JPS5849441U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS5849441U
JPS5849441U JP14358981U JP14358981U JPS5849441U JP S5849441 U JPS5849441 U JP S5849441U JP 14358981 U JP14358981 U JP 14358981U JP 14358981 U JP14358981 U JP 14358981U JP S5849441 U JPS5849441 U JP S5849441U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
abstract
heat sink
recorded
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14358981U
Other languages
Japanese (ja)
Inventor
曽原 光一
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP14358981U priority Critical patent/JPS5849441U/en
Publication of JPS5849441U publication Critical patent/JPS5849441U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、従来の半導体装置の平面図である。 第2図は、本考案の一実施例を示す図で、同図aは平面
図、同図すは側面図である。 1・・・・・・放熱板、2・・・・・・樹脂封止部、3
・・・・・・リード線、4・・・・・・捺印インクによ
る文字、5・・・・・・ミゾによる文字。
FIG. 1 is a plan view of a conventional semiconductor device. Fig. 2 shows an embodiment of the present invention, in which Fig. 2a is a plan view and Fig. 2 is a side view. 1... Heat sink, 2... Resin sealing part, 3
...Lead wire, 4...Character by stamp ink, 5...Character by groove.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 放熱板付半導体装置において、前放熱板にミゾをつけて
品名等の表示をしたことを特徴とする半導体装置。
A semiconductor device with a heat sink, characterized in that a groove is provided in the front heat sink to display a product name, etc.
JP14358981U 1981-09-28 1981-09-28 semiconductor equipment Pending JPS5849441U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14358981U JPS5849441U (en) 1981-09-28 1981-09-28 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14358981U JPS5849441U (en) 1981-09-28 1981-09-28 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS5849441U true JPS5849441U (en) 1983-04-04

Family

ID=29936568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14358981U Pending JPS5849441U (en) 1981-09-28 1981-09-28 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5849441U (en)

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