JPH01165636U - - Google Patents
Info
- Publication number
- JPH01165636U JPH01165636U JP6188288U JP6188288U JPH01165636U JP H01165636 U JPH01165636 U JP H01165636U JP 6188288 U JP6188288 U JP 6188288U JP 6188288 U JP6188288 U JP 6188288U JP H01165636 U JPH01165636 U JP H01165636U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- groove
- width
- parting surface
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図〜第８図は本考案の実施例を示し、第１
図は平面図、第２図は第１図の−視断面図、
第３図は第１図の−視断面図、第４図は第１
図の−視断面図、第５図は第１図の−視
断面図、第６図は下金型の斜視図、第７図及び第
８図は下金型の他の実施例を示す斜視図、第９図
は従来の例を示す平面図、第１０図は第９図の
−視断面図、第１１図は第９図の−視
断面図、第１２図は従来の下金型の斜視図である
。
１……下金型、１ａ……キヤビテイー、１ｂ…
…パーテイング面、１ｃ，１ｄ，１ｅ……溝、２
……上金型、２ａ……キヤビテイー、２ｂ……パ
ーテイング面、３……リードフレーム、３ａ，３
ｂ，３ｃ……リード部、４……電子部品、４ａ…
…モールド部、５ａ，５ｂ，５ｃ，５ｄ，５ｅ，
５ｆ，５ｇ……拡張部、Ａ……バリ。
1 to 8 show embodiments of the present invention.
The figure is a plan view, Figure 2 is a cross-sectional view of Figure 1,
Figure 3 is a cross-sectional view of Figure 1, and Figure 4 is a cross-sectional view of Figure 1.
5 is a sectional view of FIG. 1, FIG. 6 is a perspective view of the lower mold, and FIGS. 7 and 8 are perspective views showing other embodiments of the lower mold. 9 is a plan view showing a conventional example, FIG. 10 is a sectional view taken from the side of FIG. 9, FIG. 11 is a sectional view taken from the side of FIG. FIG. 1... Lower mold, 1a... Cavity, 1b...
...parting surface, 1c, 1d, 1e...groove, 2
... Upper mold, 2a ... Cavity, 2b ... Parting surface, 3 ... Lead frame, 3a, 3
b, 3c...Lead part, 4...Electronic component, 4a...
...Mold part, 5a, 5b, 5c, 5d, 5e,
5f, 5g...extension part, A...burr.
Claims (1)
ーテイング面に、前記リードフレームにおけるリ
ード部が嵌まる溝を設けて成るモールド成形装置
において、前記パーテイング面には、前記溝の幅
又は幅及び高さを、上下両金型におけるモールド
部成形用キヤビテイーより適宜寸法だけ外側の部
位において拡大するようにした拡張部を設けたこ
とを特徴とする半導体部品のモールド成形装置。 In a mold forming apparatus, a groove is provided in a parting surface of a lower mold and an upper mold that sandwich a lead frame into which the lead part of the lead frame is fitted, and the parting surface has a width or width of the groove and a groove. 1. A molding apparatus for a semiconductor component, characterized in that an expansion part is provided whose height is increased at a portion outside a mold part molding cavity by an appropriate dimension in both upper and lower molds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988061882U JP2526001Y2 (en) | 1988-05-10 | 1988-05-10 | Semiconductor parts molding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988061882U JP2526001Y2 (en) | 1988-05-10 | 1988-05-10 | Semiconductor parts molding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01165636U true JPH01165636U (en) | 1989-11-20 |
| JP2526001Y2 JP2526001Y2 (en) | 1997-02-12 |
Family
ID=31287527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988061882U Expired - Lifetime JP2526001Y2 (en) | 1988-05-10 | 1988-05-10 | Semiconductor parts molding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2526001Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55149952U (en) * | 1979-04-12 | 1980-10-29 |
-
1988
- 1988-05-10 JP JP1988061882U patent/JP2526001Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55149952U (en) * | 1979-04-12 | 1980-10-29 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2526001Y2 (en) | 1997-02-12 |