JPH0170517U - - Google Patents
Info
- Publication number
- JPH0170517U JPH0170517U JP1987166235U JP16623587U JPH0170517U JP H0170517 U JPH0170517 U JP H0170517U JP 1987166235 U JP1987166235 U JP 1987166235U JP 16623587 U JP16623587 U JP 16623587U JP H0170517 U JPH0170517 U JP H0170517U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- runner
- resin
- sectional
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図ａ及びｂは本考案の第１の実施例の一部
断面図及びＡ―Ａ′線断面図、第２図ａ〜ｄは第
１図の実施例の効果を説明するための注入樹脂の
流れ順に示した金型と樹脂の断面図、第３図は本
考案の第２の実施例の断面図、第４図は本考案の
第３の実施例の断面図、第５図は従来のトランス
フアーモールド金型の一例の断面図、第６図は第
５図の問題点を説明するために示したポツト部近
傍の断面図である。
１……上金型、２……下金型、３ａ，３ｂ……
ランナ、４，４ａ，４ｂ……空気溜部、８……キ
ヤビテイ。
Figures 1a and b are partial sectional views and sectional views taken along line A-A' of the first embodiment of the present invention, and Figures 2a to d are injection shots for explaining the effects of the embodiment of Figure 1. 3 is a sectional view of the second embodiment of the present invention, FIG. 4 is a sectional view of the third embodiment of the present invention, and FIG. 5 is a sectional view of the mold and resin shown in the order of resin flow. FIG. 6 is a cross-sectional view of an example of a conventional transfer mold die, and is a cross-sectional view of the vicinity of the pot portion shown to explain the problem in FIG. 5. 1... Upper mold, 2... Lower mold, 3a, 3b...
Runner, 4, 4a, 4b...Air reservoir, 8...Cavity.
Claims (1)
ベントに抜ける複数の樹脂通路が形成されている
上下一対のトランスフアーモールド金型において
、前記ランナに少なくとも１つの空気溜部を設け
たことを特徴とするトランスフアーモールド金型
。 A pair of upper and lower transfer mold molds in which a plurality of resin passages are formed for receiving injected resin in a runner and passing through a cavity to an air vent, wherein the runner is provided with at least one air reservoir. mold mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987166235U JPH0170517U (en) | 1987-10-29 | 1987-10-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987166235U JPH0170517U (en) | 1987-10-29 | 1987-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0170517U true JPH0170517U (en) | 1989-05-11 |
Family
ID=31453442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987166235U Pending JPH0170517U (en) | 1987-10-29 | 1987-10-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0170517U (en) |
-
1987
- 1987-10-29 JP JP1987166235U patent/JPH0170517U/ja active Pending
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