JPS62166010U - - Google Patents

Info

Publication number
JPS62166010U
JPS62166010U JP5459386U JP5459386U JPS62166010U JP S62166010 U JPS62166010 U JP S62166010U JP 5459386 U JP5459386 U JP 5459386U JP 5459386 U JP5459386 U JP 5459386U JP S62166010 U JPS62166010 U JP S62166010U
Authority
JP
Japan
Prior art keywords
mold
seal rubber
seal
gel
periphery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5459386U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5459386U priority Critical patent/JPS62166010U/ja
Publication of JPS62166010U publication Critical patent/JPS62166010U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の成形型の断面図、
第2図は本考案の一実施例の圧縮前の成形型の要
部断面図、第3図は本考案の一実施例の圧縮時の
成形型の要部断面図、第4図は従来の成形型の断
面図、第5図は従来の成形型の要部断面図、第6
図は従来の圧縮時の成形型の要部断面図を表わす
。 図中、1……上型、2……下型、3……溝、4
……シールゴム、5……突起部、6……SMC。
FIG. 1 is a sectional view of a mold according to an embodiment of the present invention.
Fig. 2 is a sectional view of the main part of the mold before compression according to an embodiment of the present invention, Fig. 3 is a sectional view of the main part of the mold during compression according to the embodiment of the invention, and Fig. 4 is a sectional view of the main part of the mold before compression according to the embodiment of the present invention. A sectional view of the mold, Figure 5 is a sectional view of the main part of a conventional mold, and Figure 6 is a sectional view of the main part of a conventional mold.
The figure shows a sectional view of the main part of a conventional mold during compression. In the figure, 1... Upper die, 2... Lower die, 3... Groove, 4
...Seal rubber, 5...Protrusion, 6...SMC.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一方の型の周辺部に環状に設けた溝の中に形成
したゲル状のシールゴムと、他方の型に該シール
ゴムと対峙して設けた環状の突起部とからなるシ
ール構造を備えたことを特徴とする繊維強化樹脂
成形用型。
It is characterized by having a seal structure consisting of a gel-like seal rubber formed in a groove formed in an annular shape around the periphery of one mold, and an annular projection provided on the other mold facing the seal rubber. A mold for molding fiber-reinforced resin.
JP5459386U 1986-04-11 1986-04-11 Pending JPS62166010U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5459386U JPS62166010U (en) 1986-04-11 1986-04-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5459386U JPS62166010U (en) 1986-04-11 1986-04-11

Publications (1)

Publication Number Publication Date
JPS62166010U true JPS62166010U (en) 1987-10-21

Family

ID=30881730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5459386U Pending JPS62166010U (en) 1986-04-11 1986-04-11

Country Status (1)

Country Link
JP (1) JPS62166010U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001129833A (en) * 1999-11-05 2001-05-15 Miyagi Oki Electric Co Ltd Mold and method for producing semiconductor device
WO2006128280A1 (en) 2005-05-31 2006-12-07 Woodbridge Foam Corporation Mold and method for manufacture thereof
JP2017013260A (en) * 2015-06-29 2017-01-19 東レ株式会社 Resin injection molding die, resin injection molding device, and method for producing fiber-reinforced resin using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001129833A (en) * 1999-11-05 2001-05-15 Miyagi Oki Electric Co Ltd Mold and method for producing semiconductor device
WO2006128280A1 (en) 2005-05-31 2006-12-07 Woodbridge Foam Corporation Mold and method for manufacture thereof
JP2017013260A (en) * 2015-06-29 2017-01-19 東レ株式会社 Resin injection molding die, resin injection molding device, and method for producing fiber-reinforced resin using the same

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