagrams showing the process of centering a coaxial wire type semiconductor element using the same molding machine, respectively. FIG. 6A is a plan view of the loading frame, FIG. 6B is a front view of FIG. be. 11, 12... Chase block, 13, 14
...Centering plate, 13a, 14a...
Tapered surface, 15...Carrier conveyance rail, 16...
...Semiconductor device, 17...Carrier.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金型を用いて同軸ワイヤタイプの半導体素子を
樹脂成形する半導体射出成型機において、前記金
型に半導体素子のセンタリングを行う機構を設け
たことを特徴とする半導体射出成型機。 A semiconductor injection molding machine for resin molding a coaxial wire type semiconductor element using a mold, characterized in that the mold is provided with a mechanism for centering the semiconductor element.
JP1989004736U 1989-01-19 1989-01-19 Semiconductor injection molding machine Expired - Lifetime JPH0620578Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989004736U JPH0620578Y2 (en) 1989-01-19 1989-01-19 Semiconductor injection molding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989004736U JPH0620578Y2 (en) 1989-01-19 1989-01-19 Semiconductor injection molding machine

Publications (2)

Publication Number Publication Date
JPH0297010U true JPH0297010U (en) 1990-08-02
JPH0620578Y2 JPH0620578Y2 (en) 1994-06-01

Family

ID=31207512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989004736U Expired - Lifetime JPH0620578Y2 (en) 1989-01-19 1989-01-19 Semiconductor injection molding machine

Country Status (1)

Country Link
JP (1) JPH0620578Y2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5420086A (en) * 1977-07-15 1979-02-15 Lim Holding Sa Apparatus for casting or injection molding automobile tire
JPS57163528A (en) * 1981-04-01 1982-10-07 Daifuku Co Ltd Apparatus for holding position of reinforcing material seald in resin molded body
JPS59118517U (en) * 1983-01-27 1984-08-10 安田　斗石 Synthetic resin lens and lens frame integrated mold

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5420086A (en) * 1977-07-15 1979-02-15 Lim Holding Sa Apparatus for casting or injection molding automobile tire
JPS57163528A (en) * 1981-04-01 1982-10-07 Daifuku Co Ltd Apparatus for holding position of reinforcing material seald in resin molded body
JPS59118517U (en) * 1983-01-27 1984-08-10 安田　斗石 Synthetic resin lens and lens frame integrated mold

Also Published As

Publication number Publication date
JPH0620578Y2 (en) 1994-06-01

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term