JPS6282162U - - Google Patents
Info
- Publication number
- JPS6282162U JPS6282162U JP17226085U JP17226085U JPS6282162U JP S6282162 U JPS6282162 U JP S6282162U JP 17226085 U JP17226085 U JP 17226085U JP 17226085 U JP17226085 U JP 17226085U JP S6282162 U JPS6282162 U JP S6282162U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- mounting portion
- electronic device
- protrudes
- contact surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図乃至第３図は、本考案に係る電子機器の
放熱器構造の実施例を示すものであつて、第１図
は背面側から見た斜視図、第２図は取り付け側か
ら見た斜視図、第３図Ａ，Ｂ，Ｃは、成形工程の
型抜き部分を示す説明図である。第４図および第
５図は、従来の電子機器の放熱器構造を示すもの
で、第４図は側面側から見た斜視図、第５図Ａ，
Ｂ，Ｃは、成形工程の型抜き部分を示す説明図で
ある。
１；放熱器、１ａ；放熱フイン、１ｄ；取付部
、５；第１の接触面、７；第２の接触面、４，６
，８；エジエクタピン。
Figures 1 to 3 show an embodiment of the heatsink structure for electronic equipment according to the present invention, in which Figure 1 is a perspective view seen from the back side, and Figure 2 is a perspective view seen from the mounting side. The perspective view and FIGS. 3A, 3B, and 3C are explanatory diagrams showing the die-cutting portion of the molding process. Figures 4 and 5 show the structure of a conventional heatsink for electronic equipment, with Figure 4 being a perspective view seen from the side, Figure 5 A,
B and C are explanatory diagrams showing the die-cutting portion of the molding process. 1; Heat sink, 1a; Heat dissipation fin, 1d; Mounting portion, 5; First contact surface, 7; Second contact surface, 4, 6
, 8; ediectapine.
Claims (1)
の一側壁面に突出して形成した放熱フインとを一
体成形して構成した電子機器の放熱器において、 成形機の型開き動作と関連を保ちながら金型か
ら突出するエジエクタピン用の第１の接触面を前
記取付部の筐体本体側に位置する壁面に設けると
ともに、型抜き非常時に金型から突出させるエジ
エクタピン用の第２の接触面を前記放熱フインの
背面に設けたことを特徴とする電子機器の放熱器
構造。[Scope of Claim for Utility Model Registration] A radiator for an electronic device that is constructed by integrally molding a mounting portion to the main body of the electronic device and a heat dissipation fin that is formed protruding from one side wall of the mounting portion. A first contact surface for an ejector pin that protrudes from the mold while maintaining relationship with the mold opening operation of the machine is provided on a wall surface located on the side of the housing body of the mounting portion, and an ejector pin that protrudes from the mold in the event of a mold removal emergency. 1. A heat sink structure for an electronic device, characterized in that a second contact surface is provided on the back surface of the heat sink fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17226085U JPH032367Y2 (en) | 1985-11-11 | 1985-11-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17226085U JPH032367Y2 (en) | 1985-11-11 | 1985-11-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6282162U true JPS6282162U (en) | 1987-05-26 |
| JPH032367Y2 JPH032367Y2 (en) | 1991-01-23 |
Family
ID=31108640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17226085U Expired JPH032367Y2 (en) | 1985-11-11 | 1985-11-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032367Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011100672A (en) * | 2009-11-09 | 2011-05-19 | Nippon Light Metal Co Ltd | Heat sink |
| JP2011159926A (en) * | 2010-02-04 | 2011-08-18 | Yaskawa Electric Corp | Motor controller |
-
1985
- 1985-11-11 JP JP17226085U patent/JPH032367Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011100672A (en) * | 2009-11-09 | 2011-05-19 | Nippon Light Metal Co Ltd | Heat sink |
| JP2011159926A (en) * | 2010-02-04 | 2011-08-18 | Yaskawa Electric Corp | Motor controller |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH032367Y2 (en) | 1991-01-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6282162U (en) | ||
| JPS63110045U (en) | ||
| JPS6280392U (en) | ||
| JPS58109293U (en) | Double housing heat dissipation structure | |
| JPS63110093U (en) | ||
| JPS63121451U (en) | ||
| JPH0316346U (en) | ||
| JPS624190U (en) | ||
| JPS62118453U (en) | ||
| JPH0254263U (en) | ||
| JPS6176963U (en) | ||
| JPS6390852U (en) | ||
| JPH0430743U (en) | ||
| JPS6165753U (en) | ||
| JPS58189543U (en) | Mold type semiconductor device | |
| JPS6244495U (en) | ||
| JPS62157155U (en) | ||
| JPS63165852U (en) | ||
| JPH03104752U (en) | ||
| JPH02108037U (en) | ||
| JPS6255354U (en) | ||
| JPS6228448U (en) | ||
| JPS62152451U (en) | ||
| JPS62151751U (en) | ||
| JPH03110885U (en) |