JPS599537U - Resin molding equipment for semiconductor devices - Google Patents
Resin molding equipment for semiconductor devicesInfo
- Publication number
- JPS599537U JPS599537U JP10454382U JP10454382U JPS599537U JP S599537 U JPS599537 U JP S599537U JP 10454382 U JP10454382 U JP 10454382U JP 10454382 U JP10454382 U JP 10454382U JP S599537 U JPS599537 U JP S599537U
- Authority
- JP
- Japan
- Prior art keywords
- resin molding
- semiconductor devices
- molding equipment
- lead
- upper mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本案の一実施例を示す側断面図、第２図は第１
図のＡ−Ａ断面図、第３図は本案の他の実施例を示す側
断面図、第４図〜第７図は樹脂モールド方法の説明図で
あって、第４図は半導体装置構成体の平面図、第５図は
構成体の上部金型、下部金型へのセット状態を示す側断
面図、第６図は第５図のＢ−Ｂ断面図、第７図は完成状
態を示す破断平面図である。
図中、１は上部金型、２，４はキャビティ部、３は下部
金型、５は突出部、６は凹部、８１〜８゜はリード、１
３は樹脂材である。Figure 1 is a side sectional view showing one embodiment of the present invention, and Figure 2 is a side sectional view showing one embodiment of the present invention.
3 is a side sectional view showing another embodiment of the present invention, FIGS. 4 to 7 are explanatory diagrams of a resin molding method, and FIG. 4 is a semiconductor device structure. 5 is a side sectional view showing the structure set in the upper and lower molds, FIG. 6 is a sectional view taken along line B-B in FIG. 5, and FIG. 7 is the completed state. FIG. In the figure, 1 is an upper mold, 2 and 4 are cavity parts, 3 is a lower mold, 5 is a protrusion, 6 is a recess, 81~8° is a lead, 1
3 is a resin material.
Claims (1)
よるリードの挟持部分に、リードの一方の面に密着する
凹部を形成したことを特徴とする半導体装置の樹脂モー
ルド装置。1. A resin molding apparatus for a semiconductor device, comprising an upper mold and a lower mold, and a recessed portion that closely contacts one surface of the lead is formed in a portion where the lead is held between the upper mold and the lower mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10454382U JPS599537U (en) | 1982-07-09 | 1982-07-09 | Resin molding equipment for semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10454382U JPS599537U (en) | 1982-07-09 | 1982-07-09 | Resin molding equipment for semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS599537U true JPS599537U (en) | 1984-01-21 |
Family
ID=30245430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10454382U Pending JPS599537U (en) | 1982-07-09 | 1982-07-09 | Resin molding equipment for semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS599537U (en) |
-
1982
- 1982-07-09 JP JP10454382U patent/JPS599537U/en active Pending
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