JPS63159830U - - Google Patents
Info
- Publication number
- JPS63159830U JPS63159830U JP5296387U JP5296387U JPS63159830U JP S63159830 U JPS63159830 U JP S63159830U JP 5296387 U JP5296387 U JP 5296387U JP 5296387 U JP5296387 U JP 5296387U JP S63159830 U JPS63159830 U JP S63159830U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- cavity
- molding machine
- transfer molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 6
- 238000001721 transfer moulding Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案に係るトランスフアー成形機用
金型の一実施例を示す断面図、第２図はゲートを
示す断面図、第３図は樹脂封止例を示す説明図、
第４図はリードフレームの樹脂封止を示す説明図
、第５図は従来の樹脂封止用金型を示す断面図、
第６図はゲート残りを示す説明図、第７図はリー
ドフレームと樹脂封止部を示す説明図である。
１０……リードフレーム、１２……上金型、１
４……下金型、１６……キヤビテイ、１８……ゲ
ート、２０……突起、２２……カル、２４……ラ
ンナー、２６……樹脂封止部。
FIG. 1 is a sectional view showing an embodiment of a mold for a transfer molding machine according to the present invention, FIG. 2 is a sectional view showing a gate, and FIG. 3 is an explanatory view showing an example of resin sealing.
Fig. 4 is an explanatory diagram showing resin sealing of a lead frame, Fig. 5 is a sectional view showing a conventional resin sealing mold,
FIG. 6 is an explanatory diagram showing the rest of the gate, and FIG. 7 is an explanatory diagram showing the lead frame and resin sealing part. 10...Lead frame, 12...Upper mold, 1
4...Lower mold, 16...Cavity, 18...Gate, 20...Protrusion, 22...Cull, 24...Runner, 26...Resin sealing part.
Claims (1)
止する際に使用するトランスフアー成形機用金型
において、樹脂封止部成形用のキヤビテイに通ず
るゲートの、該キヤビテイへの樹脂流入部に、前
記ゲートの底部から急激に立ち上がり、頂部が溶
融樹脂の充填方向に０．５mm以下の長さを有する
突起を設けたことを特徴とするトランスフアー成
形機用金型。 In a mold for a transfer molding machine used when resin-sealing a lead frame on which an IC chip is mounted, a gate that leads to a cavity for molding the resin-sealed part is placed at the resin inlet part of the cavity. A mold for a transfer molding machine, characterized in that the mold is provided with a protrusion that rises abruptly from the bottom and has a top having a length of 0.5 mm or less in the filling direction of molten resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5296387U JPS63159830U (en) | 1987-04-08 | 1987-04-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5296387U JPS63159830U (en) | 1987-04-08 | 1987-04-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63159830U true JPS63159830U (en) | 1988-10-19 |
Family
ID=30878594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5296387U Pending JPS63159830U (en) | 1987-04-08 | 1987-04-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63159830U (en) |
-
1987
- 1987-04-08 JP JP5296387U patent/JPS63159830U/ja active Pending
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