JPH02120842U - - Google Patents

Info

Publication number
JPH02120842U
JPH02120842U JP3070189U JP3070189U JPH02120842U JP H02120842 U JPH02120842 U JP H02120842U JP 3070189 U JP3070189 U JP 3070189U JP 3070189 U JP3070189 U JP 3070189U JP H02120842 U JPH02120842 U JP H02120842U
Authority
JP
Japan
Prior art keywords
resin
corner
cavity
electronic components
filling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3070189U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3070189U priority Critical patent/JPH02120842U/ja
Publication of JPH02120842U publication Critical patent/JPH02120842U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係る樹脂モールド装置の実施
例を示す縦断面図、第２図は概略斜視説明図であ
る。第３図はフラツトパツケージ型半導体装置の
斜視図、第４図は従来の樹脂モールド装置を示す
縦断面図、第５図は従来装置の概略斜視図である
。 ５′……上金型、６′……下金型、７′，８′
……充填キヤビテイ、９′……リードフレーム、
９ａ′……電子部品、１２ａ′，１２ｂ′，１２
ｃ′……コーナ部、２１ａ，２１ｂ，２１ｃ……
ダミーキヤビテイ。 FIG. 1 is a longitudinal sectional view showing an embodiment of a resin molding apparatus according to the present invention, and FIG. 2 is a schematic perspective view. FIG. 3 is a perspective view of a flat package type semiconductor device, FIG. 4 is a vertical sectional view showing a conventional resin molding device, and FIG. 5 is a schematic perspective view of the conventional device. 5'...Upper mold, 6'...Lower mold, 7', 8'
...Filling cavity, 9'...Lead frame,
9a'...Electronic component, 12a', 12b', 12
c'...corner part, 21a, 21b, 21c...
Dummy cavity.

Claims (1)

【実用新案登録請求の範囲】 電子部品を実装したリードフレームの樹脂モー
ルド予定部を、フラツトパツケージ成形用上下金
型の下断面略方形状の充填キヤビテイ内に配置し
、上記充填キヤビテイ内への樹脂の加圧充填によ
り電子部品を樹脂モールドする装置において、 上記充填キヤビテイの少なくとも一つのコーナ
部の外側近傍位置に、該コーナ部に連通するダミ
ーキヤビテイを形成したことを特徴とする樹脂モ
ールド装置。[Scope of Claim for Utility Model Registration] A resin-molded portion of a lead frame on which electronic components are mounted is placed in a filling cavity with a substantially rectangular lower cross section of upper and lower molds for molding a flat package, and A resin molding apparatus for resin molding electronic components by pressurized filling of resin, characterized in that a dummy cavity is formed near the outer side of at least one corner of the filling cavity and communicates with the corner.
JP3070189U 1989-03-16 1989-03-16 Pending JPH02120842U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3070189U JPH02120842U (en) 1989-03-16 1989-03-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3070189U JPH02120842U (en) 1989-03-16 1989-03-16

Publications (1)

Publication Number Publication Date
JPH02120842U true JPH02120842U (en) 1990-09-28

Family

ID=31255997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3070189U Pending JPH02120842U (en) 1989-03-16 1989-03-16

Country Status (1)

Country Link
JP (1) JPH02120842U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004017322A (en) * 2002-06-12 2004-01-22 Apic Yamada Corp Mold equipment and compression molding equipment

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6128221A (en) * 1984-07-18 1986-02-07 Nec Corp Method and apparatus for oversample coding

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6128221A (en) * 1984-07-18 1986-02-07 Nec Corp Method and apparatus for oversample coding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004017322A (en) * 2002-06-12 2004-01-22 Apic Yamada Corp Mold equipment and compression molding equipment

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