JPS5958939U - Resin molding equipment for electronic parts - Google Patents
Resin molding equipment for electronic partsInfo
- Publication number
- JPS5958939U JPS5958939U JP15528282U JP15528282U JPS5958939U JP S5958939 U JPS5958939 U JP S5958939U JP 15528282 U JP15528282 U JP 15528282U JP 15528282 U JP15528282 U JP 15528282U JP S5958939 U JPS5958939 U JP S5958939U
- Authority
- JP
- Japan
- Prior art keywords
- resin molding
- electronic parts
- molding equipment
- mold
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例の要部断面図、第２図は樹脂モ −
−ルド方法を説明するための側断面図、第３図は半導体
装置の側断面図、第４図は本案の一実施例を示す要部側
断面図、第５図は樹脂モールド方法を説明するための側
断面図である。
図中、１は上部金型、２は下部金型、３はキャビティ部
、４はランナ一部、５はゲート部、５ａは拡開部分であ
る。Figure 1 is a sectional view of the main part of the conventional example, and Figure 2 is a resin model.
3 is a side sectional view of a semiconductor device, FIG. 4 is a side sectional view of a main part showing an embodiment of the present invention, and FIG. 5 is a side sectional view for explaining the resin molding method. FIG. In the figure, 1 is an upper mold, 2 is a lower mold, 3 is a cavity part, 4 is a part of a runner, 5 is a gate part, and 5a is an expanded part.
Claims (1)
よって構成されるキャビティ部にランナ一部を、ゲート
部を介して接続したものにおいて、上記ゲート部のキャ
ビティ部に隣接する部分の開口面積をキャビティ部に向
けて順次拡大させたことを特徴とする電子部品の樹脂モ
ールド装置。A mold comprising an upper mold and a lower mold, in which a part of the runner is connected to a cavity formed by the upper mold and the lower mold via a gate part, in which a part of the runner is adjacent to the cavity part of the gate part. A resin molding device for electronic components, characterized in that the opening area of the portion is gradually enlarged toward the cavity portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15528282U JPS5958939U (en) | 1982-10-13 | 1982-10-13 | Resin molding equipment for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15528282U JPS5958939U (en) | 1982-10-13 | 1982-10-13 | Resin molding equipment for electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5958939U true JPS5958939U (en) | 1984-04-17 |
Family
ID=30343000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15528282U Pending JPS5958939U (en) | 1982-10-13 | 1982-10-13 | Resin molding equipment for electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5958939U (en) |
-
1982
- 1982-10-13 JP JP15528282U patent/JPS5958939U/en active Pending
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