JPS5849441U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5849441U JPS5849441U JP14358981U JP14358981U JPS5849441U JP S5849441 U JPS5849441 U JP S5849441U JP 14358981 U JP14358981 U JP 14358981U JP 14358981 U JP14358981 U JP 14358981U JP S5849441 U JPS5849441 U JP S5849441U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- abstract
- heat sink
- recorded
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は、従来の半導体装置の平面図である。
第2図は、本考案の一実施例を示す図で、同図aは平面
図、同図すは側面図である。
1・・・・・・放熱板、2・・・・・・樹脂封止部、3
・・・・・・リード線、4・・・・・・捺印インクによ
る文字、5・・・・・・ミゾによる文字。FIG. 1 is a plan view of a conventional semiconductor device. Fig. 2 shows an embodiment of the present invention, in which Fig. 2a is a plan view and Fig. 2 is a side view. 1... Heat sink, 2... Resin sealing part, 3
...Lead wire, 4...Character by stamp ink, 5...Character by groove.
Claims (1)
品名等の表示をしたことを特徴とする半導体装置。A semiconductor device with a heat sink, characterized in that a groove is provided in the front heat sink to display a product name, etc.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14358981U JPS5849441U (en) | 1981-09-28 | 1981-09-28 | semiconductor equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14358981U JPS5849441U (en) | 1981-09-28 | 1981-09-28 | semiconductor equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5849441U true JPS5849441U (en) | 1983-04-04 |
Family
ID=29936568
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14358981U Pending JPS5849441U (en) | 1981-09-28 | 1981-09-28 | semiconductor equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5849441U (en) |
-
1981
- 1981-09-28 JP JP14358981U patent/JPS5849441U/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS585349U (en) | semiconductor equipment | |
JPS5849441U (en) | semiconductor equipment | |
JPS6071146U (en) | semiconductor equipment | |
JPS59107157U (en) | GaAs semiconductor device | |
JPS6052635U (en) | lead frame | |
JPS5996837U (en) | semiconductor equipment | |
JPS6113940U (en) | semiconductor equipment | |
JPS5812953U (en) | semiconductor equipment | |
JPS5832655U (en) | semiconductor equipment | |
JPS5844842U (en) | semiconductor equipment | |
JPS58667U (en) | brush | |
JPS60163752U (en) | semiconductor equipment | |
JPS5999444U (en) | Resin-encapsulated semiconductor device | |
JPS6094834U (en) | semiconductor equipment | |
JPS58148956U (en) | semiconductor equipment | |
JPS5834742U (en) | Heat dissipation structure for resin-encapsulated semiconductor devices | |
JPS60179044U (en) | integrated circuit device | |
JPS6029255U (en) | pressure sensor | |
JPS5834740U (en) | semiconductor equipment | |
JPS58117624U (en) | Cap-shaped head cooling | |
JPS6041050U (en) | Resin-encapsulated semiconductor device | |
JPS602835U (en) | Semiconductor device case | |
JPS60101756U (en) | Lead frame for semiconductor devices | |
JPS5923750U (en) | semiconductor equipment | |
JPS59107152U (en) | Lead frame for semiconductor devices |