JPH0438410U - - Google Patents
Info
- Publication number
- JPH0438410U JPH0438410U JP8015690U JP8015690U JPH0438410U JP H0438410 U JPH0438410 U JP H0438410U JP 8015690 U JP8015690 U JP 8015690U JP 8015690 U JP8015690 U JP 8015690U JP H0438410 U JPH0438410 U JP H0438410U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- pot
- receiving part
- runner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000001721 transfer moulding Methods 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は従来のトランスフアーモールド金型を示す断
面図である。
１１……上金型、１２……ポツト、１３……プ
ランジヤヘツド、１４……下金型、１５……ラン
ナー、１６……樹脂受部。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a sectional view showing a conventional transfer mold die. 11... Upper mold, 12... Pot, 13... Plunger head, 14... Lower mold, 15... Runner, 16... Resin receiver.
Claims (1)
モールド金型であつて、 上金型は、樹脂を圧入するためのポツトを有し
ており、 下金型は、樹脂受部と、ランナーとを有してお
り、 該樹脂受部は、下金型の型面と同一高さに形成
されており、 該ランナーは、樹脂受部の周囲で上金型のポツ
トに連通するものであることを特徴とするトラン
スフアーモールド金型。[Scope of Claim for Utility Model Registration] A transfer mold having a set of an upper mold and a lower mold, where the upper mold has a pot for press-fitting resin, and the lower mold has a pot for press-fitting the resin. , has a resin receiving part and a runner, the resin receiving part is formed at the same height as the mold surface of the lower mold, and the runner is arranged around the resin receiving part of the upper mold. A transfer molding die characterized in that it communicates with a pot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8015690U JPH0438410U (en) | 1990-07-27 | 1990-07-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8015690U JPH0438410U (en) | 1990-07-27 | 1990-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0438410U true JPH0438410U (en) | 1992-03-31 |
Family
ID=31624961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8015690U Pending JPH0438410U (en) | 1990-07-27 | 1990-07-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0438410U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08142123A (en) * | 1994-11-15 | 1996-06-04 | Nec Corp | Mold |
-
1990
- 1990-07-27 JP JP8015690U patent/JPH0438410U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08142123A (en) * | 1994-11-15 | 1996-06-04 | Nec Corp | Mold |