JPH0167012U - - Google Patents

Info

Publication number
JPH0167012U
JPH0167012U JP16237687U JP16237687U JPH0167012U JP H0167012 U JPH0167012 U JP H0167012U JP 16237687 U JP16237687 U JP 16237687U JP 16237687 U JP16237687 U JP 16237687U JP H0167012 U JPH0167012 U JP H0167012U
Authority
JP
Japan
Prior art keywords
pot
resin
runner
molding device
cull
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16237687U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16237687U priority Critical patent/JPH0167012U/ja
Publication of JPH0167012U publication Critical patent/JPH0167012U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係る樹脂モールド装置の一実
施例を示す要部平面図、第2図は従来の樹脂モー
ルド装置の一部省略部分を含む平面図、第3図は
第2図のA−A線に沿う正断面図、第4図は第2
図及び第3図樹脂モールド装置の動作状態での正
断面図、第5図は第2図及び第3図樹脂モールド
装置の要部平面図である。 12……カル部、13……ランナ、13a……
ランナ始端部。
Fig. 1 is a plan view of essential parts showing an embodiment of a resin molding device according to the present invention, Fig. 2 is a plan view including partially omitted parts of a conventional resin molding device, and Fig. 3 is a plan view of A of Fig. 2. - A front cross-sectional view along the A line, Figure 4 is the 2nd
Figures 2 and 3 are front sectional views of the resin molding apparatus in an operating state, and Figure 5 is a plan view of the main parts of the resin molding apparatus shown in Figures 2 and 3. 12... Cal club, 13... Runner, 13a...
Start of runner.

Claims (1)

【実用新案登録請求の範囲】 ポツト内で加熱された樹脂をプランジヤにて押
圧し、上記ポツトに連通したランナ、ゲートを介
して被樹脂モールド部品のあるキヤビテイへ圧送
する樹脂モールド装置において、 上記ランナの始端部側壁面がポツトの底面をな
すカル部外周の接平面をなすように拡開してカル
部に接続したことを特徴とする樹脂モールド装置
[Scope of Claim for Utility Model Registration] In a resin molding device that presses resin heated in a pot with a plunger and forcefully feeds the resin through a runner and a gate communicating with the pot to a cavity in which a resin-molded part is located, the runner A resin molding device characterized in that a side wall surface of a starting end of the pot is expanded so as to form a tangential plane to the outer periphery of the cull forming the bottom surface of the pot and connected to the cull.
JP16237687U 1987-10-22 1987-10-22 Pending JPH0167012U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16237687U JPH0167012U (en) 1987-10-22 1987-10-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16237687U JPH0167012U (en) 1987-10-22 1987-10-22

Publications (1)

Publication Number Publication Date
JPH0167012U true JPH0167012U (en) 1989-04-28

Family

ID=31446144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16237687U Pending JPH0167012U (en) 1987-10-22 1987-10-22

Country Status (1)

Country Link
JP (1) JPH0167012U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06210674A (en) * 1993-01-14 1994-08-02 Nec Corp Resin sealing mold

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6239215A (en) * 1985-08-14 1987-02-20 Mitsubishi Electric Corp Molding method of resin

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6239215A (en) * 1985-08-14 1987-02-20 Mitsubishi Electric Corp Molding method of resin

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06210674A (en) * 1993-01-14 1994-08-02 Nec Corp Resin sealing mold

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