JPS58120646U - Resin mold equipment - Google Patents
Resin mold equipmentInfo
- Publication number
- JPS58120646U JPS58120646U JP1760382U JP1760382U JPS58120646U JP S58120646 U JPS58120646 U JP S58120646U JP 1760382 U JP1760382 U JP 1760382U JP 1760382 U JP1760382 U JP 1760382U JP S58120646 U JPS58120646 U JP S58120646U
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- resin
- resin mold
- mold equipment
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図乃至第３図は樹脂封止型半導体装置の一例を示す
一部断面平面図、第゛１図におけるＡ−Ａ線断面図、及
びＢ−Ｂ線断面図、第４図及び第５図は第１図半導体装
置の製造各工程におけるＩＪ−ドフレーム部分平面図及
び樹脂モールド成形金型の部分断面図、第６図乃至第９
図は本考案の一実施例を示す各工程における金型の部分
断面図である。
１・・・・・・放熱板、１１・・・・・・上金型、１２
・・・・・・下金型、１３・・・・・・キャビティ、１
５・・・・・・ピン、１６・・・ −・・・樹
脂注出穴、２１・・・・・・溶融樹脂材。
、−第７図
ＩＢ ｌ’ｌ ＩＢ
第９図−
、Ｚ／ ＃ １７ １５1 to 3 are a partially sectional plan view showing an example of a resin-sealed semiconductor device, a sectional view taken along the line A-A in FIG. 1, a sectional view taken along the line B-B, and FIGS. The figures are Fig. 1, a partial plan view of the IJ-de frame and a partial sectional view of the resin mold molding die in each manufacturing process of a semiconductor device, and Figs. 6 to 9.
The figures are partial sectional views of a mold at each step showing an embodiment of the present invention. 1... Heat sink, 11... Upper mold, 12
...Lower mold, 13...Cavity, 1
5...pin, 16...--resin pouring hole, 21...molten resin material. , - Figure 7 IB l'l IB Figure 9 - , Z/ # 17 15
Claims (1)
てキャビティに溶融樹脂材を注入して樹脂モールド成形
する装置であって、前記キャビティの放熱板が押圧され
る側に中心に樹脂注出穴を有するパイプ状のピンを突出
退入自在に装着したことを特徴とする樹脂モールド装置
。An apparatus for resin molding by pressing the back side of a heat sink of a semiconductor device into a cavity of a mold and injecting molten resin into the cavity, the resin being poured centered on the side of the cavity where the heat sink is pressed. A resin molding device characterized in that a pipe-shaped pin having a hole is attached so as to be able to protrude and retract.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1760382U JPS58120646U (en) | 1982-02-10 | 1982-02-10 | Resin mold equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1760382U JPS58120646U (en) | 1982-02-10 | 1982-02-10 | Resin mold equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58120646U true JPS58120646U (en) | 1983-08-17 |
Family
ID=30029903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1760382U Pending JPS58120646U (en) | 1982-02-10 | 1982-02-10 | Resin mold equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58120646U (en) |
-
1982
- 1982-02-10 JP JP1760382U patent/JPS58120646U/en active Pending
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