JPH0272558U - - Google Patents
Info
- Publication number
- JPH0272558U JPH0272558U JP15086788U JP15086788U JPH0272558U JP H0272558 U JPH0272558 U JP H0272558U JP 15086788 U JP15086788 U JP 15086788U JP 15086788 U JP15086788 U JP 15086788U JP H0272558 U JPH0272558 U JP H0272558U
- Authority
- JP
- Japan
- Prior art keywords
- pad portion
- anchor
- view
- anchor piece
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａおよびｂは本考案に係るリードフレー
ムの一実施例を示す平面図およびＡ―Ａ線断面図
、第２図はアンカー片の他の例を示す断面図、第
３図ａ，ｂはアンカー片の製造例を示す説明図、
第４図および第５図は他の実施例を示す平面図お
よびアンカー片の断面図、第６図は従来の樹脂封
止されたパツド部を示す断面図である。
１０…パツド部、１２…アンカー部、１２ａ…
アンカー片、１４…ダイ、１６…ポンチ。
1A and 1B are a plan view and a sectional view taken along the line A-A of the lead frame according to the present invention, FIG. 2 is a sectional view showing another example of the anchor piece, and FIGS. 3A and 3B are is an explanatory diagram showing an example of manufacturing an anchor piece,
4 and 5 are a plan view and a sectional view of an anchor piece showing another embodiment, and FIG. 6 is a sectional view showing a conventional resin-sealed pad portion. 10... Pad part, 12... Anchor part, 12a...
Anchor piece, 14...Die, 16...Punch.
Claims (1)
樹脂封止型半導体装置に用いるリードフレームに
おいて、 前記パツド部に、パツド部の板材を打ちおこし
た、パツド部の裏面側に突出するアンカー片を有
するアンカー部を設けたことを特徴とするリード
フレーム。[Scope of claim for utility model registration] Having a part on which a semiconductor chip is mounted,
A lead frame for use in a resin-sealed semiconductor device, characterized in that the pad portion is provided with an anchor portion having an anchor piece protruding from the back side of the pad portion, which is formed by hammering out a plate material of the pad portion. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15086788U JPH0272558U (en) | 1988-11-18 | 1988-11-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15086788U JPH0272558U (en) | 1988-11-18 | 1988-11-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0272558U true JPH0272558U (en) | 1990-06-01 |
Family
ID=31424395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15086788U Pending JPH0272558U (en) | 1988-11-18 | 1988-11-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0272558U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001085591A (en) * | 1999-08-24 | 2001-03-30 | Fairchild Korea Semiconductor Kk | Lead frame using chip pad as heat dissipation passage and semiconductor package including it |
-
1988
- 1988-11-18 JP JP15086788U patent/JPH0272558U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001085591A (en) * | 1999-08-24 | 2001-03-30 | Fairchild Korea Semiconductor Kk | Lead frame using chip pad as heat dissipation passage and semiconductor package including it |