JPS6069610U - mold die - Google Patents
mold dieInfo
- Publication number
- JPS6069610U JPS6069610U JP16277583U JP16277583U JPS6069610U JP S6069610 U JPS6069610 U JP S6069610U JP 16277583 U JP16277583 U JP 16277583U JP 16277583 U JP16277583 U JP 16277583U JP S6069610 U JPS6069610 U JP S6069610U
- Authority
- JP
- Japan
- Prior art keywords
- mold die
- mold
- view
- recorded
- electronic filing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のモールド金型キャビティ部分の斜視図で
あり、第２図は第１図のキャビティ部１を拡大した断面
図と平面図である。第３図は本考案の一実施例を示すキ
ャビティ部分の斜視図である。又第４図は本考案実施例
の半導体装置封止後後の外観図である。
１．１′・・・・・・下型キャビティ部、２，２′・・
・・・・センターブロック、３． ３’・・・・・・ゲ
ート、４，４′・・・・・・ランナー、５．５’・・川
・エジェクタービン、６・・・・・・上型キャビティ部
。
／−ｒFIG. 1 is a perspective view of a conventional mold cavity portion, and FIG. 2 is an enlarged sectional view and plan view of the cavity portion 1 of FIG. 1. FIG. 3 is a perspective view of a cavity portion showing an embodiment of the present invention. FIG. 4 is an external view of the semiconductor device according to the embodiment of the present invention after being sealed. 1.1'...Lower mold cavity part, 2,2'...
...center block, 3. 3'...gate, 4,4'...runner, 5.5'...river/ejector turbine, 6...upper mold cavity section. /-r
Claims (1)
面に文字、記号等を形成したことを特徴とするモールド
金型。A transfer mold mold, characterized in that characters, symbols, etc. are formed on the main surface of the cavity part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16277583U JPS6069610U (en) | 1983-10-21 | 1983-10-21 | mold die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16277583U JPS6069610U (en) | 1983-10-21 | 1983-10-21 | mold die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6069610U true JPS6069610U (en) | 1985-05-17 |
Family
ID=30357350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16277583U Pending JPS6069610U (en) | 1983-10-21 | 1983-10-21 | mold die |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6069610U (en) |
-
1983
- 1983-10-21 JP JP16277583U patent/JPS6069610U/en active Pending
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