JPH03104752U - - Google Patents

Info

Publication number
JPH03104752U
JPH03104752U JP1433790U JP1433790U JPH03104752U JP H03104752 U JPH03104752 U JP H03104752U JP 1433790 U JP1433790 U JP 1433790U JP 1433790 U JP1433790 U JP 1433790U JP H03104752 U JPH03104752 U JP H03104752U
Authority
JP
Japan
Prior art keywords
bent
semiconductor device
lead
heat sink
cranked part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1433790U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1433790U priority Critical patent/JPH03104752U/ja
Publication of JPH03104752U publication Critical patent/JPH03104752U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の第１実施例に係り、ａは構造
透視図、ｂは未封止半導体装置を樹脂成形金型に
固定した状態図、第２図は第２実施例の構造透視
図、第３図ａ，ｂは従来例の半導体装置の樹脂封
止の際の問題点を説明するための図、第４図ａは
従来例の対策をなした第１例の半導体装置の構造
透視図、ｂは樹脂成形金型に固定した状態図、第
５図ａは従来例の対策をなした第２例の半導体装
置の構造透視図、ｂは樹脂成形金型に固定した状
態図である。 １……放熱板、２……リード（第１リード）、
３，４……リード、７……（クランク加工部の）
側面、９……樹脂外装、１０……クランク加工部
、１１……湯口、１２……成形金型。 FIG. 1 is a perspective view of the structure of the first embodiment of the present invention, FIG. 2 is a perspective view of the structure of the unsealed semiconductor device fixed to a resin mold, and FIG. , Figures 3a and 3b are diagrams for explaining problems in resin sealing of a conventional semiconductor device, and Figure 4a is a perspective view of the structure of a first example of a semiconductor device that takes the conventional measures. Figures 5b and 5b are diagrams in which the device is fixed to a resin molding mold, Figure 5a is a perspective view of the structure of a second example semiconductor device that takes the measures taken in the conventional example, and b is a diagram in which it is fixed in a resin molding mold. . 1... Heat sink, 2... Lead (first lead),
3, 4...Lead, 7...(Crank machining part)
Side surface, 9... Resin exterior, 10... Crank processing section, 11... Sprue, 12... Molding die.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ペレツトを搭載する放熱板が、その端部
から折曲げたクランク加工部を有するリードで支
持され、樹脂封止の際放熱板裏面に樹脂絶縁膜が
形成されてなる絶縁型半導体装置において、前期
クランク加工部の側縁を折曲げ、折曲げた側面が
リード面に対して直角となつている構造を有する
ことを特徴とする絶縁型半導体装置。 In an insulated semiconductor device in which a heat sink carrying semiconductor pellets is supported by a lead having a cranked part bent from its end, and a resin insulating film is formed on the back side of the heat sink during resin sealing, An insulated semiconductor device characterized by having a structure in which a side edge of a cranked part is bent and the bent side surface is perpendicular to a lead surface.
JP1433790U 1990-02-15 1990-02-15 Pending JPH03104752U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1433790U JPH03104752U (en) 1990-02-15 1990-02-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1433790U JPH03104752U (en) 1990-02-15 1990-02-15

Publications (1)

Publication Number Publication Date
JPH03104752U true JPH03104752U (en) 1991-10-30

Family

ID=31517708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1433790U Pending JPH03104752U (en) 1990-02-15 1990-02-15

Country Status (1)

Country Link
JP (1) JPH03104752U (en)

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