JPS6373950U - - Google Patents
Info
- Publication number
- JPS6373950U JPS6373950U JP16749386U JP16749386U JPS6373950U JP S6373950 U JPS6373950 U JP S6373950U JP 16749386 U JP16749386 U JP 16749386U JP 16749386 U JP16749386 U JP 16749386U JP S6373950 U JPS6373950 U JP S6373950U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- leads
- tie bar
- periphery
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 239000008188 pellet Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案に係るリードフレーム、第２図
及び第３図は改良した上・下金型のＡから見た断
面図、第４図は従来のリードフレーム、第５図は
上・下金型の要部断面図、第６図は第５図の要部
拡大図、第８図は上・下金型の要部拡大図、第９
図は樹脂モールド後のリードフレームを示す平面
図、第７図は半導体装置の平面図である。
５……リード、６ａ，６ｂ……タイバー、２１
……リードフレーム。
Figure 1 is the lead frame according to the present invention, Figures 2 and 3 are cross-sectional views of the improved upper and lower molds as seen from A, Figure 4 is the conventional lead frame, and Figure 5 is the upper and lower molds. 6 is an enlarged view of the main part of Fig. 5, Fig. 8 is an enlarged view of the main part of the upper and lower molds, and Fig. 9 is a sectional view of the main part of the mold.
The figure is a plan view showing the lead frame after resin molding, and FIG. 7 is a plan view of the semiconductor device. 5... Lead, 6a, 6b... Tie bar, 21
……Lead frame.
Claims (1)
部の周辺部近傍に複数のリードの遊端部が延設さ
れた金属製のリードフレームに於いて、 上記複数のリードの基端部のみをタイバーで連
結一体化したことを特徴とするリードフレーム。[Claim for Utility Model Registration] In a metal lead frame in which the free ends of a plurality of leads extend near the periphery of an island portion on which a semiconductor pellet is fixedly mounted, the proximal ends of the plurality of leads A lead frame characterized by only two parts connected and integrated with a tie bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16749386U JPS6373950U (en) | 1986-10-30 | 1986-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16749386U JPS6373950U (en) | 1986-10-30 | 1986-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6373950U true JPS6373950U (en) | 1988-05-17 |
Family
ID=31099473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16749386U Pending JPS6373950U (en) | 1986-10-30 | 1986-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6373950U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016076734A (en) * | 2016-01-28 | 2016-05-12 | トヨタ自動車株式会社 | Semiconductor device |
-
1986
- 1986-10-30 JP JP16749386U patent/JPS6373950U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016076734A (en) * | 2016-01-28 | 2016-05-12 | トヨタ自動車株式会社 | Semiconductor device |