JPS6337211U - - Google Patents
Info
- Publication number
- JPS6337211U JPS6337211U JP12968386U JP12968386U JPS6337211U JP S6337211 U JPS6337211 U JP S6337211U JP 12968386 U JP12968386 U JP 12968386U JP 12968386 U JP12968386 U JP 12968386U JP S6337211 U JPS6337211 U JP S6337211U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- semiconductor device
- sealed
- sealed semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は、本考案に係る樹脂封止型半導体装置
用金型を用いて樹脂封止した場合の縦断面図、第
２図は、そのリードフレームの平面図である。
１……リードフレーム、２１，２２，２３……
帯板、３……連結片、４……素子取付板、６……
素子、７……樹脂、８……金型、８１……上型、
８２……下型、９……切込み、１０……ノツチ。
FIG. 1 is a longitudinal cross-sectional view of a resin-sealed semiconductor device using the mold for a resin-sealed semiconductor device according to the present invention, and FIG. 2 is a plan view of the lead frame thereof. 1... Lead frame, 2 1 , 2 2 , 2 3 ...
Band plate, 3... Connection piece, 4... Element mounting plate, 6...
Element, 7...Resin, 8...Mold, 8 1 ...Upper mold,
8 2 ...lower die, 9...notch, 10...notch.
Claims (1)
ードフレームに、素子を取付け、素子外周を樹脂
封止するようにした上下型よりなる樹脂封止型半
導体装置用金型において、上下型の一方若しくは
両方の前記連結片切断対応位置に、切込みを形成
するノツチを設けたことを特徴とする樹脂封止型
半導体装置用金型。 In a mold for a resin-sealed semiconductor device consisting of an upper and lower mold in which an element is attached to a lead frame in which an element mounting plate is suspended from a strip via a connecting piece, and the outer periphery of the element is sealed with resin, the upper and lower molds are A mold for a resin-sealed semiconductor device, characterized in that a notch for forming a cut is provided at a position corresponding to cutting of one or both of the connecting pieces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12968386U JPS6337211U (en) | 1986-08-25 | 1986-08-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12968386U JPS6337211U (en) | 1986-08-25 | 1986-08-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6337211U true JPS6337211U (en) | 1988-03-10 |
Family
ID=31026473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12968386U Pending JPS6337211U (en) | 1986-08-25 | 1986-08-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6337211U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006126438A1 (en) * | 2005-05-24 | 2006-11-30 | Murata Manufacturing Co., Ltd. | Method and apparatus for producing insert molding |
-
1986
- 1986-08-25 JP JP12968386U patent/JPS6337211U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006126438A1 (en) * | 2005-05-24 | 2006-11-30 | Murata Manufacturing Co., Ltd. | Method and apparatus for producing insert molding |