JPS62150117U - - Google Patents
Info
- Publication number
- JPS62150117U JPS62150117U JP3846086U JP3846086U JPS62150117U JP S62150117 U JPS62150117 U JP S62150117U JP 3846086 U JP3846086 U JP 3846086U JP 3846086 U JP3846086 U JP 3846086U JP S62150117 U JPS62150117 U JP S62150117U
- Authority
- JP
- Japan
- Prior art keywords
- gate
- mold
- cheeses
- view
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 235000013351 cheese Nutrition 0.000 claims description 4
- 238000001721 transfer moulding Methods 0.000 claims description 2
- 240000002129 Malva sylvestris Species 0.000 claims 2
- 235000006770 Malva sylvestris Nutrition 0.000 claims 2
- 230000013011 mating Effects 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図と第２図はこの考案の１実施例を示すも
ので、第１図イはトランスフアー成形用金型のゲ
ート近傍の平面図、同図ロはイのＢ―Ｂ線矢視図
、第２図は離型時にゲート部分にキズが入つた状
態を示す図である。第３図〜第８図は従来例を示
すもので、第３図は下チエイスの部分平面図、第
４図は金型の部分断面図、第５図イはゲート部分
を拡大した下チエイスの部分平面図、同図ロはイ
のＡ―Ａ線矢視図、第６図は成形品を金型から取
り出した状態の斜視図、第７図はパツケージにゲ
ート残りが生じた状態を示す斜視図、第８図はリ
ードフレームにパツケージが形成された状態を示
す平面図である。
１……上チエイス、２……上キヤビテイ、３…
…下チエイス、１４……下キヤビテイ、１７……
ゲート。
Figures 1 and 2 show one embodiment of this invention, where Figure 1A is a plan view of the vicinity of the gate of the transfer molding die, and Figure 1B is a view taken along the line B--B of Figure 2A. , FIG. 2 is a diagram showing a state in which the gate portion was scratched during mold release. Figures 3 to 8 show conventional examples. Figure 3 is a partial plan view of the lower cheese, Figure 4 is a partial sectional view of the mold, and Figure 5 A is an enlarged view of the lower cheese with the gate part. Figure 6 is a perspective view of the molded product taken out of the mold, Figure 7 is a perspective view showing a state where a gate remains in the package cage. 8 are plan views showing a state in which a package is formed on a lead frame. 1...Upper chase, 2...Upper cavity, 3...
...Lower chase, 14...Lower cavity, 17...
Gate.
Claims (1)
ヤビテイ内に一方のチエイスに設けられたゲート
を介して樹脂を供給して成形品を成形するトラン
スフアー成形用金型において、前記キヤビテイの
近傍におけるゲートをその彫込み方向でアンダー
カツトに形成したことを特徴とするトランスフア
ー成形用金型。 In a transfer mold for molding a molded product by supplying resin into a cavity formed on the mating surfaces of a pair of cheeses through a gate provided on one of the cheeses, a gate near the cavity is used. A mold for transfer molding characterized by forming an undercut in the engraving direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3846086U JPH0413136Y2 (en) | 1986-03-17 | 1986-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3846086U JPH0413136Y2 (en) | 1986-03-17 | 1986-03-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62150117U true JPS62150117U (en) | 1987-09-22 |
| JPH0413136Y2 JPH0413136Y2 (en) | 1992-03-27 |
Family
ID=30850727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3846086U Expired JPH0413136Y2 (en) | 1986-03-17 | 1986-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0413136Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004114696A (en) * | 2003-11-28 | 2004-04-15 | Oki Electric Ind Co Ltd | Mold package and its manufacture method |
-
1986
- 1986-03-17 JP JP3846086U patent/JPH0413136Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004114696A (en) * | 2003-11-28 | 2004-04-15 | Oki Electric Ind Co Ltd | Mold package and its manufacture method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0413136Y2 (en) | 1992-03-27 |
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