JPS58168131U - semiconductor manufacturing equipment - Google Patents

semiconductor manufacturing equipment

Info

Publication number
JPS58168131U
JPS58168131U JP6440782U JP6440782U JPS58168131U JP S58168131 U JPS58168131 U JP S58168131U JP 6440782 U JP6440782 U JP 6440782U JP 6440782 U JP6440782 U JP 6440782U JP S58168131 U JPS58168131 U JP S58168131U
Authority
JP
Japan
Prior art keywords
semiconductor manufacturing
heat sink
manufacturing equipment
mold
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6440782U
Other languages
Japanese (ja)
Inventor
筧　二朗
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP6440782U priority Critical patent/JPS58168131U/en
Publication of JPS58168131U publication Critical patent/JPS58168131U/en
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図は樹脂封止型半導体装置の一例を示す
平面図及び裏面図、第３図は第１図のＡ−Ａ線に沿う断
面図、第４図は従来の樹脂モールド成形用金型の部分断
面図、第５図及び第６図は本考案の一実施例を示す金型
の動作前及び動作時の部分断面図である。 １・・・放熱板、５・・・外装樹脂材、７，８・・・金
型、９・・・キャビティ、１０・・・緩衝材。1 and 2 are a plan view and a back view showing an example of a resin-sealed semiconductor device, FIG. 3 is a sectional view taken along line A-A in FIG. 1, and FIG. 4 is a conventional resin molding method. FIGS. 5 and 6 are partial sectional views of the mold before and during operation, showing an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Heat sink, 5... Exterior resin material, 7, 8... Mold, 9... Cavity, 10... Cushioning material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 上金型と下金型とからなり、上金型、下金型によって構
成されるキャビティに放熱板を、キャビティ内面に放熱
板裏面が密接されるように収納して樹脂モールドするも
のにおいて、上記放熱板裏面周縁部に対向するキャビテ
ィ内面に流動性の緩衝材を塗着したことを特徴とする半
導体製造装置。The above mold is made of an upper mold and a lower mold, and a heat sink is housed in a cavity formed by the upper mold and the lower mold so that the back surface of the heat sink is in close contact with the inner surface of the cavity, and then resin molded. A semiconductor manufacturing device characterized in that a fluid cushioning material is applied to the inner surface of the cavity facing the peripheral edge of the back surface of the heat sink.
JP6440782U 1982-04-30 1982-04-30 semiconductor manufacturing equipment Pending JPS58168131U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6440782U JPS58168131U (en) 1982-04-30 1982-04-30 semiconductor manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6440782U JPS58168131U (en) 1982-04-30 1982-04-30 semiconductor manufacturing equipment

Publications (1)

Publication Number Publication Date
JPS58168131U true JPS58168131U (en) 1983-11-09

Family

ID=30074436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6440782U Pending JPS58168131U (en) 1982-04-30 1982-04-30 semiconductor manufacturing equipment

Country Status (1)

Country Link
JP (1) JPS58168131U (en)

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