JPH0316346U - - Google Patents
Info
- Publication number
- JPH0316346U JPH0316346U JP7720889U JP7720889U JPH0316346U JP H0316346 U JPH0316346 U JP H0316346U JP 7720889 U JP7720889 U JP 7720889U JP 7720889 U JP7720889 U JP 7720889U JP H0316346 U JPH0316346 U JP H0316346U
- Authority
- JP
- Japan
- Prior art keywords
- sealed
- resin
- tip
- mounting part
- front side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図ａ及びｂは本考案の一実施例の製造方法
を説明するために示した成形金型に挟まれている
放熱板に載置された半導体チツプの平面模式図及
びＡ−Ａ′線断面模式図、第２図ａ及びｂは従来
の樹脂封止型半導体装置の一例の斜視図及び製造
方法を説明するために示した成形金型に挟まれて
いる放熱板に載置された半導体チツプのＡ−Ａ′
線断面模式図である。
１……放熱板、３……半導体チツプ、５……先
端部、６……放熱板凸部、１４……ゲート口。
Figures 1a and 1b are schematic plan views and line A-A' of a semiconductor chip placed on a heat sink sandwiched between molding dies, shown to explain the manufacturing method of an embodiment of the present invention. A schematic cross-sectional view, and FIGS. 2a and 2b are perspective views of an example of a conventional resin-sealed semiconductor device and a semiconductor mounted on a heat sink sandwiched between molding dies, shown to explain the manufacturing method. Chip A-A'
It is a line cross-sectional schematic diagram. DESCRIPTION OF SYMBOLS 1... Heat sink, 3... Semiconductor chip, 5... Tip, 6... Heat sink convex part, 14... Gate opening.
Claims (1)
有する放熱板と、前記載置部の表面側を裏面側よ
りも厚く覆つて封止しかつ前記先端部の延長方向
の側面にゲート口跡部を有する樹脂封止部とを含
む樹脂封止型半導体装置において、前記先端部が
凹凸部を有し、前記樹脂封止部の前記先端部の表
面側が該先端部の裏面側よりも薄いことを特徴と
する樹脂封止型半導体装置。 A heat dissipation plate having a mounting part on which a semiconductor chip is placed and a tip, the front side of the mounting part being covered and sealed thicker than the back side, and a gate opening trace part on the side surface in the extending direction of the tip. In the resin-sealed semiconductor device including a resin-sealed portion having a resin-sealed portion, the tip portion has an uneven portion, and the front side of the tip portion of the resin-sealed portion is thinner than the back side of the tip portion. Characteristics of resin-sealed semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7720889U JPH0316346U (en) | 1989-06-29 | 1989-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7720889U JPH0316346U (en) | 1989-06-29 | 1989-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0316346U true JPH0316346U (en) | 1991-02-19 |
Family
ID=31619380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7720889U Pending JPH0316346U (en) | 1989-06-29 | 1989-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316346U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014072347A (en) * | 2012-09-28 | 2014-04-21 | Sanken Electric Co Ltd | Semiconductor device manufacturing method and semiconductor device |
-
1989
- 1989-06-29 JP JP7720889U patent/JPH0316346U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014072347A (en) * | 2012-09-28 | 2014-04-21 | Sanken Electric Co Ltd | Semiconductor device manufacturing method and semiconductor device |