JPS60125740U - Resin molded semiconductor device - Google Patents
Resin molded semiconductor deviceInfo
- Publication number
- JPS60125740U JPS60125740U JP1288884U JP1288884U JPS60125740U JP S60125740 U JPS60125740 U JP S60125740U JP 1288884 U JP1288884 U JP 1288884U JP 1288884 U JP1288884 U JP 1288884U JP S60125740 U JPS60125740 U JP S60125740U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- molded semiconductor
- resin molded
- view
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はＤＩＰ型ＩＣの斜視図、第２図は本考案に係る
ＤＩＰ型ＩＣの斜視図、第３図はＤＩＰ型ＩＣのリード
フレームの部分平面図、第４図は樹脂モールド装置の金
型の一部省略平面図で、第５図はそのＡ−Ａ線拡大断面
図、第６図は第５図一部の樹脂モールド成形動作時の拡
大断面図、第７図は第４図Ｂ−Ｂ線拡大断面図、第８図
は本考案を実施するための樹脂モールド装置の金型の部
分平面図で、第９図はその断面図、第１０図、第１１図
、第１２図は本考案を実施するための他の工程を示す説
明図、第１３図は本考案に係るＤＩＰ型ＩＣの自動実装
時の斜視図である。
２・・・リード補強部材、５・・・す・−ド、１，１８
・・・半導体装置。FIG. 1 is a perspective view of a DIP type IC, FIG. 2 is a perspective view of a DIP type IC according to the present invention, FIG. A partially omitted plan view of the mold, FIG. 5 is an enlarged cross-sectional view taken along the line A-A, FIG. 6 is an enlarged cross-sectional view of a portion of the resin mold forming operation shown in FIG. 5, and FIG. 7 is FIG. 4 B. -B line enlarged sectional view, FIG. 8 is a partial plan view of a mold of a resin molding device for implementing the present invention, FIG. 9 is a sectional view thereof, and FIGS. 10, 11, and 12 are FIG. 13, an explanatory diagram showing another process for carrying out the present invention, is a perspective view during automatic mounting of the DIP type IC according to the present invention. 2... Lead reinforcing member, 5... Su-do, 1, 18
...Semiconductor device.
Claims (1)
リード間に、実装時に離脱可能なリード補強部材を架設
したことを特徴とする樹脂モールド型半導体装置。1. A resin-molded semiconductor device, characterized in that a lead reinforcing member that can be removed during mounting is installed between adjacent leads of a lead portion of the resin-molded semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1288884U JPS60125740U (en) | 1984-01-31 | 1984-01-31 | Resin molded semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1288884U JPS60125740U (en) | 1984-01-31 | 1984-01-31 | Resin molded semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60125740U true JPS60125740U (en) | 1985-08-24 |
Family
ID=30496378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1288884U Pending JPS60125740U (en) | 1984-01-31 | 1984-01-31 | Resin molded semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60125740U (en) |
-
1984
- 1984-01-31 JP JP1288884U patent/JPS60125740U/en active Pending
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