JPS58122443U - Resin-encapsulated semiconductor device - Google Patents
Resin-encapsulated semiconductor deviceInfo
- Publication number
- JPS58122443U JPS58122443U JP1920482U JP1920482U JPS58122443U JP S58122443 U JPS58122443 U JP S58122443U JP 1920482 U JP1920482 U JP 1920482U JP 1920482 U JP1920482 U JP 1920482U JP S58122443 U JPS58122443 U JP S58122443U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin
- encapsulated semiconductor
- back surface
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は従来の樹脂封止型半導体装置の一部
断面平面図及び裏面図、第３図は第１図のＡ−Ａ線に沿
う断面図、第４図及び第５図は第１図の半導体装置の製
造工程を説明するためのリードフレーム平面図及び樹脂
モールド成形装置の部分断面図、第６図及び第７図は本
考案の一実施例を示す裏面図及びＢ−Ｂ線に沿う拡大断
面図、第８図は第６図の半導体装置を製造する樹脂舌−
１ルド成形装置の部分断面図である。
１２・・・・・・放熱板、１６・・・・・・外装樹脂材
、１７・・・・・・凸部。 ゛1 and 2 are a partially sectional plan view and a rear view of a conventional resin-sealed semiconductor device, FIG. 3 is a sectional view taken along line A-A in FIG. 1, and FIGS. 4 and 5. 1 is a plan view of a lead frame and a partial cross-sectional view of a resin molding apparatus for explaining the manufacturing process of the semiconductor device shown in FIG. 1, and FIGS. 6 and 7 are a back view and B- An enlarged sectional view taken along line B, FIG. 8 shows a resin tongue for manufacturing the semiconductor device of FIG. 6.
FIG. 2 is a partial cross-sectional view of the first molding device. 12... Heat sink, 16... Exterior resin material, 17... Convex portion.゛
Claims (1)
ド成形した半導体装置において、放熱板裏面の外装樹脂
材に沿う周縁に凸部を形成したことを特徴とする樹脂封
止型半導体装置。A resin-sealed semiconductor device in which an exterior resin material is molded with the back surface flush with the back surface of a heat sink, characterized in that a convex portion is formed on the periphery along the exterior resin material on the back surface of the heat sink. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1920482U JPS58122443U (en) | 1982-02-12 | 1982-02-12 | Resin-encapsulated semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1920482U JPS58122443U (en) | 1982-02-12 | 1982-02-12 | Resin-encapsulated semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58122443U true JPS58122443U (en) | 1983-08-20 |
Family
ID=30031430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1920482U Pending JPS58122443U (en) | 1982-02-12 | 1982-02-12 | Resin-encapsulated semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58122443U (en) |
-
1982
- 1982-02-12 JP JP1920482U patent/JPS58122443U/en active Pending
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