JPS63124741U - - Google Patents
Info
- Publication number
- JPS63124741U JPS63124741U JP1676587U JP1676587U JPS63124741U JP S63124741 U JPS63124741 U JP S63124741U JP 1676587 U JP1676587 U JP 1676587U JP 1676587 U JP1676587 U JP 1676587U JP S63124741 U JPS63124741 U JP S63124741U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- cavity
- lead
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 4
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案装置で樹脂モールドされた電子
部品の一例を示す平面図で金型を省略して示して
おり、第２図は第１図の―線に沿つて切断し
た場合の本考案の樹脂モールド装置の要部断面図
、第３図は従来装置で樹脂モールドされた電子部
品の平面図で金型を省略して示しており、第４図
は第３図の―線に沿つて切断した場合の従来
の樹脂モールド装置の要部断面図である。
１…本体、２…リード、３…タイバー、４…上
金型、５…下金型、６…キヤビテイ、７…リード
フレーム、８…樹脂モールド予定部、９…ゲート
、１０…エアベント、１１…樹脂バリ。
Fig. 1 is a plan view showing an example of an electronic component resin-molded using the device of the present invention, with the mold omitted, and Fig. 2 shows the device of the present invention when cut along the - line in Fig. 1. Fig. 3 is a plan view of an electronic component resin-molded using a conventional apparatus, with the mold omitted, and Fig. 4 is a cross-sectional view of the main parts of the resin molding device shown in Fig. 3. FIG. 2 is a cross-sectional view of a main part of a conventional resin molding device when cut. DESCRIPTION OF SYMBOLS 1...Body, 2...Lead, 3...Tie bar, 4...Upper mold, 5...Lower mold, 6...Cavity, 7...Lead frame, 8...Resin mold planned section, 9...Gate, 10...Air vent, 11... Resin burr.
Claims (1)
ムの樹脂モールド予定部を、上記キヤビテイ内へ
の樹脂の加圧充填により樹脂モールドする装置に
おいて、 上記金型に形成されるエアベントを、リード上
面に対応する位置に形成したことを特徴とする樹
脂モールド装置。[Scope of Claim for Utility Model Registration] In an apparatus for resin-molding a portion of a lead frame to be resin-molded placed in a cavity of a mold by pressurizing and filling the resin into the cavity, the mold is formed in the mold. A resin molding device characterized in that an air vent is formed at a position corresponding to the upper surface of the lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1676587U JPS63124741U (en) | 1987-02-06 | 1987-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1676587U JPS63124741U (en) | 1987-02-06 | 1987-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63124741U true JPS63124741U (en) | 1988-08-15 |
Family
ID=30808916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1676587U Pending JPS63124741U (en) | 1987-02-06 | 1987-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63124741U (en) |
-
1987
- 1987-02-06 JP JP1676587U patent/JPS63124741U/ja active Pending
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