JPH03100413U - - Google Patents
Info
- Publication number
- JPH03100413U JPH03100413U JP926890U JP926890U JPH03100413U JP H03100413 U JPH03100413 U JP H03100413U JP 926890 U JP926890 U JP 926890U JP 926890 U JP926890 U JP 926890U JP H03100413 U JPH03100413 U JP H03100413U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead frame
- tie bar
- component body
- molding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の実施例を示す側断面図、第２
図はリードフレームの一例を示す一部平面図、第
３図は従来の樹脂モールド装置の一部を示す側断
面図である。
１……リードフレーム、１ｄ……フレーム、１
ｅ……マウント部、１ｆ……リード、１ｇ……タ
イバ、２……電子部品本体、４，５……金型、４
ａ，５ａ……キヤビテイ、４ｂ……突起。
Fig. 1 is a side sectional view showing an embodiment of the present invention;
The figure is a partial plan view showing an example of a lead frame, and FIG. 3 is a side sectional view showing a part of a conventional resin molding device. 1...Lead frame, 1d...Frame, 1
e...Mount part, 1f...Lead, 1g...Tie bar, 2...Electronic component body, 4, 5...Mold, 4
a, 5a...Cavity, 4b...Protrusion.
Claims (1)
端がマウント部近傍に配置されて電子部品本体と
電気的に接続され中間部がタイバによつて互いに
連結された多数本一組のリードとをフレーム内に
形成したリードフレームを上下一対の金型にて挟
持し、マウント部及びリードの一端部を含む領域
に形成したキヤビテイに樹脂を注入してモールド
する樹脂モールド装置において、 上記リードフレームのタイバ外周と隣接する金
型位置に突起を設けたことを特徴とする樹脂モー
ルド装置。[Claims for Utility Model Registration] A mount part on which an electronic component body is mounted, and a multi-piece unit whose one end is arranged near the mount part and is electrically connected to the electronic component body, and whose middle part is connected to each other by a tie bar. In a resin molding device, a lead frame having a set of leads formed in the frame is held between a pair of upper and lower molds, and a resin is injected into a cavity formed in an area including a mount portion and one end of the leads for molding. A resin molding device characterized in that a projection is provided at a mold position adjacent to the outer periphery of the tie bar of the lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP926890U JPH03100413U (en) | 1990-01-31 | 1990-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP926890U JPH03100413U (en) | 1990-01-31 | 1990-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03100413U true JPH03100413U (en) | 1991-10-21 |
Family
ID=31512873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP926890U Pending JPH03100413U (en) | 1990-01-31 | 1990-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03100413U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020009976A (en) * | 2018-07-12 | 2020-01-16 | エイブリック株式会社 | Resin sealing mold and method for manufacturing semiconductor device |
-
1990
- 1990-01-31 JP JP926890U patent/JPH03100413U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020009976A (en) * | 2018-07-12 | 2020-01-16 | エイブリック株式会社 | Resin sealing mold and method for manufacturing semiconductor device |