JPS5853157U - lead frame - Google Patents

lead frame

Info

Publication number
JPS5853157U
JPS5853157U JP14824681U JP14824681U JPS5853157U JP S5853157 U JPS5853157 U JP S5853157U JP 14824681 U JP14824681 U JP 14824681U JP 14824681 U JP14824681 U JP 14824681U JP S5853157 U JPS5853157 U JP S5853157U
Authority
JP
Japan
Prior art keywords
lead frame
resin
mold
gate
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14824681U
Other languages
Japanese (ja)
Inventor
修 山内
垣谷　清
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP14824681U priority Critical patent/JPS5853157U/en
Publication of JPS5853157U publication Critical patent/JPS5853157U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は一般的な樹脂封止工程を示す断面図、第２図は
本考案の一実施例のリードフレームの平　　　　′面図
である。 図中、１はリードフレーム、２はＩＣチップ、４．５は
モールド金型、６はゲート、８ｉキヤビテイ、１５は阻
止部である。FIG. 1 is a sectional view showing a general resin sealing process, and FIG. 2 is a plan view of a lead frame according to an embodiment of the present invention. In the figure, 1 is a lead frame, 2 is an IC chip, 4.5 is a mold, 6 is a gate, 8i cavity, and 15 is a blocking part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ＩＣチップをアウントしモールド金型により樹脂封止し
てなるＩＣ装置のリードフレームにおいて、該モールド
金型のキャビティ内に樹脂を供給するゲートの位置に対
応する部分に、該樹脂の流れを一部さえぎる阻止部を設
けたことを特徴とするリードフレーム。In the lead frame of an IC device in which an IC chip is removed and sealed with resin in a mold, a portion of the resin flow is placed in a portion corresponding to the position of the gate that supplies the resin into the cavity of the mold. A lead frame characterized by being provided with a blocking portion.
JP14824681U 1981-10-06 1981-10-06 lead frame Pending JPS5853157U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14824681U JPS5853157U (en) 1981-10-06 1981-10-06 lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14824681U JPS5853157U (en) 1981-10-06 1981-10-06 lead frame

Publications (1)

Publication Number Publication Date
JPS5853157U true JPS5853157U (en) 1983-04-11

Family

ID=29941069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14824681U Pending JPS5853157U (en) 1981-10-06 1981-10-06 lead frame

Country Status (1)

Country Link
JP (1) JPS5853157U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54116100A (en) * 1978-03-01 1979-09-10 Sato Ryuichi Production of organic germanium polymer
JPS54160742A (en) * 1978-06-03 1979-12-19 Asai Germanium Res Inst Antiicancer agent

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54116100A (en) * 1978-03-01 1979-09-10 Sato Ryuichi Production of organic germanium polymer
JPS54160742A (en) * 1978-06-03 1979-12-19 Asai Germanium Res Inst Antiicancer agent

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