JPS58123027U - Resin mold equipment - Google Patents
Resin mold equipmentInfo
- Publication number
- JPS58123027U JPS58123027U JP2107582U JP2107582U JPS58123027U JP S58123027 U JPS58123027 U JP S58123027U JP 2107582 U JP2107582 U JP 2107582U JP 2107582 U JP2107582 U JP 2107582U JP S58123027 U JPS58123027 U JP S58123027U
- Authority
- JP
- Japan
- Prior art keywords
- runner
- gate
- resin mold
- pot
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は樹脂封止型半導体装置の一例を示す
平面図、及びＡ−Ａ線断面図、第３図は従、来の樹脂モ
ールド装置における金型の一部省略平面図、第４図は第
３図のＢ−Ｂ線拡大断面図、第５図は第３図の部分拡大
断面図、第６図は第３図の樹脂モールド成形動作時での
Ｂ−Ｂ線拡大断面図、第７図は溶融樹脂材の粘度特性図
、第８図及び第９図は本考案の一実施例を示す金型の一
部省略平面図及び部分拡大断面図、第１０図は本考案の
他の実施例を示す金型の部分断面図である。
１５・・・下金型、１６・・・上金型、１７・・・ポッ
ト、１８・・・ランナ、１９．１９’・・・ゲート、２
０・・・キャビティ、ｎ、ｎ′・・・ゲート先端開口部
。1 and 2 are a plan view and a sectional view taken along the line A-A showing an example of a resin-sealed semiconductor device, and FIG. 3 is a partially omitted plan view of a mold in a conventional resin molding device. Figure 4 is an enlarged cross-sectional view taken along the line B-B in Figure 3, Figure 5 is a partially enlarged cross-sectional view of Figure 3, and Figure 6 is an enlarged cross-sectional view taken along the line B-B during the resin molding operation in Figure 3. 7 is a viscosity characteristic diagram of a molten resin material, FIGS. 8 and 9 are a partially omitted plan view and a partially enlarged sectional view of a mold showing an embodiment of the present invention, and FIG. 10 is a diagram of the present invention. It is a partial cross-sectional view of the metal mold|die which shows another Example. 15...Lower mold, 16...Upper mold, 17...Pot, 18...Runner, 19.19'...Gate, 2
0... Cavity, n, n'... Gate tip opening.
Claims (1)
から延びるランナと、ランナから枝状に延−びる複数の
ゲートと、各々のゲートの先端開口部に連通ずるキャビ
ティとを形成し、ポットからランナ、ゲート、キャビテ
ィへと溶融樹脂材を圧送するものにおいて、前記ランナ
の略中央部分に連−通ずるキャビティへのゲート開口面
積を他の部分のゲート開口面積より選択的に増大せしめ
たこと゛を特徴とする樹脂モールド装置。It consists of upper and lower molds, and a runner extending from the pot, a plurality of gates extending branch-like from the runner, and a cavity communicating with the opening at the tip of each gate are provided at the abutting portion of both molds. In a device for forming and pumping a molten resin material from a pot to a runner, a gate, and a cavity, the gate opening area to the cavity communicating with the approximately central part of the runner is selectively increased compared to the gate opening area of other parts. Resin molding equipment featuring the following features.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2107582U JPS58123027U (en) | 1982-02-16 | 1982-02-16 | Resin mold equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2107582U JPS58123027U (en) | 1982-02-16 | 1982-02-16 | Resin mold equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58123027U true JPS58123027U (en) | 1983-08-22 |
| JPH0110182Y2 JPH0110182Y2 (en) | 1989-03-23 |
Family
ID=30033209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2107582U Granted JPS58123027U (en) | 1982-02-16 | 1982-02-16 | Resin mold equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58123027U (en) |
-
1982
- 1982-02-16 JP JP2107582U patent/JPS58123027U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0110182Y2 (en) | 1989-03-23 |
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