JPS6183036U - - Google Patents
Info
- Publication number
- JPS6183036U JPS6183036U JP16731584U JP16731584U JPS6183036U JP S6183036 U JPS6183036 U JP S6183036U JP 16731584 U JP16731584 U JP 16731584U JP 16731584 U JP16731584 U JP 16731584U JP S6183036 U JPS6183036 U JP S6183036U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- resin
- resin encapsulation
- plunger
- encapsulation device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims 4
- 238000005538 encapsulation Methods 0.000 claims 3
- 238000000465 moulding Methods 0.000 description 2
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第1図は本考案のプランジヤーを用いて樹脂成
形している様子を示す断面図である。第2図は本
考案のプランジヤーを示す斜視図である。第3図
は本考案の他形状のプランジヤーを示す斜視図、
第4図は従来のプランジヤーを用いて樹脂成形し
ている様子を示す断面図である。
1……下型、2……上型、3……プランジヤー
、4……ポツト、5……樹脂、6……キヤビテイ
ー、7……カル、8……リードフレーム、9……
プランジヤー、9a……段部、9b,9d……突
縁。
FIG. 1 is a sectional view showing resin molding using the plunger of the present invention. FIG. 2 is a perspective view of the plunger of the present invention. FIG. 3 is a perspective view showing a plunger of another shape according to the present invention;
FIG. 4 is a sectional view showing resin molding using a conventional plunger. 1...Lower die, 2...Upper die, 3...Plunger, 4...Pot, 5...Resin, 6...Cavity, 7...Cull, 8...Lead frame, 9...
Plunger, 9a...stepped portion, 9b, 9d...projection.
Claims (1)
脂封止を行う半導体樹脂封止装置において、リー
ドフレームをセツトした金型内に樹脂を加圧注入
するプランジヤーの先端部に小径の突縁を設けて
段部を形成したことを特徴とする半導体樹脂封止
装置。 In semiconductor resin encapsulation equipment that resin-seals semiconductor elements mounted on lead frames, a small-diameter ridge is provided at the tip of a plunger that injects resin under pressure into a mold in which a lead frame is set. A semiconductor resin encapsulation device characterized in that a semiconductor resin encapsulation device is formed with a portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16731584U JPS6183036U (en) | 1984-11-02 | 1984-11-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16731584U JPS6183036U (en) | 1984-11-02 | 1984-11-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6183036U true JPS6183036U (en) | 1986-06-02 |
Family
ID=30725115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16731584U Pending JPS6183036U (en) | 1984-11-02 | 1984-11-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6183036U (en) |
-
1984
- 1984-11-02 JP JP16731584U patent/JPS6183036U/ja active Pending