JPS58118737U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS58118737U JPS58118737U JP1619082U JP1619082U JPS58118737U JP S58118737 U JPS58118737 U JP S58118737U JP 1619082 U JP1619082 U JP 1619082U JP 1619082 U JP1619082 U JP 1619082U JP S58118737 U JPS58118737 U JP S58118737U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- resin
- resin sealing
- semiconductor device
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の樹脂封止方法を示す工程断面図、第２図
は従来の半導体装置の斜視図、第３図は本考案の一実一
例による樹脂封止方法を示す工程断面図ミ第４図はそれ
によって製造された半導体装置
１、１０・・・樹脂封止用上金型、２．２０・・・樹脂
封止用下金型、３．３０・・・樹脂、４．４０・・・外
部リード、５・・・樹脂封止後の樹脂パリ、５０・・・
樹脂合せ面。1 is a process sectional view showing a conventional resin sealing method, FIG. 2 is a perspective view of a conventional semiconductor device, and FIG. 3 is a process sectional view showing a resin sealing method according to an example of the present invention. Figure 4 shows semiconductor devices 1 and 10 manufactured thereby: upper mold for resin sealing, 2.20: lower mold for resin sealing, 3.30: resin, 4.40. ...External lead, 5...Resin pad after resin sealing, 50...
Resin mating surface.
Claims (1)
せ面のない樹脂側面を有することを特徴とする半導体装
置。A semiconductor device characterized in that between external leads facing each other, there is a resin side surface without a resin mating surface after resin sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1619082U JPS58118737U (en) | 1982-02-08 | 1982-02-08 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1619082U JPS58118737U (en) | 1982-02-08 | 1982-02-08 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58118737U true JPS58118737U (en) | 1983-08-13 |
Family
ID=30028566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1619082U Pending JPS58118737U (en) | 1982-02-08 | 1982-02-08 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58118737U (en) |
-
1982
- 1982-02-08 JP JP1619082U patent/JPS58118737U/en active Pending
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